EP0160024A4 - Integrierte elektronen-röhren-struktur. - Google Patents
Integrierte elektronen-röhren-struktur.Info
- Publication number
- EP0160024A4 EP0160024A4 EP19840903796 EP84903796A EP0160024A4 EP 0160024 A4 EP0160024 A4 EP 0160024A4 EP 19840903796 EP19840903796 EP 19840903796 EP 84903796 A EP84903796 A EP 84903796A EP 0160024 A4 EP0160024 A4 EP 0160024A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- electron
- metal
- tube
- ceramic
- elements
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 229910052751 metal Inorganic materials 0.000 claims abstract description 38
- 239000000919 ceramic Substances 0.000 claims abstract description 33
- 239000002184 metal Substances 0.000 claims abstract description 30
- 238000006243 chemical reaction Methods 0.000 claims abstract description 14
- 239000004065 semiconductor Substances 0.000 claims abstract description 6
- 238000010894 electron beam technology Methods 0.000 claims abstract description 5
- 238000002844 melting Methods 0.000 claims abstract 2
- 230000008018 melting Effects 0.000 claims abstract 2
- 238000000034 method Methods 0.000 claims description 17
- 239000012212 insulator Substances 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 230000013011 mating Effects 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims description 2
- 238000005498 polishing Methods 0.000 claims 1
- 125000006850 spacer group Chemical group 0.000 description 5
- 238000005219 brazing Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000001465 metallisation Methods 0.000 description 4
- 239000011521 glass Substances 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 230000003321 amplification Effects 0.000 description 2
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000007772 electrode material Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000003199 nucleic acid amplification method Methods 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 206010037660 Pyrexia Diseases 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 230000000284 resting effect Effects 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
- C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
- C04B37/021—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles in a direct manner, e.g. direct copper bonding [DCB]
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
- C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
- C04B37/023—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used
- C04B37/025—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used consisting of glass or ceramic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J1/00—Details of electrodes, of magnetic control means, of screens, or of the mounting or spacing thereof, common to two or more basic types of discharge tubes or lamps
- H01J1/88—Mounting, supporting, spacing, or insulating of electrodes or of electrode assemblies
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
- H01J9/24—Manufacture or joining of vessels, leading-in conductors or bases
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
- C04B2237/04—Ceramic interlayers
- C04B2237/06—Oxidic interlayers
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
- C04B2237/32—Ceramic
- C04B2237/34—Oxidic
- C04B2237/343—Alumina or aluminates
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
- C04B2237/32—Ceramic
- C04B2237/34—Oxidic
- C04B2237/345—Refractory metal oxides
- C04B2237/348—Zirconia, hafnia, zirconates or hafnates
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
- C04B2237/40—Metallic
- C04B2237/405—Iron metal group, e.g. Co or Ni
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
- C04B2237/40—Metallic
- C04B2237/407—Copper
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
- C04B2237/40—Metallic
- C04B2237/408—Noble metals, e.g. palladium, platina or silver
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
- C04B2237/52—Pre-treatment of the joining surfaces, e.g. cleaning, machining
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
- C04B2237/60—Forming at the joining interface or in the joining layer specific reaction phases or zones, e.g. diffusion of reactive species from the interlayer to the substrate or from a substrate to the joining interface, carbide forming at the joining interface
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
- C04B2237/76—Forming laminates or joined articles comprising at least one member in the form other than a sheet or disc, e.g. two tubes or a tube and a sheet or disc
- C04B2237/765—Forming laminates or joined articles comprising at least one member in the form other than a sheet or disc, e.g. two tubes or a tube and a sheet or disc at least one member being a tube
Definitions
- This invention relates to an integrated electron-tube structure and in particular to a structure which may be employed for a cathode-ray tube or similar apparatus and which is adapted for the generation of an electron beam having high stability in the presence of mechanical interference.
- An improved method is presented for constructing an electron tube from ceramic and metal materials using a process of reaction bonding to achieve vacuum-tight seals between the components.
- the method enables high alignment accuracy to be achieved with a simple assembly procedure.
- Previously-known electron-tube structures used commonly in oscilloscope, video display or camera tubes employ a glass and metal construction method in which the electron-gun assembly is supported by springs in the glass envelope. Although economical, this technique is unsatisfactory for high-stability applications and the glass tube-envelope may be prone to damage from shock. There exist further problems of material and process incompatibility with semiconductors where integratedcircuit target arrays are incorporated. A form of construction which has been used for so-called ruggedized tubes is dependent on the bonding together of metal electrodes and ceramic insulators in a vacuum-tight assembly requiring no outer envelope. The use of ceramic further allows higher process temperatures to be employed in manufacture, assisting in the achievement of a high vacuum and reducing the risk of contamination of semiconductor devices in the tubes.
- a major disadvantage of the ceramic and metal structure is the high cost resulting from the complexity of the numerous metal -to-ceramic seals usually required for each tube. These seals are typically made by an appropriate brazing or hightemperature soldering process, the difficulty of which varies according to the shape of the parts to be joined. In many cases the metal parts have to be formed in such a way that the seals are relieved of stresses which could result in seal failure and which are caused by differences in thermal expansion coefficients of the materials. The resulting complex shapes may make precise alignment difficult.
- an integrated electron-tube structure utilising a process of metal -to-ceramic reaction bonding to produce an assembly forming the whole or part of an electron tube and comprising a plurality of metal elements separated by and bonded to ceramic elements; the said ceramic and metal elements in combination providing the functional electrode means and insulator means of the said integrated electron-tube structure.
- the achievement of any desired shape in the present invention may be effected either by formation of a metal element, by a combination of metal elements, by a metal layer or coating applied to the whole or part of a ceramic element or by a combination of one or more ceramic elements so metallized and one or more metal elements.
- a structure of this type it is usual, but not essential, for a structure of this type to be circular and cylindrical in form.
- the bonds may be made vacuum-tight and the outer surface of the structure may then form the outer envelope, or part thereof, of the electron-tube.
- the ceramic elements may be conveniently cut from standard commercial tubing but, in some instances, it may be advantageous to mould the ceramic, for example, to form electrode shapes, which may then be suitably metallized, it is further possible to combine a structure as previously described with one or more other structures or assemblies, fabricated by reaction bonding or other means, fitted either as part of or internal to the tube envelope and attached by welding, screwing or other means.
- reaction bonding it has been found advantageous to manufacture a cathode-ray tube deflectionelectrode structure by reaction bonding and fit this structure to an electron-gun structure fabricated separately by reaction bonding.
- the process of reaction bonding between some metals and ceramics is known. Copper and high-alumina ceramic have been found to be suitable materials for the present applications. Where appropriate, gold may be used in place of, or in combination with, copper in a single structure since reaction bonding occurs at sufficiently similar temperatures for both metals. Strong bonds are formed when the mating surfaces of the materials are ground and, for vacuum-tightness, polished.
- the elements to be bonded are stacked and aligned along an axis.
- Figure 1 is a diagram of a simple electrostatic lens according to the first embodiment of the invention, suitable for use in combination with other non-illustrated parts inside the vacuum envelope of a cathode-ray tube, for example;
- Figure 2 is a diagram showing an orthogonal view of the components of the first embodiment positioned in an alignment fixture prior to bonding;
- Figure 3 is a diagram showing a longitudinal section of an example electron-gun structure according to the second embodiment of the invention, suitable for use in, and forming part of the outer envelope of, a cathode-ray tube;
- Figure 4 Is a perspective diagram of a cathode-ray tube deflection-electrode structure according to the third embodiment of the invention, suitable for use in combination with the electron-gun structure of the second embodiment.
- FIG. 1 an integrated electron-tube structure according to the first embodiment comprising a set of metal electrode plates 1, the number and dimensions of which are selected according to the particular electronic design requirements, separated by tubular ceramic spacers 2 of length also determined by the design requirements.
- the metal plates and spacers are preferably all of the same outside diameter, although the ceramic spacers may be made slightly smaller to allow for tolerances in the diameter of standard ceramic tubuing.
- the mating surfaces of the plates and spacers are ground flat and smooth and assembled in proper alignment in a jig which permits an axial load to be applied uniformly in I ine with the areas to be bonded as indicated by the arrows 3 during subsequent heating to effect the bonds.
- Figure 2 is shown a simple method of aligning the metal plates 1 and spacers 2 of the first embodiment by means of an accurately-ground 'V'-block 4. Whilst they are resting in the 'V'-block, the elements 1 and 2 may be clamped axial ly and the clamped assembly then removed from the 'V'-block before being heated to the bonding temperature.
- This alignment method may be adapted to suit other embodiments of the invention by adding appropriate features to the 'V'-block.
- the simple structure of Figure 1 is limited in its application as part of the outer envelope of a vacuum tube because of the low breakdown-voltage of closely-spaced electrodes in air.
- FIG. 3 is shown an integrated electron-tube structure according to the second embodiment, comprising part of a cathode-ray tube electron gun in which planar and cylindrical electrodes are combined with ceramic insulators in such manner as to substantially reduce external potential gradients and in which: a metal ring 5 provides attachment means for a conventional thermionic planar cathode and heater assembly, which may be sealed to the said ring by brazing, and further provides connection to a control electrode comprising a metal deposition 6 on a ceramic insulator 7; a first accelerating electrode comprises a metal disc 8 bonded to the insulator 7 and a cylindrical insulator 9 and further comprises on the major portion of the inner surface of the insulator 9 a cylindrical metal deposition 10 which electrically contacts the disc 8; a focus electrode comprises a metal disc 11 bonded to the ceramic tube 9; a second accelerating electrode comprises a metal deposition 13 on the major portion of the Inner surface of a ceramic tube 12 which is bonded to the disc 11 and to a mounting plate 15, the latter providing means, for
- FIG 4 is shown a deflection-electrode structure according to the third embodiment, which is adapted for use in a precision cathode-ray tube in combination with an electron-gun structure in accordance with the second embodiment, and which comprises: two pairs of deflection electrodes 24 and 28 being metal layers deposited on the inner surfaces of ceramic-bar substrates 23 and 27 respectively; metal electrode-plates 25, 26 and 29, reaction-bonded to metallized end faces of the said ceramic bars, the said end faces being interconnected by further metallization of the said ceramic bars, but usually insulated from the said deflection electrodes; means for attaching the deflection-electrode structure to an electron-gun structure, for example screw holes 30.
- the ceramic material may be varied, for example to employ partially-stabilised zirconia (PSZ); the metal electrode material may be varied, for example, to employ gold, nickel or a particular al loy of copper; the metal electrode material may be plated with another metal to achieve reaction-bonding compatibility or with any substance to achieve particular electrode properties; and the ceramic material may be metallized In any desired pattern to achieve complex or multiple electrode configurations.
- PSZ partially-stabilised zirconia
- each is able to provide accurate and stable control of an electron beam and to have little sensitivity to the effects of shock, vibration and extreme temperature variations; that each may be fabricated by a rapid, reliable and accurate assembly method at low cost; that a first alternative precision lens structure is provided which may be employed in an evacuated enclosure; that a second alternative precision lens structure is provided which may comprise part of an integrated electron tube including the outer wall of the evacuated enclosure and has provision for the embodiment of a readilyavailable thermionic heater-cathode assembly, a deflection structure and a final anode structure (not illustrated) which may incorporate a semiconductor integrated-circuit target; that an integrated precision deflection structure is provided which may be adapted for use with simple deflection plates, meander-line deflection plates or helical deflection components by interchanging only the metallized ceramic elements.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Manufacture Of Electron Tubes, Discharge Lamp Vessels, Lead-In Wires, And The Like (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| AU1851/83 | 1983-10-14 | ||
| AUPG185183 | 1983-10-14 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| EP0160024A1 EP0160024A1 (de) | 1985-11-06 |
| EP0160024A4 true EP0160024A4 (de) | 1986-04-02 |
Family
ID=3770359
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP19840903796 Withdrawn EP0160024A4 (de) | 1983-10-14 | 1984-10-12 | Integrierte elektronen-röhren-struktur. |
Country Status (2)
| Country | Link |
|---|---|
| EP (1) | EP0160024A4 (de) |
| WO (1) | WO1985001831A1 (de) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3913538C2 (de) * | 1989-04-25 | 1996-11-21 | Licentia Gmbh | Elektronenauffänger für eine Elektronenstrahlröhre |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1194066B (de) * | 1957-12-05 | 1965-06-03 | Eitel Mccullough Inc | Verfahren und Vorrichtung zur Herstellung von Elektronenroehren |
| GB1090414A (en) * | 1967-01-13 | 1967-11-08 | Rank Organisation Ltd | Cathode ray tube |
| US3531853A (en) * | 1966-11-30 | 1970-10-06 | Philips Corp | Method of making a ceramic-to-metal seal |
| FR2108468A5 (de) * | 1970-09-24 | 1972-05-19 | Siemens Ag |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB582135A (en) * | 1941-04-01 | 1946-11-06 | Radio Electr Soc Fr | Improvements relating to electric discharge valves |
| US2386820A (en) * | 1941-12-22 | 1945-10-16 | Raytheon Mfg Co | Method of forming seals |
| US2564738A (en) * | 1947-02-25 | 1951-08-21 | Foerderung Forschung Gmbh | Method of forming a vacuum-tight bond between ceramics and metals |
| US3252039A (en) * | 1962-07-23 | 1966-05-17 | Gen Electric | Electric discharge device |
| US3646405A (en) * | 1969-01-08 | 1972-02-29 | Mallory & Co Inc P R | Hermetic seal |
| US3951327A (en) * | 1975-01-28 | 1976-04-20 | The United States Of America As Represented By The United States Energy Research And Development Administration | Ceramic to metal seal |
| SU782020A1 (ru) * | 1977-03-15 | 1980-11-23 | Предприятие П/Я Г-4937 | Оправка дл получени кольцевых цилиндрических спаев |
| JPS5790846A (en) * | 1980-11-27 | 1982-06-05 | Toshiba Corp | Manufacture of vacuum valve |
-
1984
- 1984-10-12 EP EP19840903796 patent/EP0160024A4/de not_active Withdrawn
- 1984-10-12 WO PCT/AU1984/000201 patent/WO1985001831A1/en not_active Ceased
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1194066B (de) * | 1957-12-05 | 1965-06-03 | Eitel Mccullough Inc | Verfahren und Vorrichtung zur Herstellung von Elektronenroehren |
| US3531853A (en) * | 1966-11-30 | 1970-10-06 | Philips Corp | Method of making a ceramic-to-metal seal |
| GB1090414A (en) * | 1967-01-13 | 1967-11-08 | Rank Organisation Ltd | Cathode ray tube |
| FR2108468A5 (de) * | 1970-09-24 | 1972-05-19 | Siemens Ag |
Non-Patent Citations (3)
| Title |
|---|
| J.T. KLOMP: "Adhesie van metaal aan keramiek", Natuurkundig Laboratorium, N.V. Philips, 1970, pages 1-7, Eindhoven, NL; * |
| See also references of WO8501831A1 * |
| THE AMERICAN CERAMIC SOCIETY BULLETIN, vol. 51, no. 9, 1972, pages 683-688, Columbus, Ohio, US; J.T. KLOMP: "Bonding of metals to ceramics and glasses" * |
Also Published As
| Publication number | Publication date |
|---|---|
| WO1985001831A1 (en) | 1985-04-25 |
| EP0160024A1 (de) | 1985-11-06 |
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