EP1111676A3 - Unterteil-Verbindungssubstrat für Elektronikteil - Google Patents

Unterteil-Verbindungssubstrat für Elektronikteil Download PDF

Info

Publication number
EP1111676A3
EP1111676A3 EP00127298A EP00127298A EP1111676A3 EP 1111676 A3 EP1111676 A3 EP 1111676A3 EP 00127298 A EP00127298 A EP 00127298A EP 00127298 A EP00127298 A EP 00127298A EP 1111676 A3 EP1111676 A3 EP 1111676A3
Authority
EP
European Patent Office
Prior art keywords
electronic parts
insulating substrate
substrate
connection terminals
mount
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP00127298A
Other languages
English (en)
French (fr)
Other versions
EP1111676A2 (de
Inventor
Shigetsugu Shinko Elec. Ind. Co. Ltd. Muramatsu
Takuya Shinko Elec. Ind. Co. Ltd. Kazama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Publication of EP1111676A2 publication Critical patent/EP1111676A2/de
Publication of EP1111676A3 publication Critical patent/EP1111676A3/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/10515—Stacked components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/9415—Dispositions of bond pads relative to the surface, e.g. recessed, protruding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
    • Y10T29/49135—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting and shaping, e.g., cutting or bending, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
EP00127298A 1999-12-22 2000-12-19 Unterteil-Verbindungssubstrat für Elektronikteil Withdrawn EP1111676A3 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP36477699A JP3681155B2 (ja) 1999-12-22 1999-12-22 電子部品の実装構造、電子部品装置、電子部品の実装方法及び電子部品装置の製造方法
JP36477699 1999-12-22

Publications (2)

Publication Number Publication Date
EP1111676A2 EP1111676A2 (de) 2001-06-27
EP1111676A3 true EP1111676A3 (de) 2003-10-01

Family

ID=18482641

Family Applications (1)

Application Number Title Priority Date Filing Date
EP00127298A Withdrawn EP1111676A3 (de) 1999-12-22 2000-12-19 Unterteil-Verbindungssubstrat für Elektronikteil

Country Status (3)

Country Link
US (1) US6628527B2 (de)
EP (1) EP1111676A3 (de)
JP (1) JP3681155B2 (de)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6713854B1 (en) 2000-10-16 2004-03-30 Legacy Electronics, Inc Electronic circuit module with a carrier having a mounting pad array
US7102892B2 (en) * 2000-03-13 2006-09-05 Legacy Electronics, Inc. Modular integrated circuit chip carrier
US7337522B2 (en) * 2000-10-16 2008-03-04 Legacy Electronics, Inc. Method and apparatus for fabricating a circuit board with a three dimensional surface mounted array of semiconductor chips
CN100369536C (zh) * 2001-03-14 2008-02-13 莱格西电子股份有限公司 制造具有三维半导体芯片阵列安装面的电路板的方法和装置
FR2834822B1 (fr) * 2002-01-11 2005-01-07 Novatec Sa Soc Interface monolithique d'interconnexion pour l'empilage de composants electroniques
JP2003243797A (ja) * 2002-02-19 2003-08-29 Matsushita Electric Ind Co Ltd モジュール部品
DE10227305A1 (de) * 2002-06-19 2003-09-04 Siemens Dematic Ag Elektrisches Mehrschicht-Bauelement-Modul und Verfahren zu dessen Herstellung
AU2003239739A1 (en) * 2002-07-04 2004-01-23 Koninklijke Philips Electronics N.V. Multi electric device package
US7087988B2 (en) * 2002-07-30 2006-08-08 Kabushiki Kaisha Toshiba Semiconductor packaging apparatus
FR2854759B1 (fr) * 2003-05-06 2005-07-08 Wavecom Module de radiocommunication realise sur un substrat de superficie superieure a celle de son boitier d'encapsulation, plateforme et dispositif de radiocommunication correspondants
JP2005268701A (ja) * 2004-03-22 2005-09-29 Matsushita Electric Ind Co Ltd 半導体装置、半導体装置の製造方法、これを用いた積層モジュールおよびその製造方法
JP2005340647A (ja) * 2004-05-28 2005-12-08 Nec Compound Semiconductor Devices Ltd インターポーザ基板、半導体パッケージ及び半導体装置並びにそれらの製造方法
JP3751625B2 (ja) 2004-06-29 2006-03-01 新光電気工業株式会社 貫通電極の製造方法
US7105918B2 (en) * 2004-07-29 2006-09-12 Micron Technology, Inc. Interposer with flexible solder pad elements and methods of manufacturing the same
CN101019464A (zh) * 2004-09-13 2007-08-15 奥迪康有限公司 具有封装电子元件的音频处理设备
US7435097B2 (en) * 2005-01-12 2008-10-14 Legacy Electronics, Inc. Radial circuit board, system, and methods
JP4934022B2 (ja) * 2005-03-17 2012-05-16 パナソニック株式会社 モジュール基板
JP2007103750A (ja) * 2005-10-06 2007-04-19 Murata Mfg Co Ltd 回路モジュール
US20110278725A1 (en) * 2007-01-31 2011-11-17 Nichepac Technology Inc. Stacking of transfer carriers with aperture arrays as interconnection joints
CN101315925A (zh) * 2007-05-28 2008-12-03 松下电器产业株式会社 电子器件内置模块及其制造方法
US8338267B2 (en) * 2007-07-11 2012-12-25 Sematech, Inc. Systems and methods for vertically integrating semiconductor devices
US20090086453A1 (en) * 2007-09-28 2009-04-02 Integrated Device Technology, Inc. Package with passive component support assembly
JP5112275B2 (ja) * 2008-12-16 2013-01-09 新光電気工業株式会社 半導体装置及び半導体装置の製造方法
JP5215244B2 (ja) * 2009-06-18 2013-06-19 新光電気工業株式会社 半導体装置
JP5510461B2 (ja) * 2010-04-13 2014-06-04 株式会社村田製作所 モジュール基板、及びモジュール基板の製造方法
EP2393345A1 (de) * 2010-05-04 2011-12-07 Vincotech Holdings S.a.r.l. Schaltungsträger mit Aussparung zum Aufnehmen elektronischer Bauteile, die mit einer Leiterplatine in Kontakt kommen
TW201306685A (zh) * 2011-07-28 2013-02-01 金綻科技股份有限公司 電路板模組之堆疊
CN104681510A (zh) * 2013-12-03 2015-06-03 晟碟信息科技（上海）有限公司 用于嵌入半导体裸片的桥结构
CN106304825B (zh) * 2015-06-24 2019-01-22 启碁科技股份有限公司 电子装置及雷达装置
CN109121294B (zh) * 2018-09-29 2020-09-18 维沃移动通信有限公司 电路板结构及电子设备
DE102019219238A1 (de) * 2019-12-10 2021-06-10 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Mehrlagiges 3D-Folienpackage
CN113727514A (zh) * 2021-08-26 2021-11-30 维沃移动通信有限公司 电路板组件和电子设备

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06151701A (ja) * 1992-11-09 1994-05-31 Sharp Corp 半導体装置の製造方法
US5531022A (en) * 1992-10-19 1996-07-02 International Business Machines Corporation Method of forming a three dimensional high performance interconnection package
US5629835A (en) * 1994-07-19 1997-05-13 Olin Corporation Metal ball grid array package with improved thermal conductivity
US5750417A (en) * 1994-04-15 1998-05-12 U.S. Philips Corporation Method of manufacturing a device having a support bar with conductor tracks for electrically contacting a semiconductor element
DE19842080A1 (de) * 1998-09-15 1999-12-09 Daimler Chrysler Ag Verfahren zur Herstellung einer Trägerplatte für Halbleiterchips und Leiterbahnen sowie Mehrebenen-Anordnung unter Verwendung einer solchen Trägerplatte

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69330450T2 (de) * 1992-08-05 2001-11-08 Fujitsu Ltd., Kawasaki Dreidimensionaler Multichipmodul
JPH09214097A (ja) 1996-02-06 1997-08-15 Toshiba Corp プリント回路基板
US5815374A (en) * 1996-09-30 1998-09-29 International Business Machines Corporation Method and apparatus for redirecting certain input/output connections of integrated circuit chip configurations
JPH10135267A (ja) 1996-10-30 1998-05-22 Oki Electric Ind Co Ltd 実装基板の構造及びその製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5531022A (en) * 1992-10-19 1996-07-02 International Business Machines Corporation Method of forming a three dimensional high performance interconnection package
JPH06151701A (ja) * 1992-11-09 1994-05-31 Sharp Corp 半導体装置の製造方法
US5750417A (en) * 1994-04-15 1998-05-12 U.S. Philips Corporation Method of manufacturing a device having a support bar with conductor tracks for electrically contacting a semiconductor element
US5629835A (en) * 1994-07-19 1997-05-13 Olin Corporation Metal ball grid array package with improved thermal conductivity
DE19842080A1 (de) * 1998-09-15 1999-12-09 Daimler Chrysler Ag Verfahren zur Herstellung einer Trägerplatte für Halbleiterchips und Leiterbahnen sowie Mehrebenen-Anordnung unter Verwendung einer solchen Trägerplatte

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 018, no. 461 (E - 1597) 26 August 1994 (1994-08-26) *

Also Published As

Publication number Publication date
US6628527B2 (en) 2003-09-30
EP1111676A2 (de) 2001-06-27
JP3681155B2 (ja) 2005-08-10
US20010005313A1 (en) 2001-06-28
JP2001185674A (ja) 2001-07-06

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