EP1144725A2 - Verfahren zur beschichtung von reaktoren für die hochdruckpolymerisation von 1-olefinen - Google Patents
Verfahren zur beschichtung von reaktoren für die hochdruckpolymerisation von 1-olefinenInfo
- Publication number
- EP1144725A2 EP1144725A2 EP99965554A EP99965554A EP1144725A2 EP 1144725 A2 EP1144725 A2 EP 1144725A2 EP 99965554 A EP99965554 A EP 99965554A EP 99965554 A EP99965554 A EP 99965554A EP 1144725 A2 EP1144725 A2 EP 1144725A2
- Authority
- EP
- European Patent Office
- Prior art keywords
- metal
- layer
- nickel
- reactor
- polymer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 37
- 238000000576 coating method Methods 0.000 title claims abstract description 16
- 239000011248 coating agent Substances 0.000 title claims abstract description 14
- 229910052751 metal Inorganic materials 0.000 claims abstract description 26
- 239000002184 metal Substances 0.000 claims abstract description 26
- 229920000642 polymer Polymers 0.000 claims abstract description 26
- 239000004815 dispersion polymer Substances 0.000 claims abstract description 20
- 230000008569 process Effects 0.000 claims abstract description 19
- 239000003792 electrolyte Substances 0.000 claims abstract description 10
- 239000008151 electrolyte solution Substances 0.000 claims abstract description 10
- 239000003638 chemical reducing agent Substances 0.000 claims abstract description 9
- 238000006116 polymerization reaction Methods 0.000 claims description 26
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims description 22
- 239000005977 Ethylene Substances 0.000 claims description 20
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 14
- -1 polytetrafluoroethylene Polymers 0.000 claims description 14
- 239000006185 dispersion Substances 0.000 claims description 13
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 13
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 13
- 229910052759 nickel Inorganic materials 0.000 claims description 6
- 239000012798 spherical particle Substances 0.000 claims description 5
- ACVYVLVWPXVTIT-UHFFFAOYSA-M phosphinate Chemical compound [O-][PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-M 0.000 claims description 4
- 238000007334 copolymerization reaction Methods 0.000 claims description 3
- 150000002815 nickel Chemical class 0.000 claims description 3
- 239000012266 salt solution Substances 0.000 claims description 3
- OFNHPGDEEMZPFG-UHFFFAOYSA-N phosphanylidynenickel Chemical compound [P].[Ni] OFNHPGDEEMZPFG-UHFFFAOYSA-N 0.000 claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- RIRXDDRGHVUXNJ-UHFFFAOYSA-N [Cu].[P] Chemical compound [Cu].[P] RIRXDDRGHVUXNJ-UHFFFAOYSA-N 0.000 claims 1
- 229910052783 alkali metal Inorganic materials 0.000 claims 1
- 150000001340 alkali metals Chemical class 0.000 claims 1
- QDWJUBJKEHXSMT-UHFFFAOYSA-N boranylidynenickel Chemical compound [Ni]#B QDWJUBJKEHXSMT-UHFFFAOYSA-N 0.000 claims 1
- FZQBLSFKFKIKJI-UHFFFAOYSA-N boron copper Chemical compound [B].[Cu] FZQBLSFKFKIKJI-UHFFFAOYSA-N 0.000 claims 1
- ZADPBFCGQRWHPN-UHFFFAOYSA-N boronic acid Chemical compound OBO ZADPBFCGQRWHPN-UHFFFAOYSA-N 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 238000011065 in-situ storage Methods 0.000 claims 1
- 239000000126 substance Substances 0.000 abstract description 8
- 238000012856 packing Methods 0.000 abstract 1
- 229920002959 polymer blend Polymers 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 29
- 238000000151 deposition Methods 0.000 description 13
- 230000008021 deposition Effects 0.000 description 13
- 229940058401 polytetrafluoroethylene Drugs 0.000 description 11
- 239000000243 solution Substances 0.000 description 10
- 238000006243 chemical reaction Methods 0.000 description 7
- 239000000203 mixture Substances 0.000 description 7
- 239000002826 coolant Substances 0.000 description 6
- 229940021013 electrolyte solution Drugs 0.000 description 6
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 5
- 239000003599 detergent Substances 0.000 description 5
- 230000017525 heat dissipation Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 229910052698 phosphorus Inorganic materials 0.000 description 5
- 239000011574 phosphorus Substances 0.000 description 5
- 229920000573 polyethylene Polymers 0.000 description 5
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 4
- 101100117236 Drosophila melanogaster speck gene Proteins 0.000 description 4
- 229920001577 copolymer Polymers 0.000 description 4
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 3
- 239000004698 Polyethylene Substances 0.000 description 3
- 238000000137 annealing Methods 0.000 description 3
- 238000007654 immersion Methods 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 2
- AFFLGGQVNFXPEV-UHFFFAOYSA-N 1-decene Chemical compound CCCCCCCCC=C AFFLGGQVNFXPEV-UHFFFAOYSA-N 0.000 description 2
- LIKMAJRDDDTEIG-UHFFFAOYSA-N 1-hexene Chemical compound CCCCC=C LIKMAJRDDDTEIG-UHFFFAOYSA-N 0.000 description 2
- KWKAKUADMBZCLK-UHFFFAOYSA-N 1-octene Chemical compound CCCCCCC=C KWKAKUADMBZCLK-UHFFFAOYSA-N 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 2
- 229910000990 Ni alloy Inorganic materials 0.000 description 2
- 229920001774 Perfluoroether Polymers 0.000 description 2
- NBBJYMSMWIIQGU-UHFFFAOYSA-N Propionic aldehyde Chemical compound CCC=O NBBJYMSMWIIQGU-UHFFFAOYSA-N 0.000 description 2
- 150000001336 alkenes Chemical class 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- 150000001735 carboxylic acids Chemical class 0.000 description 2
- 238000005234 chemical deposition Methods 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 description 2
- 229920001684 low density polyethylene Polymers 0.000 description 2
- 239000004702 low-density polyethylene Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- YWAKXRMUMFPDSH-UHFFFAOYSA-N pentene Chemical compound CCCC=C YWAKXRMUMFPDSH-UHFFFAOYSA-N 0.000 description 2
- 230000000737 periodic effect Effects 0.000 description 2
- 150000002978 peroxides Chemical class 0.000 description 2
- 235000019260 propionic acid Nutrition 0.000 description 2
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000005496 tempering Methods 0.000 description 2
- DFQUBYCHLQAFOW-IHWYPQMZSA-N (z)-4-(methylamino)-4-oxobut-2-enoic acid Chemical compound CNC(=O)\C=C/C(O)=O DFQUBYCHLQAFOW-IHWYPQMZSA-N 0.000 description 1
- OYPIGFUBEOGSBR-UHFFFAOYSA-N 1-(1,2,2-trifluoroethenoxy)propane Chemical compound CCCOC(F)=C(F)F OYPIGFUBEOGSBR-UHFFFAOYSA-N 0.000 description 1
- 229910000521 B alloy Inorganic materials 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 1
- KRKNYBCHXYNGOX-UHFFFAOYSA-K Citrate Chemical compound [O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O KRKNYBCHXYNGOX-UHFFFAOYSA-K 0.000 description 1
- 229930182843 D-Lactic acid Natural products 0.000 description 1
- JVTAAEKCZFNVCJ-UWTATZPHSA-N D-lactic acid Chemical compound C[C@@H](O)C(O)=O JVTAAEKCZFNVCJ-UWTATZPHSA-N 0.000 description 1
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical class S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- 229910001096 P alloy Inorganic materials 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 1
- 239000012190 activator Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 150000001335 aliphatic alkanes Chemical class 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 229910001515 alkali metal fluoride Inorganic materials 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000000181 anti-adherent effect Effects 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- ZTQSAGDEMFDKMZ-UHFFFAOYSA-N butyric aldehyde Natural products CCCC=O ZTQSAGDEMFDKMZ-UHFFFAOYSA-N 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 description 1
- 150000001990 dicarboxylic acid derivatives Chemical class 0.000 description 1
- 150000001991 dicarboxylic acids Chemical class 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 150000002222 fluorine compounds Chemical class 0.000 description 1
- 229920002313 fluoropolymer Polymers 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 239000003779 heat-resistant material Substances 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000004310 lactic acid Substances 0.000 description 1
- 235000014655 lactic acid Nutrition 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 125000005397 methacrylic acid ester group Chemical group 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- TVMXDCGIABBOFY-UHFFFAOYSA-N n-Octanol Natural products CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000151 polyglycol Polymers 0.000 description 1
- 239000010695 polyglycol Substances 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 239000012429 reaction media Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 230000002269 spontaneous effect Effects 0.000 description 1
- 230000000638 stimulation Effects 0.000 description 1
- 150000005621 tetraalkylammonium salts Chemical class 0.000 description 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- 230000007306 turnover Effects 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F19/00—Preventing the formation of deposits or corrosion, e.g. by using filters or scrapers
- F28F19/02—Preventing the formation of deposits or corrosion, e.g. by using filters or scrapers by using coatings, e.g. vitreous or enamel coatings
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F19/00—Preventing the formation of deposits or corrosion, e.g. by using filters or scrapers
- F28F19/02—Preventing the formation of deposits or corrosion, e.g. by using filters or scrapers by using coatings, e.g. vitreous or enamel coatings
- F28F19/06—Preventing the formation of deposits or corrosion, e.g. by using filters or scrapers by using coatings, e.g. vitreous or enamel coatings of metal
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1614—Process or apparatus coating on selected surface areas plating on one side
- C23C18/1616—Process or apparatus coating on selected surface areas plating on one side interior or inner surface
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1655—Process features
- C23C18/1662—Use of incorporated material in the solution or dispersion, e.g. particles, whiskers, wires
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
- C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2245/00—Coatings; Surface treatments
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
- Y10T428/12556—Organic component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12944—Ni-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
Definitions
- the invention relates to a method for coating reactors for the high-pressure polymerization of 1-olefins. Furthermore, this invention relates to reactors and high-pressure reactor systems for the polymerization or copolymerization of 1-olefins, in particular ethylene, containing the reactors coated according to the invention, and to a process for producing ethylene homo- and copolymers in the reactors according to the invention.
- High-pressure ethylene is a large-scale industrial process. In this process, pressures above 500 bar and temperatures of 150 ° C and higher are used. The process is generally carried out in high-pressure autoclaves or in tubular reactors. High-pressure autoclaves are known in so-called compact or elongated embodiments. The well-known tubular reactors (Ulimann's Encyclopedia of Technical Chemistry, Volume 19, p. 169 and p. 173 ff (1980), Verlag Chemie Weinheim, Deerfield Beach, Basel) are characterized by simple handling and low maintenance and are different from stirred autoclaves advantageous. The sales achievable in the above mentioned devices are limited.
- the limitation is the polymerization temperature and the polymerization pressure, which have a specific upper limit depending on the product type. For low-density LDPE waxes and LDPE polymers, this upper limit is approx. 330 ° C; Above this, spontaneous decomposition of ethylene can occur. Below a temperature of 150 ° C there can be problems with heat dissipation. Furthermore, the pressure loss that occurs is limiting; this pressure loss increases with falling temperature.
- a cooling medium generally water
- the temperature of the cooling medium is very important. At cooling medium temperatures below 150 ° C, a laminar layer of polyethylene can form, which acts as an insulator and can drastically reduce heat dissipation. If the temperature of the cooling medium is too high selected, the temperature difference between the reaction medium and the cooling medium is too small, which also leads to unsatisfactory heat transfer numbers (see, for example, E. Fitzer, W. Fritz, Chemische Christstechnik, 2nd edition, page 152 ff., 5 Springer Verlag Heidelberg, 1982) .
- 25 reactors are usually of high molecular weight, which can be seen macroscopically in the formation of so-called specks.
- Material containing specks has less good mechanical properties, however, since it forms predetermined cracks in the material at which material failure occurs, and is also disadvantageous in terms of the visual impression.
- PTFE polytetrafluoroethylene
- a method for coating a reactor has now been found, characterized in that a metal layer or a metal-polymer dispersion layer is electrolessly deposited on the inside of the reactor of a reactor for the high-pressure polymerization of ethylene by the surfaces being coated with a metal -electro- lyt solution contacted, which in addition to the metal electrolyte contains a reducing agent and optionally a halogenated polymer to be separated in dispersed form.
- reactors coated according to the invention for the high-pressure polymerization of ethylene were found.
- the reactors according to the invention were used for the high-pressure polymerization of ethylene and a process for the high-pressure polymerization of ethylene was found.
- reactors coated with an anti-adhesive metal coating or metal-polymer dispersion layer enable a significantly improved conversion compared to non-coated reactors.
- This inventive solution to the problem is based on a method for electroless chemical deposition of metal layers or metal-polymer dispersion phases, which is known per se (W. Riedel: Functional Nickel Plating, Verlag Eugen Leize, Saulgau, 1989, pages 231 to 236, ISBN 3 -750480-044-x).
- the deposition of the metal layer or the metal-polymer dispersion phases serves to coat the inner walls of the high-pressure reactor known per se.
- the metal layer to be deposited by the method according to the invention comprises an alloy or alloy-like mixed phase composed of a metal and at least one further element.
- the metal-polymer dispersion phases according to the invention additionally comprise a polymer, in the context of the invention a halogenated polymer, which is present in the metal layer is dispersed.
- the metal alloy is preferably a metal-boron alloy or a metal-phosphorus alloy with a boron or phosphorus content of 0.5 to 15% by weight.
- a particularly preferred embodiment of the coatings according to the invention is a so-called “chemical nickel system”, that is to say phosphorus-containing nickel alloys with a phosphorus content of 0.5 to 15% by weight; particularly preferred are high phosphorus-containing nickel alloys with 5 to 12% by weight.
- chemical or autocatalytic deposition of metal phosphorus or metal boron does not provide the electrons required for this through an external power source, but rather through chemical conversion in the electrolyte itself (oxidation of a reducing agent).
- the coating is carried out, for example, by immersing the workpiece in a metal electrolyte solution which has been mixed beforehand with a stabilized polymer dispersion.
- metal electrolyte solutions are usually used as metal electrolyte solutions, to which the following components are added in addition to the electrolyte: a reducing agent such as a hypophosphite or boranate (for example NaBH 4 ), a buffer mixture for adjusting the pH Wert, an alkali metal fluoride such as NaF, KF or LiF, carboxylic acids and a deposition moderator such as Pb 2+ .
- a reducing agent such as a hypophosphite or boranate (for example NaBH 4 )
- a buffer mixture for adjusting the pH Wert for example NaBH 4
- an alkali metal fluoride such as NaF, KF or LiF
- carboxylic acids carboxylic acids
- a deposition moderator such as Pb 2+
- Ni 2+ , hypophosphite, carboxylic acids and fluoride and, if appropriate, deposition moderators such as Pb 2+ are particularly preferably used.
- Such solutions are sold, for example, by Riedel, Galvano- und Filtertechnik GmbH, Halle, Westphalia and Atotech GmbH, Berlin.
- Particularly preferred are solutions which have a pH around 5 and about 27 g / 1 NiS0-6 H 2 0 and about 21 g / 1 NaH 2 P ⁇ 2 -H 2 0 with a PTFE content of 1 to 25 g / 1 included.
- the optionally used halogenated polymer of the process according to the invention is preferably fluorinated.
- suitable fluorinated polymers are polytetrafluoroethylene, perfluoroalkoxy polymers (PFA, for example with C - to C 8 -alkoxy units),
- PTFE dispersions polytetrafluorethylene dispersions
- PTFE dispersions with a solids content of 35 to 60% by weight and an average particle diameter of 0.05 to 1.2 ⁇ m, in particular 0.1 to 0.3 ⁇ m, are preferably used.
- Spherical particles are preferably used because the use of spherical particles leads to very homogeneous composite layers. The advantage of using spherical particles is faster layer growth and better, in particular longer, thermal stability of the baths, both of which offer economic advantages. This can be seen particularly clearly in comparison to systems using irregular polymer particles which are obtained by grinding the corresponding polymer.
- the dispersions used can be a nonionic detergent (for example polyglycols, alkylphenol ethoxylate or, if appropriate, mixtures of the substances mentioned, 80 to 120 g of neutral detergent per liter) or an ionic detergent (for example alkyl and haloalkylsulfonates, alkylbenzenesulfonates, Alkylphenol ether sulfates, tetraalkylammonium salts or optionally mixtures of the substances mentioned, 15 to 60 g of ionic detergent per liter) to stabilize the dispersion.
- a nonionic detergent for example polyglycols, alkylphenol ethoxylate or, if appropriate, mixtures of the substances mentioned, 80 to 120 g of neutral detergent per liter
- an ionic detergent for example alkyl and haloalkylsulfonates, alkylbenzenesulfonates, Alkylphenol ether sulfates, tetraalkylam
- Coating is carried out at a slightly elevated temperature which, however, must not be so high that the dispersion is destabilized. Temperatures of 40 to 95 ° C have proven to be suitable. Temperatures of 80 to 91 ° C. are preferred and 88 ° C. is particularly preferred.
- Deposition rates of 1 to 15 ⁇ m / h have proven to be useful.
- the deposition speed can be influenced as follows by the composition of the immersion baths:
- the deposition rate is increased by higher temperatures, there being a maximum temperature which is limited, for example, by the stability of the optionally added polymer dispersion.
- the separation speed is reduced by lower temperatures.
- the deposition rate is increased by higher electrolyte concentrations and reduced by lower ones; where concentrations of 1 g / 1 to 20 g / 1 Ni 2+ are useful, concentrations of 4 g / 1 to 10 g / 1 are preferred; for Cu 2+ 1 g / 1 to 50 g / 1 are advisable.
- the deposition rate can also be increased by higher concentrations of reducing agent;
- the rate of separation can be increased by increasing the pH. It is preferred to set a pH between 3 and 6, particularly preferably between 4 and 5.5.
- activators such as alkali fluorides, for example NaF or KF, increases the rate of separation.
- the polymer content of the dispersion coating is mainly influenced by the amount of polymer dispersion added and the choice of detergents.
- the concentration of the polymer plays the greater role here; high polymer concentrations of
- Immersion baths lead to a disproportionately high proportion of polymer in the metal-phosphorus-polymer dispersion layer or metal-boron-polymer dispersion layer.
- the surfaces treated according to the invention enable good heat transfer, although the coatings can have a not inconsiderable thickness of 1 to 100 ⁇ m. 3 to 20 ⁇ m, in particular 5 to 16 ⁇ m, are preferred.
- the polymer content of the dispersion coating is 5 to 30% by volume, preferably 15 to 25% by volume, and 19 to 21% by volume is particularly preferred.
- the surfaces treated according to the invention also have excellent durability.
- the tempering period is generally 5 minutes to 3 hours, preferably 35 to 60 minutes.
- Another object of the present invention is a method for producing a coated reactor which has a particularly adhesive, durable and heat-resistant coating and therefore achieves the object of the invention in a special way.
- This method is characterized in that a 1 to 15 ⁇ m, preferably 1 to 5 ⁇ m thick, metal-phosphor layer is additionally applied by electroless chemical deposition before the metal-polymer dispersion layer is applied.
- the electroless chemical application of a 1 to 15 ⁇ m thick metal-phosphor layer to improve the adhesion is again carried out using metal electrolyte baths, to which, however, no stabilized polymer dispersion is added in this case.
- metal electrolyte baths to which, however, no stabilized polymer dispersion is added in this case.
- For tempering is preferably dispensed with at this time, since this generally has a negative effect on the adhesiveness of the subsequent metal-polymer dispersion layer.
- the workpiece is placed in a second immersion bath which, in addition to the metal electrolyte, also comprises a stabilized polymer dispersion. This forms the metal-polymer dispersion layer.
- Annealing is then preferably carried out at 100 to 450 ° C., in particular at 315 to 400 ° C.
- the annealing time is generally 5 minutes to 3 hours, preferably 35 to 45 minutes.
- tubular reactors are used as reactors for the high-pressure polymerization of ethylene, tubular reactors being preferred.
- Tubular reactors can be coated particularly well by a preferred variant of the process according to the invention, by pumping the metal-electrolyte solution or the metal-electrolyte-polymer dispersion mixture through the reactor to be coated.
- the coated tubes according to the invention can be easily installed in polymerization plants for high-pressure polymerization and non-coated tubes can be replaced in the process.
- the ethylene polymerization in the plants according to the invention which contain the tubes according to the invention, usually takes place at temperatures from 400 to 6000 bar, preferably from 500 to 5000 bar and particularly preferably 1000 to 3500 bar.
- the reaction temperature is 150 to 450 ° C, preferably 160 to 250 ° C.
- Ethylene is particularly suitable as a monomer in the polymerization process according to the invention. It is also possible to prepare copolymers with ethylene, in principle all olefins which can be copolymerized with ethylene by free radicals are suitable as comonomers. Are preferred
- 1-olefins such as propylene, 1-butene, 1-pentene, 1-hexene, 1-octene and 1-decene,
- Acrylates such as acrylic acid, acrylic acid methyl ester, acrylic acid ethyl ester, acrylic acid n-butyl ester or acrylic acid tert. -butyl ester; Methacrylic acid, methacrylic acid methyl ester, methyl methacrylate, methacrylic acid n-butyl ester or methacrylic acid ester. -butyl ester;
- Vinyl carboxylates vinyl acetate being particularly preferred
- Unsaturated dicarboxylic acid derivatives maleic anhydride and maleic alkylimides such as maleic acid methylimide are particularly preferred.
- Hydrogen, aliphatic aldehydes, ketones, CH-acidic compounds such as mercaptans or alcohols, olefins and alkanes are suitable as molecular weight regulators.
- the polymerization can be started with oxygen-containing gases such as air, but also with organic peroxo compounds or with organic azo compounds such as AIBN (azobisisobutyronitrile).
- organic peroxo compounds are preferred, with benzoyl peroxide and di-tert-butyl peroxide being particularly preferred.
- the polymers of ethylene produced by the process according to the invention can have very different molar masses depending on the reaction conditions.
- Preferred molar masses M w are between 500 and 600,000 g.
- the low number of specks which is usually specified in the form of a speck grade, is particularly advantageous in the ethylene polymers prepared according to the invention, a low speck grade usually corresponding to a low number of specks.
- the polymers produced according to the invention are particularly suitable for the production of moldings and flat structures, such as films or bags.
- the removed reactor tube (length 150 m, diameter 15 mm) was contacted at a temperature of 88 ° C with an aqueous Nikkeisalzates, the solution the following Composition had: 27 g / 1 NiS0 4 -6 H 2 0, 21 g / 1 NaH 2 P0-2 H 2 0, lactic acid CH 3 CHOHC0 2 H 20 g / 1, propionic acid C 2 H 5 C0 2 H 3 g / 1, Na citrate 5 g / 1, NaF 1 g / 1 (Note: Electroless nickel electrolyte solutions of this and other concentrations are commercially available, for example from Riedel Galvano- und Filtertechnik GmbH, Halle, Westphalia; or from Atotech Kunststoff GmbH, Berlin) ) .
- the pH was 4.8. To achieve uniform layer thicknesses, the solution was pumped through the pipe at a flow rate of 0.1 m / s. At a deposition speed of 12 ⁇ m / h, the process is finished after 75 min. The layer thickness achieved was 16 ⁇ m. The coated tube was then rinsed with water, dried and annealed at 400 ° C. for one hour.
- the removed reactor tube (length 150 m, diameter 15 mm) was contacted at a temperature of 88 ° C. with an aqueous nickel salt solution, the solution having the following composition: 27 g / 1
- the pH was 4.8.
- the solution was pumped through the pipe at a flow rate of 0.1 m / s. At a deposition rate of 12 ⁇ m / h, 25 min. worked to get the achieved layer thickness of 5 microns.
- the nickel salt solution was then additionally mixed with 1% by volume of a PTFE dispersion with a density of 1.5 g / ml.
- This PTFE dispersion contained 50% by weight solids.
- the process was finished in two hours (layer thickness 16 ⁇ m).
- the coated tube was rinsed with water, dried and annealed at 350 ° C for one hour.
- the polymerization was carried out in a reactor of 400 m in total. A detailed description of the reactor and the polymerization conditions can be found in DE-A 40 10 271. The reactor was divided into 3 zones; at the beginning of each zone was initiated with peroxide solution. The dimensions of the zones are shown in Table 1.
- the speck mark was determined using an automatic in-line measuring device (Brabender, Duisburg, "Autographers"). For this purpose, a small part of the polymer melt was shaped into a film using an approx. 10 cm wide slot die at 200 ° C., the thickness of which was approx. 0.5 mm. The number of specks was determined using a video camera and an automatic counting device. The number was then classified in the speck grade.
- zone number 1 was coated according to the invention and the corresponding experiments were carried out. The results are shown in Table 2. It is to be expected that coating the other zones will lead to a further increase in sales.
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Dispersion Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Chemically Coating (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Polymerisation Methods In General (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
- Pretreatment Of Seeds And Plants (AREA)
- Paints Or Removers (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
- Laminated Bodies (AREA)
- Vaporization, Distillation, Condensation, Sublimation, And Cold Traps (AREA)
- Separation By Low-Temperature Treatments (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
- Processes Of Treating Macromolecular Substances (AREA)
Description
Claims
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19860526A DE19860526A1 (de) | 1998-12-30 | 1998-12-30 | Wärmeüberträger mit verringerter Neigung, Ablagerungen zu bilden und Verfahren zu deren Herstellung |
| DE19860526 | 1998-12-30 | ||
| PCT/EP1999/010372 WO2000040775A2 (de) | 1998-12-30 | 1999-12-24 | Verfahren zur beschichtung von reaktoren für die hochdruckpolymerisation von 1-olefinen |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| EP1144725A2 true EP1144725A2 (de) | 2001-10-17 |
| EP1144725B1 EP1144725B1 (de) | 2003-07-16 |
Family
ID=7892984
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP99964672A Expired - Lifetime EP1144724B1 (de) | 1998-12-30 | 1999-12-24 | Wärmeüberträger mit verringerter neigung, ablagerungen zu bilden und verfahren zu deren herstellung |
| EP99967007A Expired - Lifetime EP1144723B1 (de) | 1998-12-30 | 1999-12-24 | Verfahren zur beschichtung von apparaten und apparateteilen für den chemischen anlagenbau |
| EP99965554A Expired - Lifetime EP1144725B1 (de) | 1998-12-30 | 1999-12-24 | Verfahren zur beschichtung von reaktoren für die hochdruckpolymerisation von 1-olefinen |
Family Applications Before (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP99964672A Expired - Lifetime EP1144724B1 (de) | 1998-12-30 | 1999-12-24 | Wärmeüberträger mit verringerter neigung, ablagerungen zu bilden und verfahren zu deren herstellung |
| EP99967007A Expired - Lifetime EP1144723B1 (de) | 1998-12-30 | 1999-12-24 | Verfahren zur beschichtung von apparaten und apparateteilen für den chemischen anlagenbau |
Country Status (10)
| Country | Link |
|---|---|
| US (3) | US6513581B1 (de) |
| EP (3) | EP1144724B1 (de) |
| JP (3) | JP2003511551A (de) |
| KR (3) | KR20010100009A (de) |
| CN (3) | CN1636305A (de) |
| AT (3) | ATE227360T1 (de) |
| CA (2) | CA2358099A1 (de) |
| DE (4) | DE19860526A1 (de) |
| ES (2) | ES2197710T3 (de) |
| WO (3) | WO2000040773A2 (de) |
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| US6887955B2 (en) | 2001-08-20 | 2005-05-03 | Basell Polyolefine Gmbh | Method for high pressure polymerization of ethylene |
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| FI104823B (fi) | 1996-06-24 | 2000-04-14 | Borealis Polymers Oy | Likaantumista estävä päällyste |
| US5930581A (en) * | 1996-12-24 | 1999-07-27 | The Dow Chemical Company | Method of preparing complex-shaped ceramic-metal composite articles and the products produced thereby |
| DE19708472C2 (de) * | 1997-02-20 | 1999-02-18 | Atotech Deutschland Gmbh | Herstellverfahren für chemische Mikroreaktoren |
| DE19728629A1 (de) | 1997-07-04 | 1999-01-07 | Basf Ag | Thermoplastische Formmassen mit geringer Eigenfarbe |
| DE19835467A1 (de) * | 1998-08-06 | 2000-02-17 | Elenac Gmbh | Feststoffreaktor mit antistatischer Beschichtung zur Durchführung von Reaktionen in der Gasphase |
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1998
- 1998-12-30 DE DE19860526A patent/DE19860526A1/de not_active Withdrawn
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1999
- 1999-12-24 CN CNA998163821A patent/CN1636305A/zh active Pending
- 1999-12-24 WO PCT/EP1999/010368 patent/WO2000040773A2/de not_active Ceased
- 1999-12-24 CN CN99815259A patent/CN1332810A/zh active Pending
- 1999-12-24 WO PCT/EP1999/010372 patent/WO2000040775A2/de not_active Ceased
- 1999-12-24 WO PCT/EP1999/010371 patent/WO2000040774A2/de not_active Ceased
- 1999-12-24 EP EP99964672A patent/EP1144724B1/de not_active Expired - Lifetime
- 1999-12-24 DE DE59905005T patent/DE59905005D1/de not_active Expired - Lifetime
- 1999-12-24 EP EP99967007A patent/EP1144723B1/de not_active Expired - Lifetime
- 1999-12-24 AT AT99964672T patent/ATE227360T1/de active
- 1999-12-24 DE DE59906313T patent/DE59906313D1/de not_active Expired - Lifetime
- 1999-12-24 KR KR1020017008309A patent/KR20010100009A/ko not_active Withdrawn
- 1999-12-24 US US09/869,275 patent/US6513581B1/en not_active Expired - Fee Related
- 1999-12-24 ES ES99967007T patent/ES2197710T3/es not_active Expired - Lifetime
- 1999-12-24 JP JP2000592466A patent/JP2003511551A/ja not_active Withdrawn
- 1999-12-24 EP EP99965554A patent/EP1144725B1/de not_active Expired - Lifetime
- 1999-12-24 CN CN99816373A patent/CN1338008A/zh active Pending
- 1999-12-24 US US09/869,139 patent/US6617047B1/en not_active Expired - Fee Related
- 1999-12-24 CA CA002358099A patent/CA2358099A1/en not_active Abandoned
- 1999-12-24 KR KR1020017008321A patent/KR20010103724A/ko not_active Withdrawn
- 1999-12-24 CA CA002358097A patent/CA2358097A1/en not_active Abandoned
- 1999-12-24 US US09/869,147 patent/US6509103B1/en not_active Expired - Fee Related
- 1999-12-24 ES ES99965554T patent/ES2204184T3/es not_active Expired - Lifetime
- 1999-12-24 JP JP2000592467A patent/JP2002534606A/ja not_active Withdrawn
- 1999-12-24 JP JP2000592465A patent/JP2002534605A/ja not_active Withdrawn
- 1999-12-24 KR KR1020017008317A patent/KR20010100013A/ko not_active Withdrawn
- 1999-12-24 AT AT99965554T patent/ATE245210T1/de not_active IP Right Cessation
- 1999-12-24 AT AT99967007T patent/ATE237006T1/de active
- 1999-12-24 DE DE59903362T patent/DE59903362D1/de not_active Expired - Lifetime
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6887955B2 (en) | 2001-08-20 | 2005-05-03 | Basell Polyolefine Gmbh | Method for high pressure polymerization of ethylene |
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