EP0903210A1 - Barre de montage d'un cristal pour son sciage et procédé à couper le cristal en plaquettes - Google Patents

Barre de montage d'un cristal pour son sciage et procédé à couper le cristal en plaquettes Download PDF

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Publication number
EP0903210A1
EP0903210A1 EP98116158A EP98116158A EP0903210A1 EP 0903210 A1 EP0903210 A1 EP 0903210A1 EP 98116158 A EP98116158 A EP 98116158A EP 98116158 A EP98116158 A EP 98116158A EP 0903210 A1 EP0903210 A1 EP 0903210A1
Authority
EP
European Patent Office
Prior art keywords
crystal
saw
section
saw bar
wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP98116158A
Other languages
German (de)
English (en)
Other versions
EP0903210B1 (fr
Inventor
Maximilian Käser
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siltronic AG
Original Assignee
Wacker Siltronic AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wacker Siltronic AG filed Critical Wacker Siltronic AG
Publication of EP0903210A1 publication Critical patent/EP0903210A1/fr
Application granted granted Critical
Publication of EP0903210B1 publication Critical patent/EP0903210B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/04—Processes
    • Y10T83/0405—With preparatory or simultaneous ancillary treatment of work
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/929—Tool or tool with support
    • Y10T83/9292—Wire tool

Definitions

  • the invention relates to a saw bar for fixing a Crystals from semiconductor material when cutting off wafers of this crystal with a wire saw.
  • the invention relates also a method for cutting off discs, in which the saw bar is used.
  • the crystal is on one Saw bar fixed, in which the saw wire after cutting which penetrates a few millimeters.
  • the saw bar usually consists of a solid graphite block, and the Crystal is on this, for example with an adhesive Epoxy resin, cemented on.
  • the object of the invention is to indicate how that Creation of scoring when cutting glass from one Reliable crystal of semiconductor material with a wire saw can be avoided.
  • the task is solved by a saw bar to fix one Crystals from semiconductor material when cutting off wafers of this crystal with a wire saw that featured is by a section adjacent to the crystal, which has a hardness that is essentially the hardness of the Corresponds to crystal.
  • a Saw bar proposed that made from one material is that in terms of its hardness with the hardness of the semiconductor material matches or approximately the same hardness having.
  • Saw strips have proven to be particularly suitable a material with a hardness in the range of 4 to 7 (Mohs scale), In particular, saw strips made of glass or silicon have been proven. It is also advantageous if the material used is a electrical insulator. In this case, the saw wire during the disconnection process with weak electrical current be acted upon and a wire break or ground fault the resulting amperage change can be detected.
  • FIG. 1 is a massive Saw bar shown.
  • the saw bar according to Figure 2 is as layered composite body formed.
  • the saw bar according to Figure 3 has a hollow profile.
  • the saw bar according to FIG. 1 is first described in more detail.
  • the saw bar 1 is made of a material whose hardness essentially matches the hardness of the semiconductor material, of which the crystal 2 consists. Through this choice of material, the saw wire remains even when entering into the saw bar in the intended cutting plane, see above that the panes in the edge area are not damaged.
  • the saw bar 1 in the form of training according to Figure 2 from a layered structured composite body, wherein section 3 of the composite body adjacent to the crystal consists of a material whose hardness is the same or similar is like the hardness of the crystal 2.
  • Section 3 exists preferably from a crystal or glass shape or silicon shell if the crystal is made of silicon. At least one further section adjoins this shell 4, which is made of a material that is essential is softer than the material of section 3, the adjoins the crystal. It is particularly preferred that the further Section 4 is made of graphite or a similar hardness like graphite.
  • the sections of the layered structure Composite bodies are preferably glued together. At Using such a saw bar will not only result in the emergence avoided by scoring. It's also particularly easy break the severed slices from the saw bar because after cutting off the panes, connect to the saw bar remains, which is formed by a section of the saw bar, which is comparatively soft and acts as a predetermined breaking point is suitable.
  • the saw bar 1 designed in cross section as a hollow profile.
  • the Hollow profile can have any shape, for example rectangular, circular or otherwise polygonal. After detaching due to the hollow profile, the panes remain comparatively narrow web 5 back over which the panes with the Saw bar stay connected. By breaking this connection the disks can be exposed. This can be avoided be that the saw wire along the when disconnecting the Slices resulting cutting gap must be returned and the windows get damaged.
  • a massive Saw bar is the one that remains after the disks have been removed Connection to the saw bar comparatively wide, so that it cannot be excluded that a pane will be damaged if the connection is broken.
  • a narrow bridge that remains due to the hollow profile good as a predetermined breaking point.
  • the invention also relates to a saw strips designed as composite bodies according to FIG. 2, which has a hollow profile according to Figure 3.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
EP98116158A 1997-09-11 1998-08-27 Barre de montage d'un cristal pour son sciage et procédé à couper le cristal en plaquettes Expired - Lifetime EP0903210B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19739965 1997-09-11
DE1997139965 DE19739965A1 (de) 1997-09-11 1997-09-11 Sägeleiste zum Fixieren eines Kristalls und Verfahren zum Abtrennen von Scheiben

Publications (2)

Publication Number Publication Date
EP0903210A1 true EP0903210A1 (fr) 1999-03-24
EP0903210B1 EP0903210B1 (fr) 2001-05-16

Family

ID=7842028

Family Applications (1)

Application Number Title Priority Date Filing Date
EP98116158A Expired - Lifetime EP0903210B1 (fr) 1997-09-11 1998-08-27 Barre de montage d'un cristal pour son sciage et procédé à couper le cristal en plaquettes

Country Status (7)

Country Link
US (1) US6035845A (fr)
EP (1) EP0903210B1 (fr)
JP (1) JP3166122B2 (fr)
KR (1) KR100301381B1 (fr)
DE (2) DE19739965A1 (fr)
MY (1) MY116424A (fr)
TW (1) TW407094B (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8061345B2 (en) 2004-12-10 2011-11-22 Freiberger Compound Materials Gmbh Method for wire sawing
WO2014111304A1 (fr) * 2013-01-15 2014-07-24 Siltronic Ag Baguette à fixer par masticage pouvant être bloquée, destinée à un processus de scie à fil
CN109760221A (zh) * 2018-12-29 2019-05-17 珠海鼎泰芯源晶体有限公司 一种大尺寸薄片磷化铟晶片的线切割加工方法
CN109808085A (zh) * 2018-12-29 2019-05-28 珠海鼎泰芯源晶体有限公司 改善晶片主定位边立面加工中出现缺陷的方法

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6333377B1 (en) * 1999-03-08 2001-12-25 A&A Material Corporation Ingot support device for slicing silicon
DE102006032432B3 (de) * 2006-07-13 2007-09-27 Siltronic Ag Sägeleiste sowie Verfahren zum gleichzeitigen Abtrennen einer Vielzahl von Scheiben von einem zylindrischen Werkstück unter Verwendung der Sägeleiste
JP2011512036A (ja) * 2008-02-11 2011-04-14 エムイーエムシー・エレクトロニック・マテリアルズ・インコーポレイテッド インゴットをワイヤーソーによりスライスしてウェハとする際に使用される、カーボンナノチューブで強化されたワイヤーソー梁部
ATE500940T1 (de) * 2008-04-23 2011-03-15 Applied Materials Switzerland Sa Montierscheibe für eine drahtsägevorrichtung, drahtsägevorrichtung damit, und drahtsägeverfahren, das mit der vorrichtung durchgeführt wird
EP2477777A1 (fr) * 2009-09-18 2012-07-25 Applied Materials, Inc. Dispositif de support de pièce pour scie à fil, élément d'espacement de support et procédé de sciage associé
CN102700020A (zh) * 2012-06-15 2012-10-03 苏州晶樱光电科技有限公司 一种硅棒切割用晶托
KR101217132B1 (ko) * 2012-07-19 2012-12-31 이화다이아몬드공업 주식회사 실리콘 잉곳 절단 장치 및 방법
CN105599157B (zh) * 2016-01-06 2018-12-28 中磁科技股份有限公司 多线切割机破条工艺的改进方法
CN107745290B (zh) * 2017-04-18 2019-06-11 重庆四联特种装备材料有限公司 异形平片抛光粘接方法
CN113580403B (zh) * 2021-09-30 2022-01-25 浙江晶科能源有限公司 晶硅切割方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0232920A2 (fr) * 1986-02-14 1987-08-19 Wacker-Chemitronic Gesellschaft für Elektronik-Grundstoffe mbH Scie circulaire à coupe intérieure à plusieurs lames pour scier des lingots de cristaux ainsi que procédés éxécutés au moyen de cette scie
EP0348783A2 (fr) * 1988-06-28 1990-01-03 Naoetsu Electronics Company Procédé pour la fabrication de substrats individuels
EP0552663A1 (fr) * 1992-01-22 1993-07-28 HAUSER, Charles Dispositif pour le contrôle de la géométrie de coupe de tranches fines obtenues par sciage par fil
JPH0919921A (ja) * 1995-07-07 1997-01-21 Tokyo Seimitsu Co Ltd ワイヤソー

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4655191A (en) * 1985-03-08 1987-04-07 Motorola, Inc. Wire saw machine
CH690845A5 (de) * 1994-05-19 2001-02-15 Tokyo Seimitsu Co Ltd Verfahren zum Positionieren eines Werkstücks und Vorrichtung hierfür.
JP3397968B2 (ja) * 1996-03-29 2003-04-21 信越半導体株式会社 半導体単結晶インゴットのスライス方法
JPH09286021A (ja) * 1996-04-22 1997-11-04 Komatsu Electron Metals Co Ltd 半導体インゴットの切断方法
CH692331A5 (de) * 1996-06-04 2002-05-15 Tokyo Seimitsu Co Ltd Drahtsäge und Schneidverfahren unter Einsatz derselben.

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0232920A2 (fr) * 1986-02-14 1987-08-19 Wacker-Chemitronic Gesellschaft für Elektronik-Grundstoffe mbH Scie circulaire à coupe intérieure à plusieurs lames pour scier des lingots de cristaux ainsi que procédés éxécutés au moyen de cette scie
EP0348783A2 (fr) * 1988-06-28 1990-01-03 Naoetsu Electronics Company Procédé pour la fabrication de substrats individuels
EP0552663A1 (fr) * 1992-01-22 1993-07-28 HAUSER, Charles Dispositif pour le contrôle de la géométrie de coupe de tranches fines obtenues par sciage par fil
JPH0919921A (ja) * 1995-07-07 1997-01-21 Tokyo Seimitsu Co Ltd ワイヤソー

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 097, no. 005 30 May 1997 (1997-05-30) *

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8061345B2 (en) 2004-12-10 2011-11-22 Freiberger Compound Materials Gmbh Method for wire sawing
WO2014111304A1 (fr) * 2013-01-15 2014-07-24 Siltronic Ag Baguette à fixer par masticage pouvant être bloquée, destinée à un processus de scie à fil
CN109760221A (zh) * 2018-12-29 2019-05-17 珠海鼎泰芯源晶体有限公司 一种大尺寸薄片磷化铟晶片的线切割加工方法
CN109808085A (zh) * 2018-12-29 2019-05-28 珠海鼎泰芯源晶体有限公司 改善晶片主定位边立面加工中出现缺陷的方法

Also Published As

Publication number Publication date
JPH11151716A (ja) 1999-06-08
JP3166122B2 (ja) 2001-05-14
EP0903210B1 (fr) 2001-05-16
MY116424A (en) 2004-01-31
DE59800712D1 (de) 2001-06-21
KR100301381B1 (ko) 2001-11-22
KR19990029457A (ko) 1999-04-26
TW407094B (en) 2000-10-01
DE19739965A1 (de) 1999-03-18
US6035845A (en) 2000-03-14

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