EP0212764A2 - Connecteur haute densité à impédance contrôlée - Google Patents

Connecteur haute densité à impédance contrôlée Download PDF

Info

Publication number
EP0212764A2
EP0212764A2 EP86300288A EP86300288A EP0212764A2 EP 0212764 A2 EP0212764 A2 EP 0212764A2 EP 86300288 A EP86300288 A EP 86300288A EP 86300288 A EP86300288 A EP 86300288A EP 0212764 A2 EP0212764 A2 EP 0212764A2
Authority
EP
European Patent Office
Prior art keywords
high density
wafers
electrical connector
conductive
conductive elements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
EP86300288A
Other languages
German (de)
English (en)
Other versions
EP0212764A3 (fr
Inventor
Amir-Akbar Sadigh-Behzadi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Criton Technologies Partn Comp Of Criton Corp Bsb Diversified Co Inc Royal Zenith Corp D/b/a Viking Connectors Co
Original Assignee
Criton Technologies Partn Comp Of Criton Corp Bsb Diversified Co Inc Royal Zenith Corp D/b/a Viking Connectors Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Criton Technologies Partn Comp Of Criton Corp Bsb Diversified Co Inc Royal Zenith Corp D/b/a Viking Connectors Co filed Critical Criton Technologies Partn Comp Of Criton Corp Bsb Diversified Co Inc Royal Zenith Corp D/b/a Viking Connectors Co
Publication of EP0212764A2 publication Critical patent/EP0212764A2/fr
Publication of EP0212764A3 publication Critical patent/EP0212764A3/fr
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/721—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures cooperating directly with the edge of the rigid printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6581—Shield structure
    • H01R13/6585—Shielding material individually surrounding or interposed between mutually spaced contacts
    • H01R13/6586—Shielding material individually surrounding or interposed between mutually spaced contacts for separating multiple connector modules
    • H01R13/6587—Shielding material individually surrounding or interposed between mutually spaced contacts for separating multiple connector modules for mounting on PCBs

Definitions

  • the present invention relates to a high density, controlled impedance connector and, more particularly, to a high density connector which may be utilized to mate a plurality of modules (daughter boards) to a backplane (mother board) wherein each electrical connection has a controlled impedance and a minimum amount of crosstalk.
  • a flat cable formed with a plurality of flat conductors and surrounded on its upper and lower surface by a ground plane, thus forming a stripline may be found in U.S. Letters Patent No. 3,612,744, issued October 12, 1971 and invented by P.J. Thomas.
  • a second flat cable in the form of a microstrip is described in U.S. Letters Patent No. 4,441,088, which issued April 3, 1984 by C.J. Anderson.
  • the Anderson patent discusses the reduction of crosstalk by adjusting the amount of dielectric material between the flat conductor and the ground plane in proportion to the amount of dielectric material placed over the flat conductor.
  • a later connector for shielding electrical contacts therein to permit a high frequency signal to pass there through utilizing a stripline configuration is shown in an IBM Technical Disclosure Bulletin, Volume 10, No. 3, August 1967, pp. 203-4. This connector does not contemplate a high density connector as in the present invention.
  • a further object is to provide a high density connector which may be easily configured to accomodate different sized printed circuit boards and different mounting configurations.
  • Yet a further object is to provide a configuration for an electrical connector which may be easily replaced and repaired.
  • a still further object of this invention is to provide a high density, controlled impedance connector, which is economic, flexible and expandable.
  • a discrete wafer formed from a dielectric material having a plurality of conductive elements mounted by said wafer.
  • a single, ground plane element for connection to an electrical ground is also mounted by the wafer.
  • the discrete wafers are then stacked side-by-side in an arrangement which permits the ground plane, mounted by two wafers, to surround the plurality of conductive elements, mounted by a single discrete wafer. This arrangement creates a stripline configuration for the plurality of conductive elements, whose configuration controls the impedance of the conductive elements.
  • Figs. 1-5 illustrate one embodiment of the high density connector 10 wherein Fig. 1 is a side view showing various components of the connector including a discrete wafer 12 which, in'this alternative embodiment, mounts a plurality of signal carrying contact elements 14 adjacent to which is mounted a single ground plane element 16.
  • a discrete wafer 12 which, in'this alternative embodiment, mounts a plurality of signal carrying contact elements 14 adjacent to which is mounted a single ground plane element 16.
  • Each discrete wafer 12 is placed in a side-by-side stack with other discrete wafers 12 having ground plane elements 16 placed therebetween as best seen in Fig. 4.
  • the individual contact elements 14 are encapsulated within the insulating, dielectric material of wafer 14 and surrounded on each side by ground planes 16 for creating a stripline arrangement for each contact element 14.
  • the individual contact elements 14 are fabricated to form a ninety degree turn (Fig. 5) which is terminated at each end by a pair of spring wiping finger 18.
  • the ground plane elements 16 are each provided with four spring wiping fingers 19 (Fig. 4).
  • the spring fingers 18 and 19 are bent at an angle to the right in Figs. 1, 2 and 4 with fingers 18 extending from each wafer 12 at a surface which has been recessed at 20 to permit flexure in the right-hand direction.
  • the right-hand flexure of the spring fingers 18 and 19 fits over adjacent spring fingers so that a high density of these fingers may be accommodated within the side-by-side stack of wafers 12.
  • a spacer 22 is provided at the far right edge of each stack, followed by a mounting bracket 24.
  • the ground plane element 16 and spacers 22 have a configuration similar to the configuration of wafer 12 including a recess 23. It may now be seen that the purpose of the spacer 22 and its recess 23 is to provide an area into which the spring fingers 18 and 19 may flex when the connector 10 is assembled against a printed circuit board.
  • the addition of the mounting brackets 24 on opposite sides of the wafer stack completes the assembly.
  • the wafers 12, ground plane elements 16, spacers 22 and mounting brackets 24 are assembled in a stack which may be formed by a series of repeated parts to any desired length. These parts are provided with a plurality of apertures including three smaller apertures 25 for receiving a set of locating shafts 26 and a larger aperture 27 for receiving a support shaft 28.
  • the connector 10 is thus assembled by stacking a mounting bracket 24 on the left-hand end of the stack followed by a ground plane element 16, a wafer 12, and a ground plane element 16 until a predetermined number of wafers and ground plane elements have been stacked upon the shafts 26 and 28. It should be noted here that the number of ground plane elements 16 is one more than the ground plane elements 12.
  • the stack is then followed by a spacer 22 which provides the recesses 23 into which the spring fingers 18 for contacts 14 and spring fingers 19 for ground plane 16 extend.
  • the next element in the stack is a second mounting bracket 24.
  • the stack is typically 12" x 1/2" x 1/2" in size.
  • the support shaft 28 receives a screw 30 at each end whose threads pass through a clearance hole in bracket 24 into the internally threaded end of shaft 28 for compressing and retaining the 12" stack in its desired configuration.
  • each bracket 24 having four locating pins 32 extending from two adjacent surfaces.
  • a first surface mounts a backplane or mother board 34 wherein locating pins 32 are received by apertures 36 within the board 34.
  • Mounted at a right angle, or ninety degrees to the mother board 34 is a module or daughter board 38, also having apertures 36 therein for receiving the locating pins 32.
  • the mother and daughter boards 34 and 38 are retained against the connector 10 by suitable fastening means, such as screws 40.
  • suitable fastening means such as screws 40.
  • the screws 40 pass through the boards 34 and 38 into threaded holes in the mounting brackets 34.
  • the wafers 12 are illustrated with the contact elements 14 encapsulated therein. It will be understood that the spring fingers 18 of contact elements 14 are compressed against the mother and daughter boards 34 and 38 within the recesses 20 to make an electrical connection therebetween.
  • the spring fingers 18 contact suitable pads 42 such as those shown in Fig. 6 mounted upon the daughter board 38. Each individual pad 42 is provided with apertures 44 to make an electrical connection to the far side of the daughter board where connection with electrical conductors (not shown) is completed.
  • the spring fingers 19 on the ground plane elements 16 contact a pair of conductive strips 46 on either side of the pads 42.
  • the connector 10 consists of a stack of five brackets 24, four spacers 22, two hundred and four wafers 12 and two hundred and eight ground planes 14.
  • the reader will remember that, in the embodiment shown, there are four substacks of wafers 12 so that the one additional ground plane 16 in each substack totals the four additional ground planes in the completed stack.
  • the arrangement shown provides for eight hundred and sixteen signal contacts made by spring fingers 18 and four hundred and sixteen ground contacts made by fingers 19.
  • a discrete dielectric wafer 52 is molded from suitable insulation materials, such as polysulfone, to mount a plurality of individual conductive contact elements 54, Fig. 9, on one side, and to mount a single ground plane element 56 on the other side thereof, Fig. 10.
  • Each individual signal contact 54 is constructed with an arcuate curve of ninety degrees which is terminated at each end by a spring wiping fingers 58.
  • the spring fingers 58 are shown in their compressed position in Figs. 9 and 10 as if pressed against a printed circuit board such as boards 34 or 38.
  • the ground plane element 56 is also provided with a plurality of spring fingers 59, which coincide in their spacing with each individual spring finger 58 from the contact elements 54.
  • the contact elements 54 and ground plane elements 56 may be constructed from beryllum copper or other suitable alloys.
  • the dielectric wafer wafer 52 is molded into a hexagonal shape having first and second generally flat surfaces 60 and 62 (Fig. 7).
  • the first surface 60 is provided with a plurality of grooves 64, eight are shown in the preferred embodiment of Fig. 8, which received the arcuate contact elements 54.
  • Two edges of surface 60 arranged at right angles to one another are relieved along those edges to a depth equal to the depth of grooves 64 to form recesses 66. These recesses 66 provide clearance for the motion of the spring fingers 58 as they are pressed against the printed circuit boards.
  • the second surface 62 of wafer 52 is provided with a single recess 68 which receives the ground plane element 56. Recess 68 extends to the two edges of the hexagonal wafer 52 that are arranged at ninety degrees to one another to permit the spring fingers 59 of the ground plane element 56 to be exposed to the printed circuit boards opposite fingers 58.
  • a slotted housing 72 is provided to receive that discrete wafers 52.
  • Housing 72, Fig. 14 has a hexagonal cross section and is molded from a suitable insulated material, such as polysulfone, with a plurality of slots 74 which are open along two edge surfaces arranged at a right angle to one another.
  • the slots 74 are arranged to receive the wafers 52, contact elements 54, and ground planes 56.
  • the housing 72 thus forms a first housing for mounting the plurality of wafers 52. Housing 72 is then inserted into an elongated opening 76 in the second housing 78. The insertion of first housing 72 into elongated openings 76 may be accomplished by removing the top of housing 78. However, in the preferred embodiment, a pie shaped piece 79 is removed. Housing 72 is then rotated slightly and inserted into opening 76 so as not to injure the spring fingers 58 and 59. By rotating the housing 72, it is possible to insert the housing 72 into slot 76 far enough to permit the clearance of contacts 58 and 59 into the left-hand opening of slot 76.
  • the wedge member 79 may be replaced and retained by suitable fastening means, such as screws, not shown.
  • the second housing 78 is provided with locating pins 80 and threaded apertures 81 for aligning and mounting the connector 50 to suitable printed circuit boards 82 and 84, or by screws 85, Fig. 12.
  • the stack of wafers 52 comprises a ground plane 56 at the far left-hand end of the slot 76 adjacent housing 72.
  • the ground plane is mounted by the wafer 52 whose next surface mounts the contact elements 54.
  • This alternate stack continues until the far right-hand end of slot 76 wherein the last wafer 52 includes only the ground plane 56.
  • slot 76 may mount one hundred and one wafers 52 therein having one hundred sets of contact elements 54 and one hundred and one sets of ground plane elements 56.
  • This configuration mounts a total of sixteen hundred and eight spring finger contacts 54 and 56.
  • the spring fingers 54 and 56 are shown schematically in Figs. 11 and 13 as simple dots.
  • the spring fingers 58 of contact elements 54 slide across pads 86 (Fig. 15) to make electrical contact with the board 82.
  • the spring fingers 59 of the ground plane elements 56 slide across conductive strips 88 to complete the stripline circuit formed by surrounding contact elements 54 by ground planes 56.
  • each contact 54 has been formed with the side-by-side ground planes 56 equal distance from the contacts 54.
  • the ground planes 56 are separated by a distance "b” whereas the contact elements 54 having a width "w” and a thicknes “t” are spaced from the bottom ground plane 56 by a distance "H”.
  • the contacts 54 are spaced apart by a pitch "P”.
  • the impedance Z o of each contact 54 may be expressed by the equation: . wherein:
  • Crosstalk within connector 50 may be reduced by providing a thicker spring finger 59 for each ground plane 56 than the related spring finger 58 for each contact 54. This configuration is shown in Fig. 17. Crosstalk may also be reduced by adjusting the ratio of the distance between two adjacent contact elements 54 or pitch "P" in proportion to the height "H" of the contacts 54 above the ground plane 56. The percentage of reduction of crosstalk versus the pitch to height ratio (P/H) is shown in Fig. 18. By adjusting the pitch of the contact elements 54 or the equal spacing of these contacts from the ground planes 56, it is possible to reduce crosstalk significantly as shown by the curve of Fig. 18.
  • the connector 50 and its housing 78 may be modified wherein the contacts 54 extend through a 180 degree arc to mount the two boards 82 and 84 in a parallel in-line configuration, Fig. 19. Further, the connector 50 and its housing 78 may be modified to accommodate the contacts in a straight line configuration wherein the two boards 82 and 84 are mounted in a parallel configuration, one upon the other, Fig. 20.
  • the preferred embodiment has also shown the spring fingers 58 from the contact elements 54 mounted in alternating rows with fingers 59 from the ground planes element 56. Such an arrangement is shown schematically in Fig. 21. There are other embodiments, however, where it may be desirable to place the spring fingers 58 in an immediate side-by-side relationship separated by a pair of ground plane elements 56. Such an arrangement is shown in Fig. 22. This arrangement may be easily accomplished by the present invention.

Landscapes

  • Coupling Device And Connection With Printed Circuit (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Multi-Conductor Connections (AREA)
EP86300288A 1985-08-05 1986-01-17 Connecteur haute densité à impédance contrôlée Ceased EP0212764A3 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US76270685A 1985-08-05 1985-08-05
US762706 1985-08-05

Publications (2)

Publication Number Publication Date
EP0212764A2 true EP0212764A2 (fr) 1987-03-04
EP0212764A3 EP0212764A3 (fr) 1989-02-08

Family

ID=25065833

Family Applications (1)

Application Number Title Priority Date Filing Date
EP86300288A Ceased EP0212764A3 (fr) 1985-08-05 1986-01-17 Connecteur haute densité à impédance contrôlée

Country Status (3)

Country Link
EP (1) EP0212764A3 (fr)
JP (1) JPS6235472A (fr)
CA (1) CA1244531A (fr)

Cited By (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0365179A1 (fr) * 1988-10-17 1990-04-25 The Whitaker Corporation Système de connecteur électrique
EP0614202A3 (en) * 1993-03-05 1997-07-02 Matsushita Electric Industrial Co Ltd Three-terminal capacitor and assembly.
WO1997036349A1 (fr) * 1996-03-28 1997-10-02 Teradyne, Inc. Assemblage de connecteur electrique a partir de galettes
EP0836756A4 (fr) * 1995-07-03 1999-08-25 Berg Tech Inc Connecteur, de preference a angle droit, a ensemble integre carte a circuits imprimes
US6379188B1 (en) 1997-02-07 2002-04-30 Teradyne, Inc. Differential signal electrical connectors
WO2002065590A1 (fr) * 2001-02-12 2002-08-22 Perlos Oyj Connecteur et tranche de contact
EP1420480A3 (fr) * 2000-02-03 2004-06-02 Teradyne, Inc. Connecteur haute vitesse ayant un montage par pression
US7549897B2 (en) 2006-08-02 2009-06-23 Tyco Electronics Corporation Electrical connector having improved terminal configuration
US7591655B2 (en) 2006-08-02 2009-09-22 Tyco Electronics Corporation Electrical connector having improved electrical characteristics
US7887371B2 (en) 2004-06-23 2011-02-15 Amphenol Corporation Electrical connector incorporating passive circuit elements
US8231415B2 (en) 2009-07-10 2012-07-31 Fci Americas Technology Llc High speed backplane connector with impedance modification and skew correction
US8366485B2 (en) 2009-03-19 2013-02-05 Fci Americas Technology Llc Electrical connector having ribbed ground plate
US8382524B2 (en) 2010-05-21 2013-02-26 Amphenol Corporation Electrical connector having thick film layers
US8591257B2 (en) 2011-11-17 2013-11-26 Amphenol Corporation Electrical connector having impedance matched intermediate connection points
US8734185B2 (en) 2010-05-21 2014-05-27 Amphenol Corporation Electrical connector incorporating circuit elements
USD718253S1 (en) 2012-04-13 2014-11-25 Fci Americas Technology Llc Electrical cable connector
US8905651B2 (en) 2012-01-31 2014-12-09 Fci Dismountable optical coupling device
USD720698S1 (en) 2013-03-15 2015-01-06 Fci Americas Technology Llc Electrical cable connector
US8944831B2 (en) 2012-04-13 2015-02-03 Fci Americas Technology Llc Electrical connector having ribbed ground plate with engagement members
USD727268S1 (en) 2012-04-13 2015-04-21 Fci Americas Technology Llc Vertical electrical connector
USD727852S1 (en) 2012-04-13 2015-04-28 Fci Americas Technology Llc Ground shield for a right angle electrical connector
USD733662S1 (en) 2013-01-25 2015-07-07 Fci Americas Technology Llc Connector housing for electrical connector
US9543703B2 (en) 2012-07-11 2017-01-10 Fci Americas Technology Llc Electrical connector with reduced stack height
US9831605B2 (en) 2012-04-13 2017-11-28 Fci Americas Technology Llc High speed electrical connector

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2666338B2 (ja) * 1988-03-31 1997-10-22 三菱マテリアル株式会社 炭化タングステン基超硬合金製エンドミル
US6530790B1 (en) * 1998-11-24 2003-03-11 Teradyne, Inc. Electrical connector
USD751507S1 (en) 2012-07-11 2016-03-15 Fci Americas Technology Llc Electrical connector

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1001569A (en) * 1962-05-15 1965-08-18 Brown Engineering Company Inc Improvements in and relating to a printed circuit board connector
US3401369A (en) * 1966-06-07 1968-09-10 Ibm Connector
US3601772A (en) * 1970-05-20 1971-08-24 Berg Electronics Inc Header block assembly
US3601753A (en) * 1970-06-10 1971-08-24 Ibm Coaxial interface connector
US4469389A (en) * 1982-07-06 1984-09-04 Amp Incorporated Rotatable cam actuated connector for circuit board edge

Cited By (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0365179A1 (fr) * 1988-10-17 1990-04-25 The Whitaker Corporation Système de connecteur électrique
EP0614202A3 (en) * 1993-03-05 1997-07-02 Matsushita Electric Industrial Co Ltd Three-terminal capacitor and assembly.
EP0836756A4 (fr) * 1995-07-03 1999-08-25 Berg Tech Inc Connecteur, de preference a angle droit, a ensemble integre carte a circuits imprimes
WO1997036349A1 (fr) * 1996-03-28 1997-10-02 Teradyne, Inc. Assemblage de connecteur electrique a partir de galettes
US5702258A (en) * 1996-03-28 1997-12-30 Teradyne, Inc. Electrical connector assembled from wafers
US6379188B1 (en) 1997-02-07 2002-04-30 Teradyne, Inc. Differential signal electrical connectors
EP1420480A3 (fr) * 2000-02-03 2004-06-02 Teradyne, Inc. Connecteur haute vitesse ayant un montage par pression
WO2002065590A1 (fr) * 2001-02-12 2002-08-22 Perlos Oyj Connecteur et tranche de contact
US7887371B2 (en) 2004-06-23 2011-02-15 Amphenol Corporation Electrical connector incorporating passive circuit elements
US8123563B2 (en) 2004-06-23 2012-02-28 Amphenol Corporation Electrical connector incorporating passive circuit elements
US7549897B2 (en) 2006-08-02 2009-06-23 Tyco Electronics Corporation Electrical connector having improved terminal configuration
US7591655B2 (en) 2006-08-02 2009-09-22 Tyco Electronics Corporation Electrical connector having improved electrical characteristics
US8366485B2 (en) 2009-03-19 2013-02-05 Fci Americas Technology Llc Electrical connector having ribbed ground plate
US10720721B2 (en) 2009-03-19 2020-07-21 Fci Usa Llc Electrical connector having ribbed ground plate
US9461410B2 (en) 2009-03-19 2016-10-04 Fci Americas Technology Llc Electrical connector having ribbed ground plate
US9048583B2 (en) 2009-03-19 2015-06-02 Fci Americas Technology Llc Electrical connector having ribbed ground plate
US8231415B2 (en) 2009-07-10 2012-07-31 Fci Americas Technology Llc High speed backplane connector with impedance modification and skew correction
US8734185B2 (en) 2010-05-21 2014-05-27 Amphenol Corporation Electrical connector incorporating circuit elements
US11336060B2 (en) 2010-05-21 2022-05-17 Amphenol Corporation Electrical connector having thick film layers
US8382524B2 (en) 2010-05-21 2013-02-26 Amphenol Corporation Electrical connector having thick film layers
US10186814B2 (en) 2010-05-21 2019-01-22 Amphenol Corporation Electrical connector having a film layer
US9722366B2 (en) 2010-05-21 2017-08-01 Amphenol Corporation Electrical connector incorporating circuit elements
US8591257B2 (en) 2011-11-17 2013-11-26 Amphenol Corporation Electrical connector having impedance matched intermediate connection points
US8905651B2 (en) 2012-01-31 2014-12-09 Fci Dismountable optical coupling device
USD727268S1 (en) 2012-04-13 2015-04-21 Fci Americas Technology Llc Vertical electrical connector
USD718253S1 (en) 2012-04-13 2014-11-25 Fci Americas Technology Llc Electrical cable connector
US9831605B2 (en) 2012-04-13 2017-11-28 Fci Americas Technology Llc High speed electrical connector
USD727852S1 (en) 2012-04-13 2015-04-28 Fci Americas Technology Llc Ground shield for a right angle electrical connector
US8944831B2 (en) 2012-04-13 2015-02-03 Fci Americas Technology Llc Electrical connector having ribbed ground plate with engagement members
US9543703B2 (en) 2012-07-11 2017-01-10 Fci Americas Technology Llc Electrical connector with reduced stack height
USD733662S1 (en) 2013-01-25 2015-07-07 Fci Americas Technology Llc Connector housing for electrical connector
USD720698S1 (en) 2013-03-15 2015-01-06 Fci Americas Technology Llc Electrical cable connector

Also Published As

Publication number Publication date
EP0212764A3 (fr) 1989-02-08
CA1244531A (fr) 1988-11-08
JPS6235472A (ja) 1987-02-16

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