TW561140B - Composition containing organic metal - Google Patents
Composition containing organic metal Download PDFInfo
- Publication number
- TW561140B TW561140B TW087118843A TW87118843A TW561140B TW 561140 B TW561140 B TW 561140B TW 087118843 A TW087118843 A TW 087118843A TW 87118843 A TW87118843 A TW 87118843A TW 561140 B TW561140 B TW 561140B
- Authority
- TW
- Taiwan
- Prior art keywords
- metal
- parts
- organic
- weight
- acetylene
- Prior art date
Links
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 113
- 239000002184 metal Substances 0.000 title claims abstract description 111
- 239000000203 mixture Substances 0.000 title claims abstract description 36
- -1 metal acetylide compound Chemical class 0.000 claims abstract description 40
- 239000003960 organic solvent Substances 0.000 claims abstract description 29
- 239000007788 liquid Substances 0.000 claims abstract description 26
- 239000011347 resin Substances 0.000 claims abstract description 21
- 229920005989 resin Polymers 0.000 claims abstract description 21
- 125000004429 atom Chemical group 0.000 claims abstract description 19
- 238000010304 firing Methods 0.000 claims abstract description 17
- 125000004430 oxygen atom Chemical group O* 0.000 claims abstract description 7
- 125000001183 hydrocarbyl group Chemical group 0.000 claims abstract 3
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 claims description 33
- 125000002524 organometallic group Chemical group 0.000 claims description 31
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 7
- 239000000654 additive Substances 0.000 claims description 7
- 229910052799 carbon Inorganic materials 0.000 claims description 7
- 230000000996 additive effect Effects 0.000 claims description 5
- 125000004432 carbon atom Chemical group C* 0.000 claims description 4
- 239000011521 glass Substances 0.000 abstract description 10
- 229910052736 halogen Inorganic materials 0.000 abstract description 10
- 150000002367 halogens Chemical class 0.000 abstract description 10
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 abstract description 9
- 150000001875 compounds Chemical class 0.000 abstract description 9
- 229910052717 sulfur Inorganic materials 0.000 abstract description 9
- 239000011593 sulfur Substances 0.000 abstract description 9
- 239000000126 substance Substances 0.000 abstract description 8
- 239000002932 luster Substances 0.000 abstract description 6
- 239000007789 gas Substances 0.000 abstract description 4
- 238000004898 kneading Methods 0.000 abstract description 4
- 238000002156 mixing Methods 0.000 abstract description 4
- 239000002994 raw material Substances 0.000 abstract description 3
- LSNNMFCWUKXFEE-UHFFFAOYSA-N Sulfurous acid Chemical compound OS(O)=O LSNNMFCWUKXFEE-UHFFFAOYSA-N 0.000 abstract 1
- 238000004140 cleaning Methods 0.000 abstract 1
- 239000000356 contaminant Substances 0.000 abstract 1
- 230000007613 environmental effect Effects 0.000 abstract 1
- 229910052573 porcelain Inorganic materials 0.000 abstract 1
- 239000003292 glue Substances 0.000 description 34
- 239000010931 gold Substances 0.000 description 26
- 229910052737 gold Inorganic materials 0.000 description 25
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 22
- 239000000463 material Substances 0.000 description 20
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 13
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 13
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 description 12
- 229910052797 bismuth Inorganic materials 0.000 description 11
- 150000002430 hydrocarbons Chemical class 0.000 description 11
- 235000007173 Abies balsamea Nutrition 0.000 description 10
- 244000018716 Impatiens biflora Species 0.000 description 10
- LVUDRAFEZASJOI-UHFFFAOYSA-N acetylene gold Chemical group [Au].C#C LVUDRAFEZASJOI-UHFFFAOYSA-N 0.000 description 10
- 239000000919 ceramic Substances 0.000 description 10
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 description 9
- 239000004857 Balsam Substances 0.000 description 9
- 239000001856 Ethyl cellulose Substances 0.000 description 8
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 8
- 229920001249 ethyl cellulose Polymers 0.000 description 8
- 235000019325 ethyl cellulose Nutrition 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- 229910052763 palladium Inorganic materials 0.000 description 8
- 238000002360 preparation method Methods 0.000 description 8
- 239000003446 ligand Substances 0.000 description 7
- 229910052697 platinum Inorganic materials 0.000 description 7
- 229940116333 ethyl lactate Drugs 0.000 description 6
- 238000007650 screen-printing Methods 0.000 description 6
- 239000002904 solvent Substances 0.000 description 6
- SKBXVAOMEVOTGJ-UHFFFAOYSA-N xi-Pinol Chemical compound CC1=CCC2C(C)(C)OC1C2 SKBXVAOMEVOTGJ-UHFFFAOYSA-N 0.000 description 6
- 239000000020 Nitrocellulose Substances 0.000 description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 229920001220 nitrocellulos Polymers 0.000 description 5
- 229910052760 oxygen Inorganic materials 0.000 description 5
- 239000001301 oxygen Substances 0.000 description 5
- 238000007639 printing Methods 0.000 description 5
- 229910052703 rhodium Inorganic materials 0.000 description 5
- 239000010948 rhodium Substances 0.000 description 5
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 4
- 239000000460 chlorine Substances 0.000 description 4
- 229910052801 chlorine Inorganic materials 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- JUWSSMXCCAMYGX-UHFFFAOYSA-N gold platinum Chemical compound [Pt].[Au] JUWSSMXCCAMYGX-UHFFFAOYSA-N 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 230000002411 adverse Effects 0.000 description 3
- 125000000753 cycloalkyl group Chemical group 0.000 description 3
- 238000005034 decoration Methods 0.000 description 3
- 229930195733 hydrocarbon Natural products 0.000 description 3
- 150000002736 metal compounds Chemical class 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 239000003208 petroleum Substances 0.000 description 3
- 239000010970 precious metal Substances 0.000 description 3
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- IBXNCJKFFQIKKY-UHFFFAOYSA-N 1-pentyne Chemical compound CCCC#C IBXNCJKFFQIKKY-UHFFFAOYSA-N 0.000 description 2
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 description 2
- 239000004215 Carbon black (E152) Substances 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- KZBUYRJDOAKODT-UHFFFAOYSA-N Chlorine Chemical compound ClCl KZBUYRJDOAKODT-UHFFFAOYSA-N 0.000 description 2
- 244000062730 Melissa officinalis Species 0.000 description 2
- 235000010654 Melissa officinalis Nutrition 0.000 description 2
- AMQJEAYHLZJPGS-UHFFFAOYSA-N N-Pentanol Chemical compound CCCCCO AMQJEAYHLZJPGS-UHFFFAOYSA-N 0.000 description 2
- MQSPCDQRBBZIEJ-UHFFFAOYSA-N [C-]#[C-].[Ge+2] Chemical compound [C-]#[C-].[Ge+2] MQSPCDQRBBZIEJ-UHFFFAOYSA-N 0.000 description 2
- VLNCBHPCFUJEKR-UHFFFAOYSA-N [Rh+3].[Rh+3].[C-]#[C-].[C-]#[C-].[C-]#[C-] Chemical compound [Rh+3].[Rh+3].[C-]#[C-].[C-]#[C-].[C-]#[C-] VLNCBHPCFUJEKR-UHFFFAOYSA-N 0.000 description 2
- UHRUTKQAZMOYHJ-UHFFFAOYSA-N acetylene rhodium Chemical compound [Rh].C#C UHRUTKQAZMOYHJ-UHFFFAOYSA-N 0.000 description 2
- 239000000084 colloidal system Substances 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- YOXHCYXIAVIFCZ-UHFFFAOYSA-N cyclopropanol Chemical compound OC1CC1 YOXHCYXIAVIFCZ-UHFFFAOYSA-N 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- 238000006477 desulfuration reaction Methods 0.000 description 2
- 230000023556 desulfurization Effects 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 238000011049 filling Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 125000002887 hydroxy group Chemical class [H]O* 0.000 description 2
- 229910052741 iridium Inorganic materials 0.000 description 2
- 239000000865 liniment Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229910052707 ruthenium Inorganic materials 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- LQMDOONLLAJAPZ-UHFFFAOYSA-N 1-ethynylcyclopentan-1-ol Chemical compound C#CC1(O)CCCC1 LQMDOONLLAJAPZ-UHFFFAOYSA-N 0.000 description 1
- QPACLFFIDGQFRT-UHFFFAOYSA-N 1-ethynylcyclopropan-1-ol Chemical compound C#CC1(O)CC1 QPACLFFIDGQFRT-UHFFFAOYSA-N 0.000 description 1
- CGHIBGNXEGJPQZ-UHFFFAOYSA-N 1-hexyne Chemical compound CCCCC#C CGHIBGNXEGJPQZ-UHFFFAOYSA-N 0.000 description 1
- PPWNCLVNXGCGAF-UHFFFAOYSA-N 3,3-dimethylbut-1-yne Chemical compound CC(C)(C)C#C PPWNCLVNXGCGAF-UHFFFAOYSA-N 0.000 description 1
- LYUUHXABFZAHKB-UHFFFAOYSA-N 3,6-dimethylhept-1-yne Chemical compound CC(C)CCC(C)C#C LYUUHXABFZAHKB-UHFFFAOYSA-N 0.000 description 1
- ZZLCFHIKESPLTH-UHFFFAOYSA-N 4-Methylbiphenyl Chemical compound C1=CC(C)=CC=C1C1=CC=CC=C1 ZZLCFHIKESPLTH-UHFFFAOYSA-N 0.000 description 1
- 240000000972 Agathis dammara Species 0.000 description 1
- 241000209128 Bambusa Species 0.000 description 1
- 235000017166 Bambusa arundinacea Nutrition 0.000 description 1
- 235000017491 Bambusa tulda Nutrition 0.000 description 1
- ZTQSAGDEMFDKMZ-UHFFFAOYSA-N Butyraldehyde Chemical compound CCCC=O ZTQSAGDEMFDKMZ-UHFFFAOYSA-N 0.000 description 1
- GBASDRNMMKYGPL-UHFFFAOYSA-N C#C.[Ge] Chemical group C#C.[Ge] GBASDRNMMKYGPL-UHFFFAOYSA-N 0.000 description 1
- BMEZMBSEUYUFDM-UHFFFAOYSA-N C#C.[Pt] Chemical group C#C.[Pt] BMEZMBSEUYUFDM-UHFFFAOYSA-N 0.000 description 1
- 229920002871 Dammar gum Polymers 0.000 description 1
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- 235000015334 Phyllostachys viridis Nutrition 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- 240000008866 Ziziphus nummularia Species 0.000 description 1
- TXKPGZOYBXKOHB-UHFFFAOYSA-N [Au].[U] Chemical compound [Au].[U] TXKPGZOYBXKOHB-UHFFFAOYSA-N 0.000 description 1
- XYZNIJOLUAUPAL-UHFFFAOYSA-N [Pt+2].[C-]#[C-] Chemical compound [Pt+2].[C-]#[C-] XYZNIJOLUAUPAL-UHFFFAOYSA-N 0.000 description 1
- BAHGXWQBJSTFAC-UHFFFAOYSA-N [U].C#C Chemical compound [U].C#C BAHGXWQBJSTFAC-UHFFFAOYSA-N 0.000 description 1
- 230000021736 acetylation Effects 0.000 description 1
- 238000006640 acetylation reaction Methods 0.000 description 1
- 150000000475 acetylene derivatives Chemical class 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000005456 alcohol based solvent Substances 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 150000001345 alkine derivatives Chemical class 0.000 description 1
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 description 1
- 239000003849 aromatic solvent Substances 0.000 description 1
- 239000010426 asphalt Substances 0.000 description 1
- WKHIHUGHIZXFAE-UHFFFAOYSA-N but-1-yne;cyclobutanol Chemical compound CCC#C.OC1CCC1 WKHIHUGHIZXFAE-UHFFFAOYSA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000002079 cooperative effect Effects 0.000 description 1
- 150000004696 coordination complex Chemical class 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- KTHXBEHDVMTNOH-UHFFFAOYSA-N cyclobutanol Chemical compound OC1CCC1 KTHXBEHDVMTNOH-UHFFFAOYSA-N 0.000 description 1
- HPXRVTGHNJAIIH-UHFFFAOYSA-N cyclohexanol Chemical compound OC1CCCCC1 HPXRVTGHNJAIIH-UHFFFAOYSA-N 0.000 description 1
- TVHIJJMJTSVGSJ-UHFFFAOYSA-N cyclopentanol;prop-1-yne Chemical compound CC#C.OC1CCCC1 TVHIJJMJTSVGSJ-UHFFFAOYSA-N 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 125000002534 ethynyl group Chemical group [H]C#C* 0.000 description 1
- OJCSPXHYDFONPU-UHFFFAOYSA-N etoac etoac Chemical compound CCOC(C)=O.CCOC(C)=O OJCSPXHYDFONPU-UHFFFAOYSA-N 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- PQTCMBYFWMFIGM-UHFFFAOYSA-N gold silver Chemical compound [Ag].[Au] PQTCMBYFWMFIGM-UHFFFAOYSA-N 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- SHSFXAVQBIEYMK-UHFFFAOYSA-N hept-1-yn-3-ol Chemical compound CCCCC(O)C#C SHSFXAVQBIEYMK-UHFFFAOYSA-N 0.000 description 1
- VOHBMHAELZLACG-UHFFFAOYSA-N hept-5-yn-3-ol Chemical compound CCC(O)CC#CC VOHBMHAELZLACG-UHFFFAOYSA-N 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 239000010985 leather Substances 0.000 description 1
- 229910001338 liquidmetal Inorganic materials 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000008267 milk Substances 0.000 description 1
- 210000004080 milk Anatomy 0.000 description 1
- 235000013336 milk Nutrition 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052762 osmium Inorganic materials 0.000 description 1
- 238000007649 pad printing Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- HJFRLXPEVRXBQZ-UHFFFAOYSA-N pent-3-yn-2-ol Chemical compound CC#CC(C)O HJFRLXPEVRXBQZ-UHFFFAOYSA-N 0.000 description 1
- CRWVOXFUXPYTRK-UHFFFAOYSA-N pent-4-yn-1-ol Chemical compound OCCCC#C CRWVOXFUXPYTRK-UHFFFAOYSA-N 0.000 description 1
- JTHLRRZARWSHBE-UHFFFAOYSA-N pent-4-yn-2-ol Chemical compound CC(O)CC#C JTHLRRZARWSHBE-UHFFFAOYSA-N 0.000 description 1
- 150000003057 platinum Chemical class 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- MWWATHDPGQKSAR-UHFFFAOYSA-N propyne Chemical compound CC#C MWWATHDPGQKSAR-UHFFFAOYSA-N 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 125000004434 sulfur atom Chemical group 0.000 description 1
- 229910052815 sulfur oxide Inorganic materials 0.000 description 1
- 229940116411 terpineol Drugs 0.000 description 1
- 238000010023 transfer printing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/08—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of metallic material
Landscapes
- Chemical & Material Sciences (AREA)
- Metallurgy (AREA)
- Physics & Mathematics (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Thermal Sciences (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Conductive Materials (AREA)
- Chemically Coating (AREA)
- Paints Or Removers (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP36380397A JP3491021B2 (ja) | 1997-11-26 | 1997-11-26 | 金属アセチリド化合物を含有した金属組成物、これを用いて金属膜を形成した素材及びその金属膜形成方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW561140B true TW561140B (en) | 2003-11-11 |
Family
ID=18480237
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW087118843A TW561140B (en) | 1997-11-26 | 1998-11-13 | Composition containing organic metal |
Country Status (6)
| Country | Link |
|---|---|
| EP (1) | EP0976848B1 (fr) |
| JP (1) | JP3491021B2 (fr) |
| KR (1) | KR20000069225A (fr) |
| DE (1) | DE69840542D1 (fr) |
| TW (1) | TW561140B (fr) |
| WO (1) | WO1999027159A1 (fr) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3491021B2 (ja) | 1997-11-26 | 2004-01-26 | 大研化学工業株式会社 | 金属アセチリド化合物を含有した金属組成物、これを用いて金属膜を形成した素材及びその金属膜形成方法 |
| JP2007009250A (ja) * | 2005-06-29 | 2007-01-18 | Daiken Kagaku Kogyo Kk | 電子部品の結線方法及び電子部品 |
| JP2008106058A (ja) * | 2006-09-28 | 2008-05-08 | Daiken Kagaku Kogyo Kk | 金属化合物、その製造方法及び導体用ペースト |
| WO2010119787A1 (fr) * | 2009-04-14 | 2010-10-21 | 旭化成イーマテリアルズ株式会社 | Composition de formation d'une couche conductrice, substrat conducteur et procédé de fabrication d'un substrat conducteur |
| JP5448628B2 (ja) * | 2009-08-03 | 2014-03-19 | 大研化学工業株式会社 | 塩基性酢酸白金塩の製造方法、塩基性酢酸白金塩及び白金アセチリド化合物の製造方法 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2606807A (en) * | 1948-12-03 | 1952-08-12 | Rca Corp | Electric marking |
| US3316088A (en) * | 1963-02-11 | 1967-04-25 | Ibm | Process of electrophotography based on electrophotolytic reactions and element therefor |
| US3800030A (en) * | 1972-05-02 | 1974-03-26 | Polaroid Corp | Process for purifying silver compounds |
| DE2555374A1 (de) * | 1974-12-09 | 1976-06-10 | Air Prod & Chem | Neue platin- und palladiumverbindungen, verfahren zu deren herstellung und verfahren zu deren verwendung |
| JP2841636B2 (ja) * | 1990-02-22 | 1998-12-24 | 日産化学工業株式会社 | 白金薄膜形成用組成物 |
| JPH04186229A (ja) * | 1990-11-20 | 1992-07-03 | Matsushita Electric Ind Co Ltd | 補助電極付透明電極およびその製造方法 |
| US5464990A (en) * | 1992-09-25 | 1995-11-07 | Fuji Xerox Co., Ltd. | Voltage non-linear device and liquid crystal display device incorporating same |
| KR100294581B1 (ko) * | 1994-12-09 | 2001-09-17 | 후지무라 마사지카, 아키모토 유미 | 금속산화물박막패턴형성용조성물및그제조방법,금속산화물박막패턴의형성방법,전자부품및광학부품의제조방법,및박막의형성방법 |
| EP0969006B1 (fr) * | 1997-09-30 | 2003-11-12 | Daiken Chemical Co. Ltd. | Compose d'acetylure de metal et procede de production |
| JP3491021B2 (ja) | 1997-11-26 | 2004-01-26 | 大研化学工業株式会社 | 金属アセチリド化合物を含有した金属組成物、これを用いて金属膜を形成した素材及びその金属膜形成方法 |
| US6120586A (en) | 1998-11-13 | 2000-09-19 | Daiken Chemical Co., Ltd. | Metal composition containing metal acetylide, blank having metallic coating formed therewith, and method for forming the metallic coating |
| JP3812846B1 (ja) | 2005-10-27 | 2006-08-23 | 美智惠 安達 | セラミック発熱体の製造方法および融雪屋根瓦 |
| JP5752373B2 (ja) | 2010-08-31 | 2015-07-22 | 株式会社ユニバーサルエンターテインメント | 遊技システム及び遊技機 |
| WO2014006762A1 (fr) | 2012-07-03 | 2014-01-09 | 日立オートモティブシステムズ阪神株式会社 | Dispositif d'allumage destiné à un moteur à combustion interne |
-
1997
- 1997-11-26 JP JP36380397A patent/JP3491021B2/ja not_active Expired - Fee Related
-
1998
- 1998-11-13 TW TW087118843A patent/TW561140B/zh not_active IP Right Cessation
- 1998-11-13 DE DE69840542T patent/DE69840542D1/de not_active Expired - Lifetime
- 1998-11-13 EP EP98953055A patent/EP0976848B1/fr not_active Expired - Lifetime
- 1998-11-13 WO PCT/JP1998/005139 patent/WO1999027159A1/fr not_active Ceased
- 1998-11-30 KR KR1019997004810A patent/KR20000069225A/ko not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| JPH11158184A (ja) | 1999-06-15 |
| KR20000069225A (ko) | 2000-11-25 |
| JP3491021B2 (ja) | 2004-01-26 |
| EP0976848A1 (fr) | 2000-02-02 |
| DE69840542D1 (de) | 2009-03-26 |
| WO1999027159A1 (fr) | 1999-06-03 |
| EP0976848A4 (fr) | 2005-02-23 |
| EP0976848B1 (fr) | 2009-02-11 |
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