EP1220010A3 - Wiederbeschichtungsverfahren für mikromechanische Bauelemente - Google Patents

Wiederbeschichtungsverfahren für mikromechanische Bauelemente Download PDF

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Publication number
EP1220010A3
EP1220010A3 EP01205122A EP01205122A EP1220010A3 EP 1220010 A3 EP1220010 A3 EP 1220010A3 EP 01205122 A EP01205122 A EP 01205122A EP 01205122 A EP01205122 A EP 01205122A EP 1220010 A3 EP1220010 A3 EP 1220010A3
Authority
EP
European Patent Office
Prior art keywords
devices
micromechanical
overcoat
wafer
once
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP01205122A
Other languages
English (en)
French (fr)
Other versions
EP1220010A2 (de
Inventor
Simon Joshua Jacobs
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Texas Instruments France SAS
Texas Instruments Inc
Original Assignee
Texas Instruments France SAS
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments France SAS, Texas Instruments Inc filed Critical Texas Instruments France SAS
Publication of EP1220010A2 publication Critical patent/EP1220010A2/de
Publication of EP1220010A3 publication Critical patent/EP1220010A3/de
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00865—Multistep processes for the separation of wafers into individual elements
    • B81C1/00896—Temporary protection during separation into individual elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
    • G02B26/0833—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD
    • G02B26/0841—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD the reflecting element being moved or deformed by electrostatic means

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Light Control Or Optical Switches (AREA)
  • Micromachines (AREA)
  • Dicing (AREA)
EP01205122A 2000-12-29 2001-12-28 Wiederbeschichtungsverfahren für mikromechanische Bauelemente Withdrawn EP1220010A3 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US25899800P 2000-12-29 2000-12-29
US258998P 2000-12-29

Publications (2)

Publication Number Publication Date
EP1220010A2 EP1220010A2 (de) 2002-07-03
EP1220010A3 true EP1220010A3 (de) 2004-10-27

Family

ID=22983062

Family Applications (1)

Application Number Title Priority Date Filing Date
EP01205122A Withdrawn EP1220010A3 (de) 2000-12-29 2001-12-28 Wiederbeschichtungsverfahren für mikromechanische Bauelemente

Country Status (2)

Country Link
US (2) US6787187B2 (de)
EP (1) EP1220010A3 (de)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8410690B2 (en) 2009-02-13 2013-04-02 Qualcomm Mems Technologies, Inc. Display device with desiccant
US8853747B2 (en) 2004-05-12 2014-10-07 Qualcomm Mems Technologies, Inc. Method of making an electronic device with a curved backplate

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020122881A1 (en) * 2000-12-29 2002-09-05 Toshiyuki Kaeriyama Micromechanical device recoat methods
EP1220010A3 (de) * 2000-12-29 2004-10-27 Texas Instruments Incorporated Wiederbeschichtungsverfahren für mikromechanische Bauelemente
US20040118621A1 (en) * 2002-12-18 2004-06-24 Curtis Marc D. Live hydraulics for utility vehicles
WO2004072576A1 (ja) * 2003-02-17 2004-08-26 Nippon Telegraph And Telephone Corporation 表面形状認識用センサ及びその製造方法
US6806993B1 (en) * 2003-06-04 2004-10-19 Texas Instruments Incorporated Method for lubricating MEMS components
US6930367B2 (en) 2003-10-31 2005-08-16 Robert Bosch Gmbh Anti-stiction technique for thin film and wafer-bonded encapsulated microelectromechanical systems
US8858811B2 (en) * 2003-11-01 2014-10-14 Fred Ishii Method for manufacturing a mirror device by means of a plurality of sacrificial layers
US7449355B2 (en) * 2005-04-27 2008-11-11 Robert Bosch Gmbh Anti-stiction technique for electromechanical systems and electromechanical device employing same
US20070170528A1 (en) 2006-01-20 2007-07-26 Aaron Partridge Wafer encapsulated microelectromechanical structure and method of manufacturing same
US8040587B2 (en) 2006-05-17 2011-10-18 Qualcomm Mems Technologies, Inc. Desiccant in a MEMS device
US7848002B2 (en) * 2006-12-26 2010-12-07 Silicon Quest Kabushiki-Kaisha Method for aligning die to substrate
US8436453B2 (en) * 2006-12-28 2013-05-07 Texas Instruments Incorporated Micromechanical device lubrication
US8435838B2 (en) 2007-09-28 2013-05-07 Qualcomm Mems Technologies, Inc. Optimization of desiccant usage in a MEMS package
JP5935761B2 (ja) * 2013-06-12 2016-06-15 セイコーエプソン株式会社 光学デバイス、光スキャナーおよび画像表示装置
US10192850B1 (en) 2016-09-19 2019-01-29 Sitime Corporation Bonding process with inhibited oxide formation

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02106947A (ja) * 1988-10-17 1990-04-19 Sumitomo Electric Ind Ltd 半導体装置の製造方法
WO1996008036A1 (en) * 1994-09-02 1996-03-14 Stichting Voor De Technische Wetenschappen Process for producing micromechanical structures by means of reactive ion etching
US5824177A (en) * 1995-07-13 1998-10-20 Nippondenso Co., Ltd. Method for manufacturing a semiconductor device
DE19811115A1 (de) * 1998-03-14 1999-09-16 Stromberg Michael Verfahren zur Behandlung von Wafern beim Dünnen und Sägen
DE19921241A1 (de) * 1998-05-08 1999-11-11 Denso Corp Verfahren zur Herstellung eines Halbleitersensors für eine dynamische Größe
US6012336A (en) * 1995-09-06 2000-01-11 Sandia Corporation Capacitance pressure sensor

Family Cites Families (24)

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Publication number Priority date Publication date Assignee Title
US5061049A (en) 1984-08-31 1991-10-29 Texas Instruments Incorporated Spatial light modulator and method
US5583688A (en) 1993-12-21 1996-12-10 Texas Instruments Incorporated Multi-level digital micromirror device
US5512374A (en) 1994-05-09 1996-04-30 Texas Instruments Incorporated PFPE coatings for micro-mechanical devices
US5526878A (en) * 1995-02-06 1996-06-18 Halliburton Company Stage cementer with integral inflation packer
US5872046A (en) 1996-04-10 1999-02-16 Texas Instruments Incorporated Method of cleaning wafer after partial saw
US6686291B1 (en) * 1996-05-24 2004-02-03 Texas Instruments Incorporated Undercut process with isotropic plasma etching at package level
US5882532A (en) * 1996-05-31 1999-03-16 Hewlett-Packard Company Fabrication of single-crystal silicon structures using sacrificial-layer wafer bonding
US5858475A (en) * 1996-12-23 1999-01-12 Taiwan Semiconductor Manufacturing Company, Ltd Acoustic wave enhanced spin coating method
US6207346B1 (en) 1997-04-09 2001-03-27 Advanced Coatings International Waterborne photoresists made from urethane acrylates
US5923995A (en) * 1997-04-18 1999-07-13 National Semiconductor Corporation Methods and apparatuses for singulation of microelectromechanical systems
US6063696A (en) 1997-05-07 2000-05-16 Texas Instruments Incorporated Method of reducing wafer particles after partial saw using a superhard protective coating
US5888884A (en) * 1998-01-02 1999-03-30 General Electric Company Electronic device pad relocation, precision placement, and packaging in arrays
US6290859B1 (en) * 1999-11-12 2001-09-18 Sandia Corporation Tungsten coating for improved wear resistance and reliability of microelectromechanical devices
US6509574B2 (en) * 1999-12-02 2003-01-21 Texas Instruments Incorporated Optocouplers having integrated organic light-emitting diodes
US20010040675A1 (en) * 2000-01-28 2001-11-15 True Randall J. Method for forming a micromechanical device
US6335224B1 (en) * 2000-05-16 2002-01-01 Sandia Corporation Protection of microelectronic devices during packaging
US6379988B1 (en) * 2000-05-16 2002-04-30 Sandia Corporation Pre-release plastic packaging of MEMS and IMEMS devices
KR100837987B1 (ko) 2000-06-21 2008-06-16 텍사스 인스트루먼츠 인코포레이티드 용해 수지를 이용하는 마이크로 전기기계 시스템 장치의재코팅 방법
EP1220010A3 (de) * 2000-12-29 2004-10-27 Texas Instruments Incorporated Wiederbeschichtungsverfahren für mikromechanische Bauelemente
US7071025B2 (en) 2000-12-29 2006-07-04 Texas Instruments Incorporated Separating wafers coated with plastic films
US6625047B2 (en) * 2000-12-31 2003-09-23 Texas Instruments Incorporated Micromechanical memory element
US6800210B2 (en) * 2001-05-22 2004-10-05 Reflectivity, Inc. Method for making a micromechanical device by removing a sacrificial layer with multiple sequential etchants
US6793829B2 (en) * 2002-02-27 2004-09-21 Honeywell International Inc. Bonding for a micro-electro-mechanical system (MEMS) and MEMS based devices
US7052926B2 (en) * 2003-12-18 2006-05-30 Corporation For National Research Initiatives Fabrication of movable micromechanical components employing low-cost, high-resolution replication technology method

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02106947A (ja) * 1988-10-17 1990-04-19 Sumitomo Electric Ind Ltd 半導体装置の製造方法
WO1996008036A1 (en) * 1994-09-02 1996-03-14 Stichting Voor De Technische Wetenschappen Process for producing micromechanical structures by means of reactive ion etching
US5824177A (en) * 1995-07-13 1998-10-20 Nippondenso Co., Ltd. Method for manufacturing a semiconductor device
US6012336A (en) * 1995-09-06 2000-01-11 Sandia Corporation Capacitance pressure sensor
DE19811115A1 (de) * 1998-03-14 1999-09-16 Stromberg Michael Verfahren zur Behandlung von Wafern beim Dünnen und Sägen
DE19921241A1 (de) * 1998-05-08 1999-11-11 Denso Corp Verfahren zur Herstellung eines Halbleitersensors für eine dynamische Größe

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 014, no. 324 (E - 0951) 11 July 1990 (1990-07-11) *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8853747B2 (en) 2004-05-12 2014-10-07 Qualcomm Mems Technologies, Inc. Method of making an electronic device with a curved backplate
US8410690B2 (en) 2009-02-13 2013-04-02 Qualcomm Mems Technologies, Inc. Display device with desiccant

Also Published As

Publication number Publication date
EP1220010A2 (de) 2002-07-03
US20020132062A1 (en) 2002-09-19
US6787187B2 (en) 2004-09-07
US20050042389A1 (en) 2005-02-24
US7651734B2 (en) 2010-01-26

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