EP0081360A1 - Procédé pour la production d'un assemblage d'électrodes - Google Patents
Procédé pour la production d'un assemblage d'électrodes Download PDFInfo
- Publication number
- EP0081360A1 EP0081360A1 EP19820306457 EP82306457A EP0081360A1 EP 0081360 A1 EP0081360 A1 EP 0081360A1 EP 19820306457 EP19820306457 EP 19820306457 EP 82306457 A EP82306457 A EP 82306457A EP 0081360 A1 EP0081360 A1 EP 0081360A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- plate
- electrodes
- slots
- array
- glass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 5
- 239000011521 glass Substances 0.000 claims abstract description 32
- 239000000463 material Substances 0.000 claims abstract description 12
- 238000005530 etching Methods 0.000 claims abstract 3
- 238000000034 method Methods 0.000 claims description 25
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 claims description 10
- 230000005855 radiation Effects 0.000 claims description 10
- 239000011810 insulating material Substances 0.000 claims description 9
- 239000013078 crystal Substances 0.000 claims description 8
- 239000002904 solvent Substances 0.000 claims description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 4
- 238000000137 annealing Methods 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 238000007747 plating Methods 0.000 claims description 3
- 230000008020 evaporation Effects 0.000 claims description 2
- 238000001704 evaporation Methods 0.000 claims description 2
- 238000001552 radio frequency sputter deposition Methods 0.000 claims description 2
- 238000012216 screening Methods 0.000 claims description 2
- 239000010935 stainless steel Substances 0.000 claims description 2
- 238000007740 vapor deposition Methods 0.000 claims description 2
- 229910000990 Ni alloy Inorganic materials 0.000 claims 1
- 229910001092 metal group alloy Inorganic materials 0.000 claims 1
- 229910001256 stainless steel alloy Inorganic materials 0.000 claims 1
- 239000002241 glass-ceramic Substances 0.000 description 10
- FUJCRWPEOMXPAD-UHFFFAOYSA-N Li2O Inorganic materials [Li+].[Li+].[O-2] FUJCRWPEOMXPAD-UHFFFAOYSA-N 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 239000002131 composite material Substances 0.000 description 3
- 229910052593 corundum Inorganic materials 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000011022 opal Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 229910001845 yogo sapphire Inorganic materials 0.000 description 3
- KKCBUQHMOMHUOY-UHFFFAOYSA-N Na2O Inorganic materials [O-2].[Na+].[Na+] KKCBUQHMOMHUOY-UHFFFAOYSA-N 0.000 description 2
- 206010034972 Photosensitivity reaction Diseases 0.000 description 2
- 229910021607 Silver chloride Inorganic materials 0.000 description 2
- 229910001515 alkali metal fluoride Inorganic materials 0.000 description 2
- 238000000429 assembly Methods 0.000 description 2
- 230000000712 assembly Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 229910052681 coesite Inorganic materials 0.000 description 2
- 229910052906 cristobalite Inorganic materials 0.000 description 2
- XUCJHNOBJLKZNU-UHFFFAOYSA-M dilithium;hydroxide Chemical compound [Li+].[Li+].[OH-] XUCJHNOBJLKZNU-UHFFFAOYSA-M 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- PAZHGORSDKKUPI-UHFFFAOYSA-N lithium metasilicate Chemical compound [Li+].[Li+].[O-][Si]([O-])=O PAZHGORSDKKUPI-UHFFFAOYSA-N 0.000 description 2
- 229910052912 lithium silicate Inorganic materials 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 239000006089 photosensitive glass Substances 0.000 description 2
- 230000036211 photosensitivity Effects 0.000 description 2
- 239000005394 sealing glass Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- HKZLPVFGJNLROG-UHFFFAOYSA-M silver monochloride Chemical compound [Cl-].[Ag+] HKZLPVFGJNLROG-UHFFFAOYSA-M 0.000 description 2
- 229910052682 stishovite Inorganic materials 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229910052905 tridymite Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000006088 Fotoceram Substances 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- -1 e.g. Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
- H01J9/02—Manufacture of electrodes or electrode systems
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J17/00—Gas-filled discharge tubes with solid cathode
- H01J17/38—Cold-cathode tubes
- H01J17/48—Cold-cathode tubes with more than one cathode or anode, e.g. sequence-discharge tube, counting tube, dekatron
- H01J17/49—Display panels, e.g. with crossed electrodes, e.g. making use of direct current
- H01J17/492—Display panels, e.g. with crossed electrodes, e.g. making use of direct current with crossed electrodes
Definitions
- Electrodes there are many types of electronic devices, such as dot matrix display panels, which include two sets of electrodes spaced apart in operative relation with each other.
- the electrodes are separated by a slotted plate of electrical insulating material which is difficult to make and align with the associated electrodes.
- the structures composed of insulating materials for supporting the electrodes are relatively complex and include grooved plates or holes which are also expensive and difficult to make.
- the supporting structures utilized in electronic devices have been fabricated from glasses, glass-ceramics, ceramics, or organic plastic materials.
- Organic plastics have several advantages when being considered for such devices since they are relatively inexpensive, they can be manufactured and drilled, punched, machined, or otherwise shaped into complex geometries with reasonable ease, and they have sufficient mechanical strength for most applications. However, organic plastics cannot be used in vacuum- sealed devices.
- Sintered ceramic materials e.g., aluminum oxide
- Those materials ably withstand exposure to high temperatures but suffer from such disadvantages as being relatively expensive to manufacture, being difficult to machine or otherwise shape into complex configurations, and being relatively fragile.
- Glasses and glass-ceramics have been utilized as supports in electronic devices because of their excellent electrical insulating characteristics, their relative cheapness, their ability to withstand high temperatures, their low vapor pressure, and their high mechanical strength.
- most glasses and glass-ceramics, like sintered ceramics, are difficult to machine and holes cannot be readily drilled or punched therein.
- the articles are produced by subjecting portions of glass bodies consisting essentially, by weight on the oxide basis, of 60-85% Si0 2 , 5.5-15% Li 2 0, 2-25% Al 2 0 3 3 the ratio Al 2 O 3 :Li 2 O being less than 1.7:1, and a photosensitive metal in the indicated proportion selected from the group of 0.001-0.03% gold, computed as Au, 0.001-0.3% silver, computed as AgCl, and 0.001-1% copper, computed as CuO, to actinic radiation, again commonly ultraviolet radiation, to produce a latent image in the glass.
- a photosensitive metal in the indicated proportion selected from the group of 0.001-0.03% gold, computed as Au, 0.001-0.3% silver, computed as AgCl, and 0.001-1% copper, computed as CuO, to actinic radiation, again commonly ultraviolet radiation, to produce a latent image in the glass.
- a subsequent two-step heat treatment effects the generation of crystals in the previously-exposed portions of the bodies.
- Those portions of the glass-ceramic body are highly crystalline and contain at least one lithium-containing crystal phase which is more readily soluble in dilute hydrofluoric acid than the residual glass and other crystal phases present.
- These glass-ceramic products are mechanically stronger and are capable of being used at higher temperatures than the above-described photosensitive opal glasses.
- Chemically machinable'glasses and glass-ceramics have been used commercially in a number of applications including electronic and fluidic devices where grooves, holes, slots, etc., of high tolerances have been etched therein.
- Corning Glass Works, Corning, New York has marketed a chemically machinable glass product under the trademark FOTOFORM and a chemical machinable glass-ceramic under the trademark FOTOCERAM.
- the primary objective of the invention is to provide an improved method for fabricating electrode assemblies comprising two sets of electrodes spaced apart in operative relation with each other in which the supporting structure therefor is of such complex geometry that removal of material from the supporting structure is conventionally required, said inventive method obviating the need for machining, drilling, punching, or other mecahnical means for removing material from the supporting structure.
- Another objective of the invention is to fabricate electrode assemblies which can be utilized in gas-filled display panels or in other types of devices that employ crossed electrodes and cell matrices.
- the method of the invention comprises five general steps:
- a plate 10 of a photosensitive glass is exposed to ultraviolet radiation in the form of collimated beams, or through a patterned mask comprised of material opaque to ultraviolet radiation, or in some other manner to produce latent images in the form of parallel, linear exposed regions 20 through the body of plate 10 as seen in Fig. 2.
- regions 20 do not extend to the edges of plate 10 so that the edge portions of plate 10 remain in place to maintain the integrity of plate 10 when portions thereof are subsequently removed in exposed regions 20. It will be understood that other arrangements can be devised to hold plate 10 together after exposed regions 20 have been removed.
- Exposed regions 20 are then heated to temperatures generally below the softening point of the glass to develop crystallites therein selected from the group of a lithium silicate and an alkali metal fluoride, following which the crystallized regions are contacted with dilute hydrofluoric acid at surface 12 of plate 10 to remove the crystallized regions part way through the cross-section of plate 10 to form slots 40 seen in Fig. 3.
- an array of elongated cathode electrodes 50 is applied by any suitable method to the obverse surface 14 of plate 10 in transverse orientation to exposed regions 20. It will be appreciated that this cathode array may be formed upon plate 10 before slots 40 are produced.
- plate 10 is secured through any convenient means to the surface of a support plate 60 of an electrical insulating material, e.g., glass, which carries elongated parallel anode electrodes 70 which have been applied to support plate 60 by any suitable method.
- anodes 70 are aligned with and positioned within slots 40.
- crystallized regions 20 are again contacted with dilute hydrofluoric acid to remove the remainder thereof such that slots 40 penetrate totally through the cross-section of plate 10 providing the completed assembly shown in Figs. 6 and 7.
- the resulting assembly after the attachment of leads thereof, can be incorporated into a gas-filled display panel or into any other type of device which utilizes crossed electrodes and cell matrices.
- the anodes and cathodes can be formed from any suitable material which is highly electrically conducting and has a coefficient of thermal expansion relatively closely matching that of the plate material.
- the electrodes will be metallic, fabricated from stainless steel, nickel, or an alloy having the necessary expansion characteristic. They can be applied through'any suitable process including, but not limited to, silk screening, evaporation, RF sputtering, electroless metal plating, and vapor deposition. Galvanic plating may be used.
- support plate 60 can be accomplished through any suitable technique.
- a sealing glass frit having a fusing temperature lower than those of plates 10 and 60 will be applied to support plate 60 to contact areas of plate 10 between slots 40.
- the assemblage is then fired at a temperature sufficiently high to fuse the sealing glass frit and thereby bond together plates 10 and 60.
- a multi-unit assembly can be produced by laying up two or more individual units and securing them together via frit-sealing or other means.
- the heat treatment will consist of first exposing the glass to temperatures above the annealing point of the glass but below the softening point thereof, and thereafter subjecting the glass to temperatures above the softening point of the glass to cause the generation of crystals therein in the manner described in Patent No. 2,971,853, supra.
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Glass Compositions (AREA)
- Gas-Filled Discharge Tubes (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US32759781A | 1981-12-04 | 1981-12-04 | |
| US327597 | 1981-12-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| EP0081360A1 true EP0081360A1 (fr) | 1983-06-15 |
Family
ID=23277213
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP19820306457 Withdrawn EP0081360A1 (fr) | 1981-12-04 | 1982-12-03 | Procédé pour la production d'un assemblage d'électrodes |
Country Status (3)
| Country | Link |
|---|---|
| EP (1) | EP0081360A1 (fr) |
| JP (1) | JPS58502076A (fr) |
| WO (1) | WO1983002035A1 (fr) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3704052A (en) * | 1971-05-03 | 1972-11-28 | Ncr Co | Method of making a plasma display panel |
| US3776613A (en) * | 1970-03-20 | 1973-12-04 | Philips Corp | Gas-discharge display panel |
| US3781984A (en) * | 1971-07-15 | 1974-01-01 | Fujitsu Ltd | Method for manufacturing electrodes of a display device utilizing gas discharge |
| US3787106A (en) * | 1971-11-09 | 1974-01-22 | Owens Illinois Inc | Monolithically structured gas discharge device and method of fabrication |
| US3789470A (en) * | 1968-06-12 | 1974-02-05 | Fujitsu Ltd | Method of manufacture of display device utilizing gas discharge |
| US3973815A (en) * | 1973-05-29 | 1976-08-10 | Owens-Illinois, Inc. | Assembly and sealing of gas discharge panel |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BE513836A (fr) * | 1951-08-30 | |||
| US2628160A (en) * | 1951-08-30 | 1953-02-10 | Corning Glass Works | Sculpturing glass |
| US2971853A (en) * | 1953-03-05 | 1961-02-14 | Corning Glass Works | Ceramic body and method of making it |
| US3687513A (en) * | 1971-03-24 | 1972-08-29 | Burroughs Corp | Method of aging a display panel |
| JPS5329661A (en) * | 1976-08-30 | 1978-03-20 | Burroughs Corp | Display panel and method of manufacturing same |
| US4276335A (en) * | 1978-03-13 | 1981-06-30 | General Electric Company | Electron beam matrix deflector and method of fabrication |
-
1982
- 1982-12-01 WO PCT/US1982/001700 patent/WO1983002035A1/fr not_active Ceased
- 1982-12-01 JP JP83500503A patent/JPS58502076A/ja active Pending
- 1982-12-03 EP EP19820306457 patent/EP0081360A1/fr not_active Withdrawn
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3789470A (en) * | 1968-06-12 | 1974-02-05 | Fujitsu Ltd | Method of manufacture of display device utilizing gas discharge |
| US3776613A (en) * | 1970-03-20 | 1973-12-04 | Philips Corp | Gas-discharge display panel |
| US3704052A (en) * | 1971-05-03 | 1972-11-28 | Ncr Co | Method of making a plasma display panel |
| US3781984A (en) * | 1971-07-15 | 1974-01-01 | Fujitsu Ltd | Method for manufacturing electrodes of a display device utilizing gas discharge |
| US3787106A (en) * | 1971-11-09 | 1974-01-22 | Owens Illinois Inc | Monolithically structured gas discharge device and method of fabrication |
| US3973815A (en) * | 1973-05-29 | 1976-08-10 | Owens-Illinois, Inc. | Assembly and sealing of gas discharge panel |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58502076A (ja) | 1983-12-01 |
| WO1983002035A1 (fr) | 1983-06-09 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
| 17P | Request for examination filed |
Effective date: 19821214 |
|
| AK | Designated contracting states |
Designated state(s): BE DE FR GB IT NL SE |
|
| STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION HAS BEEN WITHDRAWN |
|
| 18W | Application withdrawn |
Withdrawal date: 19850422 |
|
| RIN1 | Information on inventor provided before grant (corrected) |
Inventor name: OGLE, JAMES ALEXANDER Inventor name: BELLMAN, ROBERT HERMAN Inventor name: KUCHINSKY, SAUL |