EP1104061A3 - Halbleiterlaserfeld und optischer abtaster - Google Patents
Halbleiterlaserfeld und optischer abtaster Download PDFInfo
- Publication number
- EP1104061A3 EP1104061A3 EP00126100A EP00126100A EP1104061A3 EP 1104061 A3 EP1104061 A3 EP 1104061A3 EP 00126100 A EP00126100 A EP 00126100A EP 00126100 A EP00126100 A EP 00126100A EP 1104061 A3 EP1104061 A3 EP 1104061A3
- Authority
- EP
- European Patent Office
- Prior art keywords
- semiconductor laser
- laser array
- optical scanner
- mount
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title abstract 3
- 230000003287 optical effect Effects 0.000 title abstract 2
- 229910000679 solder Inorganic materials 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0235—Method for mounting laser chips
- H01S5/02355—Fixing laser chips on mounts
- H01S5/0237—Fixing laser chips on mounts by soldering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
- H01S5/4031—Edge-emitting structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0233—Mounting configuration of laser chips
- H01S5/0234—Up-side down mountings, e.g. Flip-chip, epi-side down mountings or junction down mountings
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Semiconductor Lasers (AREA)
- Mechanical Optical Scanning Systems (AREA)
- Laser Beam Printer (AREA)
- Facsimile Heads (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33844999 | 1999-11-29 | ||
| JP33844999A JP2001156379A (ja) | 1999-11-29 | 1999-11-29 | 半導体レーザアレイおよび光走査装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| EP1104061A2 EP1104061A2 (de) | 2001-05-30 |
| EP1104061A3 true EP1104061A3 (de) | 2002-11-13 |
| EP1104061B1 EP1104061B1 (de) | 2006-03-01 |
Family
ID=18318269
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP00126100A Expired - Lifetime EP1104061B1 (de) | 1999-11-29 | 2000-11-29 | Halbleiterlaserfeld und optischer Abtaster |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US6867796B1 (de) |
| EP (1) | EP1104061B1 (de) |
| JP (1) | JP2001156379A (de) |
| DE (1) | DE60026220T2 (de) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006313875A (ja) * | 2005-04-08 | 2006-11-16 | Mitsubishi Electric Corp | 半導体レーザ装置 |
| JP2009130206A (ja) | 2007-11-26 | 2009-06-11 | Mitsubishi Electric Corp | 半導体発光装置及びその製造方法 |
| US10297976B2 (en) * | 2015-05-19 | 2019-05-21 | Ii-Vi Laser Enterprise Gmbh | Low thermal resistance, stress-controlled diode laser assemblies |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61206286A (ja) * | 1985-03-09 | 1986-09-12 | Sony Corp | 半導体レ−ザ装置の製造方法 |
| JPS63131104A (ja) * | 1986-11-20 | 1988-06-03 | Nippon Telegr & Teleph Corp <Ntt> | ハイブリツド光集積回路 |
| US4916710A (en) * | 1988-06-27 | 1990-04-10 | Mitsubishi Denki Kabushiki Kaisha | Multi-point emission type semiconductor laser device therefor |
| JPH0918087A (ja) * | 1995-06-27 | 1997-01-17 | Nec Corp | マルチビーム半導体レーザ装置 |
| WO1997025641A2 (de) * | 1996-01-09 | 1997-07-17 | Siemens Aktiengesellschaft | Optoelektronische sendebaugruppe |
| EP0823760A2 (de) * | 1996-08-06 | 1998-02-11 | The Furukawa Electric Co., Ltd. | Vielfachhalbleiterlaseranordnung |
| JPH1039173A (ja) * | 1996-05-23 | 1998-02-13 | Ricoh Co Ltd | 光モジュール |
| JPH1048557A (ja) * | 1996-07-30 | 1998-02-20 | Canon Inc | 走査光学装置 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2539878B2 (ja) | 1988-02-12 | 1996-10-02 | 三菱電機株式会社 | レ―ザプリンタ用半導体レ―ザ装置の駆動方法 |
| JPH0522530A (ja) | 1991-07-17 | 1993-01-29 | Canon Inc | レーザ光源装置 |
| JP3377553B2 (ja) | 1993-05-13 | 2003-02-17 | 三菱電機株式会社 | 半導体レーザ装置 |
| JPH1158828A (ja) | 1997-08-14 | 1999-03-02 | Fuji Xerox Co Ltd | レーザアレイ画像形成装置 |
-
1999
- 1999-11-29 JP JP33844999A patent/JP2001156379A/ja active Pending
-
2000
- 2000-11-24 US US09/718,364 patent/US6867796B1/en not_active Expired - Fee Related
- 2000-11-29 EP EP00126100A patent/EP1104061B1/de not_active Expired - Lifetime
- 2000-11-29 DE DE60026220T patent/DE60026220T2/de not_active Expired - Lifetime
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61206286A (ja) * | 1985-03-09 | 1986-09-12 | Sony Corp | 半導体レ−ザ装置の製造方法 |
| JPS63131104A (ja) * | 1986-11-20 | 1988-06-03 | Nippon Telegr & Teleph Corp <Ntt> | ハイブリツド光集積回路 |
| US4916710A (en) * | 1988-06-27 | 1990-04-10 | Mitsubishi Denki Kabushiki Kaisha | Multi-point emission type semiconductor laser device therefor |
| JPH0918087A (ja) * | 1995-06-27 | 1997-01-17 | Nec Corp | マルチビーム半導体レーザ装置 |
| WO1997025641A2 (de) * | 1996-01-09 | 1997-07-17 | Siemens Aktiengesellschaft | Optoelektronische sendebaugruppe |
| JPH1039173A (ja) * | 1996-05-23 | 1998-02-13 | Ricoh Co Ltd | 光モジュール |
| JPH1048557A (ja) * | 1996-07-30 | 1998-02-20 | Canon Inc | 走査光学装置 |
| EP0823760A2 (de) * | 1996-08-06 | 1998-02-11 | The Furukawa Electric Co., Ltd. | Vielfachhalbleiterlaseranordnung |
Non-Patent Citations (4)
| Title |
|---|
| PATENT ABSTRACTS OF JAPAN vol. 011, no. 041 (E - 478) 6 February 1987 (1987-02-06) * |
| PATENT ABSTRACTS OF JAPAN vol. 012, no. 388 (P - 771) 17 October 1988 (1988-10-17) * |
| PATENT ABSTRACTS OF JAPAN vol. 1997, no. 05 30 May 1997 (1997-05-30) * |
| PATENT ABSTRACTS OF JAPAN vol. 1998, no. 06 30 April 1998 (1998-04-30) * |
Also Published As
| Publication number | Publication date |
|---|---|
| EP1104061A2 (de) | 2001-05-30 |
| DE60026220D1 (de) | 2006-04-27 |
| EP1104061B1 (de) | 2006-03-01 |
| DE60026220T2 (de) | 2006-11-16 |
| JP2001156379A (ja) | 2001-06-08 |
| US6867796B1 (en) | 2005-03-15 |
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