EP1094501A3 - Vorrichtung und Verfahren zur Bearbeitung von Substraten - Google Patents

Vorrichtung und Verfahren zur Bearbeitung von Substraten Download PDF

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Publication number
EP1094501A3
EP1094501A3 EP00309179A EP00309179A EP1094501A3 EP 1094501 A3 EP1094501 A3 EP 1094501A3 EP 00309179 A EP00309179 A EP 00309179A EP 00309179 A EP00309179 A EP 00309179A EP 1094501 A3 EP1094501 A3 EP 1094501A3
Authority
EP
European Patent Office
Prior art keywords
substrate processing
processing unit
wafer
tiers
processing apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP00309179A
Other languages
English (en)
French (fr)
Other versions
EP1094501B9 (de
EP1094501A2 (de
EP1094501B1 (de
Inventor
Issei Tokyo Electron Kyusyu Limited Ueda
Shinichi Tokyo Electron Kyusyu Limited Hayashi
Naruaki Tokyo Electron Kyusyu Limited Iida
Yuji Tokyo Electron Kyusyu Limited Matsuyama
Yoichi Tokyo Electron Limited Deguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to EP07000574A priority Critical patent/EP1770761B1/de
Priority to EP07000573A priority patent/EP1770760B1/de
Priority to EP07000575A priority patent/EP1770762B1/de
Priority to EP07000576A priority patent/EP1770763A1/de
Publication of EP1094501A2 publication Critical patent/EP1094501A2/de
Publication of EP1094501A3 publication Critical patent/EP1094501A3/de
Application granted granted Critical
Publication of EP1094501B1 publication Critical patent/EP1094501B1/de
Publication of EP1094501B9 publication Critical patent/EP1094501B9/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • G—PHYSICS
    • G07—CHECKING-DEVICES
    • G07C—TIME OR ATTENDANCE REGISTERS; REGISTERING OR INDICATING THE WORKING OF MACHINES; GENERATING RANDOM NUMBERS; VOTING OR LOTTERY APPARATUS; ARRANGEMENTS, SYSTEMS OR APPARATUS FOR CHECKING NOT PROVIDED FOR ELSEWHERE
    • G07C9/00—Individual registration on entry or exit
    • G07C9/20—Individual registration on entry or exit involving the use of a pass
    • G07C9/28—Individual registration on entry or exit involving the use of a pass the pass enabling tracking or indicating presence
    • G—PHYSICS
    • G08—SIGNALLING
    • G08G—TRAFFIC CONTROL SYSTEMS
    • G08G3/00—Traffic control systems for marine craft
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0448—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0458—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers vertical arrangement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0461—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the presence of two or more transfer chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0462—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0464—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the transfer chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0466—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3306—Horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3311—Horizontal transfer of a batch of workpieces
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/14—Wafer cassette transporting

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Ocean & Marine Engineering (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Weting (AREA)
EP00309179A 1999-10-19 2000-10-18 Vorrichtung und Verfahren zur Bearbeitung von Substraten Expired - Lifetime EP1094501B9 (de)

Priority Applications (4)

Application Number Priority Date Filing Date Title
EP07000574A EP1770761B1 (de) 1999-10-19 2000-10-18 Substratverarbeitungsvorrichtung
EP07000573A EP1770760B1 (de) 1999-10-19 2000-10-18 Substratverarbeitungsvorrichtung
EP07000575A EP1770762B1 (de) 1999-10-19 2000-10-18 Substratverarbeitungsvorrichtung
EP07000576A EP1770763A1 (de) 1999-10-19 2000-10-18 Substratverarbeitungsvorrichtung

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP29639599 1999-10-19
JP29639599 1999-10-19

Related Child Applications (4)

Application Number Title Priority Date Filing Date
EP07000573A Division EP1770760B1 (de) 1999-10-19 2000-10-18 Substratverarbeitungsvorrichtung
EP07000576A Division EP1770763A1 (de) 1999-10-19 2000-10-18 Substratverarbeitungsvorrichtung
EP07000575A Division EP1770762B1 (de) 1999-10-19 2000-10-18 Substratverarbeitungsvorrichtung
EP07000574A Division EP1770761B1 (de) 1999-10-19 2000-10-18 Substratverarbeitungsvorrichtung

Publications (4)

Publication Number Publication Date
EP1094501A2 EP1094501A2 (de) 2001-04-25
EP1094501A3 true EP1094501A3 (de) 2003-08-20
EP1094501B1 EP1094501B1 (de) 2007-02-28
EP1094501B9 EP1094501B9 (de) 2007-10-31

Family

ID=17832999

Family Applications (5)

Application Number Title Priority Date Filing Date
EP07000575A Expired - Lifetime EP1770762B1 (de) 1999-10-19 2000-10-18 Substratverarbeitungsvorrichtung
EP07000576A Withdrawn EP1770763A1 (de) 1999-10-19 2000-10-18 Substratverarbeitungsvorrichtung
EP07000574A Expired - Lifetime EP1770761B1 (de) 1999-10-19 2000-10-18 Substratverarbeitungsvorrichtung
EP00309179A Expired - Lifetime EP1094501B9 (de) 1999-10-19 2000-10-18 Vorrichtung und Verfahren zur Bearbeitung von Substraten
EP07000573A Expired - Lifetime EP1770760B1 (de) 1999-10-19 2000-10-18 Substratverarbeitungsvorrichtung

Family Applications Before (3)

Application Number Title Priority Date Filing Date
EP07000575A Expired - Lifetime EP1770762B1 (de) 1999-10-19 2000-10-18 Substratverarbeitungsvorrichtung
EP07000576A Withdrawn EP1770763A1 (de) 1999-10-19 2000-10-18 Substratverarbeitungsvorrichtung
EP07000574A Expired - Lifetime EP1770761B1 (de) 1999-10-19 2000-10-18 Substratverarbeitungsvorrichtung

Family Applications After (1)

Application Number Title Priority Date Filing Date
EP07000573A Expired - Lifetime EP1770760B1 (de) 1999-10-19 2000-10-18 Substratverarbeitungsvorrichtung

Country Status (6)

Country Link
US (3) US6402401B1 (de)
EP (5) EP1770762B1 (de)
KR (1) KR100634122B1 (de)
DE (3) DE60045588D1 (de)
SG (4) SG123602A1 (de)
TW (1) TW480555B (de)

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* Cited by examiner, † Cited by third party
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EP1770763A1 (de) 2007-04-04
SG123603A1 (en) 2006-07-26
EP1770760A1 (de) 2007-04-04
EP1094501B9 (de) 2007-10-31
EP1770762A1 (de) 2007-04-04
DE60045588D1 (de) 2011-03-10
EP1094501A2 (de) 2001-04-25
US6402401B1 (en) 2002-06-11
TW480555B (en) 2002-03-21
EP1094501B1 (de) 2007-02-28
US20020118973A1 (en) 2002-08-29
DE60033613T2 (de) 2007-11-08
US20030012575A1 (en) 2003-01-16
SG90184A1 (en) 2002-07-23
EP1770761B1 (de) 2009-12-30
SG123604A1 (en) 2006-07-26
EP1770760B1 (de) 2013-04-03
SG123602A1 (en) 2006-07-26
US6672779B2 (en) 2004-01-06
DE60033613D1 (de) 2007-04-12
DE60043628D1 (de) 2010-02-11
EP1770761A1 (de) 2007-04-04
EP1770762B1 (de) 2011-01-26
US6471422B2 (en) 2002-10-29
KR100634122B1 (ko) 2006-10-16
KR20010051079A (ko) 2001-06-25

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