EP0202277A4 - Verfahren zur reduzierung des gesamthalidgehaltes eines epoxyharzes. - Google Patents

Verfahren zur reduzierung des gesamthalidgehaltes eines epoxyharzes.

Info

Publication number: EP0202277A4
Authority: EP; European Patent Office
Prior art keywords: weight; epoxy resin; percent; ketone; alkali metal
Prior art date: 1984-11-19
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Ceased

Application number

EP19850905721

Other languages

English (en)

French (fr)

Other versions

EP0202277A1 (de

Inventor

Chun S Wang

Wuu N Chen

Robert L Bowden

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Dow Chemical Co

Original Assignee

Dow Chemical Co

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1984-11-19

Filing date

1985-11-12

Publication date

1987-12-07

1985-09-09 Priority claimed from US06/773,500 external-priority patent/US4585838A/en

1985-11-12 Application filed by Dow Chemical Co filed Critical Dow Chemical Co

1986-11-26 Publication of EP0202277A1 publication Critical patent/EP0202277A1/de

1987-12-07 Publication of EP0202277A4 publication Critical patent/EP0202277A4/de

Status Ceased legal-status Critical Current

Links

239000003822 epoxy resin Substances 0.000 title claims abstract description 30
229920000647 polyepoxide Polymers 0.000 title claims abstract description 30
150000004820 halides Chemical class 0.000 title claims abstract description 23
238000000034 method Methods 0.000 title claims description 14
150000008044 alkali metal hydroxides Chemical class 0.000 claims abstract description 10
150000001875 compounds Chemical class 0.000 claims abstract description 7
238000010438 heat treatment Methods 0.000 claims abstract description 7
125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 7
150000002576 ketones Chemical group 0.000 claims abstract description 7
150000004945 aromatic hydrocarbons Chemical class 0.000 claims abstract description 6
ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical group CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 claims description 48
KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 claims description 45
HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical group [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 33
YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 31
239000002904 solvent Substances 0.000 claims description 17
239000000243 solution Substances 0.000 claims description 15
LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 12
XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 12
239000006184 cosolvent Substances 0.000 claims description 8
-1 polyoxyethylene Polymers 0.000 claims description 7
UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 claims description 6
239000002253 acid Chemical class 0.000 claims description 6
239000007864 aqueous solution Substances 0.000 claims description 5
150000007522 mineralic acids Chemical class 0.000 claims description 5
150000003839 salts Chemical class 0.000 claims description 5
238000005406 washing Methods 0.000 claims description 5
NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims description 4
229920003171 Poly (ethylene oxide) Polymers 0.000 claims description 3
ZZUFCTLCJUWOSV-UHFFFAOYSA-N furosemide Chemical compound C1=C(Cl)C(S(=O)(=O)N)=CC(C(O)=O)=C1NCC1=CC=CO1 ZZUFCTLCJUWOSV-UHFFFAOYSA-N 0.000 claims description 3
WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims description 3
NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 claims description 2
UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 claims description 2
CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 claims description 2
229910000147 aluminium phosphate Inorganic materials 0.000 claims description 2
BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical compound OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 claims description 2
229920001451 polypropylene glycol Polymers 0.000 claims description 2
239000008096 xylene Substances 0.000 claims description 2
OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims 1
125000003118 aryl group Chemical group 0.000 claims 1
229910052799 carbon Inorganic materials 0.000 claims 1
LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 abstract description 7
229920005989 resin Polymers 0.000 abstract description 6
239000011347 resin Substances 0.000 abstract description 6
239000011877 solvent mixture Substances 0.000 abstract description 6
125000001931 aliphatic group Chemical group 0.000 abstract description 2
VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 28
239000000203 mixture Substances 0.000 description 17
239000004593 Epoxy Substances 0.000 description 14
235000011118 potassium hydroxide Nutrition 0.000 description 13
229920003986 novolac Polymers 0.000 description 12
239000011541 reaction mixture Substances 0.000 description 11
FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 10
235000011121 sodium hydroxide Nutrition 0.000 description 10
229920001223 polyethylene glycol Polymers 0.000 description 9
ZRYCRPNCXLQHPN-UHFFFAOYSA-N 3-hydroxy-2-methylbenzaldehyde Chemical compound CC1=C(O)C=CC=C1C=O ZRYCRPNCXLQHPN-UHFFFAOYSA-N 0.000 description 8
239000002202 Polyethylene glycol Substances 0.000 description 7
239000012074 organic phase Substances 0.000 description 7
229940093932 potassium hydroxide Drugs 0.000 description 6
238000003756 stirring Methods 0.000 description 6
QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 5
239000003518 caustics Substances 0.000 description 5
229930003836 cresol Natural products 0.000 description 5
239000011780 sodium chloride Substances 0.000 description 5
ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 4
BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 4
238000013019 agitation Methods 0.000 description 4
238000009835 boiling Methods 0.000 description 4
239000000460 chlorine Substances 0.000 description 4
229910052801 chlorine Inorganic materials 0.000 description 4
GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical class C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 4
229940083608 sodium hydroxide Drugs 0.000 description 4
239000007787 solid Substances 0.000 description 4
CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
WMFOQBRAJBCJND-UHFFFAOYSA-M Lithium hydroxide Chemical compound [Li+].[OH-] WMFOQBRAJBCJND-UHFFFAOYSA-M 0.000 description 3
OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
238000006243 chemical reaction Methods 0.000 description 3
RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
150000007513 acids Chemical class 0.000 description 2
239000004841 bisphenol A epoxy resin Substances 0.000 description 2
JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
239000012071 phase Substances 0.000 description 2
239000000047 product Substances 0.000 description 2
LHENQXAPVKABON-UHFFFAOYSA-N 1-methoxypropan-1-ol Chemical compound CCC(O)OC LHENQXAPVKABON-UHFFFAOYSA-N 0.000 description 1
VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical class C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
229930185605 Bisphenol Natural products 0.000 description 1
LCGLNKUTAGEVQW-UHFFFAOYSA-N Dimethyl ether Chemical compound COC LCGLNKUTAGEVQW-UHFFFAOYSA-N 0.000 description 1
DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
229910019142 PO4 Inorganic materials 0.000 description 1
230000002411 adverse Effects 0.000 description 1
229910052783 alkali metal Inorganic materials 0.000 description 1
150000001340 alkali metals Chemical class 0.000 description 1
239000008346 aqueous phase Substances 0.000 description 1
KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
239000004327 boric acid Substances 0.000 description 1
239000007795 chemical reaction product Substances 0.000 description 1
ATUOYWHBWRKTHZ-UHFFFAOYSA-N dimethylmethane Natural products CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 1
150000002009 diols Chemical class 0.000 description 1
238000004821 distillation Methods 0.000 description 1
239000008393 encapsulating agent Substances 0.000 description 1
150000002118 epoxides Chemical class 0.000 description 1
125000003700 epoxy group Chemical group 0.000 description 1
SLGWESQGEUXWJQ-UHFFFAOYSA-N formaldehyde;phenol Chemical compound O=C.OC1=CC=CC=C1 SLGWESQGEUXWJQ-UHFFFAOYSA-N 0.000 description 1
235000011187 glycerol Nutrition 0.000 description 1
150000002334 glycols Chemical class 0.000 description 1
229940006116 lithium hydroxide Drugs 0.000 description 1
229910000403 monosodium phosphate Inorganic materials 0.000 description 1
235000019799 monosodium phosphate Nutrition 0.000 description 1
229920001568 phenolic resin Polymers 0.000 description 1
NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
239000010452 phosphate Substances 0.000 description 1
238000004382 potting Methods 0.000 description 1
239000001294 propane Substances 0.000 description 1
239000002002 slurry Substances 0.000 description 1
229910052708 sodium Inorganic materials 0.000 description 1
239000011734 sodium Substances 0.000 description 1
AJPJDKMHJJGVTQ-UHFFFAOYSA-M sodium dihydrogen phosphate Chemical compound [Na+].OP(O)([O-])=O AJPJDKMHJJGVTQ-UHFFFAOYSA-M 0.000 description 1
239000001488 sodium phosphate Substances 0.000 description 1
229910001220 stainless steel Inorganic materials 0.000 description 1
239000010935 stainless steel Substances 0.000 description 1
UWHCKJMYHZGTIT-UHFFFAOYSA-N tetraethylene glycol Chemical compound OCCOCCOCCOCCO UWHCKJMYHZGTIT-UHFFFAOYSA-N 0.000 description 1
150000004072 triols Chemical class 0.000 description 1

Classifications

- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/14—Polycondensates modified by chemical after-treatment
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/02—Polycondensates containing more than one epoxy group per molecule

Definitions

the present invention pertains to a process for reducing the hydrolyzable and/or bound (total) halide content of an epoxy resin.
Epoxy resins are used in the electronics industry as encapsulants, potting compounds, electrical laminates and the like. This industry has discovered that the halide content of the epoxy resin adversely affects the electrical properties of the resultant end products. The higher the halide content, the greater the detriment.
the present invention provides a pro ⁇ cess for reducing the total (hydrolyzable and/or bound) halide content of epoxy resins.
the present invention pertains to a process for reducing the total halide content of an epoxy resin containing hydrolyzable and/or bound halide which pro ⁇ cess comprises
step (F) washing the product from step (E) with either water, a dilute aqueous solution of a weak inorganic acid, acid salt or a combination thereof; and (G) recovering the resultant epoxy resin having a reduced total halide content from the product of step (F) .
Suitable epoxy resins which can be employed herein include any epoxy resin containing an average of more than one vicinal epoxy group per molecule and which contains an undesirable quantity of total, hydro ⁇ lyzable and/or bound halide.
Particularly suitable epoxy resins include the polyglycidyl ether of compounds having an average of more than one hydroxyl group per molecule and which contains at least 10 parts per million total halide such as, for example, glycidyl ethers of bisphenols, glycidyl ethers of phenol formaldehyde epoxy resins, cresol formaldehyde epoxy resins, and mixtures thereof.
Suitable ketones which can be employed herein include, for example, acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, and mixtures thereof.
Suitable aromatic hydrocarbons which can be employed herein include, for example, benzene, toluene, xylene, and mixtures thereof.
Suitable compounds having at least one ali ⁇ phatic hydroxyl group per molecule include, for example, aliphatic alcohols, diols and triols and polyoxyalkylene compounds having from 1 to 3 hydroxyl groups per molecule having an average molecular weight of from 100 to 600, preferably from 200 to 400, and mixtures thereof.
polyoxyethylene glycols sometimes referred to as polyethylene glycols, and mixtures thereof.
Suitable alkali metal hydroxides include, for example, sodium hydroxide, potassium hydroxide, lithium hydroxide, and mixtures thereof.
the alkali metal can be employed in solid form or as an aqueous solution, preferably as an aqueous solution in a concentration of from 10 to 70, preferably from 40 to 60 percent alkali metal hydroxide by weight.
the heating can be conducted at atmospheric or superatmospheric pressure.
superatmospheric pressure When relatively low boiling solvents are employed, superatmospheric pres ⁇ sure is usually required. It is preferred to employ a temperature of from 50°C up to 200°C, more preferably from 100° to 130°C. It is preferable to not employ a temperature above the boiling point of the solvent system. For low boiling solvent systems, pressure can be employed so that temperatures above the boiling point can be employed.
washing the epoxy resin to remove the salt formed and any unreacted alkali metal hydroxide it is preferred to employ a plurality of washing steps employing as the first wash a dilute solution of an inorganic acid or a dilute solution of an inorganic acid salt, preferably acids or acid salts having a pKa value of from 2 to 10, preferably from 2 to 7.
Suitable acids and acid salts include, for example, phosphoric acid, mono-sodium phosphate, di-sodiu phosphate, carbonic acid, boric acid, and mixtures thereof.
the epoxy resin is ultimately recovered by subjecting the organic phase from the washing procedure to distillation to remove the solvents from the epoxy resin.
75 G of a cresol-formaldehyde epoxy novolac resin having an average epoxide equivalent weight (EEW) of about 220 and an average epoxy functionality of about 6 containing 3536 ppm hydrolyzable chloride by weight was dissolved in 75 g of a 75/25 by weight mixture of methyl ethyl ketone ( EK) and toluene.
0.38 G (0.5 weight percent based on epoxy resin) of poly ⁇ ethylene glycol having an average molecular weight of about 400 was added to the solution and the solution was heated to 80°C with stirring.
1.05 G of 50 percent aqueous potassium hydroxide (1.25 eq. KOH to 1 eq. of hydrolyzable chloride) was added all at once and the reaction mixture was maintained at 80° for 2 hours (7200 s) with good agitation.
reaction mixture was diluted to 20 per ⁇ cent resin concentration with MEK/toluene solvent mix, neutralized with dilute H 3 P0 and then washed with water 3 to 4 times to remove NaCl.
Example 1 The procedure of Example 1 was followed employing the following components and conditions.
COSOLVENT HYDROLYZABLE CHLORIDE __£___ glycerine 181 methanol 95 isopropyl alcohol 84 monomethyl ether of propylene glycol 83 tetraethylene glycol 54 polyethylene glycol (200 MW) 60 polyethylene glycol (300 MW) 55 polyethylene glycol (400 MW) 54 polypropylene glycol (425 MW) 159
Example 1 The procedure of Example 1 was followed employing the following components and conditions.
the tem ⁇ perature was raised to 65°C and the pressure was reduced to 180 mm Hg (24 kPa) absolute.
To the resultant solution was continuously added 75.2 g (0.94 equivalent) of 50 percent aqueous sodium hydroxide solution at a constant rate over a period of 4 hours (14400 s).
the sodium hydrox ⁇ ide the water was removed by codistilling with epi- chlorohydrin and solvent. The distillate was condensed thereby forming two distinct phases, an aqueous phase (top) and an organic epichlorohydrin-solvent phase (bottom) .
the organic phase was continuously returned to the reactor.
the reaction mixture was maintained at a temperature of 65° and a pressure of about 180 mm Hg (24 kPa) absolute for an additional 30 minutes (1800 s).
the resulting cresol-formaldehyde epoxy novolac resin was then distilled under full vacuum and temperature up to 170°C .to remove all epichlorohydrin and l-methoxy-2- -hydroxy propane.
reaction mixture was diluted to 20 per ⁇ cent resin concentration with MEK/toluene (75/25) solvent mixture, neutralized with C0 2 and then washed with water 4 to 5 times to remove NaCl.
reaction mixture was diluted to 20 per- cent solid concentration with MEK/toluene solvent ixture, neutralized with dilute H 3 P0 4 and then washed with water several times to remove NaCl.
aqueous potassium hydroxide 2 eq. caustic to 1 eq. chlorine
reaction mixture was diluted to 20 per ⁇ cent solid concentration with MEK/toluene solvent mixture, neutralized with C0 2 and then washed with water several times to remove NaCl.
reaction mixture was diluted to 20 per ⁇ cent solid concentration with MEK/toluene solvent mixture, neutralized with C0 2 and then washed with water several times to remove NaCl.

Landscapes

Chemical & Material Sciences (AREA)
Health & Medical Sciences (AREA)
Chemical Kinetics & Catalysis (AREA)
Medicinal Chemistry (AREA)
Polymers & Plastics (AREA)
Organic Chemistry (AREA)
General Chemical & Material Sciences (AREA)
Epoxy Resins (AREA)
Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Epoxy Compounds (AREA)

EP19850905721 1984-11-19 1985-11-12 Verfahren zur reduzierung des gesamthalidgehaltes eines epoxyharzes. Ceased EP0202277A4 (de)

Applications Claiming Priority (6)

Application Number	Priority Date	Filing Date	Title
US67277584A	1984-11-19	1984-11-19
US672775		1984-11-19
US76297185A	1985-08-06	1985-08-06
US06/773,500 US4585838A (en)	1985-08-06	1985-09-09	Process for preparing epoxy resins containing low levels of total halide
US773500		1985-09-09
US762971		1991-09-20

Publications (2)

Publication Number	Publication Date
EP0202277A1 EP0202277A1 (de)	1986-11-26
EP0202277A4 true EP0202277A4 (de)	1987-12-07

Family

ID=27418256

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
EP19850905721 Ceased EP0202277A4 (de)	1984-11-19	1985-11-12	Verfahren zur reduzierung des gesamthalidgehaltes eines epoxyharzes.

Country Status (12)

Country	Link
EP (1)	EP0202277A4 (de)
KR (1)	KR900001943B1 (de)
CN (1)	CN1004356B (de)
AU (1)	AU560379B2 (de)
BR (1)	BR8507064A (de)
CA (1)	CA1257446A (de)
ES (1)	ES8701206A1 (de)
FI (1)	FI862961L (de)
IL (1)	IL77036A (de)
MY (1)	MY101828A (de)
NO (1)	NO165078C (de)
WO (1)	WO1986003210A1 (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US4785061A (en) *	1987-08-13	1988-11-15	The Dow Chemical Company	Method for reducing the aliphatic halide content of epoxy resins using a solvent mixture including a polar aprotic solvent
US7955498B2 (en) *	2008-12-16	2011-06-07	Chevron, U.S.A. Inc.	Reduction of organic halide contamination in hydrocarbon products

Citations (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US3928288A (en) *	1973-04-11	1975-12-23	Dow Chemical Co	Epoxy novolac resins having a narrow molecular weight distribution and process therefor
US4485221A (en) *	1983-11-03	1984-11-27	Ciba-Geigy Corporation	Process for making epoxy novolac resins with low hydrolyzable chlorine and low ionic chloride content

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
BE503550A (de) *	1950-05-27
NL98450C (de) *	1955-03-28
US2943095A (en) *	1955-06-28	1960-06-28	Union Carbide Corp	Process for preparing glycidyl polyethers of polyhydric phenols
NL270270A (de) *	1960-10-17
US4447598A (en) *	1983-04-07	1984-05-08	The Dow Chemical Company	Method of preparing epoxy resins having low hydrolyzable chloride contents

1985
- 1985-11-08 CN CN85108970.4A patent/CN1004356B/zh not_active Expired
- 1985-11-12 AU AU50915/85A patent/AU560379B2/en not_active Ceased
- 1985-11-12 KR KR1019860700472A patent/KR900001943B1/ko not_active Expired
- 1985-11-12 BR BR8507064A patent/BR8507064A/pt unknown
- 1985-11-12 FI FI862961A patent/FI862961L/fi not_active Application Discontinuation
- 1985-11-12 WO PCT/US1985/002210 patent/WO1986003210A1/en not_active Ceased
- 1985-11-12 EP EP19850905721 patent/EP0202277A4/de not_active Ceased
- 1985-11-13 IL IL77036A patent/IL77036A/xx not_active IP Right Cessation
- 1985-11-18 CA CA000495522A patent/CA1257446A/en not_active Expired
- 1985-11-18 ES ES548999A patent/ES8701206A1/es not_active Expired
1986
- 1986-07-18 NO NO862909A patent/NO165078C/no unknown
1987
- 1987-08-25 MY MYPI87001452A patent/MY101828A/en unknown

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US3928288A (en) *	1973-04-11	1975-12-23	Dow Chemical Co	Epoxy novolac resins having a narrow molecular weight distribution and process therefor
US4485221A (en) *	1983-11-03	1984-11-27	Ciba-Geigy Corporation	Process for making epoxy novolac resins with low hydrolyzable chlorine and low ionic chloride content

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN, vol. 7, no. 100 (C-164)[1245], 28th April 1983; & JP-A-58 24 578 (MITSUI SEKIYU KAGAKU KOGYO K.K.) 14-02-1983 *
See also references of WO8603210A1 *

Also Published As

Publication number	Publication date
FI862961A7 (fi)	1986-07-16
AU560379B2 (en)	1987-04-02
EP0202277A1 (de)	1986-11-26
CN1004356B (zh)	1989-05-31
IL77036A (en)	1989-07-31
CA1257446A (en)	1989-07-11
WO1986003210A1 (en)	1986-06-05
ES8701206A1 (es)	1986-11-16
NO165078C (no)	1990-12-19
NO862909D0 (no)	1986-07-18
KR870700658A (ko)	1987-12-30
FI862961A0 (fi)	1986-07-16
IL77036A0 (en)	1986-04-29
NO862909L (no)	1986-07-18
ES548999A0 (es)	1986-11-16
BR8507064A (pt)	1987-05-05
MY101828A (en)	1992-01-31
CN85108970A (zh)	1986-07-09
NO165078B (no)	1990-09-10
KR900001943B1 (ko)	1990-03-26
AU5091585A (en)	1986-06-18
FI862961L (fi)	1986-07-16

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Publication	Publication Date	Title
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EP0203473A2 (de)	1986-12-03	Verfahren zur Herstellung von Epoxidharzen
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US4558116A (en)	1985-12-10	Process for preparing relatively high molecular weight epoxy resins
AU633177B2 (en)	1993-01-21	Process for reducing the undesirable halide content of epoxy resins
EP0340716A2 (de)	1989-11-08	Herstellung von Epoxydharzen
EP0065564B1 (de)	1986-04-02	Verfahren zur herstellung hochmolekularer, hydrolysierte glycidylgruppen enthaltender epoxyharze
JPS6335171B2 (de)	1988-07-13
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KR100296249B1 (ko)	2001-10-24	알파-글리콜-함유글리시딜에테르수지제조방법