EP0956587A2 - Procede pour produire des elements de refroidissement composes de plusieurs profiles partiels en metal pour monter sur des composants a semi-conducteur, profiles pour produire des elements de refroidissement de ce type et elements de refroidissement obtenus selon ledit procede - Google Patents

Procede pour produire des elements de refroidissement composes de plusieurs profiles partiels en metal pour monter sur des composants a semi-conducteur, profiles pour produire des elements de refroidissement de ce type et elements de refroidissement obtenus selon ledit procede

Info

Publication number
EP0956587A2
EP0956587A2 EP97907016A EP97907016A EP0956587A2 EP 0956587 A2 EP0956587 A2 EP 0956587A2 EP 97907016 A EP97907016 A EP 97907016A EP 97907016 A EP97907016 A EP 97907016A EP 0956587 A2 EP0956587 A2 EP 0956587A2
Authority
EP
European Patent Office
Prior art keywords
profile
partial
wall
profiles
groove
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP97907016A
Other languages
German (de)
English (en)
Inventor
Manfred Diels
Joachim Bayer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19602943A external-priority patent/DE19602943C2/de
Application filed by Individual filed Critical Individual
Publication of EP0956587A2 publication Critical patent/EP0956587A2/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/01—Manufacture or treatment
    • H10W40/03—Manufacture or treatment of arrangements for cooling
    • H10W40/037—Assembling together parts thereof
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2215/00—Fins
    • F28F2215/10—Secondary fins, e.g. projections or recesses on main fins
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining
    • Y10T29/49908—Joining by deforming
    • Y10T29/49915—Overedge assembling of seated part
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining
    • Y10T29/49908—Joining by deforming
    • Y10T29/49924—Joining by deforming of parallel side-by-side elongated members

Definitions

  • the invention relates to a method for producing heat sinks consisting of several partial profiles made of metal, in which grooves and web strips formed on the partial profiles are each inserted into one another and connected in the transverse direction by pressurization.
  • cooling fins which consist of two extruded, approximately U-shaped partial profiles made of aluminum, the outer profile walls of which engage in the manner of tongue and groove.
  • a groove is formed on each of these profile walls of such a partial profile and a web strip is formed on the wall of the other partial profile.
  • the actual connection of the two preferably identical partial profiles takes place via web-like, hollow chambers having cooling fins which, with their correspondingly shaped, approximately U-shaped ends, are inserted into corresponding grooves on the inner sides of the partial profiles and are pressed in by clamping them in these grooves by means of corresponding pressing pressure are.
  • Both from DE-PS 25 02 472 and from DE-PS 35 18 310 are known manufacturing processes for half-open heat sinks, in which the cooling fins are pressed into a corresponding mounting groove on a base plate. Roller-type pressing tools act between the individual cooling fins on the intermediate webs on the base plate and press material into adjacent fin spaces on the cooling fins. In this way, however, only half-open heat sinks can be produced.
  • the cooling fin distances can be because of Installation type must not be set as tight as desired.
  • the object of the invention is to propose a method for producing heat sinks, preferably in a hollow profile construction, but also in a semi-open construction, by means of which heat sinks can be produced with good thermal conductivity, sufficient torsional rigidity and strength and low costs. It is also an object of the invention to propose suitable partial profiles and heat sinks produced therefrom.
  • Claims 2 and 3 propose suitable pressing methods which also enable plastic deformation of the outwardly projecting or protruding groove walls. Different heights of heat sinks can be realized with a small number of different, but system-identical sub-profiles.
  • heat sinks or heat sink strands of very great length can be produced with relatively little manufacturing outlay, which if need be shorter Sections can be split.
  • the necessary partial profiles are at least partially fixed against each other, so that additional holding devices can be omitted.
  • a compression or deformation of the outwardly projecting groove walls takes place on the connecting sides of the heat sinks or the heat sink strands, which leads to a very intimate, mechanically strong and heat-promoting connection with the adjacent web strips of the corresponding partial profiles.
  • This connection technology which can be used both for closed and for half-open heat sinks, does not influence the type and arrangement of the inner cooling fins, the design of which, at least from this point of view, can be freely selected.
  • partial profiles with the features of claims 4 to 6 are suitable in a particularly favorable manner.
  • a particularly intimate interlocking wedging of two web strips at one connection point takes place in the area of their connection points after assembly and pressing.
  • Both the partial profiles according to claims 4 to 6 and 10 and profiles according to claim 11 can be produced in a simple manner as extruded profiles made of aluminum alloys.
  • hollow cooling bodies can be produced in which the partial profile walls used for the connection form the contact surface for the installation of a semiconductor component after smoothing machining. This favors the heat conduction in such a heat sink, since the heat flows run through the outer profile wall sections perpendicular to the contact surface and the partial profile wall sections parallel thereto.
  • Fig. 1 shows a cross section through one of two of the same
  • Shell profiles manufactured heat sink the left side shows the assembly position before pressing and the right side shows the connection of the profiles after pressing,
  • FIG. 2 shows a cross section with the same mounting situations of a hollow heat sink made of two different shell profiles with cooling fins additionally arranged on one side on a shell profile
  • FIG. 3 shows a cross section in corresponding assembly arrangements through a heat sink made of three shell profiles, with the formation of two hollow chambers,
  • Fig. 4 is a cross-sectional view through a heat sink with three
  • FIG. 5 u. 6 enlarged representations of the two shell profiles used in the previous versions
  • Fig. 8 shows a section through an existing of three hollow chambers
  • Fig. 9 shows a cross section through the mounting arrangement of several
  • Fig. 10 shows a corresponding cross section of the arrangement in Figure 9 after the pressing of the outwardly projecting webs into the corresponding associated grooves.
  • Partial profiles 1 and 2 made of an aluminum alloy according to FIGS. 5 and 6 heat sinks or heat sink strands can be made with one or produce several hollow chambers, as have been shown for example in Figures 1 to 4.
  • Partial profiles 1 according to FIG. 6 have an approximately L-shaped cross section.
  • a respective contact surface for a semiconductor element (not shown) to be cooled forms the first profile wall, designated by the number 11, on which the second profile wall 12 is formed perpendicularly thereto.
  • Cooling fins 13 are formed on the inside of the first profile wall 11 at a distance from one another and are arranged approximately parallel to the second profile wall 12.
  • a heat sink according to FIG. 1 can be produced with two such partial profiles 1 according to FIG. 6, which are mounted offset from one another by 180 degrees.
  • the two partial profiles 1 are set up against one another, the web strips 111 and 121 of the partial profile 1 engaging at least partially in a positive manner in the grooves 112 and 122 of the other shell profile, one already Fixing these two shell profiles 1 against each other.
  • the web strips 123 still engage in the corresponding grooves 122.
  • the web strips 112 and 121 are pressed transversely to the longitudinal direction of the partial profile arrangement in the associated grooves 122 and 112. This results in a very intimate and clinging connection with material deformation.
  • the grooves 112 and 122 can be slightly undercut, so that the web strips 111 and 121, which are likewise widened in their head region, can be fixed in these grooves with little effort.
  • Heat sinks with several hollow chambers and a possible semi-open chamber at the end according to FIGS. 2 to 4 can be produced with the additional use of partial profiles 2 of approximately Z-shaped cross section according to FIG. 5.
  • Such profiles have a profile wall 21, on which the cooling fins 24 and 25 are preferably formed, spaced apart on both sides. At the ends of the profile wall 21 are each closed The sides of the profile walls 22 and 23 are formed vertically on different sides. Both the profile wall 21 and the profile walls 22 and 23 in turn protrude have the web strips 211, 221 and the web 233 necessary for the connection, to which the correspondingly formed grooves 212, 222, 232 and 234 are in turn associated. On this partial profile 2, further web strips 223 and grooves 213 are again provided.
  • Shell profiles 2 of this type can be installed both with one another and with shell profiles 1 and connected to one another by pressing.
  • FIG 8 a heat sink according to the structure in Figure 5 is indicated, the outer partial profiles 1 are connected in the region of their outer walls 11 by one or more rivet bolts 7, the heads 71 and 72 of which are received in counterbores 14 in these profile walls 11. With these rivet bolts 7, the connection is strengthened and it is ensured that there is no deflection of these profile walls 11, which can form contact surfaces.
  • L-shaped partial profiles 3 in cross section and Z-shaped partial profiles 4 in cross section arranged or pre-assembled in the position shown in Figure 9.
  • the two outer L-shaped partial profiles 3 have a web strip 311 on the profile wall 31 at the end and the grooves 312 and 313 immediately adjacent.
  • a groove 322 is formed on the end face, the web 321 forming the groove wall projecting outwards.
  • other partial profiles 4 consist of the central profile wall 41 with the cooling ribs formed vertically on both sides and the profile walls 42 and 43 arranged at the ends.
  • grooves 422 and 432 are again provided on the front of the profile walls 42 and 43 are limited by the outwardly projecting web strips 421 and 433.
  • the web strips 311 and 411 of adjacent partial profiles 3 and 4 respectively engage in these grooves 422 and 432.
  • Hollow chamber cooling profile according to Figure 10 forms the flat and smooth after a corresponding machining
  • Illustration shows the webs pressed into the corresponding grooves with the numbers 421 'and 433'.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Die Bonding (AREA)

Abstract

L'invention concerne un procédé permettant de produire des éléments de refroidissement composés de plusieurs profilés partiels (1, 2) en métal, selon lequel des rainures (112, 122, 212, 232) et des entretoises (111, 211, 231) formées sur les profilés partiels sont emboîtées les unes dans les autres et reliées dans le sens transversal par application de pression. Les parois (121, 221, 233) des rainures ou des entretoises d'un profilé partiel (1, 2) qui font saillie vers l'extérieur, sont courbées vers l'intérieur dans les rainures (122, 212, 232) correspondantes d'un profilé partiel (1, 2) adjacent et/ou sont comprimées avec déformation plastique en vue d'un assemblage par liaison de forme de l'entretoise entrant dans la rainure qui lui est associée. L'invention concerne également des profilés partiels correspondants et des éléments de refroidissement produits à l'aide dudit procédé.
EP97907016A 1996-01-27 1997-01-17 Procede pour produire des elements de refroidissement composes de plusieurs profiles partiels en metal pour monter sur des composants a semi-conducteur, profiles pour produire des elements de refroidissement de ce type et elements de refroidissement obtenus selon ledit procede Withdrawn EP0956587A2 (fr)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
DE19602943 1996-01-27
DE19602943A DE19602943C2 (de) 1996-01-27 1996-01-27 Verfahren zur Herstellung von Kühlkörpern zum Anbau an Halbleiterbauelemente sowie Schalenprofile zur Herstellung solcher Kühlkörper
DE19619207 1996-05-11
DE19619207 1996-05-11
PCT/DE1997/000130 WO1997027619A2 (fr) 1996-01-27 1997-01-17 Procede pour produire des elements de refroidissement composes de plusieurs profiles partiels en metal pour monter sur des composants a semi-conducteur, profiles pour produire des elements de refroidissement de ce type et elements de refroidissement obtenus selon ledit procede

Publications (1)

Publication Number Publication Date
EP0956587A2 true EP0956587A2 (fr) 1999-11-17

Family

ID=26022421

Family Applications (1)

Application Number Title Priority Date Filing Date
EP97907016A Withdrawn EP0956587A2 (fr) 1996-01-27 1997-01-17 Procede pour produire des elements de refroidissement composes de plusieurs profiles partiels en metal pour monter sur des composants a semi-conducteur, profiles pour produire des elements de refroidissement de ce type et elements de refroidissement obtenus selon ledit procede

Country Status (5)

Country Link
US (1) US6279648B1 (fr)
EP (1) EP0956587A2 (fr)
AU (1) AU1923397A (fr)
DE (1) DE29712058U1 (fr)
WO (1) WO1997027619A2 (fr)

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CN102609060A (zh) * 2011-01-19 2012-07-25 鸿富锦精密工业（深圳）有限公司 散热装置
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Also Published As

Publication number Publication date
US6279648B1 (en) 2001-08-28
DE29712058U1 (de) 1998-04-02
WO1997027619A2 (fr) 1997-07-31
WO1997027619A3 (fr) 1997-10-23
AU1923397A (en) 1997-08-20

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