EP1306162A1 - Polierblatt und herstellungsverfahren dafür - Google Patents

Polierblatt und herstellungsverfahren dafür Download PDF

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Publication number
EP1306162A1
EP1306162A1 EP01954472A EP01954472A EP1306162A1 EP 1306162 A1 EP1306162 A1 EP 1306162A1 EP 01954472 A EP01954472 A EP 01954472A EP 01954472 A EP01954472 A EP 01954472A EP 1306162 A1 EP1306162 A1 EP 1306162A1
Authority
EP
European Patent Office
Prior art keywords
polishing
sheet
woven cloth
fibers
fiber bundles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP01954472A
Other languages
English (en)
French (fr)
Inventor
Hisatomo NIHON MICRO COATING Co. LTD OHNO
Toshihiro NIHON MICRO COATING Co. LTD IZUMI
Toshihiro NIHON MICRO COATING CO. LTD KOBAYASHI
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nihon Micro Coating Co Ltd
Original Assignee
Nihon Micro Coating Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nihon Micro Coating Co Ltd filed Critical Nihon Micro Coating Co Ltd
Publication of EP1306162A1 publication Critical patent/EP1306162A1/de
Withdrawn legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/02—Backings, e.g. foils, webs, mesh fabrics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds

Definitions

  • This invention relates to a polishing sheet for polishing a target object requiring a high degree of smoothness for its surface such as semiconductor wafers, liquid crystal glass substrates, magnetic hard disk substrates and magnetic head substrates and a method of producing such a polishing sheet.
  • this invention relates to such a sheet adapted for chemical mechanical polishing.
  • CMP chemical mechanical polishing
  • the CMP method is carried out by use of a polishing liquid containing a component which reacts chemically with the target surface to be polished. While the target surface is chemically etched or while complexes and oxides are being formed on the target surface, the surface is abraded mechanically by free polishing particles contained in the polishing liquid.
  • the CMP method is known to have the advantage of being able to accomplish a very fine polishing work and to make a surface smooth to a very high degree.
  • the so-called multi-layer wiring technology is becoming important for increasing the device capacity.
  • the base layer In this multi-layer wiring technology, the base layer must be made extremely flat. If the base layer is uneven with protrusions and indentations, the result in step differences and the wires formed over a step difference are likely to be broken easily. Thus, the desired functions cannot be expected, and the CMP method is relied upon in order to make smooth a wafer having a wiring pattern and an insulating film formed thereon.
  • a CMP method may be used to make a semiconductor wafer flat by supplying an alkaline polishing liquid with a component (such as a water solution of potassium hydroxide) which reacts chemically with the film formed on the wafer surface onto a polishing pad attached to a rotary lapping plate and pressing the wafer onto this pad.
  • a component such as a water solution of potassium hydroxide
  • Prior art examples of a polishing pad used for such a purpose include a pad having a foamed base having many very small holes on the surface (such as a commercially available formed polyurethane pad IC-1000 produced by Rodel, Inc.) and a pad having a sheet of woven cloth comprising plastic fibers affixed to an elastic sheet such as a rubber sheet (as disclosed in Japanese Patent Publication No. Showa 55-90263).
  • These polishing pads were used because the free polishing particles held in the very small surface holes of a foamed material or in spaces between the fibers of the woven cloth were believed to elastically act on the target surface such that the target surface can be polished to a high degree of smoothness.
  • Prior art polishing pads using a foamed material were produced by foaming a mixture of at least two resin materials to form a foamed block and slicing such a foamed block to a desired thickness but it was difficult to control the degree of foaming to be uniform throughout the body of the foamed block.
  • the produced pads were different in the number of holes per unit area of surface and elasticity and local variations were also present even on each produced pad.
  • the polishing surface becomes worn out locally or as a whole, becoming deformed as time passes such that it becomes incapable of polishing the target surface uniformly.
  • the small holes on the polishing surface become clogged with abrading particles and debris such that the polishing rate (the amount polished per unit time) becomes lower.
  • the common practice is to carry out the so-called dressing process by use of a sand plate or the like with hard particles such as diamond particles imbedded to recondition the pad surface.
  • the dressing process is not only time-consuming but also troublesome in that hard particles such as diamond particles removed from the dressing tool become attached to the pad surface, causing unwanted scratches on the target surface to be made smooth.
  • a polishing sheet embodying this invention may be characterized as comprising a woven cloth sheet of a fiber, a fiber bundle with a plurality of fibers bundles up together or a fiber bundle assembly with a plurality of such fiber bundles of the cloth sheet.
  • Such a polishing sheet of the present invention may preferably attached to the surface of a backing sheet of a plastic, woven or non-woven cloth or foamed material by using a resin adhesive of a known kind such as urethane, polyester or acryl resins.
  • Sateen woven cloths may be used as examples of woven sheets. If the sateen number is increased, the surface roughness of the target object can be made smaller and the polishing rate can also be increased.
  • the sateen number is preferably in the range of 1-15 and more preferably in the range of 3-15.
  • Woven sheets of this invention may comprises fibers of known kinds not only for the purpose of polishing but also for general use. Fibers with thickness equal to or less than 0.1 deniers are used for reducing the surface roughness of the target object and to increase the rate of polishing. Polyester fibers of thickness equal to 0.1 deniers or smaller are preferably used.
  • Examples of resin for fixing the fibers or fiber bundles of a woven sheet include urethane resins, polyester resins and acryl resins. Urethane resins may preferably be used.
  • the density of resin in the resin solution is preferably in the range of 0.1%-30%.
  • the resin solution of this invention is obtained by dissolving such a resin material in water, alcohol or water-based solvent such as an organic solvent.
  • Polishing sheets of this invention as described above may be produced by impregnating such a woven cloth as described above with a resin solution and then drying the woven cloth impregnated with the resin solution.
  • a target object is polished by causing a polishing liquid to be present between a polishing pad or a polishing tape made of a polishing sheet of this invention and the surface of the target object to be polished and causing a relative motion between the target object and the polishing pad or the polishing tape.
  • a polishing liquid with a component which chemically interacts appropriately with the surface of the target object is preferably selected for carrying out a chemical mechanical polishing process. The invention does not require whether the polishing liquid should or should not contain abrading particles.
  • a polishing sheet 10 embodying this invention is characterized as comprising a sheet 12 having single fibers 13, fiber bundles 13 with a plurality of fibers tied together or assembles 13 of a plurality of fiber bundles each with a plurality of fibers and a resin material 14 fixing these fibers 13 and these fiber bundles 13 together.
  • the polishing sheet 10 is affixed to the surface of a backing sheet 15 by using an adhesive agent 16 of a known kind such as a urethane resin, a polyester resin or an acryl resin.
  • Examples of material to be used for the backing sheet 15 includes plastic sheets such as polyester, polypropylene or polyethylene terephthalate sheets, woven cloth sheets, non-woven cloth sheets and foamed sheets made of a foamed material such as foamed urethane.
  • sateen woven fibers and fiber bundles 13 may be used as the woven cloth sheet 12. If the sateen number in this case is too small, the polishing rate becomes too small and the surface roughness of the target object after the polishing process becomes large. If the sateen number is increased, the polishing rate becomes larger and the surface roughness of the polished target object becomes small but if the sateen number is made too large, the polishing sheet becomes too easily deformed. It is therefore preferred that the sateen number be equal to 15 or less and more preferably in the range of 3-15.
  • Fig,1(a) shows an example where the sateen number is 5.
  • fibers 13 forming the woven cloth sheet 12 of this invention include one or more selected from synthetic fibers such as nylon, polyester, acryl, vinylon, vinyl polychloride, polyethylene, vinyliden, polyurethane, polychlal, rayon, polynosic, cupra, acetate, triacetate and promix and natural fibers such as carbon fibers, silk, wool, cotton and hemp.
  • Fibers with thickness equal to or less than 0.1 deniers are used in order to make the surface roughness of the target object small and the polishing rate high. Polyester fibers with thickness equal to or less than 0.1 deniers are preferred.
  • the resin solution to be impregnated in the woven cloth sheet 12 is obtained by dissolving a known kind of urethane or polyester resin in water.
  • the density of resin in the resin solution is in the range of 0.1%-30%.
  • a urethane resin solution may preferably bu used such that the fibers and fiber bundles of the woven cloth sheet 12 are fixed together by urethane resin 14.
  • the polishing sheet 10 as shown in Figs.1(a) and 1(b) is produced by impregnating the woven cloth sheet 12 with a resin solution and drying this woven cloth sheet 12 impregnated with the resin solution such that the fibers and fiber bundles 13 of the woven cloth sheet 12 become fixed together by a resin 14.
  • the resin solution may be impregnated in the woven cloth sheet 12 by using a spray or by submerging the woven cloth sheet 12 in a tank containing the resin solution.
  • the woven cloth sheet 12 may be affixed to the backing sheet 15 without using the adhesive agent 16 but by pressing the woven cloth sheet 12 impregnated with the resin solution against the surface of the backing sheet 15 and drying the resin solution.
  • a double-faced adhesive tape of a known kind may be used on the backing sheet 15.
  • the polishing of the surface of a target object is accomplished by causing a polishing liquid to exist between a polishing pad or a polishing tape made of the polishing sheet 10 as shown in Figs.1(a) and 1(b) and causing the polishing pad or the polishing tape and the target object to move with respect to each other.
  • a polishing pad 10 made of a polishing sheet of this invention is adsorbed to a head H and while the lapping plate D and the head H are rotated as shown by arrows, a polishing liquid is supplied through a nozzle N onto the polishing pad 10 on the lapping plate D and the target object 11 is pressed on the polishing pad 10 on the lapping plate D.
  • a target object 11 such as a glass plate for liquid crystal
  • a holder S such as a frame
  • a polishing liquid is supplied to the surface of this target object 11 through a nozzle N, a head H to which the polishing pad 10 made of a polishing sheet of this invention is attached in pressed against it and caused to move horizontally on a serpentine path on the surface of the target object 11.
  • a target object 11 such as a semiconductor wafer to be adsorbed onto a head H.
  • a belt-shaped polishing pad 10 made of a polishing sheet of this invention is run in the direction shown by an arrow.
  • a polishing liquid is supplied onto the surface of the polishing pad 10 through a nozzle N, and the target object 11 adsorbed to the head H is pressed against the polishing pad 10 running over a platen P having an elastic material (not shown) affixed to its surface.
  • a target object 11 such as a semiconductor wafer
  • a drum C with the polishing pad 10 made of a polishing sheet of this invention pasted around it is caused to rotate as shown by another arrow.
  • a polishing liquid is supplied onto the surface of the polishing pad 10 around the drum C and the target object 11 adsorbed to the head H is pressed against it.
  • a target object 11 such as a semiconductor wafer to be adsorbed onto a head H and rotating the head H as shown by a an arrow while a polishing liquid is supplied through a nozzle N onto the polishing tape 10 made of a polishing sheet of this invention sent out from a supply roller R1 in the direction of another arrow.
  • the target object adsorbed to the head H is pressed against the polishing tape 10 on a platen P having an elastic material (not shown) affixed to its surface.
  • the polishing tape 10 is sequentially rolled around by a take-up roller R2.
  • the polishing tape 10 may be moved either continuously or intermittently such that the motion is stopped while the target object 11 is being pushed onto the surface of the polishing tape 10.
  • a known kind of polishing liquid used for polishing with free abrading particles may be used but those containing a component which chemically react with the surface of the target object are preferred. This is because, as explained above, the chemical mechanical polishing has the advantage of being able to carry out a high degree of planarization.
  • acidic solutions, solutions containing an oxidant, solution containing a chelating agent, or alkaline solutions such as those containing potassium hydroxide solution or sodium hydroxide solution may be used.
  • Examples of abrading particles dispersed in the polishing liquid include known kinds such as particles of silica, cerium oxide, alumina, zirconia and diamond.
  • the chemical mechanical polishing method it does not matter whether abrading particles are used or not. If a polishing liquid containing abrading particles is used, the rate of polishing becomes greater than if a polishing pad based on a foamed material is used. If a polishing liquid not containing abrading particles is used, the rate of polishing is about the same as if a polishing pad based on a foamed material is used.
  • a woven cloth sheet was prepared by using fiber bundles of 12 bundles each tying together 70 bundles of polyester fibers of thickness 0.06 deniers as weft and with sateen number of 8 and was impregnated with a resin solution prepared by dissolving urethane resin (concentration 10%) in water.
  • the impregnated woven cloth sheet was dried and then attached to the surface of a polyethylene terephthalate (PET) sheet by using an acryl adhesive agent to produce a polishing sheet embodying this invention. This polishing sheet was cut to produce a polishing pad of Test Example 1.
  • a woven cloth sheet was prepared by using fiber bundles of 12 bundles each tying together 70 bundles of polyester fibers of thickness 0.06 deniers both as weft and warp and with sateen number of 5 and was impregnated with the same resin solution prepared in Test Example 1.
  • the impregnated woven cloth sheet was dried and then attached to the surface of a PET sheet by using a double-sided acryl adhesive tape to produce a polishing sheet embodying this invention. This polishing sheet was cut to produce a polishing pad of Test Example 2.
  • a woven cloth sheet was prepared by using fiber bundles of 12 bundles each tying together 70 bundles of polyester fibers of thickness 0.06 deniers both as weft and warp and with sateen number of 1 (plain weave) and was impregnated with the same resin solution prepared in Test Example 1.
  • the impregnated woven cloth sheet was dried and then attached to the surface of a PET sheet by using a double-sided acryl adhesive tape to produce a polishing sheet embodying this invention. This polishing sheet was cut to produce a polishing pad of Test Example 3.
  • a woven cloth sheet was prepared by using fiber bundles of 12 bundles each tying together 70 bundles of polyester fibers of thickness 0.06 deniers both as weft and warp and with sateen number of 3 and was impregnated with the same resin solution prepared in Test Example 1.
  • the impregnated woven cloth sheet was dried and then attached to the surface of a PET sheet by using a double-sided acryl adhesive tape to produce a polishing sheet embodying this invention. This polishing sheet was cut to produce a polishing pad of Test Example 4.
  • ⁇ COMPARISON EXAMPLE 1> A woven cloth sheet was prepared by using fiber bundles of 12 bundles each tying together 70 bundles of polyester fibers of thickness 0.06 deniers both as weft and warp and with sateen number of 3 and was attached to the surface of a PET sheet by using a double-sided acryl adhesive tape to produce a polishing sheet embodying this invention. This polishing sheet was cut to produce a polishing pad of Comparison Example 1.
  • ⁇ COMPARISON EXAMPLE 2> This was a commercially available foamed polyurethane pad (IC-1000 produced by Rodel, Inc.).
  • a woven cloth sheet was prepared by using fiber bundles of 34 bundles each tying polyester fibers of thickness 1.18 deniers both as weft and warp and with sateen number of 1 (plain weave) and was impregnated with the same resin solution prepared in Test Example 1.
  • the impregnated woven cloth sheet was dried and then attached to the surface of a PET sheet by using a double-sided acryl adhesive tape to produce a polishing sheet embodying this invention.
  • This polishing sheet was cut to produce a polishing pad of Comparison Example 3.
  • ⁇ POLISHING TEST 1> The effects of sateen number on the polishing rate and the surface roughness of a target object were examined.
  • target objects were 8-inch silicon wafers having a Cu film of thickness 8000 ⁇ formed thereon by spattering. They were polished by using Polishing Liquid A shown in Table 2 below, containing alumina particles with average particle diameter of 0.1 ⁇ m, and a polishing machine of the rotary lapping type (Mechpol E550 produced by Presi Co., Ltd.) as shown in Fig.2, under the conditions shown in Table 1.
  • Polishing Liquid A shown in Table 2 below, containing alumina particles with average particle diameter of 0.1 ⁇ m, and a polishing machine of the rotary lapping type (Mechpol E550 produced by Presi Co., Ltd.) as shown in Fig.2, under the conditions shown in Table 1.
  • the rate of polishing (in units of ⁇ /minute) was determined by using 4-probe contact type resistance sensor for measurement of film thickness to measure the abraded film thickness per unit time.
  • Surface roughness (in units of ⁇ ) was measured by using a white color interference type surface roughness sensor (NEW VIEW produced by Zygo Co., Ltd.).
  • NAW VIEW produced by Zygo Co., Ltd.
  • Polishing pads from Test Example 4 and Comparison Examples 1 and 2 were used to polish wafers of the same kind as used in Polishing Test 1. Polishing Liquid A as used in Polishing Test 1 and Polishing Liquid B not containing abrading particles as described in Table 4 were used. It is to be noted that Polishing Liquid B contains the same components that react chemically with the Cu film to form complexes on the surface as does Polishing Liquid A.
  • the surface roughness was equally good (about 3.0 ⁇ - about 4.0 ⁇ ) whether a pad of Test Example 4 was used or a pad of Comparison Example 1 or 2 was used but it was found that the surface of the wafer with Cu film as a whole was much more uniformly smooth if a pad of Test Example 4 was used than if a pad of Comparison Example 1 or 2 was used.
  • the shape of the polishing sheet is stabilized and is not easily deformed.
  • the target surface can be polished smoothly at a high rate of polishing even without the use of abrading particles.
  • the target surface can be polished smoothly at a high rate of polishing even without the use of abrading particles.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Woven Fabrics (AREA)
EP01954472A 2001-06-06 2001-08-06 Polierblatt und herstellungsverfahren dafür Withdrawn EP1306162A1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2001208559 2001-06-06
JP2001208559A JP2002361564A (ja) 2001-06-06 2001-06-06 研磨シート及びその製造方法
PCT/JP2001/006754 WO2002100595A1 (en) 2001-06-06 2001-08-06 Polishing sheet and method of manufacturing the sheet

Publications (1)

Publication Number Publication Date
EP1306162A1 true EP1306162A1 (de) 2003-05-02

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Family Applications (1)

Application Number Title Priority Date Filing Date
EP01954472A Withdrawn EP1306162A1 (de) 2001-06-06 2001-08-06 Polierblatt und herstellungsverfahren dafür

Country Status (6)

Country Link
EP (1) EP1306162A1 (de)
JP (1) JP2002361564A (de)
KR (1) KR20030022098A (de)
CN (1) CN1438930A (de)
TW (1) TW490364B (de)
WO (1) WO2002100595A1 (de)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2025459A3 (de) * 2007-08-16 2014-06-25 Rohm and Haas Electronic Materials CMP Holdings, Inc. Gitter mit Drahtschichten für chemisch-mechanisches Polieren
WO2016120516A1 (en) * 2015-01-28 2016-08-04 Kwh Mirka Ltd A polishing pad and material and manufacturing method for such
US11273535B2 (en) 2015-08-21 2022-03-15 Pferd Milwaukee Brush Company, Inc. Abrasive tool and method for producing an abrasive tool of this kind

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005199362A (ja) * 2004-01-13 2005-07-28 Yuichiro Niizaki ブラシ毛素材および研磨ブラシ
US7824249B2 (en) * 2007-02-05 2010-11-02 San Fang Chemical Industry Co., Ltd. Polishing material having polishing particles and method for making the same
US7635290B2 (en) * 2007-08-15 2009-12-22 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Interpenetrating network for chemical mechanical polishing
WO2011046017A1 (ja) * 2009-10-14 2011-04-21 株式会社クラレ 研磨パッド
TWI713526B (zh) * 2016-05-20 2020-12-21 智勝科技股份有限公司 基底層、具有基底層的研磨墊及研磨方法
TWI587981B (zh) * 2016-09-02 2017-06-21 Mesh emery cloth with open holes

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2036247A1 (en) * 1990-03-29 1991-09-30 Jeffrey L. Berger Nonwoven surface finishing articles reinforced with a polymer backing layer and method of making same
JP3774302B2 (ja) * 1997-09-11 2006-05-10 株式会社クラレ 研磨用布帛
JPH1199479A (ja) * 1997-09-30 1999-04-13 Teijin Ltd 研磨パッド

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO02100595A1 *

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2025459A3 (de) * 2007-08-16 2014-06-25 Rohm and Haas Electronic Materials CMP Holdings, Inc. Gitter mit Drahtschichten für chemisch-mechanisches Polieren
WO2016120516A1 (en) * 2015-01-28 2016-08-04 Kwh Mirka Ltd A polishing pad and material and manufacturing method for such
US10632591B2 (en) 2015-01-28 2020-04-28 Kwh Mirka Ltd Polishing pad and material and manufacturing method for such
US11273535B2 (en) 2015-08-21 2022-03-15 Pferd Milwaukee Brush Company, Inc. Abrasive tool and method for producing an abrasive tool of this kind

Also Published As

Publication number Publication date
WO2002100595A1 (en) 2002-12-19
JP2002361564A (ja) 2002-12-18
TW490364B (en) 2002-06-11
KR20030022098A (ko) 2003-03-15
CN1438930A (zh) 2003-08-27

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