EP0604856A2 - Matériau utilisé comme contact et procédé pour sa fabrication - Google Patents

Matériau utilisé comme contact et procédé pour sa fabrication Download PDF

Info

Publication number: EP0604856A2
Authority: EP; European Patent Office
Prior art keywords: tin; nickel; tests; contact; plated
Prior art date: 1992-12-17
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Granted

Application number

EP93120409A

Other languages

German (de)

English (en)

Other versions

EP0604856A3 (fr

EP0604856B1 (fr

Inventor

Hitoshi Saito

Tadashi Yamashita

Hiroo Nakajima

Shougo Inoue

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

SANNO CO Ltd

Nippon Metal Industry Co Ltd

Original Assignee

SANNO CO Ltd

Nippon Metal Industry Co Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1992-12-17

Filing date

1993-12-17

Publication date

1994-07-06

1993-12-17 Application filed by SANNO CO Ltd, Nippon Metal Industry Co Ltd filed Critical SANNO CO Ltd

1994-07-06 Publication of EP0604856A2 publication Critical patent/EP0604856A2/fr

1995-03-15 Publication of EP0604856A3 publication Critical patent/EP0604856A3/fr

1997-03-26 Application granted granted Critical

1997-03-26 Publication of EP0604856B1 publication Critical patent/EP0604856B1/fr

2013-12-17 Anticipated expiration legal-status Critical

Status Expired - Lifetime legal-status Critical Current

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Classifications

- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
- H01H1/02—Contacts characterised by the material thereof
- H01H1/021—Composite material
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
- H01H1/02—Contacts characterised by the material thereof
- H01H1/021—Composite material
- H01H1/023—Composite material having a noble metal as the basic material

Definitions

This invention relates to contact devices which includes connectors, switches or the like. More specifically, this invention is directed to contact materials and the method of manufacturing the same, to provide a material having excellent corrosion resistance, good contact resistance, good bending fracture strength, excellent spring characteristics, and good ductility, making it suitable for use in weak and intermediate current voltage applications.
copper and copper-based alloys including brass, phosphor bronze, beryllium, copper, titanium copper, and oxygen free high conductivity copper have been widely utilized as electrical contact materials in such devices as connectors and switches. Since brass is relatively less expensive than other type of copper-based alloys, it is widely used as a contact material where a specific spring characteristic is not a major concern. Beryllium copper, on the other hand, is utilized where a highly reliable contact material having excellent spring characteristics is needed. However, this material is relatively expensive thus making the device using this material correspondingly expensive. Titanium copper has excellent heat resistance characteristics while oxygen free high conductivity copper exhibits good ductility. Generally speaking, the various types of copper-based alloy noted above are adequate for many proposes as contact materials, however, they all have certain disadvantages which are overcome by the material of the present invention.
the surface of these contacts will be vulnerable to sulfidation or oxidation.
these devices can only be utilized where the current is strong enough to fracture the said sulfides or oxides.
noble metals including gold or palladium in addition to tin are sometimes directly plated onto copper-based alloy devices to prevent the devices from being corroded.
an inter-diffusion reaction takes place between substrates of the copper-based alloys and the plated films due to the generated heat or secular changes in operating conditions.
a nickel plating may also be applied which acts as an intermediate layer between the substrates of copper-based alloys and the aforementioned plated layers. This prevents inter-diffusion action and improves the hardness of the contact device and enhances its wear resistance characteristics.
Methods for fabrication contacts utilizing nickel plated copper-based alloys generally takes two forms. The first includes the entire substrate of band-shaped copper-based alloys plated with nickel, and then entirely or partially plated with a tin or tin-based alloys followed by a press-forming technique to fabricate contacts. The second includes nickel-plating a substrate which is formed as a contact by press-forming an originally band-shaped copper-based alloy, followed by plating the contact entirely or partially with a noble metal, tin, or a tin-based alloy.
stainless steel substrates have been utilized as an alternative contact material in place of copper or copper-based alloys.
contact materials are applied by either entirely or partially plating the nickel plated substrate with a noble metal, tin or tin-based alloys or by direct plating the stainless steel substrates with nickel.
a Watt bath which is basically a strong acidity nickel plating bath containing hydrochloric acid, is utilized to partially etch the substrate and cause pitting thereon. It is difficult to completely coat these pits by nickel plating (which has a thickness ranging form 1.0 to 5.0 ⁇ m). As evidenced by salt spray tests, the corrosion resistance of these plated products is inferior to that of stainless steel products. Since a strong acidity plating bath containing hydrochloric acid is used for a direct gold plating on stainless steel substrate, similar problems will be recognized as those mentioned above in regard to nickel plating. Although acidity bath containing sulfuric acid which is environmentally more favorable has been recently developed, the corrosion protection on the contact points of most devices is not still satisfied.
a stainless steel substrate is initially clad with nickel or a nickel-based alloy (which is hereinafter called as nickel-claded stainless steel substrate material), and then noble metals, tin or tin-based alloys are plated upon said nickel-claded stainless steel substrate to fabricate contacts.
contacts comprising the nickel-claded stainless steel substrate are entirely or partially plated with at least one type of material composed of various types of noble metals, tin or tin-based alloys. The contacts were further evaluated and found to exhibit excellent characteristics in terms of corrosion resistance, contact resistance, bending strength, spring property, and ductility.
the second embodiment of this invention involves a manufacturing method for contacts which possess excellent corrosion resistance, good contact resistance, good ductility and excellent spring characteristics in which a band-shaped nickel-claded stainless steel substrate is entirely or partially plated with at least one type of material which consists of various types of noble metals, tin or tin-based alloys.
a third embodiment of the present invention describes a manufacturing method of contacts with excellent corrosion resistance, good contact resistance, good bending strength, and excellent spring characteristics.
a press-formed nickel-claded stainless steel substrate is plated with at least one type of material which consists of various types of noble metals, tin or tin-based alloys.
the nickel-claded stainless steel substrate material can be any type of materials produced by well known techniques, including band-shaped or press-formed material. It is preferable to have a thickness of plated nickel within a range from 1.0 to 5.0 ⁇ m.
a thickness of the plated layer of noble metals, tin or tin-based alloys is preferable to have a thickness of the plated layer of noble metals, tin or tin-based alloys to be in a range from 0.01 to 10 ⁇ m.
Plating baths for various metals can be employed from normally used baths; namely borofluoric bright bath for tin plating, alkali cyanide silver bath for silver plating, ammonium chloride palladium nickel plating bath for palladium nickel plating and acid hard cobalt gold plating bath of the citric acid salt buffer solution for gold plating.
the substrate for the contact materials is a stainless steel claded with nickel-based alloy
corrosion pits caused by etching during the plating process will be of considerably lower severity than for etched copper-based alloy substrates or nickel-plated stainless steel substrates.
the nickel-claded substrates exhibit superior corrosion resistance when compared to copper-based alloy or nickel-plated stainless steel substrates.
no fractures were produced during the pressing of substrates plated with noble metals, tin or tin-based alloys. Accordingly, there are no exposed portions of the substrate materials, and thus no sulfidation or oxidation thereof which might cause corrosion to form which might contaminate the contacts.
contacts which are fabricated through the present invention exhibit superior bending strength, spring characteristics and ductility to contacts conventionally manufactured.
a band-shaped nickel-claded stainless steel substrate (namely, an AISI Type 304 stainless steel substrate claded with 3 ⁇ m thick nickel having dimensions of 15.5 mm width x 50 mm length x 0.2 mm thickness) was electrolytically degreased at a temperature of 50°C in an alkali cyanide degreasing solution at 6 V for 15 seconds, the stainless steel substrate was activated by immersion in 10% sulfuric acid solution at room temperature for 30 seconds and was subjected to 0.2 ⁇ m thick gold plating by using an acid hard cobalt gold plating bath of citric acid salt buffer solution. The plated sample was then cut into 30 mm length and further subjected to the following tests.
the nickel-claded stainless steel substrate which was the same material as that used for embodiment 1, was 0.5 ⁇ m thick pure gold plated by using neutral cyanide pure gold plating bath. Similar tests 1) and 2) as carried out in association with Embodiment 1 were conducted. The obtained results are also listed in Tables 1 and 2.
Nickel-claded stainless steel as in Embodiment 1 was plated with a 2.0 ⁇ m thick silver coating by use of an alkali cyanide silver plating bath. Similar tests 1) and 2) for Embodiment 1 were conducted and the results are also listed in Tables 1 and 2.
Copper alloys including MX96, MX216, C1720, C5210 and C7250 which are widely utilized as contact materials, nickel-claded AISI Type 304 stainless steel and nickel-claded AISI Type 301 stainless steel were subjected to the spring characteristic tests. The obtained results are listed in Table 3.
Nickel-claded stainless steel substrate which is a similar material as to that used in Embodiment 1 was subjected to tests 1) and 2) as performed on the material of Embodiment 1. The results of the tests are shown in Tables 1 and 2.
the contact materials prepared through the present invention exhibit superior contact resistance characteristics, corrosion resistance, bending strength, and spring property over the conventional type of contact materials including copper, copper-based alloys, nickel-plated stainless steel when compared to other similar devices. Accordingly, it is suggested that the present contact materials can be applied to highly reliable components to which conventional types of contact materials are not readily adapted.
the present invention has been described on stainless steel clad with nickel or nickel-based alloys, but stainless steel surface can be vapor-deposited with nickel or nickel-based alloys to perform same functions.
the nickel-claded stainless steel substrate of the present invention is plated with noble metals, tin or tin-based alloys, the contact materials exhibiting excellent characteristics in terms of corrosion resistance, contact resistance, bending strength, spring property, and ductility can be fabricated easily and inexpensively. AT the same time, anti-corrosion treatment after the press-forming process can be entirely avoided.

Landscapes

Chemical & Material Sciences (AREA)
Engineering & Computer Science (AREA)
Composite Materials (AREA)
Materials Engineering (AREA)
Manufacture Of Switches (AREA)
Contacts (AREA)
Electroplating Methods And Accessories (AREA)

EP93120409A 1992-12-17 1993-12-17 Matériau utilisé comme contact et procédé pour sa fabrication Expired - Lifetime EP0604856B1 (fr)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
JP355082/92		1992-12-17
JP35508292A JP3467527B2 (ja)	1992-12-17	1992-12-17	接点材料及びその製造方法

Publications (3)

Publication Number	Publication Date
EP0604856A2 true EP0604856A2 (fr)	1994-07-06
EP0604856A3 EP0604856A3 (fr)	1995-03-15
EP0604856B1 EP0604856B1 (fr)	1997-03-26

Family

ID=18441835

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
EP93120409A Expired - Lifetime EP0604856B1 (fr)	1992-12-17	1993-12-17	Matériau utilisé comme contact et procédé pour sa fabrication

Country Status (6)

Country	Link
EP (1)	EP0604856B1 (fr)
JP (1)	JP3467527B2 (fr)
KR (1)	KR940014897A (fr)
CN (1)	CN1091548A (fr)
AT (1)	ATE150897T1 (fr)
DE (1)	DE69309242T2 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
WO2006130074A1 (fr) *	2005-05-31	2006-12-07	Sandvik Intellectual Property Ab	Produit en bande metallique, tel qu'un ressort de contact electrique, et son procede de fabrication
CN102354543A (zh) *	2011-07-28	2012-02-15	攀枝花学院	TiCr2基电触头材料及其制备方法和用途
CN113624672A (zh) *	2021-08-16	2021-11-09	格力电器（合肥）有限公司	一种应用于拨码开关触点的高加速组合式盐雾试验方法

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CN1049521C (zh) *	1997-08-08	2000-02-16	甘肃华洋实业有限公司	电触头用无银复合材料及生产工艺
DE19751841A1 (de) *	1997-11-22	1999-05-27	Stolberger Metallwerke Gmbh	Elektrisch leitfähiges Metallband und Steckverbinder daraus
CN1100887C (zh) *	1999-05-24	2003-02-05	毛朝弟	一种液态合金的溶制方法
JP4023663B2 (ja) *	2001-09-20	2007-12-19	日新製鋼株式会社	ステンレス鋼製接点
CN101453071B (zh) *	2007-11-28	2013-05-08	李世煌	一种导电材料改进的电源插头、插座、接插件的导电体
JP2015149218A (ja) *	2014-02-07	2015-08-20	矢崎総業株式会社	固定接点
JP6268055B2 (ja) *	2014-07-15	2018-01-24	矢崎総業株式会社	端子及びコネクタ
JP6272744B2 (ja) *	2014-10-24	2018-01-31	矢崎総業株式会社	板状導電体及び板状導電体の表面処理方法
JP6268070B2 (ja) *	2014-09-16	2018-01-24	矢崎総業株式会社	メッキ材及び端子金具
CN104112616B (zh) *	2014-07-21	2016-04-27	南通万德科技有限公司	一种消抖的按键及其制备方法
CN107782660B (zh) *	2017-10-24	2020-08-14	广东电网有限责任公司电力科学研究院	一种评价刀闸触头材料环境耐久性的测试方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
EP0192703B1 (fr) *	1984-08-31	1989-11-02	AT&T Corp.	Contact electrique a base de nickel
US4732821A (en) *	1986-01-30	1988-03-22	American Telephone And Telegraph Company, At&T Bell Laboratories	Nickel-based electrical contact
JPH01298617A (ja) *	1988-05-27	1989-12-01	Toshiba Corp	真空バルブ用接点とその製造方法
DE4117312A1 (de) *	1991-05-27	1992-12-03	Siemens Ag	Kontaktwerkstoff auf silberbasis zur verwendung in schaltgeraeten der energietechnik sowie verfahren zur herstellung von kontaktstuecken aus diesem werkstoff

1992
- 1992-12-17 JP JP35508292A patent/JP3467527B2/ja not_active Expired - Lifetime
1993
- 1993-12-17 DE DE69309242T patent/DE69309242T2/de not_active Expired - Fee Related
- 1993-12-17 AT AT93120409T patent/ATE150897T1/de not_active IP Right Cessation
- 1993-12-17 KR KR1019930028183A patent/KR940014897A/ko not_active Withdrawn
- 1993-12-17 EP EP93120409A patent/EP0604856B1/fr not_active Expired - Lifetime
- 1993-12-17 CN CN93119875A patent/CN1091548A/zh active Pending

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
WO2006130074A1 (fr) *	2005-05-31	2006-12-07	Sandvik Intellectual Property Ab	Produit en bande metallique, tel qu'un ressort de contact electrique, et son procede de fabrication
CN102354543A (zh) *	2011-07-28	2012-02-15	攀枝花学院	TiCr2基电触头材料及其制备方法和用途
CN102354543B (zh) *	2011-07-28	2013-06-19	攀枝花学院	TiCr2基电触头材料及其制备方法和用途
CN113624672A (zh) *	2021-08-16	2021-11-09	格力电器（合肥）有限公司	一种应用于拨码开关触点的高加速组合式盐雾试验方法

Also Published As

Publication number	Publication date
KR940014897A (ko)	1994-07-19
JP3467527B2 (ja)	2003-11-17
DE69309242D1 (de)	1997-04-30
EP0604856A3 (fr)	1995-03-15
JPH06187867A (ja)	1994-07-08
CN1091548A (zh)	1994-08-31
ATE150897T1 (de)	1997-04-15
EP0604856B1 (fr)	1997-03-26
DE69309242T2 (de)	1997-08-14

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