EP0201158B1 - Soudure par vagues vibrantes - Google Patents

Soudure par vagues vibrantes Download PDF

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Publication number
EP0201158B1
EP0201158B1 EP86301258A EP86301258A EP0201158B1 EP 0201158 B1 EP0201158 B1 EP 0201158B1 EP 86301258 A EP86301258 A EP 86301258A EP 86301258 A EP86301258 A EP 86301258A EP 0201158 B1 EP0201158 B1 EP 0201158B1
Authority
EP
European Patent Office
Prior art keywords
solder
nozzle
solder wave
wave
path
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP86301258A
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German (de)
English (en)
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EP0201158A3 (en
EP0201158A2 (fr
Inventor
Carlos A. Deambrosio
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Electrovert Ltd
Original Assignee
Electrovert Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Priority claimed from GB858511280A external-priority patent/GB8511280D0/en
Application filed by Electrovert Ltd filed Critical Electrovert Ltd
Publication of EP0201158A2 publication Critical patent/EP0201158A2/fr
Publication of EP0201158A3 publication Critical patent/EP0201158A3/en
Priority to MYPI87001369A priority Critical patent/MY100436A/en
Application granted granted Critical
Publication of EP0201158B1 publication Critical patent/EP0201158B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0661—Oscillating baths
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3468—Application of molten solder, e.g. dip soldering

Definitions

  • the present invention relates to wave soldering of printed wiring boards. More specifically, the preset invention relates to wave soldering of surface mounted devices or components on printed wiring boards as well as standard components on single sided, double sided and/or multi-layer boards.
  • the present methods of wave soldering surface mounted devices on printed wiring boards include systems having two solder waves.
  • the first solder wave typically has a narrow turbulent parabolic shape.
  • the narrow wave contacts a small area on the wiring board allowing gases to escape.
  • the gases are generated by flux volatiles and the like, which can inhibit solder wetting.
  • the narrow wave also provides a vertical pressure to force solder into the small spaces and openings between the components to ensure that all circuit pads, components, terminations, contacts, and the like, are wetted with solder.
  • the second solder wave is typically a solder wave as used in commercially available machines for soldering printed wiring boards with leaded components and the like.
  • the second wave completes the process and provides optimum exit conditions for the printed wiring boards leaving the solder wave to minimize or eliminate excess solder deposits and eliminate bridges between contacts.
  • the dual solder wave process has proven to be effective for soldering surface mounted devices onto printed wiring boards, but the process suffers from certain disadvantages.
  • One problem is excessive dross (oxide) production. Dual wave systems typically produce up to twice as much dross as single wave systems.
  • Another problem is the lack of fine control of a turbulent parabolic solder wave. Best soldering results have been obtained by immersing the printed wiring board as deeply as possible in this wave. However, the turbulence of the wave makes this task difficult and may result in solder flooding onto the top side of the printed wiring boards.
  • a still further problem with the dual solder wave process can occur when particles of dross, particles of carbonized oil or other particles in the solder stream block or partially block the narrow nozzle of the first solder wave. Such a blockage can affect the turbulent flow.
  • the present invention consists in a process for wave soldering a prefluxed element such as wave soldering surface mounted devices to a prefluxed printed wiring board, comprising the steps of moving the element along a predetermined path, forming a solder wave having a predetermined configuration beneath the path, so that at least a portion of the element passes through the solder wave, and producing an oscillation in the solder wave during the passage of the element therethrough, characterised in that the oscillation has a frequency in the range from 20 to 400 Hz.
  • the invention also consists in apparatus for wave soldering a prefluxed element such as surface mounted devices to a prefluxed printed wiring board, comprising means for moving the element along a predetermined path so that at least a portion of the element passes through a solder wave of predetermined configuration formed beneath the path, and oscillating means for producing oscillations in the solder wave during the passage of the element therethrough, characterised in that the oscillating means comprises at least one vibrating vane disposed in the solder wave, and a vibrator for oscillating the vibrating vane at a frequency in the range from 20 to 400 Hz.
  • the oscillation or vibration provided in the solder wave aids in filling small holes in a board, crevices, corners adjacent to solder masks and all other areas where solder wetting is difficult to achieve with conventional machines.
  • An additional benefit is overcoming problems that occur with thick dry film solder mask.
  • a relatively high frequency oscillation in the solder wave displaces or dislodges gas bubbles that form beneath the boards, allowing the solder to reach all areas in the matrix of components on the printed wiring boards, overcoming the repelling effect of any non-metallized elements such as component bodies, solder masks and the like.
  • the vibrating or oscillating concept of the present invention can be applied to existing types of solder wave machines for wave soldering, either as a permanent installation or a temporary installation for soldering certain difficult to solder elements.
  • the frequency of the oscillation and/ or the amplitude of the oscillation are controlled and at least one vibrating zone is formed in the solder wave.
  • the oscillation occurs in a direction substantially parallel to the path of the element and, in another embodiment, the oscillation occurs in a direction substantially perpendicular to the path of the element.
  • the vibrating vane may be in the form of a flat strip and extends in the solder wave substantially perpendicular to the path of the wiring board, and the vibrator oscillates the flat strip in a direction substantially parallel to the path of the wiring board.
  • a plurality of vibrating vanes are joined by a connector rod, and the vibrator oscillates the vanes in a direction substantially perpendicular to the path of the wiring board.
  • Means is preferably provided to enable adjustment of the frequency and/or amplitude of vibration over the frequency range of 20 to 400 cycles per second, and an amplitude range up to at least about 1.5 mm (0.060 ins.). Furthermore, the position of the vane in the solder wave is preferably adjustable. Means is also provided in one embodiment for optionally feeding a surface additive, such as oil, to the solder wave.
  • a surface additive such as oil
  • the solder wave is formed from a discharge nozzle facing upwards positioned above a solder reservoir with a pump means for forming the solder wave from the nozzle.
  • a vibrating vane is, in one embodiment, positioned in the solder wave and at least two zones of vibration are formed.
  • At least one adjustable passive vane is located in the solder wave downstream from the discharge nozzle at the element exit side.
  • the position of the passive vane provides a further zone of vibration to aid in separation of the element, such as a wiring board or the like, from the solder wave.
  • At least one liquid surface additive feeding tube may be positioned downstream of the passive vane and means is provided to supply liquid surface additive through the feeding tube to the surface of the solder wave.
  • Fig. 1 and 2 illustrate cross sections through a typical solder wave nozzle 10 such as that shown in Canadian Patent 1,002,391 to Elliott et al.
  • the nozzle 10 is connected to a solder supply conduit 11 by means of a flange 12. Solder enters the nozzle 10 and forms the desired shape of solder wave. The solder flows back into a solder pot 13.S;v, are
  • solder pot 13 Above the solder pot 13 is a wiring board, path 14 along which wiring boards 15 are conveyed.
  • the drawings illustrate a straight inclined path 14, however, the present invention may be applied to solder wave machines with horizontal or curved paths. Furthermore, the elements to be soldered may follow dip type paths in the solder wave as a reciprocal dip, curved dip or other path. Such a dipping step may be used for tinning one or more surfaces.
  • the printed wiring boards 15 have - surface mounted devices 16 with pads and contacts 17 to be coated with solder and form soldered connectios.
  • the entry side of the nozzle 10 has a guide 20 to provide a downward sloping path for a portion of the solder..
  • the exit solder wave flows to a weir plate 21.
  • Fig. 1 shows a vibrating vane 30 in the form of a flat strip positioned in the nozzle-10 extending along the length of the nozzle.
  • the vane 30 has a top edge shown to be substantially the same height as the top edge of the nozzle 10.
  • the top edge of the vane 30 may be below the top edge of the nozzle or higher than the top edge of the nozzle provided it is not so high as to- interfere with passage of the assembly being soldered.
  • a connecting rod 31 which in some nozzles may be two or more rods, pass through an aperture 32; in the exit side of the nozzle 10 to supports the vane 30.
  • the rods 31 connect to as vibrator 33 positioned away from the solder nozzle 10 above the solder pot 13.
  • the exact position of the vibrator 33 as well as the rods 31 to the vane or vanes 30 may be varied.
  • the vibrator may be located above or below the solder wave and is supported to ensure that vibration isitransmitted to the vane 30.
  • the frequency and/or amplitude of vibration is controllable by the vibrator 33.
  • solder wave It is preferred to vibrate the solder wave a sufficient amount so that gas bubbles that form beneath the wiring board 15 are displaced or dislodged, allowing solder to reach component terminations and other hard to reach areas to be soldered: Large gas bubbles may be broken into smaller ones and all the bubbles are continuously shifted allowing the solder to reach all areas.
  • the vibration is also sufficient to cause the molten solder to be forced up on either side of the surface mounted devices overcoming the repelling effect of the non metallized component bodies.
  • the solder then wets the metallic areas to be soldered; such: as component terminations, pads etcetera or forms solder joints as required.
  • the vibrating frequency together with the amplitude of vibration is adjustable to suit different types of wiring boards.
  • Figs 2 and 3 illustrate another embodiment wherein a series of short individual vanes 40 are positioned perpendicular to the length of the nozzle 10 and have a connecting rod 41 connecting all the vanes 40 together. Wherein one rod 41 is shown, it would be apparent that two or more rods may be used if necessary.
  • the rod 41 is supported at apertures 42 in the end plates 43 of the nozzle 10 and is connected to a vibrator 44 such that vibration occurs in a different plane to that shown in Fig. 1.
  • Fig. 1 illustrates that vibrations or oscillations occur substantially parallel with the travel of the wiring board path 14, and
  • Figs. 2 and 3 show that vibrations or oscillations occur substantially perpendicular to the travel of the wiring board path 14.
  • the position of the vanes 40 in the nozzle 10 may be raised or lowered and the number of vanes 40 may depend on the particular type of wave soldering machine and the particular type of printed wiring boards being soldered.
  • the size, shape, quantity and angle of vanes can be varied as required.
  • the vibrations or oscillations may be applied at any angle between the two directions shown in Figs. 1 and 2.
  • the vibrating vane 30 is connected to the vibrator 33 by one or more connecting rods 31.As shown in this figure, the top edge of the vibrating vane 30 protrudes slightly above the top edge of the nozzle 10. The top edge of the vane 30 must not interfere with the surface mounted devices on the wiring board 15.
  • the position ofthe vibrating vane 30 is adjustable for optimizing the vibrating characteristics and soldering results.
  • the wiring board path in Fig. 4 has a slope of 6o upwards in the direction oftravel. The slope angle of the path may vary from about 0 to 10° dependent upon the type of solder machine. Furthermore, curved paths or dip type paths may be provided through the solder wave.
  • two solderwave vibrating zones 50 and 51 are shown, one on each side of the vibrating vane 30 under the wiring board 15. These zones 50 and 51 allow the solder to reach all the areas requiring solder wetting.
  • A.further zone or zones of vibration 52 is formed by using a passive vane 53 on the exit side of the nozzle 10 before the weir plate 21.
  • the passive vane 53 may be located at the most suitable position avoiding the components on the printed wiring board 15, and the further vibration zone 52 preferably occurs between the nozzle and the weir. In one embodiment the further vibration zone occurs at the point or close to the point of separation of the board 15 from the solder wave.
  • the passive vane 53 also has a damping effect on the solder located between the weir 21 and the passive vane 53.
  • the U-shaped passive vane 53 shown in the drawing may be located at different positions in the exit trough 54 to vary the position of the further zone 52.
  • FIGs. 5 and 6 show a modification to the apparatus shown in Fig. 4 wherein a feeding tube 55 for a surface additive such as oil, is positioned adjacent to the weir 21 which allows an oil reservoir 56 to be formed between the tube 55 and the surface of the solder.
  • a thin coating of oil or other surface additive is created on the surface of the solder wave that reduces surface tension and at the same time reduces dross formation on the wave surface.
  • vanes need not necessarily be located in the nozzle itself, but may be positioned in the solder stream between the nozzle exit and the weir 21.
  • the vanes may be positioned on the input side of the solder wave indicated as zone 50 in Figs. 4 and 5. There are no random parameters in the vibratory wave because the frequency of oscillation and amplitude of oscillation are precisely controlled.
  • the shape or form of the vanes may be varied in orderto applyvibration at a suitable location in the solder wave. The suitable location being one which displaces or dislodges gas bubbles from underneath the wiring board, and allows solder to reach all areas to be soldered.
  • the vibrator can produce a frequency in the range of 20 to 400 cycles per second and can also vary the amplitude of vibration up to at least about 1.5 mm (0.060 inches).

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Molten Solder (AREA)

Claims (26)

1. Procédé de soudage à la vague d'un élément (15) préalablement enduit d'un flux, tel. que le soudage à la vague de dispositifs limontés en surface sur une carte de circuit imprimé préala blement enduite d'un flux, comprenant les étapes suivantes: le déplacement de l'élément suivant un trajet prédéterminé (14), la formation d'une vague de soudure ayant une configuration prédéterminée au-dessous du trajet afin qu'une partie au moins de l'élément passe dans laivague de soudure, et la création d'une oscillation dans la- vague de soudure pendant le passage de l'élément (15) dans la vague, caractérisé en ce que l'oscillation a une fréquence comprise entre 20 et 400 Hz.
2. Procédé selon la revendication 1, caractérisé en ce que la fréquence d'oscillation est réglable.
3. Procédé selon la revendications 1 du 2, caractérisé en ce que l'amplitude d'oscillation est réglable.
4. Procédé selon la revendication 1, 2 ou 3, caractérisé en ce que plusieurs zones oscillantes (50, 51, 52) sont formées dans là vague de soudure..
5. Procédé selon l'une quelconque des revendications précédentes, caractérisé en ce que l'oscillation est produite en direction sensiblement parallèle au trajet de l'élément.
6. Procédé selon l'une quelconqua des revendications 1 à 4, caractérisé en ce que l'oscillation est produite en direction sensiblement perpendiculaire au trajet de l'élément.
7. Procédé selon l'une quelconque des revendications précédentes, caractérisé par l'application d'un adjuvant superficiel (56) à la surface de la vague de soudure.
8. Appareil de soudage à la vague d'un élément (15) préalablement enduit de flux, par exemple de dispositifs montés en surface sur une carte de circuit imprimé préalablement enduite de flux, comprenant des moyens de déplacement de l'élément suivant un trajet prédéterminé (14) afin qu'une partie au moins de l'élément passe dans une vague de soudure de configuration prédéterminée formée sous ledit trajet, et des moyens d'oscillation (30, 40) destinés à créer des oscillations dans la vague de soudure lors du passage de l'élément (15) dans cette vague, caractérisé en ce que les moyens d'oscillation comportent au moins une palette vibrante (30, 40) placée dans la vague de soudure, et un vibrateur(33,44) destiné à faire osciller la palette vibrante (5) à une fréquence, comprise entre 20 et 400 Hz.
9. Appareil selon la revendication 8, caractérisé par au moins une tige (31, 41) de raccordement de la palette ou des palettes (30, 40) au vibrateur (33, 44), que est placé à distance de la vague de soudure.
10. Appareil selon la revendication 8 ou 9, caractérisé en ce que la palette ou chaque palette vibrante (30) est sous forme d'une bande plate qui est disposée dans la vague de soudure en direction sensiblement perpendiculaire au trajet (14) de l'élément (15), et le vibrateur (33) est disposé afin qu'il fasse osciller la bande plate en direction sensiblement parallèle au trajet (14) de l'élément.
11. Appareil selon la revendication 9, caractérisé en 'ce que plusieurs palettes vibrantes (40) sont raccordées par une tige (41), et le vibrateur (44) est agencé pour faire osciller les palettes en direction sensiblement perpendiculaire au trajet (14) de l'élément.
12. Appareil selon la revendication 8, 9, 10 ou 11, caractérisé en ce que le vibrateur (33, 44) comporte un dispositif de réglage de la fréquence d'oscillation produite par le vibrateur.
13. Appareil selon l'une quelconque des revendications 8 à 12, caractérisé en ce que le vibrateur (33, 44) comprend un dispositif de réglage de l'amplitude d'oscillation produite par le vibrateur.
14. Appareil selon la revendication 13, caractérisé en ce que l'amplitude est réglable jusqu'à une valeur au moins égale à 1, 5 mm (0, 060 pouce).
15. Appareil selon l'une quelconque des revendications 8 à 14, caractérisé en ce que la position de la palette ou d'au moins une palette vibrante (30, 40), dans la vague de soudure est réglable.
16. Appareil selon l'une quelconque des revendications précédentes 8 à 15, caractérisé par un dispositif (55) destiné à amener un adjuvant (56) à la surface de la vague de soudure.
17. Appareil selon l'une quelconque des revendications 8 à 16, caractérisé par un réservoir (13) destiné à contenir de la soudure fondue, une buse d'évacuation (10) tournée vers le haut et placée au-dessus du réservoir, et une pompe destinée à former la vague de soudure de configuration prédéterminée à l'aide de la buse.
18. Appareil selon la revendication 17, caractérisé en ce que deux zones au moins (50, 51) d'oscillation sont formées dans la vague de soudure, les zones étant placées de part et d'autre de la palette (30).
19. Appareil selon la revendication 18, caractérisé en ce qu'au moins un élément passif (53) est disposé dans la vague de soudure en aval de la buse d'évacuation (10) du côté de sortie des cartes de circuit, la position de l'élément passif provoquant la formation d'une zone supplémentaire (52) d'oscillation qui facilite la séparation de la carte de circuit de la vague de soudure.
20. Appareil selon la revendication 19, caractérisé par au moins un tube (55) destiné à amener un adjuvant liquide de surface, ce tube étant placé en aval de l'élément passif (53), et un dispositif destiné à transmettre un adjuvant liquide superficiel à la surface de la vague de soudure par l'intermédiaire de ce tube.
21. Appareil selon la revendication 17, 18, 19 ou 20, destiné à appliquer de la soudure à des surfaces métalliques exposées et à des surfaces métalliques en saillie sur une face d'une carte de circuit (15) ou analogue, caractérisé par
un réservoir (13) destiné à contenir de la soudure à un niveau prédéterminé,
une buse d'évacuation (10) tournée vers le haut et placée au-dessus du niveau de soudure dans le réservoir (13) et ayant un côté d'entrée et un côté de sortie de cartes de circuit,
une pompe destinée à former la vague de soudure de configuration prédéterminée à l'aide de la buse (10) afin que la vague soit au contact de la face inférieure de la carte de circuit (15) et au-dessus de toutes les surfaces métalliques en saillie,
un trajet (14) de cartes de circuit, ce trajet étant incliné vers le haut au-dessus du réservoir (13) et passant au-dessus de la buse (10), et
des moyens pour déplacer vers le haut une carte de circuit (15) le long du trajet à une vitesse prédéterminée du côté d'entrée au côté de sortie de la buse (10),
la buse (10) étant adaptée pour permettre l'écoulement d'une plus grande partie volumique de la vague de soudure vers le bas, du côté d'entrée, le côté d'entrée de la buse ayant un guide profilé (20) incliné vers le bas et adapté pour renvoyer la soudure vers le réservoir (13) en formant un courant régulier,
le côté de sortie de la buse ayant un plateau sensiblement rectangulaire qui lui est fixé et qui comporte un déversoir réglable (21) placé au bord du plateau et parallèlement au côté de sortie de la buse (10), la configuration du plateau, en coopération avec le déversoir (21), étant adaptée pour réduire la répercussion en retour des perturbations d'écoulement sur la vague de soudure et pour guider la partie volumique restante de la vague de soudure afin qu'elle forme un courant régulier horizontal ou incliné vers le bas pratiquement dans le même sens et approximativement à la même vitesse que la carte de circuit (15) qui se déplace en remontant le long du trajet (14).
22. Appareil selon la revendication 21, caractérisé en ce qu'une partie de réception de soudure est placée du côté d'entrée de carte de circuit entre la buse (10) et le niveau de soudure dans le réservoir (13), cette partie de réception ayant un dispositif réglable de guidage destiné à faire varier la section de cette partie entre le dispositif réglable de guidage et le guide profilé incliné vers le bas (20).
23. Appareil selon la revendication 21 ou 22, caractérisé en ce que la buse d'évacuation (10) a une paroi verticale du côté d'entrée de carte et une paroi inclinée vers l'intérieur du côté de sortie.
24. Appareil selon la revendication 21, 22 ou 23, caractérisé en ce que le déversoir réglable (21) placé au bord du plateau parallèlement au côté de sortie de la buse (10) est incliné vers l'intérieur vers la buse et forme un angle maximal de 15° avec la verticale.
25. Appareil selon la revendication 21, 22, 23 ou 24, caractérisé par une plaque déflectrice montée sous le déversoir réglable (21) et adaptée pour guider la soudure vers le réservoir (13).
26. Appareil selon l'une quelconque des revendications 21 à 25, caractérisé par au moins un trou d'évacuation placé dans le plateau rectangulaire à proximité de la buse (10).
EP86301258A 1985-05-03 1986-02-21 Soudure par vagues vibrantes Expired - Lifetime EP0201158B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
MYPI87001369A MY100436A (en) 1985-05-03 1987-08-18 Vibratory wave soldering.

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
GB858511280A GB8511280D0 (en) 1985-05-03 1985-05-03 Vibratory wave soldering
GB8511280 1985-05-03
CA000494984A CA1230426A (fr) 1985-05-03 1985-11-08 Soudure a la vague a vibrations pour cartes a cablage imprime
CA494984 1985-11-08

Publications (3)

Publication Number Publication Date
EP0201158A2 EP0201158A2 (fr) 1986-11-12
EP0201158A3 EP0201158A3 (en) 1987-06-03
EP0201158B1 true EP0201158B1 (fr) 1990-12-12

Family

ID=25670832

Family Applications (1)

Application Number Title Priority Date Filing Date
EP86301258A Expired - Lifetime EP0201158B1 (fr) 1985-05-03 1986-02-21 Soudure par vagues vibrantes

Country Status (9)

Country Link
US (1) US4684056A (fr)
EP (1) EP0201158B1 (fr)
CN (1) CN1003975B (fr)
AU (1) AU580236B2 (fr)
BR (1) BR8601972A (fr)
DE (1) DE3676111D1 (fr)
MY (1) MY100436A (fr)
NZ (1) NZ215973A (fr)
SG (1) SG36191G (fr)

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KR920008948B1 (ko) * 1987-02-12 1992-10-12 니혼 덴네쯔 게이기 가부시끼가이샤 프린트 기판의 납땜방법 및 그의 장치
NL8701237A (nl) * 1987-05-22 1988-12-16 Soltec Bv Inrichting voor het aanbrengen van geleidend hechtmiddel, zoals soldeer, op een kaart met bedrukte bedrading.
US4821947A (en) * 1988-02-08 1989-04-18 Union Carbide Corporation Fluxless application of a metal-comprising coating
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EP0201158A3 (en) 1987-06-03
DE3676111D1 (de) 1991-01-24
NZ215973A (en) 1988-10-28
CN86103013A (zh) 1986-10-29
AU580236B2 (en) 1989-01-05
CN1003975B (zh) 1989-04-19
SG36191G (en) 1991-06-21
AU5674586A (en) 1986-11-06
EP0201158A2 (fr) 1986-11-12
MY100436A (en) 1990-09-29
BR8601972A (pt) 1987-01-06
US4684056A (en) 1987-08-04

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