EP1282169A3 - IC-Montagestruktur und Anzeige - Google Patents

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Info

Publication number
EP1282169A3
EP1282169A3 EP02255270A EP02255270A EP1282169A3 EP 1282169 A3 EP1282169 A3 EP 1282169A3 EP 02255270 A EP02255270 A EP 02255270A EP 02255270 A EP02255270 A EP 02255270A EP 1282169 A3 EP1282169 A3 EP 1282169A3
Authority
EP
European Patent Office
Prior art keywords
mounting structure
chip mounting
display device
chips
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP02255270A
Other languages
English (en)
French (fr)
Other versions
EP1282169A2 (de
Inventor
Hirokazu c/o Hitachi Ltd. Inoue
Toyoshi c/o Fujitsu Hitachi Plasma Display Kawada
Yuji c/o Fujitsu Hitachi Plasma Display Ltd. Sano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Maxell Ltd
Original Assignee
Fujitsu Hitachi Plasma Display Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Hitachi Plasma Display Ltd filed Critical Fujitsu Hitachi Plasma Display Ltd
Publication of EP1282169A2 publication Critical patent/EP1282169A2/de
Publication of EP1282169A3 publication Critical patent/EP1282169A3/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/688—Flexible insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/157—Containers comprising an insulating or insulated base having interconnections parallel to the insulating or insulated base
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of flexible or folded printed circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
EP02255270A 2001-07-30 2002-07-29 IC-Montagestruktur und Anzeige Withdrawn EP1282169A3 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2001230307 2001-07-30
JP2001230307 2001-07-30
JP2002197621A JP3983120B2 (ja) 2001-07-30 2002-07-05 Ｉｃチップの実装構造及びディスプレイ装置
JP2002197621 2002-07-05

Publications (2)

Publication Number Publication Date
EP1282169A2 EP1282169A2 (de) 2003-02-05
EP1282169A3 true EP1282169A3 (de) 2005-10-05

Family

ID=26619581

Family Applications (1)

Application Number Title Priority Date Filing Date
EP02255270A Withdrawn EP1282169A3 (de) 2001-07-30 2002-07-29 IC-Montagestruktur und Anzeige

Country Status (6)

Country Link
US (1) US6703702B2 (de)
EP (1) EP1282169A3 (de)
JP (1) JP3983120B2 (de)
KR (2) KR100893810B1 (de)
CN (1) CN1231954C (de)
TW (1) TWI221266B (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10444557B2 (en) 2016-04-13 2019-10-15 Boe Technology Group Co., Ltd. Display module and display device

Families Citing this family (164)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1217799B1 (de) 2000-12-22 2007-01-24 Sun Microsystems, Inc. Serverseitige Ausführung von Anwendungsmodulen in einem Client/Server-System
KR100477990B1 (ko) * 2002-09-10 2005-03-23 삼성에스디아이 주식회사 플라즈마 디스플레이 패널 및 그 구동 장치와 구동 방법
JP3922152B2 (ja) * 2002-09-27 2007-05-30 住友電気工業株式会社 光モジュール
JP2004139186A (ja) * 2002-10-15 2004-05-13 Toshiba Corp 電子機器
US6921975B2 (en) * 2003-04-18 2005-07-26 Freescale Semiconductor, Inc. Circuit device with at least partial packaging, exposed active surface and a voltage reference plane
US6838776B2 (en) 2003-04-18 2005-01-04 Freescale Semiconductor, Inc. Circuit device with at least partial packaging and method for forming
KR100549666B1 (ko) * 2003-05-23 2006-02-08 엘지전자 주식회사 플라즈마 디스플레이 패널의 구동장치
JP4543772B2 (ja) * 2003-09-19 2010-09-15 セイコーエプソン株式会社 電気光学装置および電子機器
CN100375916C (zh) * 2003-09-29 2008-03-19 友达光电股份有限公司 液晶显示器模块
JP4617652B2 (ja) * 2003-10-03 2011-01-26 ソニー株式会社 電子機器の放熱機構
KR100615174B1 (ko) * 2003-10-14 2006-08-25 삼성에스디아이 주식회사 플라즈마 표시장치
KR100589399B1 (ko) * 2003-10-16 2006-06-13 삼성에스디아이 주식회사 드라이버 ｉｃ 방열구조를 갖는 플라즈마 디스플레이 장치
KR100625976B1 (ko) * 2003-10-16 2006-09-20 삼성에스디아이 주식회사 플라즈마 디스플레이 장치
US20050088092A1 (en) * 2003-10-17 2005-04-28 Myoung-Kon Kim Plasma display apparatus
KR100649182B1 (ko) * 2004-03-04 2006-11-24 삼성에스디아이 주식회사 드라이버 ｉｃ 방열구조를 갖는 플라즈마 디스플레이 장치
KR100542190B1 (ko) * 2003-10-17 2006-01-11 삼성에스디아이 주식회사 드라이버 ｉｃ 방열구조를 갖는 플라즈마 디스플레이 장치
KR100627382B1 (ko) * 2003-10-23 2006-09-22 삼성에스디아이 주식회사 드라이버 ｉｃ 방열구조를 갖는 플라즈마 디스플레이 장치
KR100627259B1 (ko) * 2003-10-23 2006-09-22 삼성에스디아이 주식회사 테이프 캐리어 패키지를 갖는 플라즈마 디스플레이 장치
KR100627381B1 (ko) * 2003-10-23 2006-09-22 삼성에스디아이 주식회사 드라이버 ｉｃ 방열구조를 갖는 플라즈마 디스플레이 장치
KR100669368B1 (ko) * 2003-10-23 2007-01-15 삼성에스디아이 주식회사 드라이버 ｉｃ 방열구조를 갖는 플라즈마 디스플레이 장치
KR100536249B1 (ko) * 2003-10-24 2005-12-12 삼성에스디아이 주식회사 플라즈마 디스플레이 패널 및 이의 구동장치 및 방법
KR100627383B1 (ko) 2003-10-24 2006-09-22 삼성에스디아이 주식회사 드라이버 ｉｃ 방열구조를 갖는 플라즈마 디스플레이 장치
KR100627303B1 (ko) 2003-10-29 2006-09-22 삼성에스디아이 주식회사 플라즈마 디스플레이 장치
US7414204B2 (en) 2003-10-29 2008-08-19 Samsung Sdi Co., Ltd. Display device and heat dissipating means therefor
KR100669696B1 (ko) * 2003-11-08 2007-01-16 삼성에스디아이 주식회사 플라즈마 표시장치
KR100627280B1 (ko) 2003-11-24 2006-09-25 삼성에스디아이 주식회사 드라이버 ｉｃ의 방열구조를 갖는 플라즈마 디스플레이 장치
KR100696465B1 (ko) * 2003-11-25 2007-03-19 삼성에스디아이 주식회사 플라즈마 디스플레이 장치
KR100589370B1 (ko) * 2003-11-26 2006-06-14 삼성에스디아이 주식회사 플라즈마 디스플레이 장치
KR100578919B1 (ko) * 2003-11-26 2006-05-11 삼성에스디아이 주식회사 플라즈마 디스플레이 장치와 이 장치에 적용되는 ｔｃｐ및 그 제조 방법
KR100708643B1 (ko) * 2003-11-27 2007-04-17 삼성에스디아이 주식회사 플라즈마 표시 장치
KR100647592B1 (ko) * 2003-11-28 2006-11-17 삼성에스디아이 주식회사 플라즈마 디스플레이 장치
KR100603322B1 (ko) * 2003-11-29 2006-07-20 삼성에스디아이 주식회사 플라즈마 표시장치
TWI268526B (en) * 2003-12-05 2006-12-11 Au Optronics Corp Plasma display
CN1555080B (zh) * 2003-12-19 2010-05-12 友达光电股份有限公司 等离子显示器
KR100669706B1 (ko) * 2004-02-10 2007-01-16 삼성에스디아이 주식회사 플라즈마 디스플레이 장치
KR100637149B1 (ko) * 2004-02-20 2006-10-20 삼성에스디아이 주식회사 플라즈마 디스플레이 장치
KR100637151B1 (ko) 2004-02-21 2006-10-23 삼성에스디아이 주식회사 플라즈마 디스플레이 장치
US6967439B2 (en) * 2004-02-24 2005-11-22 Eastman Kodak Company OLED display having thermally conductive backplate
US7508673B2 (en) 2004-03-04 2009-03-24 Samsung Sdi Co., Ltd. Heat dissipating apparatus for plasma display device
KR100740118B1 (ko) * 2004-03-30 2007-07-16 삼성에스디아이 주식회사 플라즈마 디스플레이 장치와 이 장치에 적용되는 ｔｃｐ
TWI278795B (en) * 2004-04-20 2007-04-11 Fujitsu Hitachi Plasma Display Display device
KR100570622B1 (ko) * 2004-04-21 2006-04-12 삼성에스디아이 주식회사 플라즈마 디스플레이 장치 및 이에 사용되는 샤시베이스의 제조 방법
JP2005338707A (ja) * 2004-05-31 2005-12-08 Matsushita Electric Ind Co Ltd プラズマディスプレイ装置
JP2005338706A (ja) * 2004-05-31 2005-12-08 Matsushita Electric Ind Co Ltd プラズマディスプレイ装置
KR100626012B1 (ko) * 2004-06-30 2006-09-20 삼성에스디아이 주식회사 플라즈마 디스플레이 장치
KR100563069B1 (ko) * 2004-06-30 2006-03-24 삼성에스디아이 주식회사 플라즈마 디스플레이 장치
US6972963B1 (en) * 2004-07-02 2005-12-06 Chunghwa Picture Tubes Electronic apparatus having structure for protecting flexible printed circuit and chip thereon
US7142001B2 (en) * 2004-07-07 2006-11-28 Robert Bosch Gmbh Packaged circuit module for improved installation and operation
JP2006064939A (ja) * 2004-08-26 2006-03-09 Optrex Corp 表示装置
KR100615246B1 (ko) 2004-08-28 2006-08-25 삼성에스디아이 주식회사 플라즈마 디스플레이 장치
JP2006073683A (ja) * 2004-08-31 2006-03-16 Sony Corp 回路デバイス及び回路デバイスの製造方法
KR20060021707A (ko) * 2004-09-03 2006-03-08 엘지전자 주식회사 플라즈마 디스플레이 패널용 티씨피의 히트 싱크 어셈블리장치
KR100669729B1 (ko) * 2004-09-21 2007-01-16 삼성에스디아이 주식회사 플라즈마 디스플레이 장치
KR100648695B1 (ko) * 2004-10-11 2006-11-23 삼성에스디아이 주식회사 플라즈마 디스플레이 장치
KR100669327B1 (ko) * 2004-10-11 2007-01-15 삼성에스디아이 주식회사 플라즈마 디스플레이 장치
KR100741063B1 (ko) 2004-10-15 2007-07-20 삼성에스디아이 주식회사 플라즈마 디스플레이 장치
KR100669756B1 (ko) * 2004-11-11 2007-01-16 삼성에스디아이 주식회사 플라즈마 표시장치 조립체
KR100683703B1 (ko) * 2004-11-17 2007-02-15 삼성에스디아이 주식회사 플라즈마 디스플레이 장치
KR100659071B1 (ko) * 2004-11-19 2006-12-21 삼성에스디아이 주식회사 플라즈마 디스플레이 장치
KR100684793B1 (ko) 2004-12-07 2007-02-20 삼성에스디아이 주식회사 릴상의 테이프 캐리어 패키지와 이를 적용한 플라즈마디스플레이 장치
KR100705818B1 (ko) * 2004-12-09 2007-04-10 엘지전자 주식회사 드라이브 보드상에 데이타 드라이브 아이씨칩이 실장된플라즈마 표시 패널 유니트
KR100730135B1 (ko) * 2004-12-09 2007-06-19 삼성에스디아이 주식회사 플라즈마 디스플레이 장치
JP4426430B2 (ja) * 2004-12-15 2010-03-03 日東電工株式会社 カテーテル及びその製造方法
KR20060072783A (ko) * 2004-12-23 2006-06-28 엘지전자 주식회사 플라즈마 표시장치
JP4581726B2 (ja) * 2004-12-28 2010-11-17 ソニー株式会社 表示装置および携帯機器
JP4623061B2 (ja) * 2004-12-28 2011-02-02 ソニー株式会社 表示装置および携帯機器
KR20060080409A (ko) * 2005-01-05 2006-07-10 삼성에스디아이 주식회사 플라즈마 디스플레이 패널의 직부착 필터의 접지용브라켓의 장착방법 및 그 장착구조
US20060158075A1 (en) * 2005-01-14 2006-07-20 Au Optronics Corporation Plasma display panel thermal dissipation-equilibration apparatus and mehtod
US7843116B2 (en) * 2005-01-14 2010-11-30 Au Optronics Corporation Plasma display panel thermal dissipation apparatus and method
KR100670273B1 (ko) * 2005-01-18 2007-01-16 삼성에스디아이 주식회사 플라즈마 디스플레이 장치용 방열 조립체 및 이를구비하는 플라즈마 디스플레이 장치
KR100759550B1 (ko) 2005-01-20 2007-09-18 삼성에스디아이 주식회사 디스플레이 모듈
KR100741073B1 (ko) * 2005-01-22 2007-07-20 삼성에스디아이 주식회사 디스플레이 장치용 신호전달부재의 방열 기구 및 이를구비한 플라즈마 디스플레이 장치
KR100749463B1 (ko) * 2005-01-31 2007-08-14 삼성에스디아이 주식회사 플라즈마 디스플레이 장치
KR100739051B1 (ko) * 2005-02-01 2007-07-12 삼성에스디아이 주식회사 플라즈마 디스플레이 장치
KR100683759B1 (ko) * 2005-02-03 2007-02-20 삼성에스디아이 주식회사 플라즈마 디스플레이 장치
KR100709244B1 (ko) * 2005-02-16 2007-04-19 삼성에스디아이 주식회사 플라즈마 디스플레이 장치
KR100637214B1 (ko) * 2005-02-19 2006-10-23 삼성에스디아이 주식회사 커버플레이트 장착구조 및 이를 구비한 플라즈마 디스플레이 모듈
KR20060098689A (ko) * 2005-03-03 2006-09-19 엘지전자 주식회사 티씨피 모듈의 그라운드 강화 설계 구조
KR100637217B1 (ko) 2005-03-03 2006-10-23 삼성에스디아이 주식회사 플라즈마 디스플레이 장치
KR100759553B1 (ko) 2005-04-06 2007-09-18 삼성에스디아이 주식회사 플라즈마 디스플레이 모듈
KR100759554B1 (ko) 2005-04-12 2007-09-18 삼성에스디아이 주식회사 플라즈마 디스플레이 모듈
KR100701957B1 (ko) 2005-04-15 2007-03-30 엘지전자 주식회사 플라즈마 디스플레이 패널
KR100696627B1 (ko) * 2005-04-21 2007-03-19 삼성에스디아이 주식회사 플라즈마 디스플레이 장치
CN100409274C (zh) * 2005-04-26 2008-08-06 中强光电股份有限公司 用于平面显示装置中的散热装置
KR100696515B1 (ko) * 2005-04-26 2007-03-19 삼성에스디아이 주식회사 플라즈마 디스플레이 장치
KR100696517B1 (ko) * 2005-05-02 2007-03-19 삼성에스디아이 주식회사 플라즈마 디스플레이 모듈의 집적회로칩 방열 구조 및 이를구비한 플라즈마 디스플레이 모듈
KR100730136B1 (ko) 2005-06-16 2007-06-19 삼성에스디아이 주식회사 플라즈마 디스플레이 모듈의 집적회로칩 방열 구조 및 이를구비한 플라즈마 디스플레이 모듈
WO2006136984A2 (en) * 2005-06-21 2006-12-28 Koninklijke Philips Electronics N.V. Thin film circuit connections
KR100709855B1 (ko) * 2005-07-04 2007-04-23 삼성에스디아이 주식회사 플라즈마 표시장치
CN100514396C (zh) * 2005-07-05 2009-07-15 中华映管股份有限公司 等离子体显示器
KR100649566B1 (ko) * 2005-07-07 2006-11-27 삼성에스디아이 주식회사 플라즈마 디스플레이 패널
US20100134459A1 (en) * 2005-07-12 2010-06-03 Toyoshi Kawada Flat display device
KR100652748B1 (ko) 2005-07-19 2006-12-01 엘지전자 주식회사 엘시디모듈 및 이를 구비한 이동통신 단말기
KR100649216B1 (ko) * 2005-07-21 2006-11-24 삼성에스디아이 주식회사 플라즈마 디스플레이 장치
JPWO2007020697A1 (ja) * 2005-08-18 2009-02-19 日立プラズマディスプレイ株式会社 フラットディスプレイ装置
KR20070038771A (ko) 2005-10-06 2007-04-11 엘지전자 주식회사 플라즈마 디스플레이 장치
KR100749621B1 (ko) * 2005-12-08 2007-08-14 삼성에스디아이 주식회사 플라즈마 표시장치
KR100759562B1 (ko) * 2005-12-22 2007-09-18 삼성에스디아이 주식회사 디스플레이 장치용 섀시 조립체 및 이를 구비한 디스플레이장치
KR100793549B1 (ko) * 2006-03-08 2008-01-14 엘지이노텍 주식회사 액정표시모듈 및 이를 구비하는 이동통신 단말기
KR100814819B1 (ko) * 2006-10-31 2008-03-20 삼성에스디아이 주식회사 플라즈마 디스플레이 장치
WO2008072302A1 (ja) * 2006-12-11 2008-06-19 Hitachi Plasma Display Limited 駆動回路基板装置
JP2008203376A (ja) * 2007-02-19 2008-09-04 Matsushita Electric Ind Co Ltd 半導体装置、並びに表示装置
KR100852696B1 (ko) * 2007-03-19 2008-08-19 삼성에스디아이 주식회사 플라즈마 디스플레이 장치
US8035789B2 (en) * 2007-03-19 2011-10-11 Sony Corporation Mounting structure, electro-optical device, input device, method of manufacturing mounting structure, and electronic apparatus
JP5147268B2 (ja) * 2007-03-20 2013-02-20 キヤノン株式会社 フラットパネル表示装置
US7926173B2 (en) * 2007-07-05 2011-04-19 Occam Portfolio Llc Method of making a circuit assembly
JP5029890B2 (ja) * 2007-07-13 2012-09-19 日本精機株式会社 表示装置
JP4466692B2 (ja) 2007-07-18 2010-05-26 セイコーエプソン株式会社 半導体装置
CN101755335B (zh) * 2007-07-19 2012-07-11 日本电气株式会社 电子部件安装装置及其制造方法
JP2009080894A (ja) * 2007-09-26 2009-04-16 Toshiba Corp 磁気ディスク装置
KR100907235B1 (ko) 2007-10-30 2009-07-10 히다찌 플라즈마 디스플레이 가부시키가이샤 플랫 디스플레이 장치
KR20090067744A (ko) * 2007-12-21 2009-06-25 엘지전자 주식회사 연성 필름
KR100896439B1 (ko) * 2007-12-26 2009-05-14 엘지전자 주식회사 연성 필름
KR100889002B1 (ko) * 2007-12-27 2009-03-19 엘지전자 주식회사 연성 필름
KR100947607B1 (ko) * 2007-12-27 2010-03-15 엘지전자 주식회사 연성 필름
US20110110037A1 (en) * 2008-02-01 2011-05-12 Toshiya Yamaguchi Driver module structure
JP4466744B2 (ja) * 2008-02-06 2010-05-26 株式会社デンソー 電子装置の放熱構造
KR100926611B1 (ko) * 2008-07-15 2009-11-11 삼성에스디아이 주식회사 스캔 구동장치 및 이를 이용한 플라즈마 디스플레이 장치
RU2467245C1 (ru) * 2008-10-01 2012-11-20 Шарп Кабусики Кайся Электронное устройство, осветительное устройство, устройство отображения и телевизионный приемник
CN101730385B (zh) * 2008-10-10 2012-07-04 深圳富泰宏精密工业有限公司 电路板结构
JPWO2010044291A1 (ja) * 2008-10-17 2012-03-15 シャープ株式会社 表示装置及びその製造方法
JP2010267954A (ja) * 2009-04-15 2010-11-25 Panasonic Corp 電子機器
US8698391B2 (en) * 2009-04-29 2014-04-15 Global Oled Technology Llc Chiplet display with oriented chiplets and busses
JP5273553B2 (ja) * 2009-05-29 2013-08-28 日本精機株式会社 液晶表示装置
JP2011013605A (ja) * 2009-07-06 2011-01-20 Hitachi Displays Ltd 表示装置
CN101964159B (zh) * 2009-07-21 2012-09-05 旭曜科技股份有限公司 移动通讯装置用显示模块
KR20110014033A (ko) * 2009-08-04 2011-02-10 삼성에스디아이 주식회사 플라즈마 디스플레이 장치
TWI383735B (zh) * 2009-11-23 2013-01-21 Chimei Innolux Corp 液晶顯示裝置
US8879273B2 (en) * 2010-12-23 2014-11-04 Sony Corporation Mobile terminal and casing connecting structure
JPWO2012104929A1 (ja) * 2011-01-31 2014-07-03 パナソニック株式会社 撮像装置
US8488335B2 (en) * 2011-04-18 2013-07-16 Japan Display West, Inc. Electro-optical device and electronic apparatus
CN202256953U (zh) * 2011-09-20 2012-05-30 深圳市华星光电技术有限公司 液晶显示装置
US20130070189A1 (en) * 2011-09-20 2013-03-21 Shenzhen China Star Optoelectronics Technology Co. Ltd. Liquid crystal display device
WO2014002779A1 (ja) 2012-06-29 2014-01-03 ソニー株式会社 表示装置
US10103297B2 (en) 2012-12-10 2018-10-16 Daktronics, Inc. Encapsulation of light-emitting elements on a display module
EP3179468B1 (de) * 2012-12-10 2022-01-19 Daktronics, Inc. Verkapselung von lichtemittierenden elementen auf einem anzeigemodul
KR20140079062A (ko) 2012-12-18 2014-06-26 삼성전자주식회사 반도체 패키지 및 이를 이용한 표시 장치
TWI527505B (zh) * 2013-01-10 2016-03-21 元太科技工業股份有限公司 電路基板結構及其製造方法
CN103345882B (zh) * 2013-06-24 2015-02-04 句容骏成电子有限公司 一种cob产品扭脚、检测气动一体化装置
US9089051B2 (en) 2013-06-27 2015-07-21 International Business Machines Corporation Multichip module with stiffening frame and associated covers
JP2015056265A (ja) * 2013-09-11 2015-03-23 株式会社東芝 電子機器
JP6379616B2 (ja) * 2014-04-17 2018-08-29 セイコーエプソン株式会社 電気光学装置及び電子機器
KR102415651B1 (ko) * 2015-07-01 2022-07-01 엘지전자 주식회사 이동 단말기
KR102571574B1 (ko) * 2015-12-16 2023-08-25 엘지디스플레이 주식회사 플렉서블 필름 및 이를 포함하는 액정 표시 장치
CN205620644U (zh) * 2016-05-17 2016-10-05 京东方科技集团股份有限公司 一种显示装置
US10925160B1 (en) * 2016-06-28 2021-02-16 Amazon Technologies, Inc. Electronic device with a display assembly and silicon circuit board substrate
JP6829377B2 (ja) * 2016-10-20 2021-02-10 三菱電機株式会社 表示装置
CN108205973A (zh) * 2016-12-19 2018-06-26 上海和辉光电有限公司 一种柔性显示屏及其制作方法
CN106910422B (zh) * 2017-03-30 2020-04-21 武汉天马微电子有限公司 一种显示面板和显示设备
KR101911270B1 (ko) 2017-04-27 2018-10-24 엘지전자 주식회사 이동 단말기
JP6856777B2 (ja) 2017-05-15 2021-04-14 エルジー イノテック カンパニー リミテッド オールインワンチップオンフィルム用軟性回路基板及びこれを含むチップパッケージ、及びこれを含む電子デバイス
KR102351372B1 (ko) 2017-07-06 2022-01-14 삼성전자주식회사 디스플레이를 구비한 전자장치
US10276487B1 (en) 2017-10-18 2019-04-30 Micron Technology, Inc. Semiconductor device with flexible circuit for enabling non-destructive attaching and detaching of device to system board
US10477691B2 (en) 2017-12-13 2019-11-12 E Ink Holdings Inc. Flexible display device and manufacturing method thereof
CN108241240B (zh) * 2018-02-08 2021-05-14 上海天马微电子有限公司 一种显示面板以及显示装置
KR102093497B1 (ko) * 2018-07-11 2020-03-26 삼성디스플레이 주식회사 표시모듈 및 이를 포함하는 표시장치
KR102633441B1 (ko) * 2018-12-03 2024-02-06 삼성디스플레이 주식회사 표시 유닛, 이를 포함하는 전자 장치, 및 전자 장치의 제조 방법
KR102756827B1 (ko) 2019-03-20 2025-01-20 삼성전자주식회사 칩 온 필름 패키지 및 이를 포함하는 표시 장치
CN210489211U (zh) * 2019-11-29 2020-05-08 北京京东方显示技术有限公司 一种驱动电路板以及显示装置
CN111221181A (zh) * 2020-01-20 2020-06-02 深圳市华星光电半导体显示技术有限公司 背光源及其制备方法
CN113539091B (zh) * 2021-07-13 2023-11-24 京东方科技集团股份有限公司 一种显示装置
KR20230020068A (ko) 2021-08-02 2023-02-10 삼성디스플레이 주식회사 표시 장치
CN116645882B (zh) * 2023-05-30 2026-01-23 京东方科技集团股份有限公司 显示模组及其制备方法、显示装置
KR20260049379A (ko) * 2024-10-04 2026-04-14 삼성디스플레이 주식회사 표시 장치

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0568392A2 (de) * 1992-04-30 1993-11-03 Sharp Kabushiki Kaisha Zusammenbaustruktur und Verfahren für eine flache Anzeigevorrichtung und geeignete Vorrichtung und Verfahren zum Zuführen und Aushärten von Harz
US5581443A (en) * 1994-09-14 1996-12-03 Kabushiki Kaisha Toshiba Structure for cooling a circuit module having a circuit board and a heat-generating IC chip mounted on the board, and portable electronic apparatus incorporating the structure
EP1041633A1 (de) * 1998-09-09 2000-10-04 Seiko Epson Corporation Halbleiter; seine herstellung, leiterplatte und elektronisches apparat
JP2000299416A (ja) * 1999-04-13 2000-10-24 Fuji Electric Co Ltd ドライバーモジュール構造
EP1065720A2 (de) * 1999-06-30 2001-01-03 Fujitsu Limited Treiber-IC-Modulgehäuse und Flachbildschirm damit
US20010004313A1 (en) * 1999-12-13 2001-06-21 Kabushiki Kaisha Toshiba Cooling unit for cooling circuit component generating heat and electronic apparatus comprising the cooling unit

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2803699B2 (ja) 1992-01-21 1998-09-24 富士通株式会社 Ｉｃチップの実装構造
JPH05226487A (ja) * 1992-02-14 1993-09-03 Nec Corp 半導体装置
JP2776344B2 (ja) * 1995-10-26 1998-07-16 日本電気株式会社 液晶表示装置
JPH09283976A (ja) * 1996-04-08 1997-10-31 Kitagawa Ind Co Ltd 放熱・シールド材
JPH10260641A (ja) 1997-03-17 1998-09-29 Nec Corp フラットパネル型表示装置用ドライバｉｃの実装構造
JP2991172B2 (ja) * 1997-10-24 1999-12-20 日本電気株式会社 半導体装置
JP2000172191A (ja) 1998-12-04 2000-06-23 Fujitsu Ltd 平面表示装置
JP2000250425A (ja) 1999-02-25 2000-09-14 Fujitsu Ltd ドライバｉｃ実装モジュール
JP3450213B2 (ja) 1999-03-18 2003-09-22 Ｎｅｃエレクトロニクス株式会社 フラットパネル型表示装置
US6365978B1 (en) * 1999-04-02 2002-04-02 Texas Instruments Incorporated Electrical redundancy for improved mechanical reliability in ball grid array packages
JP3367554B2 (ja) 1999-10-13 2003-01-14 日本電気株式会社 フリップチップパッケージ

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0568392A2 (de) * 1992-04-30 1993-11-03 Sharp Kabushiki Kaisha Zusammenbaustruktur und Verfahren für eine flache Anzeigevorrichtung und geeignete Vorrichtung und Verfahren zum Zuführen und Aushärten von Harz
US5581443A (en) * 1994-09-14 1996-12-03 Kabushiki Kaisha Toshiba Structure for cooling a circuit module having a circuit board and a heat-generating IC chip mounted on the board, and portable electronic apparatus incorporating the structure
EP1041633A1 (de) * 1998-09-09 2000-10-04 Seiko Epson Corporation Halbleiter; seine herstellung, leiterplatte und elektronisches apparat
JP2000299416A (ja) * 1999-04-13 2000-10-24 Fuji Electric Co Ltd ドライバーモジュール構造
EP1065720A2 (de) * 1999-06-30 2001-01-03 Fujitsu Limited Treiber-IC-Modulgehäuse und Flachbildschirm damit
US20010004313A1 (en) * 1999-12-13 2001-06-21 Kabushiki Kaisha Toshiba Cooling unit for cooling circuit component generating heat and electronic apparatus comprising the cooling unit

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 13 5 February 2001 (2001-02-05) *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10444557B2 (en) 2016-04-13 2019-10-15 Boe Technology Group Co., Ltd. Display module and display device

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