EP0700485B1 - Microvanne - Google Patents

Microvanne Download PDF

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Publication number
EP0700485B1
EP0700485B1 EP94916136A EP94916136A EP0700485B1 EP 0700485 B1 EP0700485 B1 EP 0700485B1 EP 94916136 A EP94916136 A EP 94916136A EP 94916136 A EP94916136 A EP 94916136A EP 0700485 B1 EP0700485 B1 EP 0700485B1
Authority
EP
European Patent Office
Prior art keywords
microvalve
membrane structure
membrane
microvalve according
valve
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP94916136A
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German (de)
English (en)
Other versions
EP0700485A1 (fr
Inventor
Thomas Lisec
Hans-Joachim Quenzer
Bernd Wagner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fraunhofer Gesellschaft zur Foerderung der Angewandten Forschung eV
Original Assignee
Fraunhofer Gesellschaft zur Foerderung der Angewandten Forschung eV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fraunhofer Gesellschaft zur Foerderung der Angewandten Forschung eV filed Critical Fraunhofer Gesellschaft zur Foerderung der Angewandten Forschung eV
Publication of EP0700485A1 publication Critical patent/EP0700485A1/fr
Application granted granted Critical
Publication of EP0700485B1 publication Critical patent/EP0700485B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F15—FLUID-PRESSURE ACTUATORS; HYDRAULICS OR PNEUMATICS IN GENERAL
    • F15C—FLUID-CIRCUIT ELEMENTS PREDOMINANTLY USED FOR COMPUTING OR CONTROL PURPOSES
    • F15C3/00—Circuit elements having moving parts
    • F15C3/04—Circuit elements having moving parts using diaphragms

Definitions

  • the present invention relates to a microvalve that can be used, for example, as a pilot valve in pneumatics.
  • Pneumatic controls are widely used in many areas of technology because they are characterized by a long service life, operational reliability and high forces.
  • An electro-mechanical converter (actuating element) actuated via an electrical signal acts directly or via several pressure stages on the actual valve stage (control element), which in turn manipulates a certain operating variable (pressure, flow) in the desired manner.
  • the main control elements used are cylindrical linear slide valves for main stages and cylindrical seat valves for direct-operated valves or pilot valves.
  • the solenoid has established itself as an actuating element, since this type of drive is characterized by a high work capacity and simple structure.
  • a classic solenoid valve made of molded plastic parts has dimensions of approx. 25x25x40 mm 3 , works at pressures up to 8 bar and requires approx. 2.5 W when actuated.
  • a trend towards miniaturization can also be observed in the field of pneumatics for certain applications in order to reduce costs, reduce material consumption, increase flexibility and improve switching properties.
  • the space requirement of small pneumatic valves is increasingly determined by the dimensions of the solenoid, the coil of which can only be reduced in size with a considerable increase in cost and inevitably falling performance.
  • Miniature solenoid valves (10x10x15 mm 3 ) manufactured using precision engineering are at least 5 times more expensive than classic solenoid valves.
  • EP 208386 discloses a silicon valve for flow control of a liquid which is manufactured using microstructure technology and which consists of a first planar part with an outlet opening and a second part with a planar surface which can be moved relative to the outlet opening in order to open and close it .
  • an external force is applied to it, e.g. exercised via a piston.
  • the entire construction necessary for the function of the valve is very complex.
  • actuating means used for the movement of a membrane as closing bodies in microvalves are known, for example, from DE 3919876.
  • Piezoelectrically or thermoelectrically operating coatings of the membrane, electrostatic or thermofluidic actuation are to be mentioned here in particular.
  • Piezoelectric and electostatic micro valves are also unable to provide the performance data required in pneumatics. Very high control voltages would be required to switch the high pressures that occur there (1 - 7 bar).
  • thermofluidic actuation is that the cooling process proceeds very slowly without additional disruptive aids (low dynamics).
  • a microvalve made of microstructurable material which consists of a first pressure-side part, which has a membrane structure as a movable closing body, and a second part connected to the first, with at least one outlet opening and at least one valve seat, at least one of which the two parts have one or more pits of defined depth.
  • the membrane structure is on one side with a material which has a different coefficient of thermal expansion than the membrane material at least partially coated so that when heated, the membrane structure bends against the applied pressure.
  • the membrane structure is provided with one or more heating elements.
  • the principle of operation of this microvalve is based on the thermomechanical effect which results from the different thermal coefficients of linear expansion of the membrane material and coating.
  • this mode of operation has the disadvantage that the high initial forces required for pneumatic controls when opening the valve can only be insufficiently achieved.
  • the present invention has for its object to provide a microvalve of the type in question, which is suitable for industrial pneumatic controls is inexpensive to manufacture using semiconductor technology and has improved switching properties.
  • the object is achieved with the microvalve specified in claim 1.
  • This consists of two parts.
  • the first part which is located on the side of the higher pressure p in (pressure side), has a membrane structure which is coated on one side with a material which has a coefficient of thermal expansion which differs from that of the membrane material.
  • the difference in the coefficients of linear expansion of the membrane material and coating material and the spatial arrangement of the coating on the membrane dictate the direction in which the membrane structure deflects.
  • the membrane structure can be coated completely or only at certain points. However, the coating must be applied so that the membrane structure bends when heated against the applied pressure p in .
  • the membrane structure is provided with one or more heating elements.
  • the second part is connected to the first on the side facing the lower pressure p out .
  • the closing body of the first part or substrate areas of the second part or both parts have one or more pits of a defined depth, all pits being arranged such that they are completely covered by areas of the other part when the valve is closed, so that closed cavities arise in which there are heating elements. Closed cavities are also to be understood here as those in which gaps of a few Im occur on the edges of the pits due to the production.
  • the heating elements thus heat, among other things, the gas or liquid volume located in the pits. It is essential to the arrangement of the pits that a closed volume of liquid or gas is generated with the valve closed, which can be quickly heated by the heating elements.
  • the depth of the pits is preferably at most 40 ⁇ m (claim 2).
  • the microvalve according to the invention works on the basis of a combined thermomechanical-thermopneumatic principle of action.
  • the valve is closed when de-energized. If the membrane is heated by the heating elements, a force builds up, the membrane against the higher pressure p in deflectable force (thermomechanical effect), which results from the thermal expansion of the membrane.
  • the coating can perform a function that supports this force with a corresponding coating density (bimetal effect) or only a function that determines the deflection direction of the membrane (cf. claim 6).
  • the volume of liquid or gas eg air
  • heats up in the pits below the membrane Since this can only drain off through narrow gaps, overpressure is created in the pits. There is also a brief thermopneumatic force on the membrane.
  • the valve can be opened against higher pressures than, for example, a purely thermomechanical force generation would allow.
  • the speed at which the valve opens increases considerably compared to the purely thermomechanical drive. Efficiency is also increased through better heat utilization.
  • the thermopneumatic effect is reduced by the upward movement of the membrane, ie only thermomechanical forces are effective in the open state. This is countered by the fact that the full pressure difference (p in >> p out ) is only present at the valve when it is opened.
  • the energy supply can be significantly reduced compared to conventional solenoid valves.
  • a plurality of heating elements can be provided to adapt the heating power and thus the thermomechanical force to the respective requirements.
  • the micromechanical valve described here is closed by switching off the heating elements. The process is significantly accelerated by the "bleeding" of the control volume (again p in>> p out), eg via a second micro valve, as the (p in -sided) applied pressure the membrane easily downwards (p out -sided) above presses.
  • micromechanical valves can be manufactured in a similar way to ICs, there is a significant price advantage compared to miniature solenoid valves.
  • the size of a microvalve, even with a housing, will not be more than a tenth of the volume of a conventional miniature valve.
  • the preferred microstructurable material is silicon, which is very suitable for the production of microvalves due to its physical properties.
  • the two parts of the microvalve can be two chips connected by silicon bonding or gluing (claim 4).
  • Elements that can be manufactured using silicon technology can also be manufactured very inexpensively in large numbers.
  • the coating material of the membrane structure is a metal.
  • Metals have a relatively large thermal coefficient of linear expansion compared to microstructurable material such as silicon.
  • the metal coating can e.g. B. applied as shown in the embodiment to cause the deflection of the membrane against the applied pressure p in .
  • the coating can be applied during production by means of sputtering, vapor deposition or electroplating.
  • a coating of silicon dioxide (SiO 2 ) or silicon nitride (Si 3 N 4 ), which is applied on the side facing the lower pressure (p out side) of the silicon membrane, has proven to be particularly advantageous.
  • the thickness of the coating can be up to 500 nanometers.
  • the SiO 2 or Si 3 N 4 on the side of the low pressure p out causes the membrane to deflect exclusively against the adjacent one high pressure p in , since these materials have a much lower coefficient of thermal expansion than single-crystal silicon.
  • the main advantage of this coating material is the lower power requirement compared to a metal coating.
  • a metal coating acts as a heat short circuit, ie the heat dissipation to the chip via the clamping is very large. With the same heat output, a membrane structure without metal actuators therefore reaches a significantly higher temperature.
  • the temperature is the quantity that determines the strength of the thermomechanical effect. Valves with silicon dioxide or silicon nitride layers work with lower heating outputs and have better dynamics (switching times in the range of a few msec.) Than those with metal coatings.
  • the coating only has the function of influencing the direction of the deflection, while the thermal linear expansion of the silicon membrane itself applies the force against the external pressure.
  • Claim 7 specifies an embodiment of the microvalve according to the invention in which the heating elements are implanted conductor tracks or polysilicon tracks.
  • the application of these webs can be realized with methods of semiconductor technology.
  • the membrane structure is preferably bridge-shaped (i.e. a strip clamped on both sides) or cross-shaped (claim 8), so that the pressure medium can pass through as freely as possible when the valve is opened.
  • Claim 10 specifies the preferred area of application of the microvalve according to the invention.
  • FIG. 1 shows a schematic representation of a possible embodiment for the microvalve according to the invention.
  • the microvalve consists of two silicon chips 1 and 2, which are usually connected at the wafer level by means of silicon bonding.
  • the upper (Pressure-side) chip 1 contains the movable closing body 3 - a membrane structure formed by anisotropic etching (for example a bridge or cross shape).
  • the membrane is provided with heating elements (eg implanted conductor tracks or polysilicon tracks) and selectively coated on the pit side with metal 4 (e.g. Al or Au by sputtering, vapor deposition or electroplating).
  • metal 4 e.g. Al or Au by sputtering, vapor deposition or electroplating.
  • there is a further insulating layer e.g. thermal SiO 2 between the metal coating and the heating elements.
  • the lower chip 2 contains the outlet opening 7, the anisotropically etched valve seat 5 and several pits of defined depth 6, which can be produced by both isotropic and anisotropic etching.
  • the pits have a maximum size of 400 x 600 x 40 ⁇ m 3 and are arranged so that they are covered by the membrane structure.
  • a second microvalve according to the invention can be used to vent a control volume.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Mechanical Engineering (AREA)
  • Temperature-Responsive Valves (AREA)
  • Fluid-Driven Valves (AREA)
  • Lift Valve (AREA)
  • Fluid-Pressure Circuits (AREA)
  • Drying Of Semiconductors (AREA)
  • Valve-Gear Or Valve Arrangements (AREA)
  • Forging (AREA)
  • Micromachines (AREA)

Claims (10)

  1. Microvanne en une matière microstructurable, consistant au moins en une première partie (1), située du côté de la pression, qui présente une structure de membrane (3) sous la forme d'un corps de fermeture mobile, et d'une deuxième partie (2), reliée à la première, avec au moins une ouverture d'évacuation (7) et au moins un siège de vanne (5), au moins l'une des deux parties présentant un ou plusieurs sillons de profondeur définie (6), la structure de membrane étant revêtue au moins en partie d'un côté d'une matière (4), qui possède un autre coefficient de dilatation thermique en longueur que la matière de la membrane, de telle sorte qu'il en résulte lors de l'échauffement une flexion permanente de la structure de membrane à l'encontre de la pression appliquée, et la structure de membrane étant pourvue d'un ou plusieurs éléments de chauffage,
    caractérisée en ce que
    les sillons sont disposés de telle façon qu'ils sont complètement recouverts par les zones de l'autre partie, quand la vanne est fermée, de telle sorte que l'on obtient des cavités fermées, dans lesquelles se trouvent des éléments chauffants.
  2. Microvanne selon la revendication 1,
    caractérisée en ce que
    les sillons présentent une profondeur maximale de 410 µm
  3. Microvanne selon la revendication 1 ou 2,
    caractérisée en ce que
    la matière microstructurable est du silicium
  4. Microvanne selon la revendication 3,
    caractérisée en ce que
    les deux parties de la microvanne sont deux puces reliées au moyen d'un bonding au silicone ou par collage.
  5. Microvanne selon l'une des revendications 1 à 4,
    caractérisée en ce que
    la matière de l'enduction de la structure de membrane est un métal
  6. Microvanne selon la revendication 3 ou 4,
    caractérisée en ce que
    la matière de l'enduction de la structure de membrane est de la silice SiO2 ou du nitrure de silicium Si3N4 et en ce que l'enduction est mis sur le côté de la membrane, qui est tourné vers la pression plus basse.
  7. Microvanne selon l'une des revendications 1 à 5,
    caractérisée en ce que
    les éléments de chauffage sont des pistes conductrices implantées ou des pistes de polysilicium
  8. Microvanne selon l'une des revendications 1 à 6,
    caractérisée en ce que
    la structure de membrane est constituée en forme de pont ou en forme de croix
  9. Microvanne selon l'une des revendications 1 à 7,
    caractérisée en ce que
    l'on peut régler la puissance du chauffage nécessaire à son actionnement
  10. Microvanne selon l'une des revendications 1 à 8,
    caractérisée en ce que
    on l'utilise comme vanne de commutation pilote dans des commandes pneumatiques
EP94916136A 1993-05-27 1994-05-21 Microvanne Expired - Lifetime EP0700485B1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE4317676 1993-05-27
DE4317676 1993-05-27
PCT/DE1994/000599 WO1994028318A1 (fr) 1993-05-27 1994-05-21 Microvanne

Publications (2)

Publication Number Publication Date
EP0700485A1 EP0700485A1 (fr) 1996-03-13
EP0700485B1 true EP0700485B1 (fr) 1997-08-13

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Family Applications (1)

Application Number Title Priority Date Filing Date
EP94916136A Expired - Lifetime EP0700485B1 (fr) 1993-05-27 1994-05-21 Microvanne

Country Status (6)

Country Link
US (1) US5681024A (fr)
EP (1) EP0700485B1 (fr)
JP (1) JP3418741B2 (fr)
AT (1) ATE156895T1 (fr)
DE (2) DE59403742D1 (fr)
WO (1) WO1994028318A1 (fr)

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JP3418741B2 (ja) 2003-06-23
JPH09501265A (ja) 1997-02-04
US5681024A (en) 1997-10-28
DE4418450C2 (de) 1996-07-25
DE59403742D1 (de) 1997-09-18
WO1994028318A1 (fr) 1994-12-08
ATE156895T1 (de) 1997-08-15
DE4418450A1 (de) 1994-12-01
EP0700485A1 (fr) 1996-03-13

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