EP1221134A2 - Carte a puce et son procede de production - Google Patents

Carte a puce et son procede de production

Info

Publication number
EP1221134A2
EP1221134A2 EP00967540A EP00967540A EP1221134A2 EP 1221134 A2 EP1221134 A2 EP 1221134A2 EP 00967540 A EP00967540 A EP 00967540A EP 00967540 A EP00967540 A EP 00967540A EP 1221134 A2 EP1221134 A2 EP 1221134A2
Authority
EP
European Patent Office
Prior art keywords
contact surfaces
electronic component
chip card
chip
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP00967540A
Other languages
German (de)
English (en)
Inventor
Thies Janczek
Rüdiger MENTZER
Carsten Senge
Karl-Heinz König
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Idemia Germany GmbH
Original Assignee
Orga Kartensysteme GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Orga Kartensysteme GmbH filed Critical Orga Kartensysteme GmbH
Publication of EP1221134A2 publication Critical patent/EP1221134A2/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/072—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising a plurality of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/183—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components mounted in and supported by recessed areas of the PCBs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10477—Inverted
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10719—Land grid array [LGA]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1453—Applying the circuit pattern before another process, e.g. before filling of vias with conductive paste, before making printed resistors

Definitions

  • the invention relates to a chip card with a card body consisting of:
  • At least one first electronic component having a conductor track structure
  • a second electronic component the components being electrically connected to one another at respective contact surfaces thereof.
  • the invention further relates to a method for producing a chip card with a card body consisting of several layers, wherein an electronic component for energy and data transmission between an external device and a chip integrated in the card body and vice versa is applied to a transfer layer to form a transfer module ,
  • a chip card with a card body which has two electronic components, a first electronic component as a coil for energy and data transmission between an external device and a second electronic component formed as a chip in the card body with the same is electrically connected.
  • the coil is applied to a transfer layer of the card body by means of screen printing and consists of an electrically conductive material.
  • An electrically conductive adhesive is provided for the electrical connection of the coil to the chip.
  • DE 195 00 925 C2 describes a method for producing a chip card with a card body consisting of several layers, wherein a transmission element for energy and data transmission between an external device and a chip integrated in the card body and vice versa is applied to a transfer layer. This transmission element is designed as a coil.
  • an electrically conductive adhesive is used, which is applied to the respective contact surfaces of the coil or the chip.
  • a disadvantage of the known chip card or the known method for producing the chip card is that an electrically conductive adhesive is required for contacting the electronic components in question, an additional process step being necessary for the application.
  • the object of the present invention is therefore to provide a chip card and a method for producing a chip card that ensure reliable and at the same time simplified contacting of at least two electronic components integrated in the chip card.
  • the chip card in connection with the preamble of claim 1 is characterized in that at least the contact surfaces of an electronic component are formed from a conductor material having a thermoplastic base material with enclosed metal particles.
  • the advantage of the chip card according to the invention is that the electronic components to be contacted electrically are already due to the composition of the circuit Substance of the contact surfaces are able to be able to be electrically contacted with one another without the addition of further materials.
  • the basic idea of the invention is to design at least the contact surfaces of the electronic components in such a way that an adhesive electrical connection between the corresponding contact surfaces is made possible by heating them. An additional electrically conductive adhesive for connecting the opposite contact surfaces of the components is not necessary.
  • an electronic component is designed as a coil, the entire component consisting of the same conductor material, forming a conductor track structure.
  • a transducer module can be created by applying the coil to a layer of the card body, by means of which contacting with contact surfaces of another component is made possible.
  • the contact surfaces of the transmitter module can have a greater thickness than the contact surfaces of the second electronic component to be connected, so that the contact surfaces of the second electronic module do not have to have the electrically adhesive material composition as the contact surfaces of the transmitter module, but instead, for example, exclusively consist of a metal material.
  • the method according to the invention in connection with the preamble of claim 8 is characterized in that a powdered thermoplastic material on the one hand and a powdered metal on the other hand are mixed with the addition of binders to form a conductor material, that the conductor material is applied to the transfer layer by means of screen printing with formation of contact areas and that contact areas of the chip are positioned such that they come into contact with the contact areas of the transfer module and under the influence of heat and pressure electrically and mechanically be connected to the contact surfaces.
  • the advantage of the method according to the invention is that there is no process step, namely the application of an adhesive, electrically conductive adhesive.
  • the heat input introduced when the card body is laminated can advantageously be used to soften the conductor material at the contact surfaces, so that an intimate and firm connection is created between the opposite contact surfaces.
  • a contact temperature that is higher than the lamination temperature is introduced briefly and selectively onto the contact surfaces during the lamination process.
  • the contacting temperature lies in a range between 160 ° C and 200 ° C.
  • the duration of exposure to the contacting temperature is advantageously approximately one second.
  • Figure 1 a plan view of a transmitter module
  • FIG. 1 a cross section through a chip card.
  • a transmitter module 1 as the first electronic component, consisting of a coil with turns 2 and widened contact surfaces 3 arranged at the ends of the turns 2, the coil being applied to a transfer layer 4.
  • the transmitter module 1 can be provided as a semifinished product and then joined together with other layers of a card body 5 to form a chip card.
  • the coil 1 forms with the turns 2 and the contact surfaces 3 a conductor track structure, which is preferably applied by means of screen printing to the transfer layer 4 consisting of a plastic.
  • the windings 2 and the contact surfaces 3 consist of a conductor material which is composed of a thermoplastic base material and a metal material.
  • the metal material can have a volume fraction of 45% to 65% of the total volume.
  • the thermoplastic base material can for example consist of PVC, ABS, PC, etc.
  • FIG. 2 shows a card structure 5 consisting of a plurality of layers connected to one another by lamination, of which the transfer layer 4 with the conductor tracks 2 is located in a central region.
  • a covering layer a is arranged with recesses corresponding to the contact surfaces 3 of the coil 1, so that the contact surfaces 3 extend flush with the top of the covering layer a.
  • a card body 6 formed in this way has a recess 7 for implanting a chip module 8.
  • the chip module 8 has a carrier layer 9 with external contacts for the contact-based operation of the chip card. Furthermore, the chip module 8 has a chip, not shown, which is connected to a contact rail 10 by means of individual wires.
  • the con- The clock bar 10 extends parallel to the carrier layer 9 from a central region, in which a casting compound 13 protecting the chip is arranged, into an outer region, in which contact surfaces 11 of the chip module 8 are arranged.
  • An electrically conductive connection is provided between the contact rail 10 and the outer contacts of the chip module 8, not shown.
  • the contact rail 10 can consist of a metallic material or - as in a first embodiment according to the composition of the contact surfaces 11 - of a conductor material that matches the conductor material of the contact surfaces 3.
  • both the contact rail 10 and the contact surfaces 11 can consist of the same thermoplastic material comprising a conductor material.
  • the chip module 8 For contacting the chip module 8 with the coil 1, the chip module 8 is placed on an abutment shoulder 12 of the laminated card structure 5, the contact surfaces 11 of the chip module 8 coming directly into contact with the corresponding contact surfaces 3 of the coil 1.
  • the conductor material of the contact surfaces 3, 11 softens due to subsequent heat and, if appropriate, pressure acting on the connection points, so that an intimate and firm connection between the contact surfaces 3, 11 is produced.
  • the contacting temperature generated in this case corresponds to the softening temperature of the conductor material and can be in a range from 150 ° C to 200 ° C.
  • the contacting temperature is preferably higher than the lamination temperature, so that, according to a further exemplary embodiment, the contacting of the contact surfaces 3, 11 can be integrated into the lamination process and thus takes place parallel to the lamination.
  • the invention covers any electronic component on the chip card, such as batteries, switches, displays. Diodes etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

L'invention concerne une carte à puce pourvue d'un corps constitué d'au moins un premier composant électronique présentant une structure à pistes conductrices et d'au moins un second composant électronique, ces composants étant reliés électriquement par leurs contacts respectifs. Au moins les surfaces de contact (3, 11) d'un composant électronique (1) sont formées par une matière conductrice constituée d'un matériau de base thermoplastique et de particules de métal incluses dans ce matériau de base.
EP00967540A 1999-09-01 2000-08-29 Carte a puce et son procede de production Withdrawn EP1221134A2 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19941637 1999-09-01
DE19941637A DE19941637A1 (de) 1999-09-01 1999-09-01 Chipkarte und Verfahren zur Herstellung einer Chipkarte
PCT/DE2000/002903 WO2001016876A2 (fr) 1999-09-01 2000-08-29 Carte a puce et son procede de production

Publications (1)

Publication Number Publication Date
EP1221134A2 true EP1221134A2 (fr) 2002-07-10

Family

ID=7920423

Family Applications (1)

Application Number Title Priority Date Filing Date
EP00967540A Withdrawn EP1221134A2 (fr) 1999-09-01 2000-08-29 Carte a puce et son procede de production

Country Status (4)

Country Link
EP (1) EP1221134A2 (fr)
AU (1) AU7770300A (fr)
DE (1) DE19941637A1 (fr)
WO (1) WO2001016876A2 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6630249B2 (en) 1996-11-13 2003-10-07 Fern Investments Limited Composite steel structural plastic sandwich plate systems

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10207001A1 (de) * 2002-02-19 2003-09-04 Orga Kartensysteme Gmbh Chipkarte
EP2034429A1 (fr) 2007-09-05 2009-03-11 Assa Abloy AB Procédé de fabrication d'une carte et carte obtenue selon ledit procédé
EP2618292A1 (fr) 2012-01-17 2013-07-24 Assa Abloy Ab Carte à double interface avec connexion d'insert métallique
FR3063555B1 (fr) * 2017-03-03 2021-07-09 Linxens Holding Carte a puce et procede de fabrication d’une carte a puce

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4416697A1 (de) * 1994-05-11 1995-11-16 Giesecke & Devrient Gmbh Datenträger mit integriertem Schaltkreis
DE4443980C2 (de) * 1994-12-11 1997-07-17 Angewandte Digital Elektronik Verfahren zur Herstellung von Chipkarten und Chipkarte hergestellt nach diesem Verfahren
DE19500925C2 (de) * 1995-01-16 1999-04-08 Orga Kartensysteme Gmbh Verfahren zur Herstellung einer kontaktlosen Chipkarte
FR2740935B1 (fr) * 1995-11-03 1997-12-05 Schlumberger Ind Sa Procede de fabrication d'un ensemble de modules electroniques pour cartes a memoire electronique
DE19633938A1 (de) * 1996-08-22 1998-02-26 Pav Card Gmbh Chipkarte und Verfahren zum Herstellen einer Chipkarte
DE19632814A1 (de) * 1996-08-14 1998-02-19 Siemens Ag Kombikarte und Verfahren zu ihrer Herstellung
FR2756955B1 (fr) * 1996-12-11 1999-01-08 Schlumberger Ind Sa Procede de realisation d'un circuit electronique pour une carte a memoire sans contact
FR2773642B1 (fr) * 1998-01-13 2000-03-03 Schlumberger Ind Sa Procede de connexion de plots d'un composant a circuits integres a des plages de connexion d'un substrat plastique au moyen de protuberances
FR2775810B1 (fr) * 1998-03-09 2000-04-28 Gemplus Card Int Procede de fabrication de cartes sans contact

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO0116876A3 *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6630249B2 (en) 1996-11-13 2003-10-07 Fern Investments Limited Composite steel structural plastic sandwich plate systems

Also Published As

Publication number Publication date
WO2001016876A3 (fr) 2001-05-31
AU7770300A (en) 2001-03-26
DE19941637A1 (de) 2001-03-08
WO2001016876A2 (fr) 2001-03-08

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