EP0942392A3 - Chipkarte - Google Patents

Chipkarte Download PDF

Info

Publication number
EP0942392A3
EP0942392A3 EP99103979A EP99103979A EP0942392A3 EP 0942392 A3 EP0942392 A3 EP 0942392A3 EP 99103979 A EP99103979 A EP 99103979A EP 99103979 A EP99103979 A EP 99103979A EP 0942392 A3 EP0942392 A3 EP 0942392A3
Authority
EP
European Patent Office
Prior art keywords
card
resin film
film
type semiconductor
inner leads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP99103979A
Other languages
English (en)
French (fr)
Other versions
EP0942392A2 (de
Inventor
Yasuo Tane
Kazuyasu Tanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Publication of EP0942392A2 publication Critical patent/EP0942392A2/de
Publication of EP0942392A3 publication Critical patent/EP0942392A3/de
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07728—Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
EP99103979A 1998-03-13 1999-03-10 Chipkarte Withdrawn EP0942392A3 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP6313598 1998-03-13
JP6313598 1998-03-13

Publications (2)

Publication Number Publication Date
EP0942392A2 EP0942392A2 (de) 1999-09-15
EP0942392A3 true EP0942392A3 (de) 2000-10-18

Family

ID=13220536

Family Applications (1)

Application Number Title Priority Date Filing Date
EP99103979A Withdrawn EP0942392A3 (de) 1998-03-13 1999-03-10 Chipkarte

Country Status (2)

Country Link
US (1) US6208019B1 (de)
EP (1) EP0942392A3 (de)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6268237B1 (en) * 1995-04-03 2001-07-31 Aptek Industries, Inc. Stress-free silicon wafer and a die or chip made therefrom and method
US6412702B1 (en) * 1999-01-25 2002-07-02 Mitsumi Electric Co., Ltd. Non-contact IC card having an antenna coil formed by a plating method
FR2793330B1 (fr) * 1999-05-06 2001-08-10 Oberthur Card Systems Sas Procede de montage d'un microcircuit dans une cavite d'une carte formant support et carte ainsi obtenue
FR2795846B1 (fr) * 1999-07-01 2001-08-31 Schlumberger Systems & Service PROCEDE DE FABRICATION DE CARTES LAMINEES MUNIES D'UNE COUCHE INTERMEDIAIRES DE petg
US6396138B1 (en) * 2000-02-15 2002-05-28 International Rectifier Corporation Chip array with two-sided cooling
US6462273B1 (en) * 2001-03-16 2002-10-08 Micron Technology, Inc. Semiconductor card and method of fabrication
JP2003007976A (ja) * 2001-06-25 2003-01-10 Mitsubishi Electric Corp 半導体装置及びモジュール装置
US6548759B1 (en) * 2001-06-28 2003-04-15 Amkor Technology, Inc. Pre-drilled image sensor package
US6730536B1 (en) 2001-06-28 2004-05-04 Amkor Technology, Inc. Pre-drilled image sensor package fabrication method
US6486545B1 (en) 2001-07-26 2002-11-26 Amkor Technology, Inc. Pre-drilled ball grid array package
US20050196604A1 (en) * 2004-03-05 2005-09-08 Unifoil Corporation Metallization process and product produced thereby
US7459376B2 (en) * 2005-02-04 2008-12-02 Infineon Technologies Ag Dissociated fabrication of packages and chips of integrated circuits
US7685706B2 (en) * 2005-07-08 2010-03-30 Semiconductor Energy Laboratory Co., Ltd Method of manufacturing a semiconductor device
DE102005047106B4 (de) * 2005-09-30 2009-07-23 Infineon Technologies Ag Leistungshalbleitermodul und Verfahren zur Herstellung
JP5346497B2 (ja) * 2007-06-12 2013-11-20 株式会社半導体エネルギー研究所 半導体装置
US7707706B2 (en) * 2007-06-29 2010-05-04 Ruhlamat Gmbh Method and arrangement for producing a smart card
US8690064B2 (en) * 2009-04-30 2014-04-08 Abnote Usa, Inc. Transaction card assembly and methods of manufacture
US8803185B2 (en) * 2012-02-21 2014-08-12 Peiching Ling Light emitting diode package and method of fabricating the same
US20140374151A1 (en) * 2013-06-24 2014-12-25 Jia Lin Yap Wire bonding method for flexible substrates
EP2840375A1 (de) * 2013-08-19 2015-02-25 Sensirion AG Vorrichtung mit einer mikro- oder nanoskaligen Struktur
EP2871456B1 (de) 2013-11-06 2018-10-10 Invensense, Inc. Drucksensor und Herstellungsmethode für einen Drucksensor
EP2871455B1 (de) 2013-11-06 2020-03-04 Invensense, Inc. Drucksensor
EP3076146B1 (de) 2015-04-02 2020-05-06 Invensense, Inc. Drucksensor
US11225409B2 (en) 2018-09-17 2022-01-18 Invensense, Inc. Sensor with integrated heater
CN113785178B (zh) 2019-05-17 2024-12-17 应美盛股份有限公司 气密性改进的压力传感器

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4474292A (en) * 1980-05-20 1984-10-02 Gao Gesellschaft Fur Automation Und Organisation Mbh Carrier element for an IC-chip
EP0246744A2 (de) * 1986-05-20 1987-11-25 Kabushiki Kaisha Toshiba IC-Karte und Verfahren zur Herstellung derselben
WO1996037917A1 (en) * 1995-05-23 1996-11-28 Hitachi, Ltd. Semiconductor assembly

Family Cites Families (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3702464A (en) * 1971-05-04 1972-11-07 Ibm Information card
FR2486685B1 (fr) * 1980-07-09 1985-10-31 Labo Electronique Physique Carte de paiement electronique et procede de realisation
DE3029667A1 (de) * 1980-08-05 1982-03-11 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Traegerelement fuer einen ic-baustein
DE3123198C2 (de) * 1980-12-08 1993-10-07 Gao Ges Automation Org Trägerelemente für einen IC-Baustein
US4409471A (en) * 1981-12-17 1983-10-11 Seiichiro Aigo Information card
US4447716A (en) * 1982-03-01 1984-05-08 Seiichiro Aigo Information card
FR2527036A1 (fr) * 1982-05-14 1983-11-18 Radiotechnique Compelec Procede pour connecter un semiconducteur a des elements d'un support, notamment d'une carte portative
DE3235650A1 (de) * 1982-09-27 1984-03-29 Philips Patentverwaltung Gmbh, 2000 Hamburg Informationskarte und verfahren zu ihrer herstellung
DE3248385A1 (de) * 1982-12-28 1984-06-28 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Ausweiskarte mit integriertem schaltkreis
DE3338597A1 (de) * 1983-10-24 1985-05-02 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Datentraeger mit integriertem schaltkreis und verfahren zur herstellung desselben
FR2581480A1 (fr) * 1985-04-10 1986-11-07 Ebauches Electroniques Sa Unite electronique notamment pour carte a microcircuits et carte comprenant une telle unite
EP0246893A3 (de) * 1986-05-21 1989-03-22 Hitachi, Ltd. Halbleiteranordnung mit einem isolierenden Leiterbahnensubstrat und Verfahren zur Herstellung
FR2599893B1 (fr) * 1986-05-23 1996-08-02 Ricoh Kk Procede de montage d'un module electronique sur un substrat et carte a circuit integre
JPS6394645A (ja) * 1986-10-08 1988-04-25 Mitsubishi Electric Corp 電子装置
US5067008A (en) * 1989-08-11 1991-11-19 Hitachi Maxell, Ltd. Ic package and ic card incorporating the same thereinto
EP0417887B1 (de) * 1989-09-09 1995-06-14 Mitsubishi Denki Kabushiki Kaisha Integrierte Schaltungskarte
US5227338A (en) * 1990-04-30 1993-07-13 International Business Machines Corporation Three-dimensional memory card structure with internal direct chip attachment
FR2662000A1 (fr) * 1990-05-11 1991-11-15 Philips Composants Carte a microcircuit.
JP2560895B2 (ja) * 1990-07-25 1996-12-04 三菱電機株式会社 Ｉｃカードの製造方法およびｉｃカード
US5250600A (en) * 1992-05-28 1993-10-05 Johnson Matthey Inc. Low temperature flexible die attach adhesive and articles using same
FR2691563B1 (fr) * 1992-05-19 1996-05-31 Francois Droz Carte comprenant au moins un element electronique et procede de fabrication d'une telle carte.
US5324687A (en) * 1992-10-16 1994-06-28 General Electric Company Method for thinning of integrated circuit chips for lightweight packaged electronic systems
WO1995011135A1 (fr) * 1993-10-18 1995-04-27 Oki Electric Industry Co., Ltd. Module a circuit integre et porteur de donnees pourvu d'un tel module
US5581445A (en) * 1994-02-14 1996-12-03 Us3, Inc. Plastic integrated circuit card with reinforcement structure for protecting integrated circuit module
US5480842A (en) * 1994-04-11 1996-01-02 At&T Corp. Method for fabricating thin, strong, and flexible die for smart cards
US5917705A (en) * 1994-04-27 1999-06-29 Siemens Aktiengesellschaft Chip card
DE4416697A1 (de) * 1994-05-11 1995-11-16 Giesecke & Devrient Gmbh Datenträger mit integriertem Schaltkreis
JP3186925B2 (ja) * 1994-08-04 2001-07-11 シャープ株式会社 パネルの実装構造並びに集積回路搭載テープおよびその製造方法
EP0740340B1 (de) * 1995-04-07 2002-06-26 Shinko Electric Industries Co. Ltd. Struktur und Verfahren zur Montage eines Halbleiterchips
US5773775A (en) * 1995-05-17 1998-06-30 Alps Electric Co., Ltd. Pressure actuated circuit breaker with frangible printed circuit board
DE19528730A1 (de) * 1995-08-04 1997-02-06 Giesecke & Devrient Gmbh Verfahren zur Herstellung eines Datenträgers
JP2987101B2 (ja) * 1996-04-15 1999-12-06 株式会社ニッシン 半導体装置の接続方法並びに半導体装置の接続器
DE19617055C1 (de) * 1996-04-29 1997-06-26 Semikron Elektronik Gmbh Halbleiterleistungsmodul hoher Packungsdichte in Mehrschichtbauweise
JPH09327990A (ja) * 1996-06-11 1997-12-22 Toshiba Corp カード型記憶装置
US5773884A (en) * 1996-06-27 1998-06-30 International Business Machines Corporation Electronic package with thermally conductive support member having a thin circuitized substrate and semiconductor device bonded thereto
US5786988A (en) * 1996-07-02 1998-07-28 Sandisk Corporation Integrated circuit chips made bendable by forming indentations in their back surfaces flexible packages thereof and methods of manufacture
US6027958A (en) * 1996-07-11 2000-02-22 Kopin Corporation Transferred flexible integrated circuit
JP3322575B2 (ja) * 1996-07-31 2002-09-09 太陽誘電株式会社 ハイブリッドモジュールとその製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4474292A (en) * 1980-05-20 1984-10-02 Gao Gesellschaft Fur Automation Und Organisation Mbh Carrier element for an IC-chip
EP0246744A2 (de) * 1986-05-20 1987-11-25 Kabushiki Kaisha Toshiba IC-Karte und Verfahren zur Herstellung derselben
WO1996037917A1 (en) * 1995-05-23 1996-11-28 Hitachi, Ltd. Semiconductor assembly

Also Published As

Publication number Publication date
EP0942392A2 (de) 1999-09-15
US6208019B1 (en) 2001-03-27

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