EP0976848A4 - Composition metallique contenant de l'acetylure de metal, ebauche dotee d'un revetement metallique forme a l'aide de ladite composition et procede de formation dudit revetement metallique - Google Patents

Composition metallique contenant de l'acetylure de metal, ebauche dotee d'un revetement metallique forme a l'aide de ladite composition et procede de formation dudit revetement metallique

Info

Publication number: EP0976848A4
Authority: EP; European Patent Office
Prior art keywords: metal coating; metal; brake; forming; composition containing
Prior art date: 1997-11-26
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Granted

Application number

EP98953055A

Other languages

German (de)

English (en)

Other versions

EP0976848A1 (fr

EP0976848B1 (fr

Inventor

Akio Harada

Yoshiki Okamoto

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Daiken Kagaku Kogyo KK

Original Assignee

Daiken Kagaku Kogyo KK

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1997-11-26

Filing date

1998-11-13

Publication date

2005-02-23

1998-11-13 Application filed by Daiken Kagaku Kogyo KK filed Critical Daiken Kagaku Kogyo KK

2000-02-02 Publication of EP0976848A1 publication Critical patent/EP0976848A1/fr

2005-02-23 Publication of EP0976848A4 publication Critical patent/EP0976848A4/fr

2009-02-11 Application granted granted Critical

2009-02-11 Publication of EP0976848B1 publication Critical patent/EP0976848B1/fr

2018-11-13 Anticipated expiration legal-status Critical

Status Expired - Lifetime legal-status Critical Current

Links

Classifications

- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/08—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of metallic material

Landscapes

Chemical & Material Sciences (AREA)
Metallurgy (AREA)
Physics & Mathematics (AREA)
General Chemical & Material Sciences (AREA)
Chemical Kinetics & Catalysis (AREA)
Engineering & Computer Science (AREA)
Materials Engineering (AREA)
Thermal Sciences (AREA)
Organic Chemistry (AREA)
Mechanical Engineering (AREA)
Conductive Materials (AREA)
Chemically Coating (AREA)
Paints Or Removers (AREA)
Parts Printed On Printed Circuit Boards (AREA)
Compositions Of Macromolecular Compounds (AREA)
Manufacturing Of Printed Wiring (AREA)

EP98953055A 1997-11-26 1998-11-13 Composition metallique contenant un acetylure de metal, ebauche dotee d'un revetement metallique forme a l'aide de ladite composition et procede de formation dudit revetement metallique Expired - Lifetime EP0976848B1 (fr)

Applications Claiming Priority (3)

Application Number	Priority Date	Filing Date	Title
JP36380397		1997-11-26
JP36380397A JP3491021B2 (ja)	1997-11-26	1997-11-26	金属アセチリド化合物を含有した金属組成物、これを用いて金属膜を形成した素材及びその金属膜形成方法
PCT/JP1998/005139 WO1999027159A1 (fr)	1997-11-26	1998-11-13	Composition metallique contenant de l'acetylure de metal, ebauche dotee d'un revetement metallique forme a l'aide de ladite composition et procede de formation dudit revetement metallique

Publications (3)

Publication Number	Publication Date
EP0976848A1 EP0976848A1 (fr)	2000-02-02
EP0976848A4 true EP0976848A4 (fr)	2005-02-23
EP0976848B1 EP0976848B1 (fr)	2009-02-11

Family

ID=18480237

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
EP98953055A Expired - Lifetime EP0976848B1 (fr)	1997-11-26	1998-11-13	Composition metallique contenant un acetylure de metal, ebauche dotee d'un revetement metallique forme a l'aide de ladite composition et procede de formation dudit revetement metallique

Country Status (6)

Country	Link
EP (1)	EP0976848B1 (fr)
JP (1)	JP3491021B2 (fr)
KR (1)	KR20000069225A (fr)
DE (1)	DE69840542D1 (fr)
TW (1)	TW561140B (fr)
WO (1)	WO1999027159A1 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP3491021B2 (ja)	1997-11-26	2004-01-26	大研化学工業株式会社	金属アセチリド化合物を含有した金属組成物、これを用いて金属膜を形成した素材及びその金属膜形成方法
JP2007009250A (ja) *	2005-06-29	2007-01-18	Daiken Kagaku Kogyo Kk	電子部品の結線方法及び電子部品
JP2008106058A (ja) *	2006-09-28	2008-05-08	Daiken Kagaku Kogyo Kk	金属化合物、その製造方法及び導体用ペースト
WO2010119787A1 (fr) *	2009-04-14	2010-10-21	旭化成イーマテリアルズ株式会社	Composition de formation d'une couche conductrice, substrat conducteur et procédé de fabrication d'un substrat conducteur
JP5448628B2 (ja) *	2009-08-03	2014-03-19	大研化学工業株式会社	塩基性酢酸白金塩の製造方法、塩基性酢酸白金塩及び白金アセチリド化合物の製造方法

Citations (9)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US2606807A (en) *	1948-12-03	1952-08-12	Rca Corp	Electric marking
US3316088A (en) *	1963-02-11	1967-04-25	Ibm	Process of electrophotography based on electrophotolytic reactions and element therefor
US3800030A (en) *	1972-05-02	1974-03-26	Polaroid Corp	Process for purifying silver compounds
US4098807A (en) *	1974-12-09	1978-07-04	Air Products And Chemicals, Inc.	Platinum and palladium complexes
US5100702A (en) *	1990-02-22	1992-03-31	Nissan Chemical Industries, Ltd.	Thin platinum film-forming composition
US5312643A (en) *	1990-11-20	1994-05-17	Matsushita Electric Industrial Co., Ltd.	Method of producing a transparent conductive film provided with supplementary metal lines
US5464990A (en) *	1992-09-25	1995-11-07	Fuji Xerox Co., Ltd.	Voltage non-linear device and liquid crystal display device incorporating same
US5630872A (en) *	1994-12-09	1997-05-20	Mitsubishi Materials Corporation	Formation of thin-film patterns of a metal oxide
EP0969006A1 (fr) *	1997-09-30	2000-01-05	Daiken Chemical Co. Ltd.	Compose d'acetylure de metal et procede de production

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP3491021B2 (ja)	1997-11-26	2004-01-26	大研化学工業株式会社	金属アセチリド化合物を含有した金属組成物、これを用いて金属膜を形成した素材及びその金属膜形成方法
US6120586A (en)	1998-11-13	2000-09-19	Daiken Chemical Co., Ltd.	Metal composition containing metal acetylide, blank having metallic coating formed therewith, and method for forming the metallic coating
JP3812846B1 (ja)	2005-10-27	2006-08-23	美智惠安達	セラミック発熱体の製造方法および融雪屋根瓦
JP5752373B2 (ja)	2010-08-31	2015-07-22	株式会社ユニバーサルエンターテインメント	遊技システム及び遊技機
WO2014006762A1 (fr)	2012-07-03	2014-01-09	日立オートモティブシステムズ阪神株式会社	Dispositif d'allumage destiné à un moteur à combustion interne

1997
- 1997-11-26 JP JP36380397A patent/JP3491021B2/ja not_active Expired - Fee Related
1998
- 1998-11-13 TW TW087118843A patent/TW561140B/zh not_active IP Right Cessation
- 1998-11-13 DE DE69840542T patent/DE69840542D1/de not_active Expired - Lifetime
- 1998-11-13 EP EP98953055A patent/EP0976848B1/fr not_active Expired - Lifetime
- 1998-11-13 WO PCT/JP1998/005139 patent/WO1999027159A1/fr not_active Ceased
- 1998-11-30 KR KR1019997004810A patent/KR20000069225A/ko not_active Ceased

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US2606807A (en) *	1948-12-03	1952-08-12	Rca Corp	Electric marking
US3316088A (en) *	1963-02-11	1967-04-25	Ibm	Process of electrophotography based on electrophotolytic reactions and element therefor
US3800030A (en) *	1972-05-02	1974-03-26	Polaroid Corp	Process for purifying silver compounds
US4098807A (en) *	1974-12-09	1978-07-04	Air Products And Chemicals, Inc.	Platinum and palladium complexes
US5100702A (en) *	1990-02-22	1992-03-31	Nissan Chemical Industries, Ltd.	Thin platinum film-forming composition
US5312643A (en) *	1990-11-20	1994-05-17	Matsushita Electric Industrial Co., Ltd.	Method of producing a transparent conductive film provided with supplementary metal lines
US5464990A (en) *	1992-09-25	1995-11-07	Fuji Xerox Co., Ltd.	Voltage non-linear device and liquid crystal display device incorporating same
US5630872A (en) *	1994-12-09	1997-05-20	Mitsubishi Materials Corporation	Formation of thin-film patterns of a metal oxide
EP0969006A1 (fr) *	1997-09-30	2000-01-05	Daiken Chemical Co. Ltd.	Compose d'acetylure de metal et procede de production

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO9927159A1 *

Also Published As

Publication number	Publication date
JPH11158184A (ja)	1999-06-15
KR20000069225A (ko)	2000-11-25
JP3491021B2 (ja)	2004-01-26
EP0976848A1 (fr)	2000-02-02
TW561140B (en)	2003-11-11
DE69840542D1 (de)	2009-03-26
WO1999027159A1 (fr)	1999-06-03
EP0976848B1 (fr)	2009-02-11

Legal Events

Date	Code	Title	Description
1999-12-17	PUAI	Public reference made under article 153(3) epc to a published international application that has entered the european phase	Free format text: ORIGINAL CODE: 0009012
2000-02-02	17P	Request for examination filed	Effective date: 19990809
2000-02-02	AK	Designated contracting states	Kind code of ref document: A1 Designated state(s): DE GB IT
2005-02-23	A4	Supplementary search report drawn up and despatched	Effective date: 20050111
2005-02-23	RIC1	Information provided on ipc code assigned before grant	Ipc: 7C 07F 15/00 B Ipc: 7C 07F 19/00 B Ipc: 7C 23C 18/08 A
2005-05-04	17Q	First examination report despatched	Effective date: 20050321
2007-05-02	17Q	First examination report despatched	Effective date: 20050321
2008-02-08	GRAP	Despatch of communication of intention to grant a patent	Free format text: ORIGINAL CODE: EPIDOSNIGR1
2008-07-15	GRAS	Grant fee paid	Free format text: ORIGINAL CODE: EPIDOSNIGR3
2009-01-09	GRAA	(expected) grant	Free format text: ORIGINAL CODE: 0009210
2009-02-11	AK	Designated contracting states	Kind code of ref document: B1 Designated state(s): DE GB IT
2009-02-11	REG	Reference to a national code	Ref country code: GB Ref legal event code: FG4D
2009-03-26	REF	Corresponds to:	Ref document number: 69840542 Country of ref document: DE Date of ref document: 20090326 Kind code of ref document: P
2009-12-18	PLBE	No opposition filed within time limit	Free format text: ORIGINAL CODE: 0009261
2009-12-18	STAA	Information on the status of an ep patent application or granted ep patent	Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT
2010-01-20	26N	No opposition filed	Effective date: 20091112
2011-03-31	PG25	Lapsed in a contracting state [announced via postgrant information from national office to epo]	Ref country code: IT Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20090211
2015-01-30	PGFP	Annual fee paid to national office [announced via postgrant information from national office to epo]	Ref country code: GB Payment date: 20141119 Year of fee payment: 17
2016-07-27	GBPC	Gb: european patent ceased through non-payment of renewal fee	Effective date: 20151113
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