EP1144710A2 - Dispositif de depot en phase gazeuse par procede physique a faisceau electronique et panneau de commande associe - Google Patents

Dispositif de depot en phase gazeuse par procede physique a faisceau electronique et panneau de commande associe

Info

Publication number
EP1144710A2
EP1144710A2 EP00975181A EP00975181A EP1144710A2 EP 1144710 A2 EP1144710 A2 EP 1144710A2 EP 00975181 A EP00975181 A EP 00975181A EP 00975181 A EP00975181 A EP 00975181A EP 1144710 A2 EP1144710 A2 EP 1144710A2
Authority
EP
European Patent Office
Prior art keywords
electron beam
indicia
components
vapor deposition
adjacent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
EP00975181A
Other languages
German (de)
English (en)
Other versions
EP1144710A3 (fr
Inventor
Robert William Bruce
John Douglas Evans, Sr.
Antonio Frank Maricocchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Publication of EP1144710A2 publication Critical patent/EP1144710A2/fr
Publication of EP1144710A3 publication Critical patent/EP1144710A3/fr
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/28—Vacuum evaporation by wave energy or particle radiation
    • C23C14/30—Vacuum evaporation by wave energy or particle radiation by electron bombardment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
    • C23C14/566—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases using a load-lock chamber

Definitions

  • This invention generally relates to an electron beam physical vapor deposition (EBPVD) coating apparatus. More particularly, this invention is directed to such a coating apparatus equipped with a control panel that enables information regarding the operating status of an EBPVD coating apparatus to be quickly and accurately noted, and allows the operator to make appropriate manual changes or adjustments to the apparatus and the coating process .
  • EBPVD electron beam physical vapor deposition
  • Thermal barrier coatings have found wide use for thermally insulating the exterior surfaces of high-temperature gas turbine components in order to minimize the service temperatures of such components.
  • Various ceramic materials have been employed as the TBC, particularly zirconia (Zr0 2 ) stabilized by yttria (Y 2 0 3 ) , magnesia (MgO) or other oxides.
  • Zr0 2 zirconia
  • Y 2 0 3 yttria
  • MgO magnesia
  • These particular materials are widely employed in the art because they can be readily deposited by plasma spray and vapor deposition techniques.
  • An example of the latter is electron beam physical vapor deposition (EBPVD) , which produces a thermal barrier coating having a columnar grain structure that is able to expand with its underlying substrate without causing damaging stresses that lead to spallation, and therefore exhibits enhanced strain tolerance.
  • EBPVD electron beam physical vapor deposition
  • Processes for producing TBC by EBPVD generally entail preheating a component to an acceptable coating temperature, and then inserting the component into a heated coating chamber maintained at a low pressure, typically about 0.005 mbar.
  • the component is supported in proximity to an ingot of the ceramic coating material (e.g., YSZ) , and an electron beam is projected onto the ingot so as to melt the surface of the ingot and produce a vapor of the coating material that deposits onto the component.
  • the temperature range within which EBPVD processes can be performed depends in part on the compositions of the component and the coating material. A minimum process temperature is generally established to ensure the coating material will suitably evaporate and deposit on the component, while a maximum process temperature is generally established to avoid microstructural damage to the article.
  • the present invention is an electron beam physical vapor deposition (EBPVD) apparatus for producing a coating (e.g., a ceramic thermal barrier coating) on an article.
  • the EBPVD apparatus of this invention generally includes a coating chamber that is operable at an elevated temperature (e.g., at least 800°C) and a subatmospheric pressure (e.g., between 10 "3 mbar and 5xl0 "2 mbar) .
  • An electron beam (EB) gun is used to project an electron beam into the coating chamber and onto a coating material within the chamber. The EB gun is operated to melt and evaporate the coating material.
  • the operation of the EBPVD apparatus can be enhanced through the use of a control panel by which certain components of the apparatus can be monitored and controlled.
  • the control panel includes a schematic of at least a portion of the apparatus and its components, with indicia of the components, visual indicators associated with the indicia for indicating the operating status of the components, and controls associated with the indicia and adjacent the visual indicators for changing the operation of the corresponding component of the EBPVD apparatus .
  • components that are preferably monitored and controlled with the panel include the EB gun and those components that determine the vacuum levels and coolant flows through the EBPVD apparatus.
  • Figures 1 and 2 are schematic top and front views, respectively, of an electron beam physical vapor deposition apparatus.
  • Figure 3 shows a control panel for monitoring and controlling the operation of the apparatus of Figures 1 and 2.
  • FIG. 1 An EBPVD apparatus 10 in accordance with this invention is generally depicted in Figures 1 and 2.
  • a ceramic thermal barrier coating can be deposited on a metal component intended for operation within a thermally hostile environment.
  • Notable examples of such components include the high and low pressure turbine nozzles and blades, shrouds, combustor liners and augmentor hardware of gas turbine engines .
  • the EBPVD apparatus 10 is shown in Figures 1 and 2 as including a coating chamber 12, preheat chambers 14, and two pairs of loading chambers 16 and 18, so that the apparatus 10 has a symmetrical configuration.
  • the loading chambers 16 are shown as being aligned with their respective preheat chambers 14, with parts 20 originally loaded on rakes 22 within the chambers 16 having been transferred to the preheat chambers 14 and, as depicted in Figure 1, into the coating chamber 12.
  • Ingots 26 of the desired coating material are shown as being loaded in channels 104 of a magazine 102, and then fed into the coating chamber 12 from beneath the coating chamber 12.
  • the loading chambers 16 and 18 are shown mounted on low-profile movable platforms 24, so that paired loading chambers 16 and 18 can be selectively aligned with the preheat chamber 14. For example, when the front lefthand loading chamber 16 is brought into alignment with the lefthand preheat chamber 14 to allow the parts 20 to be inserted into the coating chamber 12, the rear lefthand loading chamber 18 is set back from the lefthand preheat chamber 14, so that parts can be simultaneously loaded or unloaded from the rake 22 of the rear lefthand loading chamber 18.
  • the platforms 24 are shown as being at least in part supported on roller bearings 44 mounted in the floor, though it is foreseeable that a variety of bearings could be used.
  • the loading chambers 16 and 18 are equipped with loading doors 40 through which parts are loaded onto the rakes 22.
  • the loading chambers 16 and 18 are also equipped with access doors 42 to motion drives
  • the parts 20 supported on the rakes 22 are preferably rotated and/or oscillated within the coating chamber 12 in order to promote the desired coating distribution around the parts 20.
  • the access doors 42 allow the operator of the apparatus 10 to quickly adjust or change the settings of the motion drives 46 without interfering with loading and unloading of parts from the loading chambers 16 and 18.
  • Coating is performed within the coating chamber
  • the walls and certain other components of the coating chamber 12, including crucibles used to contain the molten coating material, are often fluid-cooled to minimize the rate at which the temperature within the coating chamber 12 rises during a coating campaign.
  • the pressure within the coating chamber 12 is controlled by the rate at which gases can be pumped from the chamber 12, and the flow rate into the chamber 12 of desired gases, such as oxygen and argon.
  • gases are shown as being introduced into the coating chamber 12 through a valve 58 located near the coating chamber 12.
  • the flow rates of the gases are individually controlled based on the targeted process pressure and oxygen partial pressure.
  • cryogenic and diffusion pumps 32 and 34 of types known in the art can be employed to evacuate the coating chamber 12 prior to and during the deposition process.
  • a pair of diffusion pumps 38 are shown as being employed to evacuate the preheat chambers 14.
  • the diffusion pump 34 for the coating chamber 12 may be modified with a throttle valve 36 to regulate the operation of the pump 34 at relatively high pressures, e.g., above 0.010 mbar.
  • FIG. 3 Shown in Figure 3 is a portion of a preferred control panel 118 for controlling and monitoring EBPVD apparatuses of the type shown in Figures 1 and 2.
  • the control panel 118 is shown as including a schematic of a portion of the EBPVD apparatus 10 and its support systems, including indicia 120 for individual components and systems.
  • visual readouts 122 are located adjacent the indicia 120 for indicating the operating status of the components represented by the indicia.
  • controls 124 are included within the schematic by which the operation of the corresponding components can be adjusted based on the status indicated by the readouts 122.
  • the panel 118 shown in Figure 3 information regarding the operating status of the EBPVD apparatus 10 can be quickly and accurately noted to allow the operator to make any appropriate adjustments to the apparatus 10 and the coating process.
  • components that are of particular interest for monitoring and controlling with the panel 118 include the EB guns 30, those components that indicate and control the vacuum levels within the coating chamber 12, such as the pumps 32 and 34 and the gas valve 58, and those components that indicate and control the cooling flows through the EBPVD apparatus.
  • Readouts 122 in the form of actuation lights preferably indicate the operating status of the EB guns 30.
  • the locations of the parts 20 within the chambers 12, 14 and 16 are also preferably indicated with actuation lights to allow manual control with switches 124.
  • actuation lights and switches 124 are preferably provided to indicate and control the positions of the valves that set cooling flows and the positions of the valves that control evacuation of the chambers 12, 14 and 16 with the mechanical pumps, cryogenic pump 32, and diffusion pumps 34 and 38.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

L'invention concerne un dispositif (10) de dépôt en phase vapeur par procédé physique à faisceau électronique, qui permet de produire un dépôt sur un article (20). Le dispositif (10) comprend généralement une chambre de dépôt (12) qui peut être utilisée à des températures élevées et à des pressions subatmosphériques. Un canon électronique (30) projette un faisceau électronique (28) dans la chambre de dépôt (12) et sur un matériau de dépôt (26) placé à l'intérieur de la chambre (12), ce qui provoque la fonte et l'évaporation du matériau de dépôt (26). Le fonctionnement du dispositif de l'invention (10) est amélioré grâce à un panneau de commande (118)au moyen duquel les éléments du dispositif (10) peuvent être surveillés et commandés. Le panneau de commande (118) comprend un schéma du dispositif (10) et de ses éléments, ainsi que les repères (120) des éléments, des indicateurs visuels associés aux repères (120), qui permettent d'indiquer l'état de fonctionnement des éléments, et des commandes (124) associées aux repères (120) et adjacentes aux indicateurs visuels, qui sont destinées à modifier le fonctionnement de l'élément correspondant du dispositif de l'invention (10).
EP00975181A 1999-08-04 2000-08-03 Dispositif de depot en phase gazeuse par procede physique a faisceau electronique et panneau de commande associe Ceased EP1144710A3 (fr)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US621754 1990-12-04
US14722999P 1999-08-04 1999-08-04
US147229P 1999-08-04
US62175400A 2000-07-24 2000-07-24
PCT/US2000/021131 WO2001011103A2 (fr) 1999-08-04 2000-08-03 Dispositif de depot en phase gazeuse par procede physique a faisceau electronique et panneau de commande associe

Publications (2)

Publication Number Publication Date
EP1144710A2 true EP1144710A2 (fr) 2001-10-17
EP1144710A3 EP1144710A3 (fr) 2001-12-05

Family

ID=26844713

Family Applications (1)

Application Number Title Priority Date Filing Date
EP00975181A Ceased EP1144710A3 (fr) 1999-08-04 2000-08-03 Dispositif de depot en phase gazeuse par procede physique a faisceau electronique et panneau de commande associe

Country Status (4)

Country Link
EP (1) EP1144710A3 (fr)
JP (1) JP2003522291A (fr)
UA (1) UA73725C2 (fr)
WO (1) WO2001011103A2 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114364824A (zh) * 2019-08-30 2022-04-15 应用材料公司 电子束pvd终点检测和闭环工艺控制系统

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3141901B2 (ja) * 1992-06-12 2001-03-07 横河電機株式会社 グラフィック表示装置
US5534314A (en) * 1994-08-31 1996-07-09 University Of Virginia Patent Foundation Directed vapor deposition of electron beam evaporant
JPH1011133A (ja) * 1996-06-20 1998-01-16 Hitachi Ltd プラント監視画面作成方法、プラント監視画面作成装置、プラント監視方法、プラント監視装置
JPH10171531A (ja) * 1996-12-10 1998-06-26 Toshiba Corp プラント監視表示装置
JPH10237646A (ja) * 1997-02-28 1998-09-08 Asahi Optical Co Ltd 光学薄膜製造システム

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO0111103A2 *

Also Published As

Publication number Publication date
WO2001011103A2 (fr) 2001-02-15
EP1144710A3 (fr) 2001-12-05
UA73725C2 (uk) 2005-09-15
JP2003522291A (ja) 2003-07-22
WO2001011103A3 (fr) 2001-08-16

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