EP0379948A2 - Solutions aqueuses, acides pour le dépôt électrolytique d'étain et/ou d'alliages plomb/étain - Google Patents

Solutions aqueuses, acides pour le dépôt électrolytique d'étain et/ou d'alliages plomb/étain Download PDF

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Publication number
EP0379948A2
EP0379948A2 EP90100870A EP90100870A EP0379948A2 EP 0379948 A2 EP0379948 A2 EP 0379948A2 EP 90100870 A EP90100870 A EP 90100870A EP 90100870 A EP90100870 A EP 90100870A EP 0379948 A2 EP0379948 A2 EP 0379948A2
Authority
EP
European Patent Office
Prior art keywords
tin
optionally
aqueous
lead
alkanesulfonic acid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP90100870A
Other languages
German (de)
English (en)
Other versions
EP0379948B1 (fr
EP0379948A3 (fr
Inventor
Willi Metzger
Manfred Schmitz
Karl-Jürgen Schmidt
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Blasberg-Oberflachentechnik GmbH
Original Assignee
Blasberg-Oberflachentechnik GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Blasberg-Oberflachentechnik GmbH filed Critical Blasberg-Oberflachentechnik GmbH
Publication of EP0379948A2 publication Critical patent/EP0379948A2/fr
Publication of EP0379948A3 publication Critical patent/EP0379948A3/fr
Application granted granted Critical
Publication of EP0379948B1 publication Critical patent/EP0379948B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C25D3/32—Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin

Definitions

  • the present invention relates to aqueous, acidic solutions for the electrolytic deposition of tin and / or lead / tin alloys containing a mixture of tin and / or lead salts of an alkanesulfonic acid, free alkanesulfonic acid, the alkyl group of the alkanesulfonic acid consisting of 1 to 5 carbon atoms , non-ionic wetting agent and optionally aromatic short-chain aldehydes and / or optionally aromatic ketones and / or optionally short-chain unsaturated carboxylic acids.
  • DE-PS 1 260 262 describes aldol condensation products which are added to aqueous baths for the electrodeposition of tin as brighteners.
  • US Pat. No. 2,525,942 relates to the use of alkanesulfonic acid derivatives in solution for metal deposition.
  • US Pat. No. 4,582,576 describes a process which deposits shiny tin-tin / lead layers from baths containing alkanesulfonic acid.
  • aqueous, acidic solutions described therein contain metal salts, free alkane or alkanol sulfonic acid, wetting agents, a short-chain aliphatic aldehyde, an aromatic aldehyde, optionally an aromatic ketone and an unsaturated, short-chain carboxylic acid.
  • the compositions described there have the disadvantage that they have only poor resilience in the high current density range.
  • the object on which the invention is based is to provide aqueous, acidic solutions which have a better load-bearing capacity in the high current density range and enable uniform gloss scattering over the entire current density range.
  • an aqueous, acidic solution for the electrolytic deposition of tin and / or lead / tin alloys containing a mixture of tin and / or lead salts of an alkanesulfonic acid, free alkanesulfonic acid, the alkyl group of the alkanesulfonic acid consists of 1 to 5 ° C atoms, non-ionic wetting agent and optionally aromatic short-chain aldehydes and / or optionally aromatic ketones and / or optionally short-chain unsaturated carboxylic acids, characterized in that a mixture of a reaction product of acetaldehyde and / or its as a further brightener Aldol condensation products containing ammonia and / or acyclic ketones and / or aliphatic amines, amides, amino acids and / or hydrazine compounds.
  • a non-ionic wetting agent of the alkylaryl polyglycol ether type is preferably selected as the wetting agent. If a mixture of a reaction product of acetaldehyde and / or its aldol condensation products with acyclic ketones is chosen as the brightening agent, the aliphatic ketone preferably contains 10 carbon atoms in the molecule. Naphthaldehyde, chloroacetophenone or benzalacetone, formaldehyde or acetaldehyde and, as unsaturated carboxylic acid, methacrylic acid or methyl methacrylic acid are preferably added to the mixture in a preferred manner.
  • the aqueous, acidic solutions according to the invention preferably contain 5 to 25% by weight of the corresponding metal salt or salts, 6 to 20% by weight of the alkanesulfonic acid, 0.1 to 5% by weight of non-ionic wetting agent, 0.1 to 5 %
  • the aldol condensation product if 0.1 to 3% of the aromatic aldehyde, optionally 0.01 to 1.0% by weight of the aromatic ketone, optionally 0.01 to 1.0% by weight of the short-chain aliphatic aldehyde, and optionally 0.01 to 1% of the unsaturated carboxylic acid.
  • the information relates to mixtures that are adjusted to 1 liter of finished solution.
  • aldol condensation products according to DE-PS 1 260 262 in a process for the electrolytic deposition of tin and / or lead / tin alloys surprisingly leads to improved galvanic deposition in the high current density range, and at the same time uniform gloss scattering is achieved in the low current density range.
  • Process parameters The usability of the electrolyte was tested for tin and / or lead / tin deposition in a Hull cell in accordance with DIN 50 957. Temperature: 20 - 25 ° C, exposure time: 5 minutes with mechanical stirring, anode tin or lead-tin analogous to the composition of the precipitation. Sheet steel cathode material, cell current 2, 3 or 4 amps per cell.
  • Examples 1 to 4 each ensure very good galvanic deposition in the high current density range and at the same time ensure uniform gloss scattering in the low current density range.
  • Example 1 of the US patent a uniform gloss was only achieved in the range of 1-8 amperes / dm 2 at 2 ampere cell current. Amorphous burns occurred above 8 A / dm2. In the low current density range ⁇ 1 A / dm2, the deposition was milky matt.
  • the sheet After adding 10 ml / l of the additive according to the invention, the sheet was uniformly shiny from 0.2 to 10 A / dm 2.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electrolytic Production Of Metals (AREA)
EP90100870A 1989-01-25 1990-01-17 Solutions aqueuses, acides pour le dépôt électrolytique d'étain et/ou d'alliages plomb/étain Expired - Lifetime EP0379948B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3902042A DE3902042A1 (de) 1989-01-25 1989-01-25 Waessrige, saure loesungen fuer die elektrolytische abscheidung von zinn und/oder blei/zinnlegierungen
DE3902042 1989-01-25

Publications (3)

Publication Number Publication Date
EP0379948A2 true EP0379948A2 (fr) 1990-08-01
EP0379948A3 EP0379948A3 (fr) 1991-07-31
EP0379948B1 EP0379948B1 (fr) 1994-03-09

Family

ID=6372697

Family Applications (1)

Application Number Title Priority Date Filing Date
EP90100870A Expired - Lifetime EP0379948B1 (fr) 1989-01-25 1990-01-17 Solutions aqueuses, acides pour le dépôt électrolytique d'étain et/ou d'alliages plomb/étain

Country Status (5)

Country Link
US (1) US5021130A (fr)
EP (1) EP0379948B1 (fr)
JP (1) JP3096465B2 (fr)
DD (1) DD291785A5 (fr)
DE (2) DE3902042A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004007809A3 (fr) * 2002-07-13 2004-04-15 Dana Corp Coussinets
EP1705267A1 (fr) * 2005-03-24 2006-09-27 Dowa Mining Co., Ltd Produit plaqué d'étain et son procédé de fabrication

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5651873A (en) * 1994-06-30 1997-07-29 Mitsubishi Materials Corporation Electroplating solution for forming Pb-Sn alloy bump electrodes on semiconductor wafer surface
ATE181117T1 (de) * 1994-12-09 1999-06-15 Federal Mogul Wiesbaden Gmbh Schichtwerkstoff für gleitelemente sowie verfahren und mittel zu seiner herstellung
DE19728777C2 (de) * 1997-07-05 2001-03-15 Federal Mogul Wiesbaden Gmbh Schichtverbundwerkstoff für Gleitlager sowie Verfahren zur Herstellung von Lagerschalen
US6267863B1 (en) * 1999-02-05 2001-07-31 Lucent Technologies Inc. Electroplating solution for electroplating lead and lead/tin alloys
EP1260614B1 (fr) * 2001-05-24 2008-04-23 Shipley Co. L.L.C. Placage d'étain
US6730209B2 (en) * 2002-02-22 2004-05-04 Lucent Technologies Inc. Solder electroplating bath including brighteners having reduced volatility
WO2004034427A2 (fr) * 2002-10-08 2004-04-22 Honeywell International Inc. Conditionnements de semi-conducteur, soudures et anodes contenant du plomb, et procedes d'elimination d'emetteurs alpha de materiaux
CN110428939B (zh) * 2019-08-09 2020-06-30 常州大学 一种高导电石墨烯铜/铝复合导线的制备方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2525942A (en) * 1945-06-29 1950-10-17 Standard Oil Co Electrodepositing bath and process
DE1260262B (de) * 1963-05-06 1968-02-01 Friedr Blasberg G M B H Galvanisches Bad und Verfahren zur elektrolytischen Abscheidung hochglaenzender Zinnueberzuege
US4132610A (en) * 1976-05-18 1979-01-02 Hyogo Prefectural Government Method of bright electroplating of tin-lead alloy
US4582576A (en) * 1985-03-26 1986-04-15 Mcgean-Rohco, Inc. Plating bath and method for electroplating tin and/or lead

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004007809A3 (fr) * 2002-07-13 2004-04-15 Dana Corp Coussinets
US7174637B2 (en) 2002-07-13 2007-02-13 Dana Corporation Bearings
US7455458B2 (en) 2002-07-13 2008-11-25 Mahle Engine Systems Ltd. Bearings
EP1705267A1 (fr) * 2005-03-24 2006-09-27 Dowa Mining Co., Ltd Produit plaqué d'étain et son procédé de fabrication

Also Published As

Publication number Publication date
DE3902042C2 (fr) 1991-05-02
JP3096465B2 (ja) 2000-10-10
EP0379948B1 (fr) 1994-03-09
DD291785A5 (de) 1991-07-11
EP0379948A3 (fr) 1991-07-31
US5021130A (en) 1991-06-04
DE3902042A1 (de) 1990-07-26
JPH02232389A (ja) 1990-09-14
DE59004841D1 (de) 1994-04-14

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