EP1285459A2 - Procede pour charger et decharger un bassin de traitement - Google Patents

Procede pour charger et decharger un bassin de traitement

Info

Publication number
EP1285459A2
EP1285459A2 EP01921357A EP01921357A EP1285459A2 EP 1285459 A2 EP1285459 A2 EP 1285459A2 EP 01921357 A EP01921357 A EP 01921357A EP 01921357 A EP01921357 A EP 01921357A EP 1285459 A2 EP1285459 A2 EP 1285459A2
Authority
EP
European Patent Office
Prior art keywords
substrates
gripper
basin
treatment
receiving slots
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP01921357A
Other languages
German (de)
English (en)
Inventor
Thomas Rodewaldt
Felix Wehrle
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mattson Wet Products GmbH
Original Assignee
Mattson Wet Products GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mattson Wet Products GmbH filed Critical Mattson Wet Products GmbH
Publication of EP1285459A2 publication Critical patent/EP1285459A2/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7612—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by lifting arrangements, e.g. lift pins

Definitions

  • the present invention relates to a method for loading a treatment basin with disc-shaped substrates, in particular semiconductor wafers, and a method for unloading disc-shaped substrates, in particular semiconductor wafers from a treatment basin.
  • guide slots are provided in the side walls of the basin for receiving and guiding semiconductor wafers.
  • a lifting element which is generally arranged in the center, is provided in the form of a knife-like bar with which the wafers are lowered and raised in the basin.
  • a transport hood with guide slots is provided which correspond to the guide slots in the treatment basin.
  • a locking mechanism nism inside the hood is able to fix the wafers in the hood.
  • This system has the disadvantage that the hood must first be loaded in order to then load the treatment basin. Furthermore, the hood itself must be unloaded again after the treatment basin has been unloaded, which considerably increases the handling effort of the treatment system.
  • the structure of the hood is also relatively large and complex.
  • the hood has the problem that gases rising from the treatment pool collect in the hood and are precipitated on the side walls of the hood. It is not possible with the hood to handle substrates wetted with treatment liquid in the course of the treatment, since the treatment liquid also wets the hood itself and the guide slots provided therein. Due to the structure of the hood, the treatment liquid cannot be removed from the hood. This leads to contamination of the wafers and / or subsequent treatment areas.
  • DE-A-196 378 75 shows a system for the wet treatment of substrates in a container containing a treatment fluid.
  • the substrates with a substrate carrier are used in the container.
  • the substrates are aligned and centered in the container by means of a substrate receiving device provided in the container.
  • the substrates are moved into a hood placed over the container with lateral guide slots, the lateral guide tion slots in the hood with guide devices of the substrate receiving device are aligned.
  • a wafer cleaning device is also known from JP-A-052 706 60, in which the wafers are inserted with a wafer gripper into a container filled with treatment fluid.
  • the wafer holder is inserted with the wafers into the treatment container and the wafers are transferred to a stationary receptacle provided in the treatment container by opening the gripper.
  • the gripper is moved out of the treatment tank during the treatment.
  • the wafers are removed in the reverse manner.
  • JP 05 338 794 which has a wafer gripper with two opposite gripper arms with guides for receiving the wafer.
  • the guides in the gripper arms are made of a material that is softer than that of the wafers to prevent the substrates from being damaged by friction between the guides and the substrates.
  • the present invention is based on the object of simplifying the handling of substrates, in particular the loading and unloading of disk-shaped substrates into and out of the treatment basin and the risk of contamination of the Reduce substrates.
  • this object is achieved in a method for loading a treatment basin with disk-shaped substrates, in particular semiconductor wafers, with the following method steps: gripping the substrates with a gripper which has at least two opposing gripping elements with receiving slots facing one another; Positioning the substrate above the treatment basin such that the substrates are aligned with guide slots within the treatment basin; Lowering the gripper to partially lower the substrates into the treatment tank until the substrates have a raised substrate lifting element in the loading contact action pool; partial movement of the gripping elements into a position in which the substrates are no longer held but are guided in the receiving slots; further lowering of the substrates into the treatment basin by lowering the lifting element.
  • a treatment basin with lateral guide slots can be loaded directly by a substrate gripper in a simple manner. Since the gripping elements of the substrate gripper are controlled in such a way that they provide guidance of the substrates when lowering into the treatment basin through the lifting element, the risk of tilting and damage to the substrates is prevented.
  • the gripper can be of simple construction, and the fact that there is no closed hood with side walls greatly reduces the risk of contamination of the wafers.
  • the gripping elements preferably follow the contour of the substrates. For a seamless transition between the guidance through the gripping elements and the guidance through the guide slots within the basin, the gripping elements are lowered onto an upper edge of the basin or into a position directly above the edge.
  • the object of the invention is also achieved in a method for unloading disk-shaped substrates, in particular semiconductor wafers, from a treatment tank with a substrate lifting element and guide slots in the tank in that a gripper which has at least two opposite gripping elements with mutually facing receiving slots, above the treatment basin is positioned such that the guide slots in the basin and the receiving slots in the gripping elements are aligned with each other; the substrates are lifted and inserted into the receiving slots of the gripping elements; the gripping elements for gripping the substrates are moved towards one another; and the substrates are then lifted out of the treatment tank by lifting the gripper.
  • a gripper with a simple shape which in turn has no large areas, can be used those contaminants that could be transferred to the substrates.
  • the gripping elements follow the contour of the substrates.
  • the gripping elements are preferably positioned on or just above an upper edge of the treatment basin during the lifting of the substrates.
  • the gripper preferably grips the substrates below their center line.
  • FIG. 1 shows a perspective view of a wafer treatment device, certain components being omitted to simplify the illustration;
  • Figure 2 is a perspective view of a substrate gripper, the
  • Figure 3 is a schematic representation of slots in racks of the substrate gripper
  • Figures 4, 5 and 6 different process steps when loading a semiconductor wafer in a treatment tank.
  • FIG. 1 shows a device 1 for treating semiconductor wafers.
  • the device has a wafer handling device 3 with a gripper 5, which can best be seen in FIG. 2.
  • the gripper 5 is formed by two essentially horizontally arranged toothed racks 7, 8 which are fastened to rotatable shafts 13, 14 via respective arms 10, 11.
  • the racks 7 have receiving slots 15 for
  • the receiving slots 15 of the racks 7 and 8 face each other and have a guide and centering area 16 and a holding area 17, as best shown in FIG. 3 can be seen.
  • the guiding and centering area 16 has inclined surfaces 18 which run towards one another and on which the semiconductor wafers can slide in order to achieve centering with respect to the receiving slots 15.
  • the holding area 17 directly adjoins the guiding and centering area 16 at the point where the inclined surfaces 18 are closest to one another.
  • the holding area 17 also has inclined surfaces 19 which run towards one another.
  • the inclined surfaces 19 converge towards one another at an acute angle, like the inclined surfaces 18. In the holding area of the receiving slots, tight and precise guidance and a secure hold of the wafers 20 are ensured.
  • the racks 7, 8 can be moved towards and away from one another by rotating the respective shafts 13, 14, as will be described in more detail below.
  • the gripper 5 can also be moved vertically and horizontally, specifically by means of corresponding movement mechanisms which are arranged on a vertically running rail 24 or on a horizontally running guide rail 26.
  • the device 1 has a plurality of treatment basins, which are not shown in FIG. 1 to simplify the illustration.
  • FIGS. 4 to 6 show treatment tanks 28 schematically.
  • the treatment tanks can be filled with a treatment fluid via lines (not shown).
  • FIG. 1 shows vertical guide rails 35 for two lifting elements 33 arranged in different treatment basins.
  • the device 1 shown in FIG. 1 has a hood 36 which can be placed over the treatment basin (not shown) and which can be moved via suitable vertical and horizontal guide rails of the device. The hood 36 is used when the wafer is dried according to the Marangoni method after treatment in one of the basins.
  • the movement of the gripper 5 or the hood 36 takes place via suitable drive units, e.g. Servomotors 37.
  • a large number of semiconductor wafers 20 are gripped by the gripper 5.
  • the wafers 20 are received in the holding areas 17 of the receiving slots 15 of the toothed racks 7, 8 and guided laterally.
  • the gripper 5 is then moved over the treatment basin 28 in such a way that the wafers 20 are aligned with guide slots formed between the guide elements 30, 31.
  • the gripper 5 is then lowered into the position shown in FIG. 4, in which the toothed racks 7, 8 are arranged just above an upper edge of the treatment basin 28.
  • the wafers 20 are partially introduced into the treatment basin 28.
  • the lifting element 33 is in a raised position and contacts the wafer 20 at a lower point.
  • FIG. 5 shows an exemplary intermediate position of the lifting element 33 during the lowering process.
  • the wafers 20 are still guided through the toothed racks 7, 8.
  • the wafers 20 are also already guided through the guide slots formed between the guide projections 30, 31.
  • FIG. 6 shows a completely lowered position of the wafers 20, in which they rest on the lifting element 33 and are only guided through the guide projections 30, 31 in the treatment basin.
  • the gripper 5 can, as soon as the wafers 20 are guided through the guide projections 30, 31 in the basin 28, swing open further and be moved away from the region of the treatment basin, for example in order to load or treat another treatment basin. to unload.
  • the lifting element 33 When the lifting element 33 is lowered, it is possible to control the toothed racks 7, 8 in such a way that they follow the contour of the wafers 20, i.e. that the racks 7, 8 are moved towards or away from each other in accordance with the wafer contour. This provides a particularly long guidance when the wafers are lowered by the toothed racks 7, 8.
  • the guide elements 30, 31 within the treatment basin 28 can therefore be reduced to a minimum, which improves the flow conditions in the basin.
  • the unloading of the treatment basin 28 takes place in the opposite way to the loading.
  • the gripper 5 is moved into the position shown in FIG. 6 above the basin 28, the guide regions 16 of the receiving slots 15 of the toothed racks 7, 8 being aligned with the guide slots in the treatment basin.
  • the wafers are over the Lifting element 33 is raised and accommodated in the guide areas 16, the wafers 20 being centered on the receiving slots 15 of the toothed racks 7, 8 because of the conically shaped guide surfaces, as shown in FIG.
  • the wafers When the wafers are raised to such an extent that the racks 7, 8 lie in a predetermined position, for example below a center line of the wafers 20, they are moved towards one another in order to insert and grip the wafers 20 in the holding regions 17 of the receiving slots, such as it is shown in Figure 3. Finally, the gripper 5 is raised in order to completely lift the wafer 20 out of the basin 28.
  • the shape of the gripper 5 can deviate from the shape shown.
  • the racks 7, 8 it is not necessary for the racks 7, 8 to be pivoted via the shafts 13, 14 and the connecting arms 10, 11. Rather, it is also possible to move the racks 7, 8 linearly towards and away from one another.

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Specific Conveyance Elements (AREA)

Abstract

L'invention concerne un procédé pour charger et décharger un bassin de traitement. L'objectif de l'invention est de simplifier le chargement d'un bassin de traitement avec des substrats en forme de disque et également le déchargement de ce basin. A cet effet, les substrats en forme de disque sont saisis pendant le chargement par un preneur qui comprend au moins deux éléments preneurs opposés comportant des fentes de réception en vis-à-vis. Les substrats sont placés au-dessus du bassin de traitement de telle sorte qu'ils sont alignés par rapport à des fentes de guidage, dans le bassin de traitement. Le preneur est abaissé de façon à abaisser partiellement les substrats partiellement dans le bassin de traitement, jusqu'à ce qu'ils viennent en contact avec un élément de levage de substrat, levé, à l'intérieur du bassin de traitement. Les éléments preneurs sont ensuite séparés l'un de l'autre pour prendre une position dans laquelle les substrats ne sont plus maintenus mais toutefois guidés dans les fentes de réception, les substrats étant alors abaissés dans le bassin de traitement par abaissement de l'élément de levage. Pour le déchargement des substrats, un preneur qui comprend au moins deux éléments preneurs opposés pourvus de fentes de réception en vis-à-vis est placé au-dessus du bassin de traitement de telle sorte que des fentes de guidage du bassin et les fentes de réception des éléments preneurs soient alignées. Les substrats sont ensuite levés par l'élément de levage de substrat et introduits dans les fentes de réception des éléments preneurs. Lorsqu'une position prédéterminée est atteinte, les éléments preneurs sont rapprochés l'un de l'autre pour qu'ils puissent saisir les substrats, ces derniers étant sortis du bassin de traitement par levage du preneur.
EP01921357A 2000-04-05 2001-03-29 Procede pour charger et decharger un bassin de traitement Withdrawn EP1285459A2 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10017010A DE10017010C2 (de) 2000-04-05 2000-04-05 Verfahren zum Be- und Entladen eines Behandlungsbeckens
DE10017010 2000-04-05
PCT/EP2001/003577 WO2001078112A1 (fr) 2000-04-05 2001-03-29 Procede pour charger et decharger un bassin de traitement

Publications (1)

Publication Number Publication Date
EP1285459A2 true EP1285459A2 (fr) 2003-02-26

Family

ID=7637724

Family Applications (1)

Application Number Title Priority Date Filing Date
EP01921357A Withdrawn EP1285459A2 (fr) 2000-04-05 2001-03-29 Procede pour charger et decharger un bassin de traitement

Country Status (7)

Country Link
US (1) US20030108409A1 (fr)
EP (1) EP1285459A2 (fr)
JP (1) JP2003530282A (fr)
KR (1) KR20020087478A (fr)
DE (1) DE10017010C2 (fr)
TW (1) TW508340B (fr)
WO (1) WO2001078112A1 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10239578A1 (de) * 2002-08-28 2004-03-18 Mattson Wet Products Gmbh Vorrichtung und Verfahren zum Behandeln von Substraten
KR101203894B1 (ko) * 2010-06-16 2012-11-23 주식회사 에스에프에이 기판 그립 장치
DE102023210126A1 (de) 2023-10-16 2025-04-17 Freiberger Compound Materials Gesellschaft mit beschränkter Haftung Verfahren zur Herstellung eines III-V-Substrats, insbesondere GaAs und InP
JP7744477B2 (ja) * 2023-11-09 2025-09-25 深▲セン▼市昇維旭技術有限公司 ウェーハ処理装置及び処理方法

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US5505577A (en) * 1990-11-17 1996-04-09 Tokyo Electron Limited Transfer apparatus
US5188499A (en) * 1990-12-14 1993-02-23 Mactronix Method and apparatus for varying wafer spacing
JPH05270660A (ja) * 1992-03-24 1993-10-19 Tokyo Electron Ltd 洗浄処理装置
JP3002604B2 (ja) * 1992-06-11 2000-01-24 三菱電機株式会社 製品搬送用ハンド
JP3194209B2 (ja) * 1992-11-10 2001-07-30 東京エレクトロン株式会社 洗浄処理装置
JPH06196467A (ja) * 1992-12-24 1994-07-15 Fujitsu Ltd 半導体製造装置
JPH07297165A (ja) * 1994-04-22 1995-11-10 Nippon Steel Corp 半導体基板の洗浄液乾燥方法
US5730162A (en) * 1995-01-12 1998-03-24 Tokyo Electron Limited Apparatus and method for washing substrates
US5853496A (en) * 1995-08-08 1998-12-29 Tokyo Electron Limited Transfer machine, transfer method, cleaning machine, and cleaning method
JPH09172052A (ja) * 1995-12-19 1997-06-30 Fujitsu Ltd ウェーハ移載装置及びウェーハ移載方法
DE19637875C2 (de) * 1996-04-17 1999-07-22 Steag Micro Tech Gmbh Anlage zur Naßbehandlung von Substraten
DE19652526C2 (de) * 1996-04-22 2000-12-07 Steag Micro Tech Gmbh Transporteinrichtung für Substrate und Verfahren zum Beladen der Transporteinrichtung mit Substraten
JP3548373B2 (ja) * 1997-03-24 2004-07-28 大日本スクリーン製造株式会社 基板処理装置
JPH11121585A (ja) * 1997-10-17 1999-04-30 Olympus Optical Co Ltd ウェハ搬送装置
US6457929B2 (en) * 1998-11-03 2002-10-01 Seh America, Inc. Apparatus and method for automatically transferring wafers between wafer holders in a liquid environment

Non-Patent Citations (1)

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Title
See references of WO0178112A1 *

Also Published As

Publication number Publication date
WO2001078112A8 (fr) 2002-12-19
US20030108409A1 (en) 2003-06-12
TW508340B (en) 2002-11-01
WO2001078112A1 (fr) 2001-10-18
DE10017010A1 (de) 2001-10-18
DE10017010C2 (de) 2002-02-07
JP2003530282A (ja) 2003-10-14
KR20020087478A (ko) 2002-11-22

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