EP0446442A1 - Plaquettes À  circuits imprimés en poly(sulfure d'arylène) présentant une bonne adhésion aux métaux - Google Patents

Plaquettes À  circuits imprimés en poly(sulfure d'arylène) présentant une bonne adhésion aux métaux Download PDF

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Publication number
EP0446442A1
EP0446442A1 EP90123538A EP90123538A EP0446442A1 EP 0446442 A1 EP0446442 A1 EP 0446442A1 EP 90123538 A EP90123538 A EP 90123538A EP 90123538 A EP90123538 A EP 90123538A EP 0446442 A1 EP0446442 A1 EP 0446442A1
Authority
EP
European Patent Office
Prior art keywords
circuit boards
printed circuit
pas
metal
poly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP90123538A
Other languages
German (de)
English (en)
Inventor
Udo Dr. Wolf
Günther Dr. Weymans
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bayer AG
Original Assignee
Bayer AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bayer AG filed Critical Bayer AG
Publication of EP0446442A1 publication Critical patent/EP0446442A1/fr
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02—Pretreatment of the material to be coated
    • C23C14/021—Cleaning or etching treatments
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C23C14/20—Metallic material, boron or silicon on organic substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0333—Organic insulating material consisting of one material containing S
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0783—Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer

Definitions

  • the invention relates to a process for the production of printed circuit boards from molding compositions containing polyarylene sulfide by means of a special surface treatment with organic solvents, and to the printed circuit boards according to this process and their use.
  • the invention relates to a method for producing printed circuit boards from molding compositions containing polyarylene sulfide.
  • the printed circuit boards show a very good adhesion of the metal.
  • Methods for improving metal adhesion are known. These are complex and provide circuit boards with less than satisfactory properties (e.g. high electrolyte content).
  • circuit boards with good metal adhesion can be produced from polyarylene sulfide molding compositions if the surface of the board produced by customary known processes (e.g. extrusion) is treated with aprotic, organic liquids.
  • the invention relates to a process for the production of printed circuit boards from molding compounds containing polyarylene sulfide, characterized in that printed circuit boards made from a molding compound containing polyarylene sulfide with an essentially amorphous surface with aprotic organic liquids, at temperatures from 10 ° C. to the glass transition temperature of the polyarylsulfide molding compound used , optionally after applying a reversible mask negative to the surface of the circuit board to be contacted with metal, and then metallized by vapor deposition with the corresponding metal atoms by known methods.
  • This PAS can be known additives, fillers and reinforcing agents such as glass fibers in known Amounts are added by known methods. Small mixtures of other polymers than the PAS - and preferably up to a maximum of 5 parts by weight per 100 parts by weight of PAS - can be added to the PAS-containing molding compositions.
  • PAS-containing molding compositions are known. Suitable are e.g. the PAS-containing molding compounds available under the trade names FORTRON® (Kureha, Japan), SUPEC® (General Electric), RYTON® (Phillips Petrol) and TEDUR® (Bayer AG).
  • printed circuit board applications are all shaped bodies in which the PAS molding compound is used as a carrier material for metals in electronics and electrical engineering.
  • the circuit boards can be both plates and foils (e.g. for capacitor applications). It can also be PAS molded parts, on which macroscopically thick metal molded parts are supposed to adhere, which are then used due to the electrical properties of the hybrid PAS / metal.
  • the PAS molding compounds are processed in a known manner on conventional processing machines to give molded parts for printed circuit boards.
  • An essentially amorphous PAS molding compound is used, for example, by spraying into relatively low-temperature tools or by extrusion with rapid cooling at the extrusion exit point.
  • the molding compound itself crystallizes only very poorly and therefore usually already has an amorphous molded cover layer.
  • Such PAS molding compositions are, for example, branched or their crystallization is prevented, for example, by additives or by impurities.
  • PAS-containing molding materials used with preference have glass transition temperatures of more than 85 ° C. and a heat resistance (determined according to Vicat B) of more than 230 ° C., in particular more than 260 ° C.
  • Vicat B heat resistance
  • the Vicat B temperature can be increased up to 270 ° C by adding fillers and crystallization formers.
  • the surface to be coated with metal is then brought into contact with aprotic solvents, at temperatures from 10 ° C. to the glass transition temperature of the PAS, preferably from 10 ° C. to 80 ° C. and in particular from 20 ° C. to 30 ° C.
  • Aprotic organic liquids suitable according to the invention are lactams, e.g. N-substituted lactams such as N-methylcaprolactam (NMC), N-methylpyrrolidine (NMP) and 2-methyltetrahydrofuran. They can be used individually or as a mixture.
  • the contact times of these liquids with the amorphous surface of the plate (or the film) are less than 1 hour, preferably less than 10 minutes and in particular 0.1 to 60 seconds.
  • Several treatments can also be carried out with different organic liquids.
  • Another object of the invention is the use of the plates treated according to the invention with high roughness of the surfaces for the production of metal-coated (conductor) plates.
  • a mask is then optionally applied to the surface by known methods, which mask those areas which should not come into contact with metal.
  • the surface of the plate can now be brought into contact with metal by known methods, e.g. by steaming. Catalytic deposition of metal on the surface, immersion in metal baths, insofar as the temperature resistance of the PAS mixture used allows, sputtering, plasma evaporation, etc.
  • Plates (molded parts) pretreated according to the invention have a significantly improved adhesion to metals, in particular to copper and aluminum.
  • Another advantage of the method according to the invention is simple implementation, which favors the cycle time in plate production. Special technical equipment is not required. by spraying or immersing in the liquids.
  • Another advantage is that no inorganic liquids and salts are necessary (e.g. HF / KF, methylene chloride, acetone).
  • the electrolyte content of the plates (films) is not increased by the treatment according to the invention.
  • the boards treated according to the invention are preferably suitable for the production of printed circuit boards.
  • Substance c) was injected into a mold at 80 ° C., so that an amorphous outer skin was formed. The surface was then directly sputter-coated with copper. Liability was checked by applying an adhesive strip. Part of the copper top layer could easily be removed.
  • Example 1 The PAS form from Example 1 was brought into contact with a) water, b) methylene chloride, c) acetone for about 30 seconds before vapor deposition with copper. After the samples had been dried in air at room temperature, steaming was carried out as in Example 1. Here too, there were no good adhesion properties.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Chemically Coating (AREA)
  • Laminated Bodies (AREA)
EP90123538A 1990-03-16 1990-12-07 Plaquettes À  circuits imprimés en poly(sulfure d'arylène) présentant une bonne adhésion aux métaux Withdrawn EP0446442A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19904008462 DE4008462A1 (de) 1990-03-16 1990-03-16 Polyarylensulfid-leiterplatten mit guter metallhaftung
DE4008462 1990-03-16

Publications (1)

Publication Number Publication Date
EP0446442A1 true EP0446442A1 (fr) 1991-09-18

Family

ID=6402377

Family Applications (1)

Application Number Title Priority Date Filing Date
EP90123538A Withdrawn EP0446442A1 (fr) 1990-03-16 1990-12-07 Plaquettes À  circuits imprimés en poly(sulfure d'arylène) présentant une bonne adhésion aux métaux

Country Status (3)

Country Link
EP (1) EP0446442A1 (fr)
JP (1) JPH04221880A (fr)
DE (1) DE4008462A1 (fr)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3854973A (en) * 1970-01-26 1974-12-17 Macdermid Inc Method of making additive printed circuit boards
EP0182379A2 (fr) * 1984-11-23 1986-05-28 Phillips Petroleum Company Revêtement des surfaces en sulfure de polyarylène
EP0103149B1 (fr) * 1982-08-20 1988-04-06 Phillips Petroleum Company Plaquettes à circuits imprimés se composant de poly(sulfure d'arylène)

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3854973A (en) * 1970-01-26 1974-12-17 Macdermid Inc Method of making additive printed circuit boards
EP0103149B1 (fr) * 1982-08-20 1988-04-06 Phillips Petroleum Company Plaquettes à circuits imprimés se composant de poly(sulfure d'arylène)
EP0182379A2 (fr) * 1984-11-23 1986-05-28 Phillips Petroleum Company Revêtement des surfaces en sulfure de polyarylène

Also Published As

Publication number Publication date
DE4008462A1 (de) 1991-09-19
JPH04221880A (ja) 1992-08-12

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