EP0377080A2 - Conducteur électrique à isolant polymère - Google Patents
Conducteur électrique à isolant polymère Download PDFInfo
- Publication number
- EP0377080A2 EP0377080A2 EP89117457A EP89117457A EP0377080A2 EP 0377080 A2 EP0377080 A2 EP 0377080A2 EP 89117457 A EP89117457 A EP 89117457A EP 89117457 A EP89117457 A EP 89117457A EP 0377080 A2 EP0377080 A2 EP 0377080A2
- Authority
- EP
- European Patent Office
- Prior art keywords
- adhesive
- insulated conductor
- polymer
- peroxide
- conductor according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004020 conductor Substances 0.000 title claims description 39
- 238000009413 insulation Methods 0.000 title description 6
- 239000000853 adhesive Substances 0.000 claims abstract description 37
- 230000001070 adhesive effect Effects 0.000 claims abstract description 37
- 229920000642 polymer Polymers 0.000 claims abstract description 27
- 239000002904 solvent Substances 0.000 claims abstract description 19
- -1 polyphenylene Polymers 0.000 claims abstract description 15
- 239000000463 material Substances 0.000 claims abstract description 13
- 238000000034 method Methods 0.000 claims abstract description 13
- 229920001721 polyimide Polymers 0.000 claims abstract description 13
- 239000004642 Polyimide Substances 0.000 claims abstract description 11
- 150000001451 organic peroxides Chemical class 0.000 claims abstract description 9
- 239000004696 Poly ether ether ketone Substances 0.000 claims abstract description 8
- 238000000576 coating method Methods 0.000 claims abstract description 8
- 238000010438 heat treatment Methods 0.000 claims abstract description 8
- 229920002530 polyetherether ketone Polymers 0.000 claims abstract description 8
- 239000012790 adhesive layer Substances 0.000 claims abstract description 6
- 239000011248 coating agent Substances 0.000 claims abstract description 6
- 239000010410 layer Substances 0.000 claims description 21
- 239000012774 insulation material Substances 0.000 claims description 12
- 238000004132 cross linking Methods 0.000 claims description 11
- 239000000243 solution Substances 0.000 claims description 11
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical group OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 claims description 7
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 claims description 6
- HKMVWLQFAYGKSI-UHFFFAOYSA-N 3-triethoxysilylpropyl thiocyanate Chemical compound CCO[Si](OCC)(OCC)CCCSC#N HKMVWLQFAYGKSI-UHFFFAOYSA-N 0.000 claims description 6
- 239000004734 Polyphenylene sulfide Substances 0.000 claims description 6
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 6
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 6
- 239000000203 mixture Chemical group 0.000 claims description 6
- 229920000069 polyphenylene sulfide Polymers 0.000 claims description 6
- 229910000077 silane Inorganic materials 0.000 claims description 6
- 230000003081 coactivator Effects 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 239000003960 organic solvent Substances 0.000 claims description 5
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 5
- BJELTSYBAHKXRW-UHFFFAOYSA-N 2,4,6-triallyloxy-1,3,5-triazine Chemical compound C=CCOC1=NC(OCC=C)=NC(OCC=C)=N1 BJELTSYBAHKXRW-UHFFFAOYSA-N 0.000 claims description 4
- URDOJQUSEUXVRP-UHFFFAOYSA-N 3-triethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CCO[Si](OCC)(OCC)CCCOC(=O)C(C)=C URDOJQUSEUXVRP-UHFFFAOYSA-N 0.000 claims description 4
- WOXXJEVNDJOOLV-UHFFFAOYSA-N ethenyl-tris(2-methoxyethoxy)silane Chemical group COCCO[Si](OCCOC)(OCCOC)C=C WOXXJEVNDJOOLV-UHFFFAOYSA-N 0.000 claims description 4
- 239000003063 flame retardant Substances 0.000 claims description 4
- 239000011521 glass Substances 0.000 claims description 4
- 239000004005 microsphere Substances 0.000 claims description 4
- 229920001187 thermosetting polymer Polymers 0.000 claims description 4
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims description 3
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical group C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 claims description 3
- 125000001931 aliphatic group Chemical group 0.000 claims description 3
- 235000019400 benzoyl peroxide Nutrition 0.000 claims description 3
- 125000004432 carbon atom Chemical group C* 0.000 claims description 3
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 claims description 3
- 229910052739 hydrogen Inorganic materials 0.000 claims description 3
- 239000001257 hydrogen Substances 0.000 claims description 3
- 125000003944 tolyl group Chemical group 0.000 claims description 3
- 125000002947 alkylene group Chemical group 0.000 claims description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 2
- 239000004342 Benzoyl peroxide Substances 0.000 claims 2
- 229920006254 polymer film Polymers 0.000 claims 2
- 239000012190 activator Substances 0.000 claims 1
- 238000004026 adhesive bonding Methods 0.000 claims 1
- 238000001704 evaporation Methods 0.000 claims 1
- 239000011810 insulating material Substances 0.000 claims 1
- 238000005304 joining Methods 0.000 abstract description 2
- 229920000265 Polyparaphenylene Polymers 0.000 abstract 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 abstract 1
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 36
- 150000002978 peroxides Chemical class 0.000 description 10
- 150000003254 radicals Chemical class 0.000 description 10
- 239000000047 product Substances 0.000 description 8
- 238000006243 chemical reaction Methods 0.000 description 7
- 238000010276 construction Methods 0.000 description 5
- 239000007787 solid Substances 0.000 description 5
- 239000004952 Polyamide Substances 0.000 description 4
- QXJJQWWVWRCVQT-UHFFFAOYSA-K calcium;sodium;phosphate Chemical compound [Na+].[Ca+2].[O-]P([O-])([O-])=O QXJJQWWVWRCVQT-UHFFFAOYSA-K 0.000 description 4
- 239000012530 fluid Substances 0.000 description 4
- 125000000524 functional group Chemical group 0.000 description 4
- 239000011159 matrix material Substances 0.000 description 4
- 229920002647 polyamide Polymers 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 3
- 239000004215 Carbon black (E152) Substances 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- 239000002131 composite material Substances 0.000 description 3
- 229930195733 hydrocarbon Natural products 0.000 description 3
- 150000003949 imides Chemical class 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 238000010998 test method Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 229920001169 thermoplastic Polymers 0.000 description 3
- 239000004416 thermosoftening plastic Substances 0.000 description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000004971 Cross linker Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 150000001408 amides Chemical class 0.000 description 2
- 229920001400 block copolymer Polymers 0.000 description 2
- 239000007795 chemical reaction product Substances 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical group [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 230000006855 networking Effects 0.000 description 2
- 125000005375 organosiloxane group Chemical group 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000001054 red pigment Substances 0.000 description 2
- 150000004756 silanes Chemical class 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- UOCLXMDMGBRAIB-UHFFFAOYSA-N 1,1,1-trichloroethane Chemical compound CC(Cl)(Cl)Cl UOCLXMDMGBRAIB-UHFFFAOYSA-N 0.000 description 1
- 229920001875 Ebonite Polymers 0.000 description 1
- 239000004812 Fluorinated ethylene propylene Substances 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 239000002318 adhesion promoter Substances 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 125000006267 biphenyl group Chemical group 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000003776 cleavage reaction Methods 0.000 description 1
- 239000008199 coating composition Substances 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 125000004427 diamine group Chemical group 0.000 description 1
- 150000001990 dicarboxylic acid derivatives Chemical class 0.000 description 1
- XMEORSGHQPZTCP-UHFFFAOYSA-N dichloromethane;1,1,1-trichloroethane Chemical compound ClCCl.CC(Cl)(Cl)Cl XMEORSGHQPZTCP-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 239000001056 green pigment Substances 0.000 description 1
- 239000010720 hydraulic oil Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- UMRZSTCPUPJPOJ-KNVOCYPGSA-N norbornane Chemical compound C1C[C@H]2CC[C@@H]1C2 UMRZSTCPUPJPOJ-KNVOCYPGSA-N 0.000 description 1
- 125000003518 norbornenyl group Chemical group C12(C=CC(CC1)C2)* 0.000 description 1
- 125000000962 organic group Chemical group 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229920009441 perflouroethylene propylene Polymers 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920003192 poly(bis maleimide) Polymers 0.000 description 1
- 229920001281 polyalkylene Polymers 0.000 description 1
- 229920000412 polyarylene Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000007363 ring formation reaction Methods 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 230000007017 scission Effects 0.000 description 1
- 238000007086 side reaction Methods 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 238000005494 tarnishing Methods 0.000 description 1
- 230000001988 toxicity Effects 0.000 description 1
- 231100000419 toxicity Toxicity 0.000 description 1
- 230000001960 triggered effect Effects 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- DXZMANYCMVCPIM-UHFFFAOYSA-L zinc;diethylphosphinate Chemical compound [Zn+2].CCP([O-])(=O)CC.CCP([O-])(=O)CC DXZMANYCMVCPIM-UHFFFAOYSA-L 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/303—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups H01B3/38 or H01B3/302
- H01B3/306—Polyimides or polyesterimides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/301—Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen or carbon in the main chain of the macromolecule, not provided for in group H01B3/302
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/46—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes silicones
Definitions
- This invention relates to insulated electrical conductors, particularly those conductors that are insulated with polymers. Round cables as well as flat and coaxial cables are to be used as electrical conductors.
- the siloxanes have 1.3 to 1.95 phenyl and methyl groups per silicon atom, up to half of the phenyl groups can be biphenyl groups and up to 10% of the organic groups can be tolyl, alkyl, ethyl or other groups.
- the siloxanes are soluble in aromatic, organic solvents or mixtures.
- the polyamide is denoted by ⁇ -NH - R - NH - (CH2) m - [- NH - R1 - NH - (CH2) m ] n ⁇ -, where m is two or more, n 0 or an integer, R the The residue of an ethylenically unsaturated dicarboxylic acid after removal of the hydroxyl groups and R1 represents the residue of isophthalic, terephthalic or saturated aliphatic acids with 4 to 10 carbon atoms, the hydroxyl groups of which have been removed.
- a wire is coated with this mixture and cured by removal of the solvent and by heating to form an insulating varnish coating on the wire.
- Composite materials could be made by firmly joining two sheet members made of the same or different materials, e.g. glass, metals or polymers, by converting the organosilanamide block copolymers described in U.S. Patent No. 3,740,305 to the corresponding polyimides in order to to form firmly bonded materials.
- the organosilane imides were applied to the surfaces of the sheet members to be bonded, the solvent was removed, and the cyclization reaction was effected by heat.
- organosiloxanes have the formula wherein R is a monovalent hydrocarbon radical, usually methyl, and n is 0 to 150.
- organosiloxaneimide block copolymers A much broader and wider variety of organosiloxaneimide block copolymers than those mentioned above has been provided by U.S. Patent 4,522,985; according to this publication, the norbornane and norbornene cores have been used extensively for both the siloxane and diamine regions of the starting materials.
- Curing under heat for example to cyclize a polyamide into a polyimide directly on the cable, was not a good solution. It is now common to coat a fully cured polyimide tape with a thermoplastic adhesive material, such as a fluorinated ethylene-propylene copolymer. This works very well unless halogen-free insulation is required due to reduced toxicity when burned; it is desirable to remove the outer layer of the thermoplastic adhesive after processing, or to subject the cable to electromagnetic radiation, in which case a halogenated polymer will not work very well under such radiation and a halogenated material must be avoided.
- a thermoplastic adhesive material such as a fluorinated ethylene-propylene copolymer
- the invention has for its object to provide an insulation material which has good insulating properties and good adhesiveness when it is applied to the material to be insulated. Furthermore, a method for isolating an electrical conductor is to be specified by means of which the insulation material can be applied to the conductor with good adhesion.
- the insulation material according to the invention consists of a high temperature-resistant polymer which surrounds an electrical conductor. A completely heat-cured organosiloxaneimide adhesive is applied to this polymer, which surprisingly ensures a good polymer-polymer connection.
- the polymer is preferably a polyimide, polyphenylene sulfide (PPS) or a polyether ether ketone (PEEK).
- PPS polyphenylene sulfide
- PEEK polyether ether ketone
- the cables according to the invention are particularly suitable for use at high temperatures and under aggressive environmental conditions.
- the new composite material can be used both as primary insulation and as a jacket.
- the organopolysiloxaneimide is dissolved in an organic solvent, possibly with organic peroxides and pigments, and the solution is applied to a layer of the fully cured polymer.
- the solvent is then evaporated and the polymer layer is wrapped around an electrical conductor with the adhesive on top.
- the polymer layer is preferably cut into a band shape and wound spirally around the electrical conductor.
- the conductor wrapped in the tape is first of all for a relatively short time heated to a higher temperature to seal the layers of polymer. It is then held at a low temperature for an extended period of time to increase the cross-link curing reaction and to prevent problems such as tarnishing of metal conductors, which can occur at higher temperatures and longer heating times.
- the preferred organopolysiloxaneimide adhesive is a fully cured material with the formula where Q is a tetravalent radical selected from where D is selected from wherein R4 is a bivalent radical selected from and divalent organic radicals of the general formula wherein R1 and R2 represent alkylenes, usually - (CH2) 3 -, or R4, wherein R represents methyl, phenyl, tolyl or a mixture of aliphatic and aromatic radicals, wherein R3 represents hydrogen or an alkyl radical with 1 to 8 carbon atoms , X from bivalent radicals -CR 3rd 2nd -, C y H 2y -, - CO -, - SO2-, -O-, and -S-, is selected, where y 1 to 5, k 1 to 7, n 1 to 7, m is an integer greater than 1 and p are 0 or 1.
- the crosslinking reaction is preferably carried out in the presence of a peroxide.
- Benzoyl peroxides such as bis-2,4-dichlorobenzoyl peroxide, dicumyl peroxide or t-butyl peroxide are particularly suitable as peroxides.
- the presence of peroxide accelerates the crosslinking reaction and increases chemical resistance to solvents.
- the crosslinking reaction is initiated by cleavage of the peroxide, as can be seen from the formula below.
- the radicals formed in this way generate a polymer radical by splitting off hydrogen from the polymer chain. Two of the polymer radicals generated in this way can saturate to form a CC bond, as can be seen from the formula below.
- a coactivator such as, for example, triallyl cyanurate
- three-dimensional crosslinking can be achieved, which leads to a thermally more stable product which also has better chemical resistance due to the multiplication of the crosslinking sites.
- the polymer radical reacts with an allyl group of the cyanurate. The formula is shown below.
- the crosslinking is only started when the finished product is exposed to a higher temperature, which ensures that no pre-crosslinking takes place during the drying and further processing of the product.
- the reaction is only triggered when the product is held at 300 ° C for a period of 1 to 3 minutes.
- the finished products are subjected to post-heating, which normally takes place at 200 ° C for 2 to 3 hours. Insulation produced using this method can be used for mechanical loads up to a permanent temperature of 150 ° C and for only electrical loads up to a permanent temperature of 170 ° C.
- a low dielectric constant is required to use the insulation material for flat or coaxial cables.
- the adhesive approach must be modified. This can be done, for example, by adding expanded glass spheres, preferably microspheres, which are hollow on the inside in addition to the mixture mentioned.
- a coupling agent based on silane is added give.
- vinyl tris (2-methoxyethoxy) silane (1); 3,4 epoxybutyltriethoxysilane (2); 3-thiocyanatopropyltriethoxysilane (3) or 3-methacryloxypropyltriethoxysilane (4) can be used.
- the amount of silane used in each case is approximately 0.1 to 0.8% of the weight of glass spheres.
- the silanes that can be used have the following general formula y-Si-R'-X, where y and X represent the two different reactive centers.
- the functional group X is linked to an organic intermediate piece R 'with the four-bonded silicon atom.
- the functional group y is a removable group, in this case either a trimethoxy or a trieethoxysilyl group.
- the function of silanes as an adhesion promoter is based on the formation of a monomolecular silane layer on the surface of the glass spheres, the functional group y reacting here.
- the remaining functional group X can react chemically with the plastic matrix or with the crosslinker / coactivator system.
- a halogen-free flame retardant can also be added.
- the proportion of the flame retardant can be up to approx. 20 percent by weight. This also makes it possible to obtain a higher layer thickness of the adhesive application and thus to use the coated polymer layer, for example in the form of a film, for the production of ribbon cables.
- the thickness of the adhesive layer is preferably 50 to 100 microns. This enables the embedding of bare conductors or of fully insulated wires.
- a roll of polyimide film (DuPont Kapton H-50) is coated with a 2.54 ⁇ m (0.0001 inch) thick layer of an organopolysiloxanimide adhesive which has been dissolved in methylene chloride to give a 5% solids solution .
- 20% by weight of a green pigment in polyester based on the organopolysiloxaneimide was added to the solution of organopolysiloxaneimide and methylene chloride to color the film. The solvent is evaporated to a to produce dry film.
- the roll is then cut into evenly wound bobbins with an approximately 1.83 mm (0.072 inch) wide band.
- the tape is wrapped around a 30 AWG silver plated copper conductor to give a 2.1 wrap construction with a 0.3048 mm (0.012 inch) end diameter.
- This wrapped structure is connected in an air oven at 300 ° C with a residence time of 50 seconds.
- the outer adhesive layer which is not covered with a film layer, is washed off the assembly by passing the assembly through a methylene chloride bath to give a green, insulated wire assembly. Tests are carried out on this wire construction with regard to the dielectric in a moist environment, with regard to aging when heated and with regard to the resistance to solvents.
- the test procedure for dielectric in a humid environment is carried out according to the provisions of MIL-W-81822A, section 4.6.20; the heat resistance test procedure is in accordance with the provisions of MIL-W-81822A, section 4.6.22; and resistance to fluids is determined by the provisions of MIL-W-8l822A, section 4.6.25.
- the heat resistance of the construction using an organosiloxaneimide adhesive is greater than the heat resistance of a comparable polyester adhesive, but the solvent resistance to 1,1,1-trichloroethane is insufficient.
- a roll of polyimide film (DuPont Kapton H-100) is covered with a 2.54 ⁇ m (0.0001 inch) thick layer coated from an organopolysiloxaneimide adhesive which was dissolved in methylene chloride to give a 5% solids solution.
- a red pigment containing chromium is added to the adhesive solution to color the tape. The solvent is evaporated to give a dry film.
- Another tape is coated exactly as above, except that an organic peroxide (e.g. Luprox 500R dicumyl peroxide) is added in an amount of 10% by weight based on the organopolysiloxaneimide adhesive.
- an organic peroxide e.g. Luprox 500R dicumyl peroxide
- Both tapes are cut into evenly wound coils approximately 2.64 mm (0.104 inch) wide.
- the tapes are wrapped around a 30 AWG silver plated copper conductor to create a 3.2 wrap construction with a finished 0.4064 mm (0.016 inch) diameter.
- the wrapped superstructures are fired in an air oven with a temperature of 320 ° C and a residence time of 100 seconds.
- the outer layer of adhesive that is not covered by the film is washed off the assembly by passing the assembly through a methylene chloride bath. A red, insulated wire structure is obtained.
- the adhesive is more resistant to some solvents than to other solvents.
- the curing of samples in the presence of peroxide accelerates the crosslinking and thus increases the solvent resistance of the adhesive with respect to solvents which more easily dissolve the adhesive, for example methylene chloride.
- a roll of PEEK (polyether ether ketone) film is coated with a 0.00254 mm (0.0001 inch) thick layer of an organopolysiloxanimide adhesive dissolved in methylene chloride to form a 5% solids solution. to surrender.
- a chromium-containing red pigment is added at 25% by weight, based on the organopolysiloxanimide adhesive, in order to color the tape.
- the solvent is evaporated to give a 5.0 wrap construction with a final diameter of 0.508 mm (0.020 inch).
- the wrapped structure is heated in an air oven at 300 ° C with a residence time of 100 seconds.
- the outer adhesive layer which is not covered by a film layer, is washed off the assembly by passing it through a methylene chloride bath so that a red, insulated conductor assembly is obtained.
- the finished composite insulation material had a tensile strength of 25,000 psi and an elongation of 110%. It also had good heat resistance and good electrical properties.
- a polyphenylene sulfide film with a layer thickness of about 12 to 100 microns is coated with an adhesive solution.
- the adhesive solution used as a coating composition contains organopolysiloxane imide as the plastic matrix, bis-2,4-dichlorobenzoyl peroxide as the crosslinker, triallyl cyanurate as the coactivator, and color pigments and methylene chloride as the solvent.
- the solids concentration is about 20 to 25% by weight, depending on the required layer thickness.
- the solvent is evaporated, the crosslinking reaction takes place at 300 ° C and a time of 1 to 3 minutes.
- the finished product is subjected to post-heating, which takes place at 200 ° C for a period of 2 to 3 hours.
- the end product is a primary insulation material for electrical parts, can be used mechanically for a continuous temperature of at least 150 ° C and electrically for a temperature of at least 170 ° C.
- Methylene chloride was found to be the best solvent for the uncured organopolysiloxaneimide adhesive.
- the improved resistance to methylene chloride by means of an organopolysiloxaneimide hardened with the help of peroxide thus eliminates a weak point in the use of this adhesive for the production of wires and cables.
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Organic Insulating Materials (AREA)
- Insulated Conductors (AREA)
- Insulators (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US28804888A | 1988-12-21 | 1988-12-21 | |
| US288048 | 1988-12-21 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| EP0377080A2 true EP0377080A2 (fr) | 1990-07-11 |
| EP0377080A3 EP0377080A3 (fr) | 1991-12-18 |
| EP0377080B1 EP0377080B1 (fr) | 1995-12-06 |
Family
ID=23105529
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP89117457A Expired - Lifetime EP0377080B1 (fr) | 1988-12-21 | 1989-09-21 | Conducteur électrique à isolant polymère |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP0377080B1 (fr) |
| AT (1) | ATE131310T1 (fr) |
| DE (2) | DE58909529D1 (fr) |
| ES (1) | ES2080058T3 (fr) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0551747A1 (fr) * | 1992-01-10 | 1993-07-21 | General Electric Company | Films flexibles de polyétherimide |
| EP0568923A1 (fr) * | 1992-05-08 | 1993-11-10 | PIRELLI CAVI S.p.A. | Câble fonctionnant à hautes températures |
| EP2544194A1 (fr) * | 2011-07-07 | 2013-01-09 | Nitto Denko Corporation | Matériau de revêtement, fil électrique rectangulaire recouvert et dispositif électrique |
| EP2544193A3 (fr) * | 2011-07-07 | 2014-11-19 | Nitto Denko Corporation | Matériau de revêtement, fil électrique supraconducteur et dispositif électrique |
| EP2544192A3 (fr) * | 2011-07-07 | 2014-11-19 | Nitto Denko Corporation | Matériau de revêtement, fil électrique supraconducteur et dispositif électrique |
| EP2544191A3 (fr) * | 2011-07-07 | 2014-11-26 | Nitto Denko Corporation | Matériau de revêtement, fil électrique rectangulaire recouvert et dispositif électrique |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0727966B2 (ja) * | 1986-07-04 | 1995-03-29 | 日立化成工業株式会社 | 半導体装置 |
-
1989
- 1989-09-21 DE DE58909529T patent/DE58909529D1/de not_active Expired - Fee Related
- 1989-09-21 ES ES89117457T patent/ES2080058T3/es not_active Expired - Lifetime
- 1989-09-21 AT AT89117457T patent/ATE131310T1/de not_active IP Right Cessation
- 1989-09-21 EP EP89117457A patent/EP0377080B1/fr not_active Expired - Lifetime
- 1989-09-21 DE DE198989117457T patent/DE377080T1/de active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0551747A1 (fr) * | 1992-01-10 | 1993-07-21 | General Electric Company | Films flexibles de polyétherimide |
| EP0568923A1 (fr) * | 1992-05-08 | 1993-11-10 | PIRELLI CAVI S.p.A. | Câble fonctionnant à hautes températures |
| US5437930A (en) * | 1992-05-08 | 1995-08-01 | Pirelli Cavi S.P.A. | Cable for high operating temperatures |
| EP2544194A1 (fr) * | 2011-07-07 | 2013-01-09 | Nitto Denko Corporation | Matériau de revêtement, fil électrique rectangulaire recouvert et dispositif électrique |
| EP2544193A3 (fr) * | 2011-07-07 | 2014-11-19 | Nitto Denko Corporation | Matériau de revêtement, fil électrique supraconducteur et dispositif électrique |
| EP2544192A3 (fr) * | 2011-07-07 | 2014-11-19 | Nitto Denko Corporation | Matériau de revêtement, fil électrique supraconducteur et dispositif électrique |
| EP2544191A3 (fr) * | 2011-07-07 | 2014-11-26 | Nitto Denko Corporation | Matériau de revêtement, fil électrique rectangulaire recouvert et dispositif électrique |
Also Published As
| Publication number | Publication date |
|---|---|
| DE58909529D1 (de) | 1996-01-18 |
| ATE131310T1 (de) | 1995-12-15 |
| DE377080T1 (de) | 1990-10-18 |
| EP0377080B1 (fr) | 1995-12-06 |
| EP0377080A3 (fr) | 1991-12-18 |
| ES2080058T3 (es) | 1996-02-01 |
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