EP0189781A1 - Méthode de fabrication pour bobine plate et bobine plate pour tube d'onde de choc - Google Patents

Méthode de fabrication pour bobine plate et bobine plate pour tube d'onde de choc Download PDF

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Publication number
EP0189781A1
EP0189781A1 EP86100419A EP86100419A EP0189781A1 EP 0189781 A1 EP0189781 A1 EP 0189781A1 EP 86100419 A EP86100419 A EP 86100419A EP 86100419 A EP86100419 A EP 86100419A EP 0189781 A1 EP0189781 A1 EP 0189781A1
Authority
EP
European Patent Office
Prior art keywords
flat coil
spiral
layer
carrier
shock wave
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP86100419A
Other languages
German (de)
English (en)
Other versions
EP0189781B1 (fr
Inventor
Georg Naser
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Siemens Corp
Original Assignee
Siemens AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG, Siemens Corp filed Critical Siemens AG
Publication of EP0189781A1 publication Critical patent/EP0189781A1/fr
Application granted granted Critical
Publication of EP0189781B1 publication Critical patent/EP0189781B1/fr
Expired legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances

Definitions

  • the invention relates to a method for producing a spiral flat coil for a shock wave tube and a spiral flat coil for the shock wave tube. It also relates to a flat coil for a shock wave tube for crushing concrements in a patient, for example kidney stones.
  • DE-OS 33 12 014 Shock wave tubes of this type have been known for a long time ("Akustician Beihefte", 1962, Issue 1, pages 185-202). According to recent investigations, e.g. specified in DE-OS 33 12 014, used in medical technology for crushing concrements in the body of a patient.
  • DE-OS 33 12 014 describes a shock wave tube for this purpose. Due to the high pressure pulse of approx. 100 bar, the materials of such a shock wave tube are subjected to high stresses with every shock wave emission. The discharge coil and the membrane are particularly exposed to high mechanical forces.
  • a spherical cap-shaped coil is provided, the spherical cap shape z. B. by subsequent processing, such as turning out a flat coil. This procedure is very expensive and requires sophisticated processing tools.
  • the object of the invention is to design a method of the type mentioned in the introduction in such a way that a flat coil with any spiral shape can be produced with simple means.
  • a mask in the form of a spiral is photographically transferred to a printed circuit board with a carrier layer, with an electrically conductive layer above and with a light-sensitive top layer, in that the top layer is developed, in that the gaps between the spiral passages of the transferred mask are etched away from the electrically conductive layer, that the spiral passages remaining on the electrically conductive layer are galvanically reinforced, and that the printed circuit board is then glued onto a flat coil carrier.
  • a flat coil produced by the method is characterized according to the invention in that it is composed of a) a carrier layer, b) a spiral made of copper attached to the carrier layer and c) a disk provided as a flat coil carrier made of a reverberant and electrically non-conductive material, whereby the disc is glued to the spiral and / or the carrier layer.
  • the advantage of the method is that coils with any spiral shape can be easily produced. No complex mechanical processing tools such as a lathe or milling machine are required for this.
  • a particularly advantageous embodiment of the method is that the circuit board is glued to the flat coil carrier with its surface carrying the spiral.
  • this measure ensures that the non-conductive part of the circuit board simultaneously serves as an insulating film between the coil and a membrane in front of it.
  • the assembly of the essential components of the shock wave tube, namely flat coil, insulating foil and membrane, is thereby considerably simplified.
  • FIG. 1 denotes a shock wave tube in general, the essential components of which consist of a flat coil carrier 3 with associated spiral coil 4 (shown in FIGS. 3 and 4), an insulating film 5 and a membrane 7. Holding means for the coil 4, the insulating film 5 and the membrane 7 are not shown.
  • a high-voltage pulse of short duration is applied to the flat coil 4 in order to trigger a shock wave. Due to the electromagnetic interaction of the coil 4 with the membrane 7, the membrane 7 is knocked away from the coil 4; it creates the shock wave.
  • the coil 4 must have a defined shape for the shock wave tube 1 to function properly and to produce a certain desired wave shape.
  • the surface of the coil 4 can, for. B. be flat if the generation of a flat shock wave is desired, or concave catotte-shaped if the shock wave generated with it should focus on a point. In addition to the defined shape of the coil 4, it is of great importance that the insulation between the coil turns is flawless, e.g. B. without air pockets.
  • the voltage pulses that act on the coil 4 are in the order of magnitude between 10 and 30 kV.
  • a round ceramic disk is assumed. This disc has, for example, a thickness of 40 mm with a diameter of 155 mm.
  • smaller slices e.g. 60 mm diameter with a thickness of 15 mm.
  • a printed circuit board 9 is another starting material. It is provided for the production of the actual coil 4.
  • the printed circuit board 9 consists of an electrically non-conductive carrier layer 11, which preferably consists of polyimide. This polyimide film can have a thickness of approx. 200 ⁇ m.
  • One side of the carrier layer 11 is provided with a thin layer 13 made of an electrically conductive substance, in particular a copper layer approximately 7 ⁇ m thick.
  • a light-sensitive top layer 15 is in turn applied to the copper layer 13.
  • FIG. 2 shows the flat coil carrier 3 and the printed circuit board 9 processed after a first and second method step.
  • a mask - (not shown) in which - depending on the type of photosensitive upper layer 15 - the Spirafform in positive or Negative representation is contained, by subsequent exposure of the parts of the light-sensitive layer 15 not covered by the mask, by development and etching of the spaces between the spiral passages 13a, the printed circuit board 9 shown in FIG. 2 results. It consists of the carrier layer 11 and parts of the original one Copper layer 13. The spiral paths 13a now form a flat coil 4 with a spiral course of the turns.
  • the spiral copper layer 13 is shown, after the latter has been galvanized to a total thickness of approximately 7 ⁇ m. B. was amplified about 150 microns.
  • the spiral produced in this way with the spiral ducts 13a is suitable for withstanding the high voltage and current surge during the generation of shock waves if the individual spiral ducts 13a are at a sufficient distance from one another.
  • FIG. 4 shows the finished arrangement of flat coil carrier 3 and integrated coil 4.
  • the spaces between the spiral copper layer 13a have now been filled with a synthetic resin 17.
  • the coil 4 is glued to the end of the flat coil carrier 3.
  • the entire end face of the flat coil carrier 3 can also be coated with synthetic resin in one operation.
  • the printed circuit board 4 may be also bonded in principle with both the support layer 11 as the layer 1 3 against the flat coil support. 3
  • the advantage of the second embodiment is that the carrier layer 11 can simultaneously serve as an insulating film 5 in order to electrically isolate the coil 4 from the membrane 7.
  • Aluminum oxide ceramics are preferably used as materials for the flat coil carrier 3, but good results have also been achieved with filled and unfilled epoxy resin.

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Surgical Instruments (AREA)
EP86100419A 1985-01-28 1986-01-14 Méthode de fabrication pour bobine plate et bobine plate pour tube d'onde de choc Expired EP0189781B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3502770 1985-01-28
DE19853502770 DE3502770A1 (de) 1985-01-28 1985-01-28 Verfahren zur herstellung einer flachspule sowie flachspule fuer ein stosswellenrohr

Publications (2)

Publication Number Publication Date
EP0189781A1 true EP0189781A1 (fr) 1986-08-06
EP0189781B1 EP0189781B1 (fr) 1989-05-03

Family

ID=6260970

Family Applications (1)

Application Number Title Priority Date Filing Date
EP86100419A Expired EP0189781B1 (fr) 1985-01-28 1986-01-14 Méthode de fabrication pour bobine plate et bobine plate pour tube d'onde de choc

Country Status (3)

Country Link
EP (1) EP0189781B1 (fr)
JP (1) JPS61176334A (fr)
DE (2) DE3502770A1 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0435838A3 (en) * 1989-12-19 1991-10-02 International Business Machines Corporation Sputtering apparatus
GB2290171A (en) * 1994-06-03 1995-12-13 Plessey Semiconductors Ltd Inductor chip device
US6837859B2 (en) 2001-09-10 2005-01-04 Siemens Aktiengesellschaft Shock wave source with a coil carrier having a non-circular contour
US6849053B2 (en) 2001-09-10 2005-02-01 Siemens Aktiengesellschaft Shock wave source with a wave damping coil carrier

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05100223A (ja) * 1991-04-03 1993-04-23 Riyoosan:Kk 光源装置
DE102006040728A1 (de) * 2006-08-31 2008-03-13 Siemens Ag Verfahren und Vorrichtung zum Herstellen eines elektronischen Moduls

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3189767A (en) * 1963-01-28 1965-06-15 Gen Electric Ultrasonic transmitting means and method of producing same
FR2209273A1 (fr) * 1972-12-05 1974-06-28 Dainippon Printing Co Ltd
DE3312014A1 (de) * 1983-04-02 1984-10-11 Wolfgang Prof. Dr. 7140 Ludwigsburg Eisenmenger Einrichtung zur beruehrungsfreien zertruemmerung von konkrementen im koerper von lebewesen
US4494100A (en) * 1982-07-12 1985-01-15 Motorola, Inc. Planar inductors

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3189767A (en) * 1963-01-28 1965-06-15 Gen Electric Ultrasonic transmitting means and method of producing same
FR2209273A1 (fr) * 1972-12-05 1974-06-28 Dainippon Printing Co Ltd
US4494100A (en) * 1982-07-12 1985-01-15 Motorola, Inc. Planar inductors
DE3312014A1 (de) * 1983-04-02 1984-10-11 Wolfgang Prof. Dr. 7140 Ludwigsburg Eisenmenger Einrichtung zur beruehrungsfreien zertruemmerung von konkrementen im koerper von lebewesen

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0435838A3 (en) * 1989-12-19 1991-10-02 International Business Machines Corporation Sputtering apparatus
GB2290171A (en) * 1994-06-03 1995-12-13 Plessey Semiconductors Ltd Inductor chip device
GB2290171B (en) * 1994-06-03 1998-01-21 Plessey Semiconductors Ltd Inductor chip device
US6837859B2 (en) 2001-09-10 2005-01-04 Siemens Aktiengesellschaft Shock wave source with a coil carrier having a non-circular contour
US6849053B2 (en) 2001-09-10 2005-02-01 Siemens Aktiengesellschaft Shock wave source with a wave damping coil carrier

Also Published As

Publication number Publication date
DE3663208D1 (en) 1989-06-08
DE3502770A1 (de) 1986-07-31
JPS61176334A (ja) 1986-08-08
EP0189781B1 (fr) 1989-05-03
JPH0459897B2 (fr) 1992-09-24

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