EP0902854A2 - Prozess zur herstellung eines thermisch stabilen, metallbeschichteten monofilaments oder garns - Google Patents
Prozess zur herstellung eines thermisch stabilen, metallbeschichteten monofilaments oder garnsInfo
- Publication number
- EP0902854A2 EP0902854A2 EP97944281A EP97944281A EP0902854A2 EP 0902854 A2 EP0902854 A2 EP 0902854A2 EP 97944281 A EP97944281 A EP 97944281A EP 97944281 A EP97944281 A EP 97944281A EP 0902854 A2 EP0902854 A2 EP 0902854A2
- Authority
- EP
- European Patent Office
- Prior art keywords
- monofilament
- nickel
- coating
- surfactant
- polymeric
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 46
- 239000002184 metal Substances 0.000 title claims abstract description 46
- 238000000034 method Methods 0.000 title claims description 45
- 230000008569 process Effects 0.000 title claims description 43
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 156
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 77
- 238000000576 coating method Methods 0.000 claims abstract description 36
- 239000011248 coating agent Substances 0.000 claims abstract description 30
- 239000004094 surface-active agent Substances 0.000 claims abstract description 24
- 229910052802 copper Inorganic materials 0.000 claims abstract description 23
- 239000010949 copper Substances 0.000 claims abstract description 23
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 22
- 239000002253 acid Substances 0.000 claims abstract description 16
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 26
- 230000003213 activating effect Effects 0.000 claims description 15
- 229920003235 aromatic polyamide Polymers 0.000 claims description 9
- 230000015556 catabolic process Effects 0.000 claims description 8
- 238000006731 degradation reaction Methods 0.000 claims description 8
- 239000004760 aramid Substances 0.000 claims description 7
- 229910000521 B alloy Inorganic materials 0.000 claims description 6
- QDWJUBJKEHXSMT-UHFFFAOYSA-N boranylidynenickel Chemical compound [Ni]#B QDWJUBJKEHXSMT-UHFFFAOYSA-N 0.000 claims description 6
- 125000000217 alkyl group Chemical group 0.000 claims description 5
- 239000004952 Polyamide Substances 0.000 claims description 3
- 229920002647 polyamide Polymers 0.000 claims description 3
- 229920000728 polyester Polymers 0.000 claims description 3
- 150000001412 amines Chemical group 0.000 claims description 2
- 150000002148 esters Chemical class 0.000 claims description 2
- UQSQSQZYBQSBJZ-UHFFFAOYSA-N fluorosulfonic acid Chemical compound OS(F)(=O)=O UQSQSQZYBQSBJZ-UHFFFAOYSA-N 0.000 claims description 2
- 150000003839 salts Chemical class 0.000 claims description 2
- 239000007787 solid Substances 0.000 claims description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 9
- 238000007747 plating Methods 0.000 abstract description 5
- 235000004879 dioscorea Nutrition 0.000 description 58
- 239000000243 solution Substances 0.000 description 30
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 14
- 238000000151 deposition Methods 0.000 description 14
- 230000008021 deposition Effects 0.000 description 13
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 12
- 239000003054 catalyst Substances 0.000 description 10
- 239000000203 mixture Substances 0.000 description 10
- 238000007654 immersion Methods 0.000 description 9
- 229910045601 alloy Inorganic materials 0.000 description 7
- 239000000956 alloy Substances 0.000 description 7
- 239000003638 chemical reducing agent Substances 0.000 description 7
- 238000009713 electroplating Methods 0.000 description 7
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 description 7
- 229910052763 palladium Inorganic materials 0.000 description 7
- 229920000642 polymer Polymers 0.000 description 7
- -1 sodium alkyl benzoates Chemical class 0.000 description 7
- 239000000835 fiber Substances 0.000 description 6
- 238000001465 metallisation Methods 0.000 description 6
- 239000008367 deionised water Substances 0.000 description 5
- 229910021641 deionized water Inorganic materials 0.000 description 5
- 230000003647 oxidation Effects 0.000 description 5
- 238000007254 oxidation reaction Methods 0.000 description 5
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 4
- 229910052796 boron Inorganic materials 0.000 description 4
- 230000035515 penetration Effects 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- 230000004913 activation Effects 0.000 description 3
- 229920006231 aramid fiber Polymers 0.000 description 3
- 229910000085 borane Inorganic materials 0.000 description 3
- RJTANRZEWTUVMA-UHFFFAOYSA-N boron;n-methylmethanamine Chemical compound [B].CNC RJTANRZEWTUVMA-UHFFFAOYSA-N 0.000 description 3
- 230000003197 catalytic effect Effects 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 239000012141 concentrate Substances 0.000 description 3
- 238000000454 electroless metal deposition Methods 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- UORVGPXVDQYIDP-UHFFFAOYSA-N trihydridoboron Substances B UORVGPXVDQYIDP-UHFFFAOYSA-N 0.000 description 3
- YXIWHUQXZSMYRE-UHFFFAOYSA-N 1,3-benzothiazole-2-thiol Chemical compound C1=CC=C2SC(S)=NC2=C1 YXIWHUQXZSMYRE-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- DHMQDGOQFOQNFH-UHFFFAOYSA-N Glycine Chemical compound NCC(O)=O DHMQDGOQFOQNFH-UHFFFAOYSA-N 0.000 description 2
- AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical compound CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 description 2
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 2
- 239000012190 activator Substances 0.000 description 2
- 125000005907 alkyl ester group Chemical group 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000010924 continuous production Methods 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 2
- OJMIONKXNSYLSR-UHFFFAOYSA-N phosphorous acid Chemical compound OP(O)O OJMIONKXNSYLSR-UHFFFAOYSA-N 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000005382 thermal cycling Methods 0.000 description 2
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 239000002759 woven fabric Substances 0.000 description 2
- KEQGZUUPPQEDPF-UHFFFAOYSA-N 1,3-dichloro-5,5-dimethylimidazolidine-2,4-dione Chemical compound CC1(C)N(Cl)C(=O)N(Cl)C1=O KEQGZUUPPQEDPF-UHFFFAOYSA-N 0.000 description 1
- KWSLGOVYXMQPPX-UHFFFAOYSA-N 5-[3-(trifluoromethyl)phenyl]-2h-tetrazole Chemical compound FC(F)(F)C1=CC=CC(C2=NNN=N2)=C1 KWSLGOVYXMQPPX-UHFFFAOYSA-N 0.000 description 1
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- FPJWBLGHTJEFTL-UHFFFAOYSA-N B.CNC.OC(=O)CC(O)(CC(O)=O)C(O)=O Chemical compound B.CNC.OC(=O)CC(O)(CC(O)=O)C(O)=O FPJWBLGHTJEFTL-UHFFFAOYSA-N 0.000 description 1
- 239000004471 Glycine Substances 0.000 description 1
- 229920000271 Kevlar® Polymers 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- VEQPNABPJHWNSG-UHFFFAOYSA-N Nickel(2+) Chemical compound [Ni+2] VEQPNABPJHWNSG-UHFFFAOYSA-N 0.000 description 1
- 229920002292 Nylon 6 Polymers 0.000 description 1
- 229920002302 Nylon 6,6 Polymers 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 239000003929 acidic solution Substances 0.000 description 1
- 229920006397 acrylic thermoplastic Polymers 0.000 description 1
- 230000001464 adherent effect Effects 0.000 description 1
- 230000004931 aggregating effect Effects 0.000 description 1
- 238000013019 agitation Methods 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 125000005599 alkyl carboxylate group Chemical group 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 239000000908 ammonium hydroxide Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 239000003518 caustics Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- XTHPWXDJESJLNJ-UHFFFAOYSA-N chlorosulfonic acid Substances OS(Cl)(=O)=O XTHPWXDJESJLNJ-UHFFFAOYSA-N 0.000 description 1
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 239000011231 conductive filler Substances 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000001351 cycling effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- RXPAJWPEYBDXOG-UHFFFAOYSA-N hydron;methyl 4-methoxypyridine-2-carboxylate;chloride Chemical compound Cl.COC(=O)C1=CC(OC)=CC=N1 RXPAJWPEYBDXOG-UHFFFAOYSA-N 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000004761 kevlar Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229940098779 methanesulfonic acid Drugs 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000002991 molded plastic Substances 0.000 description 1
- 229910001453 nickel ion Inorganic materials 0.000 description 1
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 1
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 239000006174 pH buffer Substances 0.000 description 1
- MUJIDPITZJWBSW-UHFFFAOYSA-N palladium(2+) Chemical compound [Pd+2] MUJIDPITZJWBSW-UHFFFAOYSA-N 0.000 description 1
- 229920000889 poly(m-phenylene isophthalamide) Polymers 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920003366 poly(p-phenylene terephthalamide) Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 239000001509 sodium citrate Substances 0.000 description 1
- NLJMYIDDQXHKNR-UHFFFAOYSA-K sodium citrate Chemical compound O.O.[Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O NLJMYIDDQXHKNR-UHFFFAOYSA-K 0.000 description 1
- 229910001379 sodium hypophosphite Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 150000003871 sulfonates Chemical class 0.000 description 1
- ISXSCDLOGDJUNJ-UHFFFAOYSA-N tert-butyl prop-2-enoate Chemical compound CC(C)(C)OC(=O)C=C ISXSCDLOGDJUNJ-UHFFFAOYSA-N 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1635—Composition of the substrate
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1635—Composition of the substrate
- C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
- C23C18/1641—Organic substrates, e.g. resin, plastic
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/22—Roughening, e.g. by etching
- C23C18/24—Roughening, e.g. by etching using acid aqueous solutions
-
- D—TEXTILES; PAPER
- D06—TREATMENT OF TEXTILES OR THE LIKE; LAUNDERING; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR
- D06M—TREATMENT, NOT PROVIDED FOR ELSEWHERE IN CLASS D06, OF FIBRES, THREADS, YARNS, FABRICS, FEATHERS OR FIBROUS GOODS MADE FROM SUCH MATERIALS
- D06M11/00—Treating fibres, threads, yarns, fabrics or fibrous goods made from such materials, with inorganic substances or complexes thereof; Such treatment combined with mechanical treatment, e.g. mercerising
- D06M11/83—Treating fibres, threads, yarns, fabrics or fibrous goods made from such materials, with inorganic substances or complexes thereof; Such treatment combined with mechanical treatment, e.g. mercerising with metals; with metal-generating compounds, e.g. metal carbonyls; Reduction of metal compounds on textiles
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1655—Process features
- C23C18/1658—Process features with two steps starting with metal deposition followed by addition of reducing agent
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
Definitions
- This invention relates to a process for making completely and substantially uniformly metal coated polymeric monofilaments or yarn made from a plurality of such polymeric monofilaments which are coated with electrolessly deposited nickel and optionally with electrolytically deposited metal on the nickel. More particularly, this invention relates to a process for activating the surfaces of polymeric monofilaments which are subsequently coated with electrolessly deposited nickel.
- yam of monofilaments to be treated is unwound from a feed storage reel, passed through the appropriate chemical treating steps and then stored on a take up reel.
- the monofilaments positioned within the interior of the yam are not coated or are insufficiently coated so that the metal coatings on the monofilaments are non-uniform.
- a non-uniformly coated yam has undesirable nonuniform electrical conductivity. In many applications, such as for protective outside layers for cables, non-uniform metal outside layers are unacceptable.
- electroless nickel has been extremely difficult to deposit electroless nickel uniformly and completely onto the surface of monofilaments in a multifilament yarn bundle by wet chemical electroless processes.
- Various types of pre- woven fabric are coated with electroless metal, primarily electroless copper, for use as electromagnetic interference (EMI) control and shielding.
- electroless copper although appearing to have adequate adhesion to the individual monofilament polymer surface in a pre-woven fabric, for reasons not entirely understood, will not maintain its adhesion after exposure to high temperature or humidity exposure.
- This problem can be alleviated by using electroless nickel which forms tight polymeric bonds to the various functional groups on the surface of polymers which have been treated by the process of this invention.
- the resultant nickel-coated filaments are resistant to degradation exposure to thermal cycling and humidity.
- U.S. Patent 5,302,415 describes a process for electrolessly metalizing various aramid fibers using copper, nickel, silver, or cobalt.
- the disclosed process utilizes an 80 to 90% sulfuric acid solution to modify the surfaces of the aramid fibers. Modification is achieved by controlled fiber degradation as a consequence of depolymerization, to provide sites for the deposition of a sensitizer which promotes electroless metal deposition.
- the aramid fibers cannot be contacted with this strong sulfuric acid solution for more than a short time period because the fibers will dissolve or be degraded in the acid.
- electroless copper typically produces a coarse-grained coating which lacks the adhesion, ductility and flexural endurance that cable shielding applications in question require. Furthermore, an all-electroless copper construction requires the addition of another metal layer on each monofilament to protect the exposed copper against long-term oxidation.
- Nickel deposition by conventional phosphite-reduced electroless nickel processes results in a coating with a conductivity typically less than 15% that of copper. Due to oxidation of the phosphorous in the nickel-phosphorous alloy, of those nickel processes, such coatings form a much more stable surface and are generally preferred for applications involving high corrosion resistance. However, they are highly resistive and difficult to clean.
- the present invention provides a process for modifying the surface 10 of a polymeric monofilament to render said surface water- wettable characterized by contacting said surface with an aqueous activating solution comprising sulfuric acid or a strong acid derivative of sulfuric acid having a concentration of 75 to 85 percent by weight and a surfactant for a time period and temperature sufficient to render said surfaces water-wettable but 15 less than that wherein substantial mechanical degradation of said monofilament occurs.
- the present invention also provides a process for completely and substantially uniformly coating the surface of a polymeric monofilament with an electrically conductive electroless nickel coating wherein said surface is 20 modified by the process of contacting the monofilament with acid and surfactant solution prior to coating with said nickel characterized by feeding said monofilament from at least one feed reel, through an electroless nickel bath to at least one take-up reel wherein tension on said monofilament within said bath is sufficiently low to permit complete and substantially uniform 25 coating.
- the invention includes monofilaments and yams of monofilaments coated with electrically conductive nickel-boron alloy coatings.
- FIG. 30 The figure shows an apparatus suitable for processing yarn in accordance with this invention.
- the surfaces of monofilaments in a yam to be coated with metal are contacted with an aqueous activating solution which renders the surfaces hydrophilic and facilitates adsorption of a catalyst for effecting electroless nickel deposition.
- the aqueous activating solution comprises an acid such as sulfuric acid, or a strong acid derivative of sulfuric acid such as methane- sulfonic acid, chlorosulfonic acid, fluorosulfonic acid, and the like and a surfactant having from 8 to 12 carbon atoms.
- Suitable surfactants include fiuoroalkyl salts, ethers and esters, polyethoxylated quaternary ammonium salts, sodium alkyl benzoates, polyethoxylated straight chain alcohols and the like.
- Particularly suitable surfactants include amine perflouroralkyl sulfonates, fluorinated alkyl alkoxylates, fluorinated alkylesters, fluorinated alkyl carboxylate salts or the like.
- the use of the surfactant permits using weaker acid compositions which permits longer contact times with the monofilament without substantial degradation. The increased permissible contact times permit increased penetration of the aqueous activating composition into interior monofilaments of any yam being treated.
- the yam or monofilament surfaces then are contacted with a palladium catalyst in order to provide a catalytic surface for the electroless deposition of electrically conductive metal.
- nickel as it relates to the electrolessly-applied metal coating, refers to a nickel/boron alloy and excludes nickel/phosphorous alloys.
- the electroless nickel bath contains both nickel and boron and a reducing agent which produces the nickel-boron alloy coating for the polymeric monofilaments.
- monofilaments to be metal coated are passed, generally as yam, through an electroless bath to coat nickel completely and substantially uniformly on all the monofilament surfaces.
- Tension on the yam passing through the electroless nickel bath is either eliminated or maintained sufficiently low so that the nickel coatingsolution can penetrate into and through the entire yam bundle, in particular even on the surface of monofilaments located within the yarn bundle interior. It has been found that when the yam is passed through the electroless nickel bath under moderate significant tension, , the monofilaments at the interior of the yam bundle are either not coated at all or are incompletely coated so that the metal coating on the monofilaments is not uniform.
- the nickel coated yam can be coated electrolytically with an electrolytic metal such as copper or nickel.
- the electrolytic metal deposition also can be effected in a reel to reel process wherein the nickel-coated yam positioned within an agitated electrolytic aqueous bath is subjected to little or no tension to permit the aqueous electrolytic bath to penetrate into the interior of the yarn to be coated.
- the nickel coated or nickel and electrolytic metal coated monofilament or yam which can be braided or woven, functions as a substitute for metal wire.
- a virtually pure nickel substrate ( 1 ) is metallurgically compatible with a subsequent electrolytically applied layer of metal such as copper,
- electrolytically-deposited metal e.g. copper over the amine-borane nickel layer that, by reason of its dense fine-grained composition, (a) has excellent ductility and flexural endurance properties, (b) is more conductive per unit weight than electroless copper.
- a construction consisting of a yam bundle of polyaramid monofilaments metalized with amine-borane reduced electroless nickel only.
- metalized fibers find utility as conductive fillers which minimize electrostatic buildup on the surface of molded plastic parts used in electrical/electronic applications.
- the idealized metal coating must be bonded to the polyaramid monofilament surfaces with sufficient adhesion to withstand the mechanical abrasion of the chopping as well as the elevated temperature experienced in the injection molding processes, while at the same time providing an acceptable level of conductivity which does not materially change due to oxidation, unlike nickel-phosphorous alloy in the 10-20 ohm/foot range.
- the monofilament surfaces to be treated in accordance with this invention are formed from a polymeric compositions rendered more hydrophilic by the acid and surfactant activating solution to enable a more complete and more uniform electroless nickel coating on all the monofilament surfaces which is adherent and sufficiently electrically conductive to facilitate subsequent electrolytic metal coating on the conductive nickel.
- Suitable polymeric compositions for forming the monofilament or yam include aramid, such as poly(p-phenylene terephthalamide), poly (m-phenylene isophthalamide), and the like, polyamide, such as nylon 6, nylon 66, and the like, polyester, polyimide, polyetherimide, acrylics, polytetrafluoroethylene and the like, preferably aramid since it provides excellent tensile strength per unit weight.
- yams have a denier between about 55 and 3,000 and more typically between about 55 and 600 with 10-15 micron diameter monofilaments.
- the monofilaments can be solid or hollow.
- a surfactant permits using a weaker acid which results in reduced degradation to the monofilament surfaces
- sulfuric acid used in combination with a surfactant 75 to 85%, preferably 78 to 83% sulfuric acid can be utilized which permits increasing the contact time of the yam with the activating composition considerably while avoiding undesirable monofilament degradation.
- the increased contact time and the presence of a surfactant provides more complete penetration of the activating solution into the yam and thereby permits greater assurance of subsequent complete and substantially uniform electroless metal coating.
- the surfactant is utilized in concentration between about 10 and 1000 parts per million (ppm) preferably between about 100 and 500 ppm of the activating solution.
- acceptable nickel coated monofilaments can be made by treating the monofilaments with solutions known to improve the water wettability of surfaces such as potassium hydroxide, sodium hydroxide, or other caustic compositions used alone or in combination with a lower alcohol such methanol or ethanol, or chromic acid, or the like.
- the monofilaments can, also, be treated by immersion in 5 concentrated sulfuric acid as described in U.S. Patent 5,302,415, such as, for example, by immersion in 80 to 90 weight percent sulfuric acid, for 2 to 60 seconds at 10 to 100°C, although the fibers may be somewhat degraded by such immersion.
- the surfaces are contacted with any one of the catalyst systems well known to those versed in the art of electroless plating to effect electroless metal deposition.
- Catalyst combinations which can be used in conjunction with the sensitized surfaces are disclosed in U.S. Pat. Nos. 3,011,920 and 3,562,038
- the catalyst application is provided for a period, generally of one to about 5 five minutes, and then the sample is immersed in an acidic solution to remove tin from the surface in the process referred to as acceleration.
- the sample is then passed through in an electroless nickel bath for a period ranging from about two to ten minutes to provide the desired thickness of nickel.
- Deposition and activation of the catalyst and subsequent deposition 0 of the electroless nickel is conducted with the yarn under tension which is zero or is sufficiently low so that the treatment baths contact all the monofilament surfaces.
- a storage roll 10 has wound upon it multifilament yarns, 12 and 14.
- Guide rollers 16 and 18 pull yarns 14 and 12 5 from storage roll 10 and deposit the yams within bath 20 and onto endless web 22.
- Endless web 22 is moved about rollers 24 and 26, at least one of which is powered.
- Yams 12 and 14 are passed under guide rollers 28 and 30 and are removed from bath 20 by powered rollers 32 and 34 as treated yam 36 and 38.
- the bath can be the pretreatment bath, the catalyst deposition or 0 activation bath or the electroless nickel bath described above.
- Powered rollers 32 and 34 and the endless web 22 are operated at a speed to assure little or no tension on the yams 40 and 42 deposited in the bath 20 on endless web 22.
- Suitable electroless nickel baths are those which are boron-based rather than phosphorous based since the boron based baths deposit a form of nickel resistant to oxidation and which are sufficiently conductive to facilitate subsequent electrolytic metal deposition, such as copper onto the nickel surface.
- Suitable boron based electroless nickel baths are disclosed in U S
- Nickel Chloride NiCl 2 6H 2 0
- Dimethylamine Borane 3.0 g/1
- Nickel is deposited on the receptive surfaces by electroless
- 25 alloy is between about 8 and 15 micro-ohm cm.
- a typical specific resistivity of nickel-low phosphorous alloy is 20-50 micro-ohm cm; and for a nickel- high phosphorous alloy between 150-250 micro-ohm cm.
- the electroless layer is sufficiently thick to permit subsequent electrolytic deposition of a uniform metal layer such as copper. Generally, the electroless nickel layer is
- the nickel coated monofilaments can be further coated with electrolytic metal such as electrolytic copper in an electrolytic plating process step.
- electrolytic metal such as electrolytic copper
- the nickel coated yam is passed through an electrolytic plating bath under little or no tension so that
- the aqueous electrolytic plating bath can penetrate into the entire yam to contact all nickel coated monofilament surfaces.
- An electrical charge is applied to the electrolytic plating bath to effect electrolytic metal deposition completely and substantially uniformly on all nickel surfaces.
- the thickness of the electrolytic metal coating can be controlled by controlling the time,
- EXAMPLE 1 Para-aramid yarn of 200 denier(d) with 89 monofilaments was treated for 90 seconds in an aqueous activating solution of 79% sulfuric acid which contained 50 ppm of a 3: 1 mixture of a perfluorinated alkyl ester surfactant and a perfluorinated alkyl alkoxylate surfactant at 40°C.
- the para- aramid yam was a product sold by E. I. du Pont de Nemours and Company under the tradename "Kevlar”. The yam was then rinsed with water and conveyed through a continuous treating process under zero or very low tension on a carrier film as shown in the figure.
- the continuous process included a series of steps in a series of devices as shown in the figure with solutions which provided the catalyst system prior to electroless nickel deposition, final rinse, drying, and wind-up steps.
- the yam first passed through a solution which was about 5% NaOH which rendered the monofilament surfaces alkaline prior to passing into a palladium activating solution which was an ionic soluble palladium complex sold by Atotech, Inc. under the trade name, Neoganth 834.
- This solution was made up by using 3% of the Neoganth 834 palladium activator concentrate in 96.5% by volume deionized water with 0.5% of 50% NaOH solution used to adjust the pH to 11.5.
- the bath was heated to 50°C for about 2 hours and was then cooled to 45°C for use in treating the yam.
- the yam was passed through two rinse stations, each providing about 1 minute rinse with deionized water, then into a dimethylamineborane reducer solution sold by
- Atotech, Inc. under the tradename "Neoganth WA.
- the reducer solution was made by taking 0.5% by volume of the Neoganth WA concentrate and diluting it with 99% deionized water containing 0.5% boric acid as a pH buffer. This solution was heated to 35°C for use in reducing the soluble palladium ion to the palladium metal which provides active catalytic sites on the polymer surface to initiate electroless nickel deposition.
- the yam was conveyed directly from the reducer solution into an electroless nickel plating bath comprising Niklad 752, available from MacDermid Corp.
- This bath was operated at 70°C with a pH of 6.6 and contained dimethylamine borane as the reducing agent; and was made up according to the supplier's instructions for the desired percent of nickel and reducer.
- the yam was conveyed through the bath while supported on a carrier film under very low tension. Using high agitation in the bath, it was possible to obtain complete penetration of the bath into the yam bundle and uniform metalization of each monofilament. Typically, a 4 minute dwell time in this bath provided about 30% weight increase to the yarn by the nickel coating.
- the resultant coated yarn had a resistance of about 100 ohms/ft.
- Additional yams processed with 5 shorter dwell times provided proportionately less nickel and higher resistances, while longer dwell times provided proportionately higher metal addition with lower resistance.
- a cross-sectional analysis provided revealed complete and uniform deposition of nickel around all of the monofilaments in the yarn bundle.
- EXAMPLE 2 A hollow picture frame type rack was cut out of 1/1 6" polyethylene sheeting and U-shaped grooves were milled on the top and bottom of the rack so that yam could be wound around the rack loosely
- Niklad 797B sodium hypophosphite solution
- the pH was adjusted to 5.0-5.2 with 50% ammonia and the solution was heated to 90°C prior to immersion of the rack containing the yam sample.
- the racks were agitated
- the final dried yam had a resistance of 300 ohms/ft. which was three times higher than the coated yarn of Example 1.
- Examples 1 and 2 were repeated except that the yams were treated in concentrated sulfuric acid for a much shorter time as taught in U.S. Patent 5,302,415. To minimize substantial degradation of the monofilaments. it was necessary to limit the immersion of the yams in the concentrated sulfuric acid to only half as long as the immersions of Examples 1 and 2.
- the coated yarns exhibited electrical resistances similar to the coated yams of Examples 1 and 2.
- EXAMPLE 5 The metalized yam obtained by the process of Example 1 was subsequently electroplated with copper by passing the nickel coated yam through a gas agitated electrolytic acid copper sulfate plating bath fitted with contact bars which passed electrical current into the yam as it entered and exited from the plating bath.
- the nickel coated yam could withstand about 5 amps of current before sustaining yam damage and added about 65% by weight of copper to produce a material that had a resistance less than 1 ohm/ft.
- This copper plated yam still retained all of the good handling, drape, and flexibility characteristics of the original starting yam.
- This electrolytic plating provided a fine grained equi-axial crystal structure on the copper.
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- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
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- Inorganic Chemistry (AREA)
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Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US655733 | 1996-05-30 | ||
| US08/656,914 US5935706A (en) | 1996-05-30 | 1996-05-30 | Thermally stable metal coated polymeric monofilament or yarn |
| US08/655,733 US6045680A (en) | 1996-05-30 | 1996-05-30 | Process for making thermally stable metal coated polymeric monofilament or yarn |
| US656914 | 1996-05-30 | ||
| PCT/US1997/009116 WO1997048832A2 (en) | 1996-05-30 | 1997-05-30 | Process for making thermally stable metal coated polymeric monofilament or yarn |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| EP0902854A2 true EP0902854A2 (de) | 1999-03-24 |
| EP0902854B1 EP0902854B1 (de) | 2001-12-12 |
Family
ID=27097017
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP97944281A Expired - Lifetime EP0902854B1 (de) | 1996-05-30 | 1997-05-30 | Prozess zur herstellung eines thermisch stabilen, metallbeschichteten polymeren monofilaments |
Country Status (6)
| Country | Link |
|---|---|
| EP (1) | EP0902854B1 (de) |
| JP (1) | JP4060363B2 (de) |
| CA (1) | CA2255646C (de) |
| DE (1) | DE69709094T2 (de) |
| ES (1) | ES2165628T3 (de) |
| WO (1) | WO1997048832A2 (de) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1435407A1 (de) | 2003-01-02 | 2004-07-07 | Teijin Twaron B.V. | Mit einer leitfähigen Ausrüstung versehenes Aramidgarn |
| WO2006081622A1 (en) * | 2005-02-03 | 2006-08-10 | Australian Wool Innovation Limited | Fibre coating composition |
| GB0505822D0 (en) * | 2005-03-22 | 2005-04-27 | Conductive Inkjet Tech Ltd | Treatment of flexible web material |
| JP5327494B2 (ja) * | 2005-11-16 | 2013-10-30 | 日立化成株式会社 | 無電解めっき用触媒濃縮液の製造方法とそれを用いためっき触媒付与方法 |
| GB0614706D0 (en) * | 2006-07-25 | 2006-09-06 | Gore W L & Ass Uk | Fabric |
| EP2596149A2 (de) * | 2010-07-23 | 2013-05-29 | Syscom Advanced Materials | Elektrisch leitende metallbeschichtete fasern, kontinuierliches herstellungsverfahren und ihre verwendung |
| WO2012092505A1 (en) | 2010-12-29 | 2012-07-05 | Syscom Advanced Materials | Metal and metallized fiber hybrid wire |
| JP6220113B2 (ja) * | 2011-02-17 | 2017-10-25 | 矢崎総業株式会社 | シールドスリーブの製造方法 |
| JP6006931B2 (ja) * | 2011-11-24 | 2016-10-12 | 矢崎総業株式会社 | メッキ繊維及びその製造方法 |
| JP2014120327A (ja) * | 2012-12-17 | 2014-06-30 | Yazaki Corp | 電線用導体 |
| CN114687205A (zh) * | 2022-04-19 | 2022-07-01 | 中国科学院苏州纳米技术与纳米仿生研究所 | 高分子纤维材料的多金属复合方法及多金属复合纤维 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1243493B (de) * | 1961-02-04 | 1967-06-29 | Bayer Ag | Waessriges Bad zur chemischen Abscheidung von borhaltigen Metallueberzuegen |
| US3515649A (en) * | 1967-05-02 | 1970-06-02 | Ivan C Hepfer | Pre-plating conditioning process |
| GB1243481A (en) * | 1969-01-22 | 1971-08-18 | Hoechst Ag | Metallisation of plastics |
| US4673469A (en) * | 1984-06-08 | 1987-06-16 | Mcgean-Rohco, Inc. | Method of plating plastics |
| US4634805A (en) * | 1985-05-02 | 1987-01-06 | Material Concepts, Inc. | Conductive cable or fabric |
| US4639380A (en) * | 1985-05-06 | 1987-01-27 | International Business Machines Corporation | Process for preparing a substrate for subsequent electroless deposition of a metal |
| US5302415A (en) * | 1992-12-08 | 1994-04-12 | E. I. Du Pont De Nemours And Company | Electroless plated aramid surfaces and a process for making such surfaces |
-
1997
- 1997-05-30 CA CA002255646A patent/CA2255646C/en not_active Expired - Lifetime
- 1997-05-30 JP JP50299398A patent/JP4060363B2/ja not_active Expired - Lifetime
- 1997-05-30 WO PCT/US1997/009116 patent/WO1997048832A2/en not_active Ceased
- 1997-05-30 DE DE69709094T patent/DE69709094T2/de not_active Expired - Lifetime
- 1997-05-30 EP EP97944281A patent/EP0902854B1/de not_active Expired - Lifetime
- 1997-05-30 ES ES97944281T patent/ES2165628T3/es not_active Expired - Lifetime
Non-Patent Citations (1)
| Title |
|---|
| See references of WO9748832A3 * |
Also Published As
| Publication number | Publication date |
|---|---|
| DE69709094T2 (de) | 2002-07-18 |
| JP2000512690A (ja) | 2000-09-26 |
| JP4060363B2 (ja) | 2008-03-12 |
| CA2255646A1 (en) | 1997-12-24 |
| DE69709094D1 (de) | 2002-01-24 |
| ES2165628T3 (es) | 2002-03-16 |
| WO1997048832A3 (en) | 1998-02-26 |
| EP0902854B1 (de) | 2001-12-12 |
| WO1997048832A2 (en) | 1997-12-24 |
| CA2255646C (en) | 2008-04-08 |
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