EP0857541A3 - Chemisch-mechanische Poliervorrichtung - Google Patents

Chemisch-mechanische Poliervorrichtung Download PDF

Info

Publication number
EP0857541A3
EP0857541A3 EP98101376A EP98101376A EP0857541A3 EP 0857541 A3 EP0857541 A3 EP 0857541A3 EP 98101376 A EP98101376 A EP 98101376A EP 98101376 A EP98101376 A EP 98101376A EP 0857541 A3 EP0857541 A3 EP 0857541A3
Authority
EP
European Patent Office
Prior art keywords
wafer
carrier
pad
adhered
thickness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP98101376A
Other languages
English (en)
French (fr)
Other versions
EP0857541A2 (de
Inventor
Shigeto Izumi
Hatsuyuki Arai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Speedfam IPEC Corp
Original Assignee
SpeedFam Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SpeedFam Co Ltd filed Critical SpeedFam Co Ltd
Publication of EP0857541A2 publication Critical patent/EP0857541A2/de
Publication of EP0857541A3 publication Critical patent/EP0857541A3/de
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
EP98101376A 1997-02-06 1998-01-27 Chemisch-mechanische Poliervorrichtung Withdrawn EP0857541A3 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP38427/97 1997-02-06
JP3842797A JPH10217112A (ja) 1997-02-06 1997-02-06 Ｃｍｐ装置

Publications (2)

Publication Number Publication Date
EP0857541A2 EP0857541A2 (de) 1998-08-12
EP0857541A3 true EP0857541A3 (de) 1999-02-03

Family

ID=12525025

Family Applications (1)

Application Number Title Priority Date Filing Date
EP98101376A Withdrawn EP0857541A3 (de) 1997-02-06 1998-01-27 Chemisch-mechanische Poliervorrichtung

Country Status (5)

Country Link
US (1) US6030488A (de)
EP (1) EP0857541A3 (de)
JP (1) JPH10217112A (de)
KR (1) KR19980071123A (de)
TW (1) TW372901B (de)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11138429A (ja) * 1997-11-11 1999-05-25 Sony Corp 研磨装置
JPH11204468A (ja) * 1998-01-09 1999-07-30 Speedfam Co Ltd 半導体ウエハの表面平坦化装置
JP2000141215A (ja) 1998-11-05 2000-05-23 Sony Corp 平坦化研磨装置及び平坦化研磨方法
WO2000069595A2 (en) * 1999-05-19 2000-11-23 Speedfam-Ipec Corporation Method and apparatus for automatically adjusting the contour of a wafer carrier surface
US6340326B1 (en) 2000-01-28 2002-01-22 Lam Research Corporation System and method for controlled polishing and planarization of semiconductor wafers
US6705930B2 (en) * 2000-01-28 2004-03-16 Lam Research Corporation System and method for polishing and planarizing semiconductor wafers using reduced surface area polishing pads and variable partial pad-wafer overlapping techniques
DE10009656B4 (de) * 2000-02-24 2005-12-08 Siltronic Ag Verfahren zur Herstellung einer Halbleiterscheibe
JP4615813B2 (ja) * 2000-05-27 2011-01-19 ローム アンド ハース エレクトロニック マテリアルズ シーエムピー ホウルディングス インコーポレイテッド 化学機械平坦化用の研磨パッド
US6652357B1 (en) 2000-09-22 2003-11-25 Lam Research Corporation Methods for controlling retaining ring and wafer head tilt for chemical mechanical polishing
US6585572B1 (en) 2000-08-22 2003-07-01 Lam Research Corporation Subaperture chemical mechanical polishing system
US7481695B2 (en) 2000-08-22 2009-01-27 Lam Research Corporation Polishing apparatus and methods having high processing workload for controlling polishing pressure applied by polishing head
US6640155B2 (en) 2000-08-22 2003-10-28 Lam Research Corporation Chemical mechanical polishing apparatus and methods with central control of polishing pressure applied by polishing head
US6471566B1 (en) 2000-09-18 2002-10-29 Lam Research Corporation Sacrificial retaining ring CMP system and methods for implementing the same
US6443815B1 (en) 2000-09-22 2002-09-03 Lam Research Corporation Apparatus and methods for controlling pad conditioning head tilt for chemical mechanical polishing
JP4009087B2 (ja) * 2001-07-06 2007-11-14 アプライド マテリアルズ インコーポレイテッド 半導体製造装置における磁気発生装置、半導体製造装置および磁場強度制御方法
US6530829B1 (en) * 2001-08-30 2003-03-11 Micron Technology, Inc. CMP pad having isolated pockets of continuous porosity and a method for using such pad
US6736720B2 (en) 2001-12-26 2004-05-18 Lam Research Corporation Apparatus and methods for controlling wafer temperature in chemical mechanical polishing
US6592437B1 (en) 2001-12-26 2003-07-15 Lam Research Corporation Active gimbal ring with internal gel and methods for making same
US6937915B1 (en) 2002-03-28 2005-08-30 Lam Research Corporation Apparatus and methods for detecting transitions of wafer surface properties in chemical mechanical polishing for process status and control
CA2519942A1 (en) 2003-03-25 2004-10-14 Neopad Technologies Corporation Chip customized polish pads for chemical mechanical planarization (cmp)
US20070215280A1 (en) * 2006-03-15 2007-09-20 Sandhu Rajinder R Semiconductor surface processing
JP5008922B2 (ja) * 2006-07-31 2012-08-22 セツ子 近藤 ロアチャックパッド
US20080125021A1 (en) * 2006-11-27 2008-05-29 United Microelectronics Corp. Disk holder and disk rotating device having the same
JP2010118424A (ja) * 2008-11-12 2010-05-27 Disco Abrasive Syst Ltd 薄板状ワークの搬送装置
US20180281151A1 (en) * 2017-03-30 2018-10-04 Applied Materials, Inc. Adhesive-less carriers for chemical mechanical polishing
KR102783310B1 (ko) * 2019-11-19 2025-03-19 가부시키가이샤 에바라 세이사꾸쇼 기판을 보유 지지하기 위한 톱링 및 기판 처리 장치

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62297063A (ja) * 1986-02-21 1987-12-24 Hitachi Ltd 薄片状部材研磨用真空チヤツク装置
US4954141A (en) * 1988-01-28 1990-09-04 Showa Denko Kabushiki Kaisha Polishing pad for semiconductor wafers
EP0454362A2 (de) * 1990-04-27 1991-10-30 Shin-Etsu Handotai Company Limited Traghalterung und Verfahren zur Herstellung der Traghalterung durch feine Oberflächenbearbeitung
EP0578351A1 (de) * 1992-07-07 1994-01-12 Shin-Etsu Handotai Company Limited Elastische Schaumfolie und Aufspannvorrichtung zum Polieren von Waffeln, die diese Folie verwendet
JPH07320995A (ja) * 1994-05-23 1995-12-08 Sony Corp 研磨装置および研磨方法と張り合わせ方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03173129A (ja) * 1989-12-01 1991-07-26 Hitachi Ltd 研磨装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62297063A (ja) * 1986-02-21 1987-12-24 Hitachi Ltd 薄片状部材研磨用真空チヤツク装置
US4954141A (en) * 1988-01-28 1990-09-04 Showa Denko Kabushiki Kaisha Polishing pad for semiconductor wafers
EP0454362A2 (de) * 1990-04-27 1991-10-30 Shin-Etsu Handotai Company Limited Traghalterung und Verfahren zur Herstellung der Traghalterung durch feine Oberflächenbearbeitung
EP0578351A1 (de) * 1992-07-07 1994-01-12 Shin-Etsu Handotai Company Limited Elastische Schaumfolie und Aufspannvorrichtung zum Polieren von Waffeln, die diese Folie verwendet
JPH07320995A (ja) * 1994-05-23 1995-12-08 Sony Corp 研磨装置および研磨方法と張り合わせ方法

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 012, no. 190 (M - 704) 3 June 1988 (1988-06-03) *
PATENT ABSTRACTS OF JAPAN vol. 096, no. 004 30 April 1996 (1996-04-30) *

Also Published As

Publication number Publication date
EP0857541A2 (de) 1998-08-12
JPH10217112A (ja) 1998-08-18
KR19980071123A (ko) 1998-10-26
US6030488A (en) 2000-02-29
TW372901B (en) 1999-11-01

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