EP0968632A2 - Dispositif servant a dissiper la chaleur provenant d'une source de chaleur placee dans un boitier - Google Patents

Dispositif servant a dissiper la chaleur provenant d'une source de chaleur placee dans un boitier

Info

Publication number
EP0968632A2
EP0968632A2 EP98919048A EP98919048A EP0968632A2 EP 0968632 A2 EP0968632 A2 EP 0968632A2 EP 98919048 A EP98919048 A EP 98919048A EP 98919048 A EP98919048 A EP 98919048A EP 0968632 A2 EP0968632 A2 EP 0968632A2
Authority
EP
European Patent Office
Prior art keywords
heat
housing
heat conduction
arrangement according
conduction element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP98919048A
Other languages
German (de)
English (en)
Inventor
Gottfried Rieger
Michael Tirpitz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Siemens Corp
Original Assignee
Siemens AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG, Siemens Corp filed Critical Siemens AG
Publication of EP0968632A2 publication Critical patent/EP0968632A2/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means

Definitions

  • heat dissipation of the heat generated by heat sources from the housing is generally necessary. This is particularly true for heat generated by electronic, optical or mechanical loss of performance.
  • air circulation and thus heat dissipation can be brought about by one or more fans or fans on the housing or directly on a component to be cooled.
  • So-called 'heat pipes' are known from the document "Competence for your benefit - Innovations 1995" from the company ALUTRONIC. These are used to dissipate the heat lost from electronic components Heat is extracted and released again at the other end via condensation of the liquid, which means that the heat generated by electronic components can be dissipated to a heat sink.
  • a device for cooling power resistors is also known from document DE 37 01 477 AI.
  • an electrically insulated heat conduction tube arranged on a power resistor is used to transport heat from a thermally critical area to a non-critical area. The heat pipe is firmly connected to the power resistor or the heat sink both in the area of the evaporation zone and in the area of the condensation zone.
  • the elongated heat pipe referred to as the 'heat pipe'
  • the 'heat pipe' is relatively rigid and can cause hairline cracks due to vibrations.
  • the 'heat pipe' is relatively rigid and can cause hairline cracks due to vibrations.
  • Such cracks could lead to the penetration of air into the heat pipe under vacuum or even loss of the liquid contained. This would cause a drastic deterioration in the heat conduction properties of the heat conduction pipe and could therefore lead to overheating and destruction of the components to be cooled.
  • the problem of vibrations and vibrations increases in particular when the components to be cooled and the heat sink are not arranged on the same carrier, but on different carriers that are movable in terms of vibration technology.
  • the object of the invention is to provide an improved arrangement for the dissipation of heat, which is particularly suitable for operation in industrial ambient conditions.
  • the object is achieved with the arrangement specified in claim 1 for dissipating heat from a heat source from a housing.
  • the advantage of the arrangement for dissipating heat according to the invention is that it enables maintenance-free heat dissipation even in housings which are industrial conditions such as vibrations and vibrations.
  • housings without openings, such as fan slots can be used, so that increased protection and improved electromagnetic shielding of electronic components is made possible.
  • the use of completely sealed housings therefore also enables use in potentially explosive environments.
  • a double mechanical decoupling from the heat source and the secondary cooling element can be achieved.
  • the primary cooling element can additionally be mechanically decoupled from the heat source, for example via a leaf spring connection.
  • the heat source is, for example, a mechanically highly sensitive electronic component, for example a microprocessor. Due to the mechanical decoupling according to the invention, the heat source and the heat sink can advantageously be arranged on different carriers.
  • the carriers can thus be present, for example, in the form of a relatively flexible printed circuit board and a relatively rigid housing wall, which as a rule have different vibration movements in the event of vibrations.
  • 1 shows an example of an arrangement according to the invention for dissipating heat from a heat source from a housing
  • 2 shows an example of the elongated heat conduction element with primary and secondary cooling element in an exploded view.
  • the arrangement for dissipating heat in this case has at least one elongated heat conduction element P with a first end Pl for receiving heat inside the housing G and a second end P2 for dissipating heat outside the housing G.
  • the heat conduction element P penetrates this in particular at an opening 0 in the housing wall A of the housing G.
  • the opening 0 penetrated by the heat conduction element P can be sealed, for example, with a rubber seal, so that the housing G is completely self-contained. This is particularly advantageous in the case of housings which are intended for use in explosion-proof rooms and / or are intended to have complete electromagnetic shielding.
  • the heat conduction element P is in particular in the form of a heat conduction channel, preferably in the form of a heat conduction pipe, such as a so-called 'heat pipe'.
  • the primary cooling element Kl is connected to the heat source B in the housing G.
  • the heat source B is, for example, one or more electronic components, such as power components that produce waste heat or a microprocessor, with the housing of which the primary cooling element Kl can be connected.
  • the primary cooling element K1 can be mechanically decoupled from it, for example via a conventional spring leaf connection F for microprocessor housing attachments, ie in particular not rigidly.
  • the primary cooling element K 1 has first connecting means H 1 for connecting the first end Pl of the heat conducting element P.
  • the arrangement according to the invention further comprises a secondary cooling element K2 arranged outside the housing G.
  • This has second connection means H2 for connecting the second end P2 of the heat-conducting element P.
  • the secondary cooling element K2 is preferably arranged on an outer side of the housing wall A of the housing G. If the housing G itself is thermally conductive, as is the case, for example, with metallic housings, heat dissipation via the housing G is also advantageously effected.
  • the secondary cooling element K2 can have cooling fins R for increasing the surface area.
  • the primary and secondary cooling elements K1 and K2 are preferably made of metallic or another heat-conducting material, such as copper or aluminum.
  • the first and / or the second connection means H1 or H2 are designed such that the first end P1 and / or the second end P2 of the heat-conducting element P is connected to the primary and / or the secondary cooling element K1 or K2 so as to be thermally conductive and mechanically movable is.
  • the arrangement thus leads to the dissipation of the heat of the heat source B arranged inside the housing G to the outside to the secondary cooling element K2.
  • the heat conduction element P has at least one bend L between the first and the second end P2.
  • the bend L is in particular L-shaped and preferably has an angle in the range of 90 °.
  • the bend L is designed such that the first end Pl of the heat-conducting element P within the housing G extends approximately perpendicular to the housing wall A penetrated by the heat-conducting element P.
  • the bend L can advantageously be designed such that the second end P2 of the heat-conducting element P extends outside the housing G approximately parallel to the housing wall A penetrated by the heat-conducting element P.
  • a reversed configuration of the bend L is possible, so that the first end P1 runs approximately parallel inside the housing and the second end P2 outside the housing G runs approximately perpendicular to the housing wall A.
  • FIG. 2 also shows, by way of example, the elongated heat conduction element P with an angle L, and the primary and secondary cooling elements K 1 and K 2 of an embodiment of the arrangement according to the invention for dissipating heat in the unassembled state and without a housing.
  • the primary and secondary cooling elements K1 and K2 are each constructed in two parts from an upper and a lower cooling segment, which are identified in FIG. 2 by the reference symbols K1, K12, K21 and K22.
  • the first connection element H1 is present on the primary cooling element K1, for example in the form of a half-shell H1l or H12 respectively introduced into the upper and lower cooling segments K1 and K12.
  • the cooling segments K1 and K12 are put together, for example by screwing or jamming, they encompass the first end P1 of the heat-conducting element P in a heat-conducting manner the upper and lower cooling segments K21 and K22 each introduced half-shell H21 or H22, which, when the cooling segments K21 and K22 are assembled, comprise the second end P2 of the heat-conducting element P in a heat-conducting manner.
  • the diameters D1 and D2 of the half-shells H11, H12 and H21, H22 of the primary and secondary cooling elements K1 and K2 are dimensioned such that the first and / or the second end P1, P2 are mechanically movable therewith connected is.
  • a mechanically movable connection is preferably made by dimensioning the diameter D1 or D2 such that it is at least slightly larger than the diameter D of the heat conduction element P.
  • the diameter D1 of the primary cooling element Kl is approximately the same size as the diameter D of the primary cooling element Kl
  • Heat conduction element P so that a firm connection is effected.
  • the diameter D2 of the secondary cooling element K2 is dimensioned larger than the diameter D of the heat-conducting element P in such a way that a mechanically movable connection and a heat-conducting connection are produced on the one hand.
  • the heat conduction element P with a permanently connected primary cooling element K 1 can be rotated radially with respect to the secondary cooling element K 2 via its second end P2.
  • the heat transfer between heat conduction element P and cooling elements K1 and K2 can advantageously be optimized by means of thermal paste.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

Le dispositif selon l'invention comporte un élément de refroidissement primaire (K1), disposé à l'intérieur d'un boîtier (G), et un élément de refroidissement secondaire (K2), disposé à l'extérieur dudit boîtier (G). Ces éléments de refroidissement sont, pour permettre la diffusion de la chaleur à partir du boîtier (G), reliés, de façon thermoconductrice et mécaniquement mobile, par un élément de conduction thermique. L'avantage offert par le dispositif de dispersion de chaleur selon l'invention réside dans le fait qu'avec un tel dispositif, notamment le risque de formation de microcriques sur l'élément de conduction de chaleur (P), formation due aux vibrations, est fortement réduit. Ainsi, un tel dispositif peut être utilisé de façon avantageuse dans des conditions d'environnement industrielles.
EP98919048A 1997-03-19 1998-03-06 Dispositif servant a dissiper la chaleur provenant d'une source de chaleur placee dans un boitier Withdrawn EP0968632A2 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE29704885U 1997-03-19
DE29704885U DE29704885U1 (de) 1997-03-19 1997-03-19 Anordnung zur Abführung von Wärme einer in einem Gehäuse angeordneten Wärmequelle
PCT/DE1998/000670 WO1998042169A2 (fr) 1997-03-19 1998-03-06 Dispositif servant a dissiper la chaleur provenant d'une source de chaleur placee dans un boitier

Publications (1)

Publication Number Publication Date
EP0968632A2 true EP0968632A2 (fr) 2000-01-05

Family

ID=8037653

Family Applications (1)

Application Number Title Priority Date Filing Date
EP98919048A Withdrawn EP0968632A2 (fr) 1997-03-19 1998-03-06 Dispositif servant a dissiper la chaleur provenant d'une source de chaleur placee dans un boitier

Country Status (3)

Country Link
EP (1) EP0968632A2 (fr)
DE (1) DE29704885U1 (fr)
WO (1) WO1998042169A2 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE20220421U1 (de) * 2001-03-21 2003-07-31 Fritschle, Simone, 70197 Stuttgart Computergehäuse
DE10332770A1 (de) * 2003-07-17 2005-02-24 Jürgen Dr.-Ing. Schulz-Harder Kühlvorrichtung zum Abführen von Verlustwärme von einem elektrischen oder elektronischen Bauelement oder Baugruppe
DE102004030675A1 (de) * 2004-06-24 2005-11-10 Nft Nanofiltertechnik Gmbh Kühleinrichtung für elektronische Bauelemente
DE102005019437A1 (de) * 2005-01-25 2006-08-03 Axel Benner Computer
DE102013010867B4 (de) * 2013-06-28 2015-11-12 Protonet GmbH Anordnung zum Kühlen von in einem Gehäuse anordnenbaren elektrischen und/oder elektronischen Bauteilen und Rechner mit einer solchen

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3226602A (en) * 1962-10-29 1965-12-28 Thore M Elfving Heat transferring mounting panels for electric components and circuits
US3852804A (en) * 1973-05-02 1974-12-03 Gen Electric Double-sided heat-pipe cooled power semiconductor device assembly
JPS568238Y2 (fr) * 1976-02-14 1981-02-23
DE2801660C2 (de) * 1978-01-16 1986-01-30 kabelmetal electro GmbH, 3000 Hannover Vorrichtung zum Abführen der Verlustwärme von elektronischen Bauelementen
DE3701477A1 (de) * 1987-01-16 1988-07-28 Licentia Gmbh Einrichtung zur kuehlung von leistungswiderstaenden
US4917173A (en) * 1988-11-15 1990-04-17 The United States Of America As Represented By The National Aeronautics And Space Administration Monogroove liquid heat exchanger
DE69031883T2 (de) * 1989-06-08 1998-08-27 Furukawa Electric Co Ltd Kühlvorrichtung mit elektrisch isoliertem Wärmerohr für Halbleiter
JPH0714029B2 (ja) * 1990-02-07 1995-02-15 日本碍子株式会社 電力用半導体素子
FR2687464A1 (fr) * 1992-02-19 1993-08-20 Bernier Jacques Caloducs a melange zeotropique de fluides.
JP3067399B2 (ja) * 1992-07-03 2000-07-17 株式会社日立製作所 半導体冷却装置
US5343940A (en) * 1992-10-29 1994-09-06 Amigo Jean Flexible heat transfer device
US5339214A (en) * 1993-02-12 1994-08-16 Intel Corporation Multiple-fan microprocessor cooling through a finned heat pipe
DE4312830A1 (de) * 1993-04-20 1994-10-27 Privates Inst Fuer Luft Und Ka Vorrichtung zur Kühlung von hochtemperatursupraleitenden, mikroelektronischen Bauelementen, vorzugsweise Sensoren
DE9312138U1 (de) * 1993-08-13 1993-10-21 Kunze, Burkhard, Dipl.-Ing., 82041 Oberhaching Kühlvorrichtung
US5598320A (en) * 1995-03-06 1997-01-28 Ast Research, Inc. Rotable and slideble heat pipe apparatus for reducing heat build up in electronic devices
US5606341A (en) * 1995-10-02 1997-02-25 Ncr Corporation Passive CPU cooling and LCD heating for a laptop computer

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO9842169A3 *

Also Published As

Publication number Publication date
DE29704885U1 (de) 1998-04-30
WO1998042169A3 (fr) 1999-02-25
WO1998042169A2 (fr) 1998-09-24

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