EP0632545A3 - Verbindungsanordnung für elektrische Kontakte. - Google Patents
Verbindungsanordnung für elektrische Kontakte. Download PDFInfo
- Publication number
- EP0632545A3 EP0632545A3 EP94304529A EP94304529A EP0632545A3 EP 0632545 A3 EP0632545 A3 EP 0632545A3 EP 94304529 A EP94304529 A EP 94304529A EP 94304529 A EP94304529 A EP 94304529A EP 0632545 A3 EP0632545 A3 EP 0632545A3
- Authority
- EP
- European Patent Office
- Prior art keywords
- interconnecting
- contact
- printed circuit
- lead
- distance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/12—Resilient or clamping means for holding component to structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/10—Plug-in assemblages of components, e.g. IC sockets
- H05K7/1015—Plug-in assemblages of components, e.g. IC sockets having exterior leads
- H05K7/1023—Plug-in assemblages of components, e.g. IC sockets having exterior leads co-operating by abutting, e.g. flat pack
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
- H01R12/721—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures cooperating directly with the edge of the rigid printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/10—Plug-in assemblages of components, e.g. IC sockets
- H05K7/1015—Plug-in assemblages of components, e.g. IC sockets having exterior leads
- H05K7/103—Plug-in assemblages of components, e.g. IC sockets having exterior leads co-operating by sliding, e.g. DIP carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/62—Means for facilitating engagement or disengagement of coupling parts or for holding them in engagement
- H01R13/629—Additional means for facilitating engagement or disengagement of coupling parts, e.g. aligning or guiding means, levers, gas pressure electrical locking indicators, manufacturing tolerances
- H01R13/631—Additional means for facilitating engagement or disengagement of coupling parts, e.g. aligning or guiding means, levers, gas pressure electrical locking indicators, manufacturing tolerances for engagement only
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Multi-Conductor Connections (AREA)
- Connecting Device With Holders (AREA)
- Combinations Of Printed Boards (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US08/085,292 US5336094A (en) | 1993-06-30 | 1993-06-30 | Apparatus for interconnecting electrical contacts |
| US85292 | 1993-06-30 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| EP0632545A2 EP0632545A2 (de) | 1995-01-04 |
| EP0632545A3 true EP0632545A3 (de) | 1995-09-20 |
| EP0632545B1 EP0632545B1 (de) | 1999-10-06 |
Family
ID=22190648
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP94304529A Expired - Lifetime EP0632545B1 (de) | 1993-06-30 | 1994-06-22 | Verbindungsanordnung für elektrische Kontakte |
Country Status (11)
| Country | Link |
|---|---|
| US (1) | US5336094A (de) |
| EP (1) | EP0632545B1 (de) |
| JP (1) | JP2683320B2 (de) |
| KR (1) | KR100281695B1 (de) |
| AT (1) | ATE185454T1 (de) |
| CA (1) | CA2122508C (de) |
| DE (1) | DE69421008T2 (de) |
| DK (1) | DK0632545T3 (de) |
| ES (1) | ES2141200T3 (de) |
| MY (1) | MY111967A (de) |
| TW (1) | TW269754B (de) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6403226B1 (en) | 1996-05-17 | 2002-06-11 | 3M Innovative Properties Company | Electronic assemblies with elastomeric members made from cured, room temperature curable silicone compositions having improved stress relaxation resistance |
Families Citing this family (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5634801A (en) * | 1991-01-09 | 1997-06-03 | Johnstech International Corporation | Electrical interconnect contact system |
| US5645433A (en) * | 1994-05-09 | 1997-07-08 | Johnstech International Corporation | Contacting system for electrical devices |
| US5594355A (en) * | 1994-07-19 | 1997-01-14 | Delta Design, Inc. | Electrical contactor apparatus for testing integrated circuit devices |
| US5609489A (en) * | 1994-12-21 | 1997-03-11 | Hewlett-Packard Company | Socket for contacting an electronic circuit during testing |
| DE69630474T2 (de) * | 1995-02-07 | 2004-08-05 | Johnstech International Corp., Minneapolis | Gerät zur Steuerung der Impedanz von elektrischen Kontakten |
| US5588846A (en) * | 1995-08-25 | 1996-12-31 | The Whitaker Corporation | Right angle electrical connector |
| US5947749A (en) * | 1996-07-02 | 1999-09-07 | Johnstech International Corporation | Electrical interconnect contact system |
| US5888075A (en) * | 1997-02-10 | 1999-03-30 | Kabushiki Kaisha Nihon Micronics | Auxiliary apparatus for testing device |
| US6019612A (en) * | 1997-02-10 | 2000-02-01 | Kabushiki Kaisha Nihon Micronics | Electrical connecting apparatus for electrically connecting a device to be tested |
| US6064218A (en) * | 1997-03-11 | 2000-05-16 | Primeyield Systems, Inc. | Peripherally leaded package test contactor |
| SG88739A1 (en) * | 1997-05-15 | 2002-05-21 | Nihon Micronics Kk | Auxiliary apparatus for testing device |
| US5910024A (en) * | 1997-08-28 | 1999-06-08 | Mcms, Inc. | Carrier socket for receiving a damaged IC |
| EP0919816B1 (de) * | 1997-11-25 | 2006-12-27 | Kabushiki Kaisha Nihon Micronics | Elektrische Verbindungsvorrichtung |
| KR20010003825A (ko) * | 1999-06-25 | 2001-01-15 | 윤창진 | 미생물을 코팅한 미생물 착생대 및 그 코팅방법 |
| KR100355241B1 (ko) * | 1999-08-27 | 2002-10-11 | 오기만 | 미생물 활성용 오폐수 정화를 위한 정화용 여재의 체결방법과 폭기조 내에 시공방법 |
| DE10119122A1 (de) * | 2000-06-02 | 2002-10-24 | Sillner Georg Rudolf | Verfahren sowie Vorrichtung zum Messen, insbesondere Hochfrequenzmessen von elektrischen Bauelementen |
| US6350153B1 (en) | 2000-06-16 | 2002-02-26 | Leeno Ind Inc | Electrical connector for connecting an integrated circuit to a printed circuit board |
| KR100373623B1 (ko) * | 2000-07-20 | 2003-03-04 | 조현국 | 미생물 접촉용 오, 폐수, 하수처리 여재의 제조장치 |
| KR100439661B1 (ko) * | 2001-07-11 | 2004-07-12 | 곽종운 | 미생물 접촉여재 및 그 제조방법 |
| US6876213B2 (en) | 2002-02-22 | 2005-04-05 | Johnstech International Corporation | Compliant actuator for IC test fixtures |
| DE20310734U1 (de) * | 2003-07-12 | 2003-10-23 | HARTING Electro-Optics GmbH & Co. KG, 32339 Espelkamp | Steckvorrichtung zur Verbindung von Leiterplatten |
| US7329130B2 (en) * | 2005-09-30 | 2008-02-12 | Japan Aviation Electronics Industry, Limited | Intervening connection apparatus capable of easily and accurately positioning a conductor |
| JP2009043591A (ja) | 2007-08-09 | 2009-02-26 | Yamaichi Electronics Co Ltd | Ｉｃソケット |
| JP5029969B2 (ja) * | 2008-11-12 | 2012-09-19 | 山一電機株式会社 | 電気接続装置 |
| US20110212639A1 (en) * | 2010-02-26 | 2011-09-01 | Jeffrey Paquette | Circuit card assembly connector and interconnection system |
| US8197274B2 (en) | 2010-08-18 | 2012-06-12 | Rockwell Automation Technologies, Inc. | Torsional contact device and method for electronics module |
| US8246358B2 (en) | 2010-09-30 | 2012-08-21 | Rockwell Automation Technologies, Inc. | Contact device and method for insertion and removal of device under power without interruption |
| US8308490B2 (en) | 2010-09-30 | 2012-11-13 | Rockwell Automation Technologies, Inc. | Contact configuration for electronics to base connection |
| US12270850B2 (en) | 2023-03-08 | 2025-04-08 | Infineon Technologies Ag | Semiconductor device testing with lead extender |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4445735A (en) * | 1980-12-05 | 1984-05-01 | Compagnie Internationale Pour L'informatique Cii-Honeywell Bull (Societe Anonyme) | Electrical connection device for high density contacts |
| US4458968A (en) * | 1982-07-06 | 1984-07-10 | At&T Bell Laboratories | Integrated circuit chip carrier mounting arrangement |
| EP0384438A1 (de) * | 1989-02-23 | 1990-08-29 | The Whitaker Corporation | Elektrischer Verbinder und Verfahren zum Herstellen eines elektrischen Verbinders |
| US5207584A (en) * | 1991-01-09 | 1993-05-04 | Johnson David A | Electrical interconnect contact system |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4894022A (en) * | 1988-07-28 | 1990-01-16 | Hewlett-Packard Company | Solderless surface mount card edge connector |
| US5069629A (en) * | 1991-01-09 | 1991-12-03 | Johnson David A | Electrical interconnect contact system |
-
1993
- 1993-06-30 US US08/085,292 patent/US5336094A/en not_active Expired - Lifetime
-
1994
- 1994-04-12 MY MYPI94000868A patent/MY111967A/en unknown
- 1994-04-14 TW TW083103325A patent/TW269754B/zh not_active IP Right Cessation
- 1994-04-29 CA CA002122508A patent/CA2122508C/en not_active Expired - Fee Related
- 1994-05-26 KR KR1019940011579A patent/KR100281695B1/ko not_active Expired - Fee Related
- 1994-06-22 EP EP94304529A patent/EP0632545B1/de not_active Expired - Lifetime
- 1994-06-22 AT AT94304529T patent/ATE185454T1/de not_active IP Right Cessation
- 1994-06-22 DE DE69421008T patent/DE69421008T2/de not_active Expired - Lifetime
- 1994-06-22 ES ES94304529T patent/ES2141200T3/es not_active Expired - Lifetime
- 1994-06-22 DK DK94304529T patent/DK0632545T3/da active
- 1994-06-28 JP JP14686094A patent/JP2683320B2/ja not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4445735A (en) * | 1980-12-05 | 1984-05-01 | Compagnie Internationale Pour L'informatique Cii-Honeywell Bull (Societe Anonyme) | Electrical connection device for high density contacts |
| US4458968A (en) * | 1982-07-06 | 1984-07-10 | At&T Bell Laboratories | Integrated circuit chip carrier mounting arrangement |
| EP0384438A1 (de) * | 1989-02-23 | 1990-08-29 | The Whitaker Corporation | Elektrischer Verbinder und Verfahren zum Herstellen eines elektrischen Verbinders |
| US5207584A (en) * | 1991-01-09 | 1993-05-04 | Johnson David A | Electrical interconnect contact system |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6403226B1 (en) | 1996-05-17 | 2002-06-11 | 3M Innovative Properties Company | Electronic assemblies with elastomeric members made from cured, room temperature curable silicone compositions having improved stress relaxation resistance |
Also Published As
| Publication number | Publication date |
|---|---|
| EP0632545B1 (de) | 1999-10-06 |
| DE69421008T2 (de) | 2000-06-08 |
| ES2141200T3 (es) | 2000-03-16 |
| KR100281695B1 (ko) | 2001-05-02 |
| KR950002547A (ko) | 1995-01-04 |
| CA2122508A1 (en) | 1994-12-31 |
| EP0632545A2 (de) | 1995-01-04 |
| MY111967A (en) | 2001-03-31 |
| CA2122508C (en) | 2002-04-16 |
| TW269754B (de) | 1996-02-01 |
| DK0632545T3 (da) | 2000-04-10 |
| JPH07147172A (ja) | 1995-06-06 |
| ATE185454T1 (de) | 1999-10-15 |
| JP2683320B2 (ja) | 1997-11-26 |
| US5336094A (en) | 1994-08-09 |
| DE69421008D1 (de) | 1999-11-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TW269754B (de) | ||
| CA2197143A1 (en) | Printed circuit board connector | |
| MY108186A (en) | Surface mount electrical connector assembly | |
| GB2008333A (en) | Electrical connector | |
| EP0286422A3 (en) | Electrical connector terminal for a flexible printed circuit board | |
| PT817319E (pt) | Sistema de contactos de interligacao electrica | |
| CA2059386A1 (en) | Socket and Header Electrical Connector Assembly | |
| DE69318651D1 (de) | Verbinderblock | |
| SE8303597D0 (sv) | Pa en gemensam berskena monterad apparatsats | |
| EP0735623A3 (de) | Elektrischer Verbinder | |
| ATE328379T1 (de) | Leiterplatte für modularstecker | |
| TW549724U (en) | Ball grid array socket | |
| DE68923361D1 (de) | Modulares Verbindersystem mit oberflächenmontierten Verbindern hoher Kontaktelementdichte. | |
| JP2001244599A (ja) | Ｉｃの実装構造及びｂｇａ形ｉｃ用位置固定シート | |
| JPS5471388A (en) | Electric connector that ensure low cost | |
| MY130144A (en) | Connector with press-fit terminal pins | |
| EP0305027A3 (de) | Temperaturmesssonde | |
| ES2021551A6 (es) | Unidad funcional enchuflable activa para un dispositivo de contacto de enchufe multipolo. | |
| ATE268452T1 (de) | Lampenanordnung und zugehöriges testverfahren | |
| WO2000004585A3 (de) | Chipträgeranordnung sowie verfahren zur herstellung einer chipträgeranordnung mit elektrischem test | |
| GB1522467A (en) | Housings for electric or electronic equipment | |
| EP0200516A3 (en) | Electrical terminator device | |
| EP0234367A3 (en) | Spring contact for an electrical plag-in connection rail | |
| FR2579380B1 (fr) | Borne de contact electrique thermo-enfichable sur une carte de circuit imprime et connecteur comportant de telles bornes | |
| EP0886348A3 (de) | Elektrischer Verbinder |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
| AK | Designated contracting states |
Kind code of ref document: A2 Designated state(s): AT BE CH DE DK ES FR GB IE IT LI NL PT SE |
|
| PUAL | Search report despatched |
Free format text: ORIGINAL CODE: 0009013 |
|
| AK | Designated contracting states |
Kind code of ref document: A3 Designated state(s): AT BE CH DE DK ES FR GB IE IT LI NL PT SE |
|
| 17P | Request for examination filed |
Effective date: 19960304 |
|
| 17Q | First examination report despatched |
Effective date: 19980216 |
|
| GRAG | Despatch of communication of intention to grant |
Free format text: ORIGINAL CODE: EPIDOS AGRA |
|
| GRAG | Despatch of communication of intention to grant |
Free format text: ORIGINAL CODE: EPIDOS AGRA |
|
| GRAH | Despatch of communication of intention to grant a patent |
Free format text: ORIGINAL CODE: EPIDOS IGRA |
|
| GRAH | Despatch of communication of intention to grant a patent |
Free format text: ORIGINAL CODE: EPIDOS IGRA |
|
| GRAA | (expected) grant |
Free format text: ORIGINAL CODE: 0009210 |
|
| AK | Designated contracting states |
Kind code of ref document: B1 Designated state(s): AT BE CH DE DK ES FR GB IE IT LI NL PT SE |
|
| REF | Corresponds to: |
Ref document number: 185454 Country of ref document: AT Date of ref document: 19991015 Kind code of ref document: T |
|
| REG | Reference to a national code |
Ref country code: CH Ref legal event code: EP |
|
| REF | Corresponds to: |
Ref document number: 69421008 Country of ref document: DE Date of ref document: 19991111 |
|
| ET | Fr: translation filed | ||
| ITF | It: translation for a ep patent filed | ||
| REG | Reference to a national code |
Ref country code: IE Ref legal event code: FG4D |
|
| REG | Reference to a national code |
Ref country code: CH Ref legal event code: NV Representative=s name: E. BLUM & CO. PATENTANWAELTE |
|
| REG | Reference to a national code |
Ref country code: ES Ref legal event code: FG2A Ref document number: 2141200 Country of ref document: ES Kind code of ref document: T3 |
|
| REG | Reference to a national code |
Ref country code: PT Ref legal event code: SC4A Free format text: AVAILABILITY OF NATIONAL TRANSLATION Effective date: 19991230 |
|
| REG | Reference to a national code |
Ref country code: DK Ref legal event code: T3 |
|
| PLBE | No opposition filed within time limit |
Free format text: ORIGINAL CODE: 0009261 |
|
| STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT |
|
| 26N | No opposition filed | ||
| REG | Reference to a national code |
Ref country code: GB Ref legal event code: IF02 |
|
| PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: SE Payment date: 20020611 Year of fee payment: 9 Ref country code: PT Payment date: 20020611 Year of fee payment: 9 |
|
| PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: AT Payment date: 20020612 Year of fee payment: 9 |
|
| PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: DK Payment date: 20020614 Year of fee payment: 9 |
|
| PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: ES Payment date: 20020618 Year of fee payment: 9 |
|
| PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: IE Payment date: 20020625 Year of fee payment: 9 |
|
| PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: NL Payment date: 20020628 Year of fee payment: 9 |
|
| PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: CH Payment date: 20020702 Year of fee payment: 9 |
|
| PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: BE Payment date: 20020829 Year of fee payment: 9 |
|
| PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: AT Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20030622 |
|
| PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: SE Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20030623 Ref country code: IE Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20030623 Ref country code: ES Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20030623 |
|
| PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: LI Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20030630 Ref country code: DK Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20030630 Ref country code: CH Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20030630 Ref country code: BE Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20030630 |
|
| BERE | Be: lapsed |
Owner name: *JOHNSTECH INTERNATIONAL CORP. Effective date: 20030630 |
|
| PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: PT Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20031231 |
|
| PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: NL Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20040101 |
|
| EUG | Se: european patent has lapsed | ||
| REG | Reference to a national code |
Ref country code: CH Ref legal event code: PL |
|
| NLV4 | Nl: lapsed or anulled due to non-payment of the annual fee |
Effective date: 20040101 |
|
| REG | Reference to a national code |
Ref country code: DK Ref legal event code: EBP |
|
| REG | Reference to a national code |
Ref country code: PT Ref legal event code: MM4A Free format text: LAPSE DUE TO NON-PAYMENT OF FEES Effective date: 20031231 |
|
| REG | Reference to a national code |
Ref country code: IE Ref legal event code: MM4A |
|
| REG | Reference to a national code |
Ref country code: ES Ref legal event code: FD2A Effective date: 20030623 |
|
| PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: IT Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES;WARNING: LAPSES OF ITALIAN PATENTS WITH EFFECTIVE DATE BEFORE 2007 MAY HAVE OCCURRED AT ANY TIME BEFORE 2007. THE CORRECT EFFECTIVE DATE MAY BE DIFFERENT FROM THE ONE RECORDED. Effective date: 20050622 |
|
| PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: DE Payment date: 20120620 Year of fee payment: 19 |
|
| PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: GB Payment date: 20120620 Year of fee payment: 19 Ref country code: FR Payment date: 20120619 Year of fee payment: 19 |
|
| REG | Reference to a national code |
Ref country code: DE Ref legal event code: R119 Ref document number: 69421008 Country of ref document: DE |
|
| GBPC | Gb: european patent ceased through non-payment of renewal fee |
Effective date: 20130622 |
|
| REG | Reference to a national code |
Ref country code: FR Ref legal event code: ST Effective date: 20140228 |
|
| PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: GB Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20130622 Ref country code: DE Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20140101 |
|
| REG | Reference to a national code |
Ref country code: DE Ref legal event code: R079 Ref document number: 69421008 Country of ref document: DE Free format text: PREVIOUS MAIN CLASS: H01R0023720000 Ipc: H01R0012500000 |
|
| PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: FR Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20130701 |
|
| REG | Reference to a national code |
Ref country code: DE Ref legal event code: R119 Ref document number: 69421008 Country of ref document: DE Effective date: 20140101 Ref country code: DE Ref legal event code: R079 Ref document number: 69421008 Country of ref document: DE Free format text: PREVIOUS MAIN CLASS: H01R0023720000 Ipc: H01R0012500000 Effective date: 20140523 |