EP1264346A1 - Convertisseur et son procede de production - Google Patents

Convertisseur et son procede de production

Info

Publication number
EP1264346A1
EP1264346A1 EP01915025A EP01915025A EP1264346A1 EP 1264346 A1 EP1264346 A1 EP 1264346A1 EP 01915025 A EP01915025 A EP 01915025A EP 01915025 A EP01915025 A EP 01915025A EP 1264346 A1 EP1264346 A1 EP 1264346A1
Authority
EP
European Patent Office
Prior art keywords
converter
semiconductor substrates
receiving parts
assembly
connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
EP01915025A
Other languages
German (de)
English (en)
Inventor
Richard Spitz
Alfred Goerlach
Alexander Wallrauch
Christoph Ruf
Peter Urbach
Uwe Knappenberger
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of EP1264346A1 publication Critical patent/EP1264346A1/fr
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

Definitions

  • the invention relates to a converter according to the preamble of claim 1 and the manufacture of a converter.
  • Power converters of the type mentioned here are known in a wide variety of embodiments. They are used to transform or control electrical energy. Power converters can be designed as rectifiers, inverters, converters for direct current and converters for alternating current. According to these embodiments, the converters have converter valves, in particular diodes, thyristors, transistors, MOSFETs, IGBTs and triac's. Controllable and non-controllable converter valves are therefore known. In the motor vehicle sector, converters are used in particular as rectifiers, which convert the alternating quantity supplied by a generator into an equal quantity. Mainly three-phase generators are used that supply several alternating voltages that are phase-shifted with respect to each other. The rectifier must be designed with multiple poles.
  • Rectifiers of this type have a corresponding number of individual, discrete power diodes that form the rectifier assembly.
  • This comprises two connection plates, one of which forms the positive and the other the negative voltage connection. Both connections are electrically isolated from each other.
  • the diodes can be pressed into the sheets with their housing.
  • the negative connection plate for thermal and electrical contacting is attached to the end shield of the generator.
  • the positive connection has a bolt in order to be able to tap the voltage. To cool this positive connection, it is designed as a heat sink. It can lie in the air flow of the generator fan or can also be coupled to the bearing plate of the generator by thermal coupling with the aid of a heat-conducting film.
  • the thermal design of a single press-in diode and the complete rectifier must take two different operating cases into account.
  • a few tens of watts of power dissipation occur in the current path of each diode, which must be dissipated as heat via the negative and / or positive connection.
  • the second, so-called load dump case occurs in the event of a sudden load shedding, after which the generator controller needs a certain period of time to adapt the current to the excitation winding and to de-energize the generator voltage.
  • the rectifier diodes can be designed as Zener diodes, which are able to absorb the entire power of the generator for a short time.
  • the power losses that occur here can be of the order of several kilowatts.
  • the heat then generated at the rectifier diodes cannot be dissipated via the heat sink, but is absorbed in the diode housing itself by an adequately dimensioned copper mass, which thus serves as a heat buffer. It is thus shown that the known power converters are complex and, in addition, are relatively large, since — in the case of a three-phase bridge rectifier — six individual diodes have to be cooled by means of connection plates of complex construction.
  • a converter with the features mentioned in claim 1 offers the advantage that there is a significant simplification of the construction and reduction of the space requirement of the converter, and this is also associated with a considerable reduction in production costs.
  • the receiving parts serving as the electrical connection and the semiconductor substrates form a stack and a thermally and electrically conductive insert, which permits the electrical connection, is arranged between the semiconductor substrates, a thermal coupling between the two receiving parts is achieved. It is sufficient for Somic if one of the receiving parts with its fastening means is attached to a separate heat sink, for example on a generator end shield, is arranged to be able to dissipate the heat loss.
  • both receiving parts are also electrically isolated from one another, so that no further components or measures are required for this. It shows that an additional heat sink for one of the receiving parts can be omitted.
  • the arrangement according to the invention has the advantage that the plus and minus connections on one of the receptacle parts can be implemented as a common busbar above or below the converter valves and, moreover, additional wiring is largely dispensed with, since the between the insert arranged in the converter valves serves as a three-phase connection.
  • the invention is not limited to rectifiers for use with three-phase generators.
  • all other types of converters can be realized with this.
  • the insert is designed with two poles and the semiconductor substrate has two contact surfaces on its surface facing the insert, it is of course also possible to use controllable converter valves, in particular thyristors and transistors, MOSFETs and IGBTs. be applied.
  • the use of the converter according to the invention can therefore be used in many conversion and control areas of electrical energy.
  • the receiving parts are made of copper or at least have copper. They can be plate-shaped, in particular in the case of the receiving part with the fastening means, a flat surface is provided in order to provide a large heat transfer surface to the bearing plate of the generator, so that the heat generated can be given off well to the generator housing.
  • a flat surface is provided in order to provide a large heat transfer surface to the bearing plate of the generator, so that the heat generated can be given off well to the generator housing.
  • the converter is attached to the end shield of an electrical machine, in particular a generator, there are also advantages for the design of the machine: Due to the small size of the converter, enlarged air inlet openings can be formed on the end shield, through which either the cooling and thus the efficiency of the Machine, or the fan wheel of the machine can be reduced in order to reduce noise emissions.
  • the converter can also be attached to a liquid-cooled machine.
  • the small size of the converter also results in a high degree of flexibility in the arrangement on a machine.
  • the converter can be connected to a claw special claw pole generator of a motor vehicle, can be arranged on the A or B side. Due to the small dimensions of the compact converter, there is also a higher mechanical stability against impact and vibration stresses, so that a high and permanent functional reliability is given, particularly when used in a motor vehicle.
  • a power converter in particular of the type mentioned above, can be easily and inexpensively manufactured. It is provided during production that the components are stacked on top of one another, an electrically conductive contact means being applied between the components at least in regions. When the components (receiving parts, semiconductor substrates and insert part) are stacked on top of one another, they can be placed one on top of the other, the contact means being present in between. However, it is also possible for subassemblies to be prefabricated. For example, it is possible to attach one of the semiconductor substrates to each receiving part by means of the contact means. Both receiving parts are then joined together with the insertion part and connected to one another by means of the contact means. The sequence can therefore be selected almost as desired, but the stacking arrangement of the components is always selected.
  • the contact means can be a solder paste or solder foil.
  • the solder paste is applied to at least one of the components that are should be added.
  • it is advantageous that it builds up a certain adhesive effect so that the parts lying on one another adhere to one another and thus do not slip in a subsequent heating process during assembly and are connected to one another in a precisely aligned manner.
  • the contact means by diffusion soldering or conductive gluing.
  • conductive adhesive an adhesive is used which is partially electrically conductive and which can therefore contain, for example, electrically conductive particles.
  • an electrically non-conductive spacer can be arranged between the receiving parts.
  • This can be designed in such a way that an essentially closed housing is formed, in which the housing walls are formed by the receiving parts and the spacer.
  • This spacer can be designed as a subassembly with the insert. It is possible to remove the A £> stand holder after connecting the components with the contact means. However, it can also remain arranged until the free space between the receiving parts is filled with a casting compound or sprayed with plastic. However, it can also remain between the receiving parts after the free spaces have been filled.
  • the inserts located between two semiconductor substrates can be connected to one another.
  • Connection lugs can be provided which protrude beyond the edge of the housing. At the end of the flags, these can be connected. This simplifies the assembly of the converter. After complete assembly, the inserts, in particular their connecting lugs, can be mechanically separated from one another.
  • pre-assembly in particular, it is provided that the components are pre-fixed.
  • pins or recesses can be formed on the facing sides of the receiving plates, which interact with pins or recesses formed on the spacer by the pins engaging in the recesses.
  • the spacer can therefore also be used as a prefixing element which, as mentioned above, can be removed after assembly.
  • the side edges of the semiconductor substrates can be coated with a protective lacquer in order to protect the substrates from the chemically aggressive potting compounds or plastics and from moisture in some cases.
  • FIG. 1 shows the circuit diagram of a converter
  • FIG. 2 shows the basic structure of a converter
  • FIG. 3 shows a sectional view of the converter according to FIG. 2,
  • FIG. 4 shows an exploded view of a first exemplary embodiment of a converter arrangement
  • FIG. 5 shows an exploded view of a second exemplary embodiment of a converter arrangement
  • FIG. 6 shows an exploded illustration of a third exemplary embodiment of a converter arrangement
  • FIG. 7 shows a power converter provided with a plastic housing (molded housing).
  • FIG. 1 shows the circuit diagram of a converter 1, which is assumed to be the rectifier 2 for further considerations.
  • the converter 1 assigns at least two, here six converter valves 3 to 8, which in the case of the rectifier 2 are implemented as diodes, in particular Zener diodes.
  • the converter shown in FIG. 1 is a so-called six-pulse bridge converter which has a three-phase connection 9 with three phase connections U, V and W.
  • the converter 1 has a DC voltage connection 10, which comprises a positive connection B + and a negative connection B-.
  • the converter 1 is designed as a three-pole rectifier. However, it becomes clear that, of course, more or less pole converter types can also be implemented.
  • the structure of the converter 1 is described below with reference to FIGS. 2 and 3.
  • the same or equivalent parts as in Figure 1 are given the same reference numerals.
  • the DC connection 10 is formed by two thermally and electrically conductive receiving parts 11 and 12, which are spaced apart.
  • the receiving part 11 forms the B + connection of the direct current connection 10;
  • the receiving part 12 forms the B connection of the direct current connection 10.
  • the receiving parts 11 and 12 are realized as plates 13 and 14.
  • the converter valves 3 to 8 are designed as semiconductor substrates 15, each semiconductor substrate 15 having an upper and lower electrical contact surface 16 and 17, respectively. Two semiconductor substrates 15 are stacked on top of one another between the plates 13 and 14.
  • each insert part 18 forms a connection U, V, W of the three-phase connection 9 and, as mentioned above, each receiving part 11 and 12 forms a connection of the direct-current connection 10.
  • the semiconductor substrates 15 are flat and have no housing.
  • different converter valves are used as semiconductor substrates 15.
  • so-called axial pn diodes are preferably used, in which the pn junction is essentially perpendicular to the plane of the drawing.
  • a p- or n-layer of a semiconductor substrate 15 bears on the connection part 11 and the other n- or p-layer on the insert part 18 with their contact surfaces 16 and 17, respectively.
  • other semiconductor substrates can also be used, such as planar components or, in the case of corresponding contact areas provided with solder deposits, also integrated circuits.
  • the insert 18 comprises a plurality of connecting lugs 19, each of which is assigned to a contact surface.
  • the lower contact surface 17 of the semiconductor substrate 15 can have a plurality of partial contact surfaces.
  • the plates 13 and 14 can have an elevation 21 on the side surfaces facing one another, on which — in the assembled state — the semiconductor substrates 15 come to rest.
  • the receiving part 12 also has a fastening means with which the assembled converter 1 can be fastened to a generator end shield.
  • the fastening means is implemented with two openings 22, through which a bolt can be inserted.
  • the openings 22 and / or the bolt can comprise threads. It is thus possible to arrange the receiving part 12 with its underside 23 opposite the elevation 21 flat on the generator plate. For better heat transfer, a thermal paste can be introduced between the generator shield and the underside 23.
  • the receiving part 11 has at least one receptacle 24, here two, each of which can receive a connection element, for example a bolt, so that a current tap can be attached to the receiving part 11.
  • a connecting part in particular a connecting plate, can also be soldered or welded to the receiving part 11.
  • the insert parts 18 and the spacer 25 are designed as an assembled subassembly 25 '.
  • the spacer 25 has openings on a wall 26 through which the connecting lugs 19 extend.
  • the spacer 25 is here essentially U-shaped, so that when the converter 1 is assembled, a housing is formed which is only open on one side in order, for example, to be able to introduce a casting compound or a plastic.
  • the receiving parts thus form the lid and bottom of the housing.
  • the spacer 25 can also have pre-fixing elements 27 which are designed as pins which engage in pre-fixing elements 28 designed as recesses on the receiving parts 11 and 12.
  • the assembly on the receiving part 12 is preferably started.
  • An electrically conductive contact means for example solder paste or solder foil, is applied to the elevation 21 in the region of the semiconductor substrates 15 to be applied.
  • the upper contact surfaces 16 are coated with the contact agent.
  • the subassembly 25 ' is plugged onto the plate 12 in such a way that the prefixing elements 27 engage in the prefixing elements 28.
  • the inserts 18 are then coated on their free side with the contact means, specifically at the point at which the semiconductor substrates 15 come to rest. These are then placed on the contact means on the insert 18.
  • the receiving part 25 is finally put on.
  • a preassembled converter assembly 1 ' is produced, which is prefixed by using solder paste and the spacer 15. Subsequent heating of the assembled converter assembly 1 'influences the solder paste in such a way that a permanent electrical connection between the receiving parts 11, 12, the semiconductor substrates 15 and the insert parts 19 is achieved.
  • the soldering temperatures must be observed.
  • temperatures of more than 350 ° C may be reached.
  • the spacer 25 is then made of a heat-resistant material, for example a ceramic or a high-temperature-resistant plastic.
  • the spacer 25 could be formed as a plastic part.
  • a two-part soldering process is also conceivable, in which the lower semiconductor substrates 15 are first applied to the elevation 21 and connected to the receiving part 12 by soldering.
  • the other semiconductor substrates 15 can be connected in an analogous manner to the upper receiving part 11. This results in prefabricated subassemblies 11 ', 12', so that in a further assembly step the subassembly 25 'can be inserted and connected to the other subassemblies 11' and 12 '.
  • the semiconductor substrates 15 can be attached to the receiving parts 11 and 12 by means of solder paste.
  • the inserts 18 can then be attached to the semiconductor substrates 15 by conductive adhesive.
  • the critical thermal coupling of the semiconductor substrates 15 to the receiving parts 11 and 12 can thus take place via a high-temperature solder, while the contact to the insert parts 18 is made with the conductive adhesive, which hardens without the high soldering temperatures.
  • the spacer 25 could preferably be made of plastic f.
  • the receiving part 11 has lateral, separable extensions extensions 29, each having an opening 30.
  • two guide bolts 31 can be used, which can be inserted into the openings 30 and 22.
  • the guide pin 31 thus forms a pre-fixing element 28 '.
  • a housing part 32 which is present as a clip and is essentially U-shaped, can be inserted into the space between the two receiving parts 11 and 12 ,
  • the insert parts 18 can be integrated in a so-called leadframe frame 33, that is to say that the connecting lugs 19 are connected to one another at their free end.
  • the leadframe frame 33 also has two legs 34 which are essentially parallel to the connecting lugs 19. Each leg 34 has an opening 35 through which the guide bolts 31 can reach.
  • the guide bolts 31 can be designed as dowel pins which have threads which can be screwed into the threads of the openings 22 and 30, the openings 22 later serving, as mentioned above, as a fastening element of the converter 1 on a generator.
  • solder foil parts 36 can now be used particularly advantageously, which produce the electrical connection of the semiconductor substrates 15 with the receiving parts 11 and 12 and the insert parts 18.
  • the converter assembly 1 'according to FIG. 5 is assembled and then heated, the electrical contacts are made through the solder foils 36. Then, plastic is poured or injected into the free areas between the two receiving parts 11 and 12, the housing part 32 preventing the casting compound or the plastic from escaping unintentionally.
  • the side edges S of the semiconductor substrates 15 can be painted in order to prevent the semiconductor substrates 15 from being attacked by chemically aggressive casting compounds or plastics or penetrating moisture.
  • the extensions 30 and the legs 34 can be separated at the dividing lines T.
  • the guide bolts 31 can thus be removed again, so that the openings 22 on the receiving part 22 can be used for fastening the converter 1 to the generator shield.
  • the packaging of the pre-assembled or fully assembled converter assembly 1 ′ can also be done entirely without additional housing components with a mold housing 37 according to FIG. 7.
  • the component to be packaged in this case the converter assembly 1 ', is placed in a molding mold comprising an upper and lower part, the upper and lower parts being sealed against one another with high pressure.
  • a defined cavity remains in and around the component, which can be sprayed with a plastic compound.
  • This plastic mass with a defined pressure and defined temperature injected into the cavity.
  • the molding compound then hardens in the mold within a short time.
  • the mold can be opened and the fully packaged component can be ejected.
  • the semiconductor substrates 15 located between the plates 11, 13 and 12, 14 do not bear any mechanical stress, for example by closing and sealing the Moldform, may be exposed. For this reason, the mold can only be sealed directly against the lower plate 12, 14.
  • the upper plate 11, 13 is therefore completely encapsulated. Between this upper plate 11, 13 and the mold is one of the cavities described above.

Landscapes

  • Rectifiers (AREA)
  • Dc-Dc Converters (AREA)

Abstract

L'invention concerne un convertisseur (1) comprenant : au moins deux substrats semiconducteurs (15), dont chacun présente au moins deux surfaces de contact (16, 17) ; deux parties de logement (11, 12) thermoconductrices qui comportent les deux substrats semiconducteurs (15) et présentent chacune un raccord électrique (B+, B-) ; un moyen de fixation (22) formé sur une des parties de logement (11, 12) et au moins un troisième raccord électrique (U, V, W). L'invention est caractérisée en ce que les parties de logement (11, 12) et les substrats semiconducteurs (15) forment des piles (20), en ce que les parties de logement (11, 12) enserrent les substrats semiconducteurs (15), et en ce qu'un élément d'insertion (18) thermoconducteur et électroconducteur, présentant le ou les troisièmes raccords (U, V, W), est placé entre les substrats semiconducteurs (15).
EP01915025A 2000-02-26 2001-02-21 Convertisseur et son procede de production Ceased EP1264346A1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10009171 2000-02-26
DE10009171A DE10009171B4 (de) 2000-02-26 2000-02-26 Stromrichter und sein Herstellverfahren
PCT/DE2001/000666 WO2001063671A1 (fr) 2000-02-26 2001-02-21 Convertisseur et son procede de production

Publications (1)

Publication Number Publication Date
EP1264346A1 true EP1264346A1 (fr) 2002-12-11

Family

ID=7632581

Family Applications (1)

Application Number Title Priority Date Filing Date
EP01915025A Ceased EP1264346A1 (fr) 2000-02-26 2001-02-21 Convertisseur et son procede de production

Country Status (7)

Country Link
US (1) US6774476B2 (fr)
EP (1) EP1264346A1 (fr)
JP (1) JP2003525007A (fr)
AU (1) AU2001242267A1 (fr)
DE (1) DE10009171B4 (fr)
TW (1) TW508832B (fr)
WO (1) WO2001063671A1 (fr)

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JP3673776B2 (ja) 2002-07-03 2005-07-20 株式会社日立製作所 半導体モジュール及び電力変換装置
DE10258035A1 (de) * 2002-12-12 2004-06-24 Robert Bosch Gmbh Einphasiges Stromrichtermodul
EP1528677B1 (fr) 2003-10-30 2006-05-10 Agilent Technologies, Inc. Transformateur à couplage acoustique de couches minces avec deux éléments piézoélectriques à axe-c inversé
DE10352079A1 (de) * 2003-11-08 2005-06-02 Robert Bosch Gmbh Elektromotor, sowie Verfahren zur Herstellung eines solchen
JP4284625B2 (ja) * 2005-06-22 2009-06-24 株式会社デンソー 三相インバータ装置
DE102005039478B4 (de) * 2005-08-18 2007-05-24 Infineon Technologies Ag Leistungshalbleiterbauteil mit Halbleiterchipstapel und Verfahren zur Herstellung desselben
JP4564937B2 (ja) * 2006-04-27 2010-10-20 日立オートモティブシステムズ株式会社 電気回路装置及び電気回路モジュール並びに電力変換装置
FI121613B (fi) * 2006-12-21 2011-01-31 Abb Oy Menetelmä ja järjestelmä jännitevälipiirisellä taajuusmuuttajalla syötetyn moottorin yhteydessä
JP5029824B2 (ja) * 2007-09-20 2012-09-19 株式会社安川電機 マトリクスコンバータ
US8011950B2 (en) 2009-02-18 2011-09-06 Cinch Connectors, Inc. Electrical connector
DE102009024341B4 (de) * 2009-06-09 2012-12-06 Minebea Co., Ltd. Ansteuerschaltung für einen mehrphasigen Elektromotor, bei der die Ansteuerschaltung mitsamt der Brückenschaltung auf einer einzigen Leiterplatte angeordnet ist
DE102010028203A1 (de) * 2010-04-26 2011-10-27 Robert Bosch Gmbh Gleichrichter-Brückenschaltung
MY166609A (en) 2010-09-15 2018-07-17 Semiconductor Components Ind Llc Connector assembly and method of manufacture
DE102016101433A1 (de) * 2016-01-27 2017-07-27 Infineon Technologies Ag Multi-Chip-Halbleiterleistungsgehäuse
US12122251B2 (en) * 2022-09-28 2024-10-22 BorgWarner US Technologies LLC Systems and methods for bidirectional message architecture for inverter for electric vehicle
CN119324973B (zh) * 2024-10-14 2025-09-19 广东电网有限责任公司 一种换流阀监控查看方法、装置、设备及存储介质

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Also Published As

Publication number Publication date
JP2003525007A (ja) 2003-08-19
US20030142480A1 (en) 2003-07-31
DE10009171A1 (de) 2001-09-13
AU2001242267A1 (en) 2001-09-03
TW508832B (en) 2002-11-01
US6774476B2 (en) 2004-08-10
DE10009171B4 (de) 2005-08-11
WO2001063671A1 (fr) 2001-08-30

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