EP0602838A1 - Eléments magnétiques plats - Google Patents

Eléments magnétiques plats Download PDF

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Publication number
EP0602838A1
EP0602838A1 EP93309635A EP93309635A EP0602838A1 EP 0602838 A1 EP0602838 A1 EP 0602838A1 EP 93309635 A EP93309635 A EP 93309635A EP 93309635 A EP93309635 A EP 93309635A EP 0602838 A1 EP0602838 A1 EP 0602838A1
Authority
EP
European Patent Office
Prior art keywords
rings
dielectric
conductive
adjacent
holes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP93309635A
Other languages
German (de)
English (en)
Inventor
Lennart Daniel Pitzele
Matthew Anthony Wilkowski
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
AT&T Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AT&T Corp filed Critical AT&T Corp
Publication of EP0602838A1 publication Critical patent/EP0602838A1/fr
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F5/00—Coils
    • H01F5/003—Printed circuit coils
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2847—Sheets; Strips
    • H01F2027/2861—Coil formed by folding a blank

Definitions

  • This invention relates to magnetic components, such as inductors and transformers.
  • planar magnetic components comprise individual conductor rings which are connected in series or parallel to form windings.
  • each ring is formed on an individual dielectric layer and the rings are stacked in a magnetic shell core.
  • Lead outs are coupled to each ring and are soldered to copper posts located outside the ring perimeter protruding from a terminal header. The resistances of the lead outs can give rise to considerable losses.
  • One way of eliminating the lead outs and solder posts is to form a plurality of conductive rings on a flexible circuit and then fold the circuit in order to form a primary winding (see, e.g., U.S. Pat. No. 5,017,902).
  • a single flexible circuit can also include one or more secondary windings (see, e.g., U.S. Pat. No. 4,959,630).
  • the invention is a magnetic component comprising a plurality of conductive rings formed on a surface for a flexible dielectric layer.
  • the rings are formed adjacent to one another in a row having a central axis.
  • a conductive path is formed between adjacent rings to provide electrical connection between said adjacent rings.
  • the path is formed outside the periphery of the adjacent rings and displaced from the central axis.
  • the dielectric is folded so that the adjacent rings are stacked vertically.
  • FIGS. 1-4 illustrate a magnetic component in accordance with one embodiment of the invention. It will be understood that “magnetic component” is intended to include inductors, transformers and other components which include a conductive winding.
  • FIGS. 1 and 2 show conductive layers on opposite major surfaces of a flexible circuit 10.
  • the circuit includes a dielectric layer 11, which is typically polyimide film.
  • the dielectric layer usually has a thickness of 0.05 mm to 0.08 mm.
  • the conductive layer on what is termed the "top” of the circuit in FIG. 1 is designated 12 while the conductive layer on the "bottom” in FIG. 2 is designated 13.
  • FIG. 2 is a view of the bottom conductive layer from the same side as FIG. 1 but with the top conductor layer 12 removed in order to more clearly illustrate the super-position of the two conductive layers.
  • Each conductive layer, 12 and 13, forms a series of three conductive rings, 14-16 and 17-19, respectively.
  • Each ring is electrically connected to at least one adjacent ring either on the same surface or on the opposite surface of the circuit.
  • Interconnection between adjacent rings on the same surface i.e., rings 15, 16 and 17, 18
  • conductive bars 20 and 21, respectively are displaced from, and essentially parallel to, the longitudinal central axis, 22, of the row of rings 14-19. The advantage of this displacement will be discussed below.
  • Interconnection between adjacent rings on opposite surfaces e.g., 14, 17
  • conductive via holes e.g., 23
  • Two sets of tabs are also formed in the dielectric layer adjacent to each ring on different sides of the central axis 22.
  • Each tab includes a hole (e.g., 28 and 29) formed through the dielectric layer and including conductive material on the side walls thereof.
  • the conductive material is coupled to a corresponding ring (14 and 19, respectively) in order to form electrical terminations.
  • the remaining holes in the tabs are not electrically coupled to any ring in the unfolded state shown in FIGS. 1 and 2. However, as will be made clearer, the holes on the left-hand side of FIGS. 1 and 2 will be electrically coupled to one or the other of the termination holes 28 and 30 when the circuit is folded.
  • the holes on the opposite side of the axis (e.g., 31 and 32) will serve as anchors when the circuit is folded.
  • the conductive layers, via holes, tabs, and tab holes are formed by standard processing.
  • the dielectric layer including the tabs is formed by stamping. Via holes and tab holes are then formed by drilling. Both surfaces of the dielectric are then plated with copper to a thickness of approximately 0.10 mm to 0.20 mm, and the copper is patterned in accordance with standard photolithographic procedures.
  • each conductive layer, 12 and 13 is covered with a further layer of dielectric material (not shown for the sake of clarity) to avoid shorting of adjacent rings when the circuit is folded.
  • These layers can be the same material as the dielectric base layer (11) and typically have a thickness of approximately 0.05 mm to 0.08 mm.
  • the additional dielectric layers may also be formed by stamping and deposited by a standard lamination process.
  • the resulting circuit can then be folded along the horizontal dashed lines shown in FIGS. 1 and 2 in order to form a conductive winding as illustrated in FIGS. 3 and 4.
  • the folded circuit is placed within a magnetic shell core 40 which comprises a magnetic material such as MgZn ferrite formed in two halves.
  • Each half includes a base portion 44, a center core 41, and a pair of side walls, 42 and 43, spaced from the core.
  • the base, core and side walls define a core "window" which houses at least a portion of the conductive rings 14-19 of the flexible circuit, with the cores of the two halves passing through the ring holes.
  • a secondary winding can also be included in the structure by interleaving a plurality of rings on dielectric layers with the rings of the flexible circuit 10.
  • the stackup resulting from the folding and placing of circuit 10 within the core 40 can best be understood by looking at FIG. 4. It will be noted, for example, that the interconnecting bars 20 and 21 fall outside the core window and, further, are disposed in opposite folds. Thus, the interconnections of the rings do not stack up within the window or in a single position outside the window, thereby improving the fill factor of the flexible circuit in a given volume.
  • additional rings can be produced by making use of a spiral-type pattern illustrated in the plan view of FIG. 5.
  • the conductor pattern on the top surface of the dielectric is illustrated by the solid lines and the conductor pattern on the bottom surface is illustrated by dashed lines. Connection between top and bottom conductors is, again, established by via holes.
  • Each spiral pattern, 50-52 has three turns and, therefore, comprises three rings. Thus, a total of 9 rings is formed, 6 on the top surface and 3 on the bottom surface.
  • interconnection between at least two adjacent rings in the winding is provided by interconnection bars 53 and 54 which are displaced from the longitudinal center axis 55 of the rings to improve the stackup as previously described. Tabs are provided adjacent each spiral pattern for electrical connection and anchoring as before. The dielectric would be folded along the horizontal dotted lines 56 and 57 to form the winding and placed in a core such as that shown in FIGS. 3 and 4.

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Coil Winding Methods And Apparatuses (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)
EP93309635A 1992-12-17 1993-12-02 Eléments magnétiques plats Withdrawn EP0602838A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US99563692A 1992-12-17 1992-12-17
US995636 1992-12-17

Publications (1)

Publication Number Publication Date
EP0602838A1 true EP0602838A1 (fr) 1994-06-22

Family

ID=25542046

Family Applications (1)

Application Number Title Priority Date Filing Date
EP93309635A Withdrawn EP0602838A1 (fr) 1992-12-17 1993-12-02 Eléments magnétiques plats

Country Status (2)

Country Link
EP (1) EP0602838A1 (fr)
JP (1) JPH06224044A (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5886610A (en) * 1996-07-17 1999-03-23 Canova; Antonio Ultra flat magnetic device for electronic circuits

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3002260A (en) * 1961-10-03 shortt etal
DD99880A1 (fr) * 1972-09-18 1973-08-20
DE3643044A1 (de) * 1986-12-17 1988-06-30 Ivan Bystrican Faltspule
US5017902A (en) * 1989-05-30 1991-05-21 General Electric Company Conductive film magnetic components

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3002260A (en) * 1961-10-03 shortt etal
DD99880A1 (fr) * 1972-09-18 1973-08-20
DE3643044A1 (de) * 1986-12-17 1988-06-30 Ivan Bystrican Faltspule
US5017902A (en) * 1989-05-30 1991-05-21 General Electric Company Conductive film magnetic components

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5886610A (en) * 1996-07-17 1999-03-23 Canova; Antonio Ultra flat magnetic device for electronic circuits

Also Published As

Publication number Publication date
JPH06224044A (ja) 1994-08-12

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PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

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Effective date: 19941223