EP0735156A2 - Procédé et appareil pour l'étamage partiel d'une bande - Google Patents

Procédé et appareil pour l'étamage partiel d'une bande Download PDF

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Publication number
EP0735156A2
EP0735156A2 EP96104657A EP96104657A EP0735156A2 EP 0735156 A2 EP0735156 A2 EP 0735156A2 EP 96104657 A EP96104657 A EP 96104657A EP 96104657 A EP96104657 A EP 96104657A EP 0735156 A2 EP0735156 A2 EP 0735156A2
Authority
EP
European Patent Office
Prior art keywords
strips
strip
molten metal
tape
heating chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP96104657A
Other languages
German (de)
English (en)
Other versions
EP0735156B1 (fr
EP0735156A3 (fr
Inventor
Isabell Dipl.-Ing. Dr.Re.Nat. Buresch
Traugott Schneider
Hermann Sturm
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wieland Werke AG
Original Assignee
Wieland Werke AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wieland Werke AG filed Critical Wieland Werke AG
Publication of EP0735156A2 publication Critical patent/EP0735156A2/fr
Publication of EP0735156A3 publication Critical patent/EP0735156A3/fr
Application granted granted Critical
Publication of EP0735156B1 publication Critical patent/EP0735156B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/04Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the coating material
    • C23C2/08Tin or alloys based thereon
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/34Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the shape of the material to be treated
    • C23C2/36Elongated material
    • C23C2/40Plates; Strips
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/12All metal or with adjacent metals
    • Y10T428/12493Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/12All metal or with adjacent metals
    • Y10T428/12493Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12708Sn-base component
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/12All metal or with adjacent metals
    • Y10T428/12493Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12708Sn-base component
    • Y10T428/12715Next to Group IB metal-base component
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/12All metal or with adjacent metals
    • Y10T428/12493Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12708Sn-base component
    • Y10T428/12722Next to Group VIII metal-base component
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/12All metal or with adjacent metals
    • Y10T428/12993Surface feature [e.g., rough, mirror]
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/24Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/24Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer

Definitions

  • the invention relates to a partially hot-dip tinned strip made of coatable material according to the preamble of claim 1.
  • Partly tinned tapes on one or both sides can be produced, for example, by the process according to US Pat. No. 4,529,628.
  • liquid metal is partially applied to a belt on one or both sides via a nozzle.
  • the thickness of the coating is controlled by the belt speed and the nozzle output.
  • the layer thickness is therefore identical across the entire range.
  • the coating is continuous over the length of the belt. It is only possible to apply one coating material per strip side. If several coating materials or different properties are required on one strip side, several production steps in succession are necessary.
  • this method does not offer the possibility of coating the strip edges, which is required with regard to solderability in the edge area or when making contact via the strip edge. This process is therefore not highly economical.
  • the invention is therefore based on the object, in particular to expand the range of partially tinned strips in accordance with the needs of the electronics industry.
  • the object is achieved in that the strip - seen in the longitudinal direction - is interrupted at regular and / or irregular intervals (A 1 , A 2 , A 3 ). Distances (A 1 , A 2 , A 3 %) in the range from 1 to 20 mm are preferred.
  • the strips have different layer thicknesses (D1 / D2), or the strips consist of different coating materials.
  • the advantages of thin Sn layers with, for example, low insertion and drawing forces can be shared the advantages of thick Sn layers combined with good solderability (especially for connectors).
  • Harder coating materials e.g. in the contact zone with softer coating materials e.g. can be combined in the crimp or solder area.
  • Copper, copper alloy, iron or iron alloy are preferred as the strip material; Pure tin, tin alloys or zinc are preferably available as coating materials.
  • the invention further relates to methods and apparatus for producing the partially hot-dip tinned strip.
  • the method assumes that the moving strip is provided with flux and heated and that molten metal is applied to the heated strip from at least one storage chamber via at least one opening and excess molten metal is stripped off.
  • the method is characterized in that the supply of the molten metal from the opening is selectively opened and closed.
  • different coating materials can also be used in one and the same strip.
  • the storage chamber feeds at least two openings lying next to one another.
  • the invention achieves structures in which the coating strips are notable for high adhesion.
  • Partially tinned tapes are used in electronics and electrical engineering. They are used, for example, to manufacture connectors for the automotive industry, telecommunications and others. Some coated tapes are also used in the manufacture of semiconductor components such as QFPs (Quad Flat Package), SOTs (Small Outline Transistor), ICs (Integrated Circuit) and others here the combination of the bare strip surface with a well solderable tinned surface.
  • QFPs Quad Flat Package
  • SOTs Small Outline Transistor
  • ICs Integrated Circuit
  • the tape 1 according to Fig. 1 and 2 is each provided with four coating strips 2, 3, 4, 5. According to Figure 1, these are arranged approximately in the middle of the tape, according to Figure 2 on the tape edges. In both Fig.1 / 2, the strips 2, 3 on the top of the tape should have a layer thickness D1, the strips 4, 5 on the underside of the tape should have a layer thickness D2. Furthermore, it is indicated in FIG. 2 that the strips 2, 4 consist of a different coating material than the strips 3, 5. Only the two FIGS. 1/2 show the multiple possibilities of tinning the strip with different distances (A 1 , A 2 , A 3 ...) interrupted strips 2, 3, 4, 5.
  • the strip 1 running off a decoiler 6 passes through a flux feed 7 and for heating comes into a heating chamber 8, in which an insert 9 is integrated, in which a storage chamber 10 is arranged.
  • the metal melt 11 located in the storage chamber 10 is thus kept at the same time at the temperature.
  • the insert 9 rests resiliently on the belt 1.
  • the metal melt 11 provided for coating can reach the strip 1 via an opening 12.
  • Means for controlling the melt supply are indicated by paragraph 13.
  • the layer thickness of the strip 2, 3, 4, 5 to be applied can be varied by the subsequent stripping 14 for the molten metal 11 and / or by the insert 9 being pressed more or less strongly onto the strip 1.
  • the tinned strip 1 is finally rolled up on a reel 15.
  • a storage chamber 10 feeds two openings 12 lying next to one another.
  • the insert 9 has two storage chambers 10 opened laterally to the legs 8 'of the heating chamber 8, so that strips 2, 3, 4, 5 result on the edge strips.
  • these storage chambers 10 are connected to grooves 16 in the heating chamber 8 which encompass the strip edges (means for controlling the supply of melt are not shown in more detail here).
  • the heating chamber 8 which is essentially U-shaped in cross section, can consist, for example, of a base plate provided with heating cartridges, onto which a graphite plate and side legs 8 'are also screwed from graphite.
  • Graphite can also be provided as the material for the insert 9.
  • Tapes with the following dimensions can be tinned: thickness: 0.05 to 1.5 mm, width: 5 to 200 mm.
  • Tinning temperature 50 to 400 ° C.
  • Layer thicknesses of 0.2 to 25 ⁇ m can be achieved.
  • the strips partially coated in this way have an intermetallic phase between the coating and the base material, which increases the adhesion of the coating, so that the coating does not flake off during bending processes even after heat treatments.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Coating With Molten Metal (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Connection Of Batteries Or Terminals (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Bending Of Plates, Rods, And Pipes (AREA)
  • Treatment Of Fiber Materials (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Vehicle Interior And Exterior Ornaments, Soundproofing, And Insulation (AREA)
EP96104657A 1995-03-30 1996-03-23 Procédé et appareil pour l'étamage partiel d'une bande Expired - Lifetime EP0735156B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19511656 1995-03-30
DE19511656A DE19511656C2 (de) 1995-03-30 1995-03-30 Partiell feuerverzinntes Band

Publications (3)

Publication Number Publication Date
EP0735156A2 true EP0735156A2 (fr) 1996-10-02
EP0735156A3 EP0735156A3 (fr) 1998-10-28
EP0735156B1 EP0735156B1 (fr) 2001-09-05

Family

ID=7758144

Family Applications (1)

Application Number Title Priority Date Filing Date
EP96104657A Expired - Lifetime EP0735156B1 (fr) 1995-03-30 1996-03-23 Procédé et appareil pour l'étamage partiel d'une bande

Country Status (7)

Country Link
US (1) US5712048A (fr)
EP (1) EP0735156B1 (fr)
JP (1) JP3954129B2 (fr)
AT (1) ATE205262T1 (fr)
DE (2) DE19511656C2 (fr)
DK (1) DK0735156T3 (fr)
ES (1) ES2161310T3 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1857568A1 (fr) * 2006-05-18 2007-11-21 Wieland-Werke AG Dispositif de revêtement et méthode pour fabrication d'une bande métallique partiellement revêtue sur une face

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ITMI20042516A1 (it) * 2004-12-27 2005-03-27 Getters Spa Processo per produrre mediante deposizione di lega bassofondente dispositivi portanti almeno un materiale attivo
DE102006033072B4 (de) * 2006-07-14 2008-11-13 Von Ardenne Anlagentechnik Gmbh Verfahren und Vorrichtung zum Beschichten von Substraten durch Tauchen in eine Metallschmelze
EP1905857B1 (fr) 2006-09-29 2013-08-14 EZM Edelstahlzieherei Mark GmbH Acier à haute résistance et utilisations d'un tel acier
DE102010054539A1 (de) * 2010-12-15 2012-06-21 OTB Oberflächentechnik in Berlin GmbH & Co. KG Verfahren zur Herstellung eines Werkstücks aus Kupfer oder einer Kupferlegierung mit einer Beschichtung

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE278819C (fr) *
US2274963A (en) * 1938-08-10 1942-03-03 Crucible Steel Company Process for plating tin and tin alloys
US2394545A (en) * 1942-08-28 1946-02-12 Interchem Corp Tin plate manufacture
JPS5130539B1 (fr) * 1971-05-10 1976-09-01
US3860780A (en) * 1973-09-24 1975-01-14 Dynaloc Corp Method of making self-centering pulley using mig welding
JPS55145396A (en) * 1979-04-27 1980-11-12 Furukawa Circuit Foil Copper foil for printed circuit and method of fabricating same
CH648601A5 (fr) * 1979-07-31 1985-03-29 Battelle Memorial Institute Procede de revetement en continu d'un substrat metallique sur une partie au moins de sa surface par un autre metal et dispositif pour la mise en oeuvre de ce procede.
US4381342A (en) * 1981-04-27 1983-04-26 Eastman Kodak Company Liquid jet method for coating photographic recording media
JPS5953666A (ja) * 1982-09-22 1984-03-28 Nippon Steel Corp 部分めつき鋼帯
JPS6115954A (ja) * 1984-07-03 1986-01-24 Sumitomo Electric Ind Ltd 金属帯板用連続めつき方法とそれを実施するための装置
JPS6115955A (ja) * 1984-07-03 1986-01-24 Sumitomo Electric Ind Ltd 金属帯板用連続めつき装置
JPS61235550A (ja) * 1985-04-10 1986-10-20 Nisshin Steel Co Ltd メニスカスコ−テイング方法におけるめつき付着量の制御方法
DE3536304A1 (de) * 1985-10-11 1987-04-16 Kaspar Eidenberg Verfahren zum verzinnen von leiterplatten und vorrichtung zum durchfuehren dieses verfahrens
DE3539585A1 (de) * 1985-10-11 1987-07-02 Kaspar Eidenberg Verfahren zum verloeten der anschluesse von bauteilen mit den leiterbahnen und loetaugen von leiterplatten und vorrichtung zum durchfuehren dieses verfahrens
DD278819A1 (de) * 1988-12-27 1990-05-16 Elektronische Bauelemente Dorf Vorrichtung zum wahlweisen einseitigen schmelzfluessigen teilbeschichten von metallbaendern mit einer loetfaehigen schicht aus zinn oder zinn-blei-legierungen
WO1991006687A1 (fr) * 1989-10-25 1991-05-16 Nkk Corporation Procede de placage en continu de plaques metalliques
DE4019090A1 (de) * 1990-06-15 1991-12-19 Battelle Institut E V Verfahren zur beschichtung von substraten
FR2670505B1 (fr) * 1990-12-17 1994-03-25 Solems Procede et appareil pour apporter un compose metallique fondu a un substrat.
US5429882A (en) * 1993-04-05 1995-07-04 The Louis Berkman Company Building material coating
JP3264704B2 (ja) * 1992-10-06 2002-03-11 松下電器産業株式会社 光学素子成形用金型およびその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1857568A1 (fr) * 2006-05-18 2007-11-21 Wieland-Werke AG Dispositif de revêtement et méthode pour fabrication d'une bande métallique partiellement revêtue sur une face

Also Published As

Publication number Publication date
ATE205262T1 (de) 2001-09-15
JPH08283924A (ja) 1996-10-29
DE59607603D1 (de) 2001-10-11
DE19511656C2 (de) 1997-11-27
DE19511656A1 (de) 1996-10-02
JP3954129B2 (ja) 2007-08-08
EP0735156B1 (fr) 2001-09-05
DK0735156T3 (da) 2001-11-05
ES2161310T3 (es) 2001-12-01
US5712048A (en) 1998-01-27
EP0735156A3 (fr) 1998-10-28

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