EP1420917A1 - Procede et dispositif de micro-usinage d'une piece a usiner au moyen d'un rayonnement laser - Google Patents

Procede et dispositif de micro-usinage d'une piece a usiner au moyen d'un rayonnement laser

Info

Publication number
EP1420917A1
EP1420917A1 EP02769865A EP02769865A EP1420917A1 EP 1420917 A1 EP1420917 A1 EP 1420917A1 EP 02769865 A EP02769865 A EP 02769865A EP 02769865 A EP02769865 A EP 02769865A EP 1420917 A1 EP1420917 A1 EP 1420917A1
Authority
EP
European Patent Office
Prior art keywords
workpiece
sacrificial layer
laser
laser radiation
micromachining
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
EP02769865A
Other languages
German (de)
English (en)
Inventor
Henning Hanebuth
Eberhard Kull
Günter KAMLAGE
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Siemens Corp
Original Assignee
Siemens AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG, Siemens Corp filed Critical Siemens AG
Publication of EP1420917A1 publication Critical patent/EP1420917A1/fr
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B23K26/0734—Shaping the laser spot into an annular shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1 ns or less
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/18—Working by laser beam, e.g. welding, cutting or boring using absorbing layers on the workpiece, e.g. for marking or protecting purposes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/02—Iron or ferrous alloys
    • B23K2103/04—Steel or steel alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/02—Iron or ferrous alloys
    • B23K2103/04—Steel or steel alloys
    • B23K2103/05—Stainless steel
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B23K2103/12—Copper or alloys thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials

Definitions

  • the invention relates to a method for micromachining a workpiece, in particular for producing a hole in the workpiece, by means of ultra-short pulsed laser radiation.
  • the radius of the rounding is essentially influenced by the beam caustics in the focal point area, ie the sharper the radiation is focused, the greater the rounding radius on the surface of the workpiece.
  • the minimum focal diameter and the divergence angle are mainly determined by the world length of the laser radiation used, the diameter of the laser light emerging from the laser and the focal length of the focusing optics.
  • both the pulse energy and the pulse number have an influence on the edge geometry of the workpiece to be machined.
  • Percussion drilling d. H. when drilling with a rigid laser beam and a stationary workpiece, an increase in the rounding at the leading edge of the laser light on the workpiece can be observed with increasing pulse number and increasing pulse energy.
  • Another problem is that the particles removed from the workpiece during drilling are deposited in the vicinity of the borehole during the drilling process and interfere with the continuation of the drilling process. The particles can stick to the surface and then have to be removed afterwards.
  • the problem of edge rounding has been solved by galvanically coating the surface of the workpiece to be machined with a sacrificial layer made of copper, so that the edge entry side profile that is typical for laser drilling can form therein.
  • the use of the sacrificial layer also has the advantage that that of the
  • Drilling loosened material particles are deposited on the surface of the sacrificial layer and are removed together with the sacrificial layer when it is removed.
  • the sacrificial layer is removed by being stripped off with an acid.
  • This process is very complex. The duration of the step must be determined so that the workpiece itself is not attacked by the acid becomes.
  • hydrogen is generated during scraping, which penetrates into the surface of the workpiece and embrittles it.
  • a very high pressure-loaded metallic material such as is used in a diesel injection nozzle, there is a risk of hydrogen embrittlement
  • Another problem with processing with conventional pulsed lasers is that with laser pulses in the nanosecond range, the laser energy causes a fusion in the transition area between the sacrificial layer and the workpiece, which leads to plastic deformations in the transition region between the sacrificial layer and the workpiece. After removing the sacrificial layer, an undesirable ridge remains.
  • this object is achieved in one of the methods of the type mentioned at the outset in that a sacrificial layer is placed firmly on a surface of the workpiece, that subsequently ultrashort laser pulses are generated which penetrate the sacrificial layer and remove material of the workpiece, and that after sufficient removal of Material of the workpiece the sacrificial layer is removed.
  • the sacrificial layer is not chemically firmly connected to the workpiece to be machined, the sacrificial layer can be easily removed after laser processing. To do this, the sacrificial layer only has to be pushed away or lifted off. Together with the sacrificial layer the particles removed from the workpiece and deposited on the free surface of the sacrificial layer are also removed. The edge profile with the edge rounding caused by the laser radiation is formed in the sacrificial layer and is removed with it. This creates a sharp-edged contour at the transition between the surface of the workpiece and the depression or hole caused by the laser radiation.
  • ultra-short laser pulses enable melt-free removal, i.e. melting of the sacrificial layer with the workpiece is avoided.
  • the fact that the sacrificial layer lies on the workpiece without any gaps means that the workpiece can be precisely removed without any edges being wrinkled. Rather, sharp edged edges are on
  • Drilled holes or other depressions in the workpiece produced by the laser pulses are Drilled holes or other depressions in the workpiece produced by the laser pulses.
  • the workpiece is irradiated with laser pulses that have a length of less than 500 picoseconds, in particular less than 1 picosecond.
  • materials for the sacrificial layer in particular those which consist of a soft material which can be adapted to the surface shape of the workpiece and whose properties are similar to the material of the workpiece.
  • a correspondingly heat-resistant plastic is also suitable.
  • a layer of soft metal is preferably used as the sacrificial layer, since the surface of the soft metal can easily be adapted to the surface of the workpiece.
  • Lead can be used as a soft metal.
  • Copper is particularly suitable as metal.
  • a copper layer of a few hundred micrometers thick is preferably used, for example with a thickness of 200 ⁇ m.
  • the invention also relates to a device with an ultra-short-pulsed laser for carrying out one of the methods identified above.
  • the device according to the invention has means for focusing the laser beam. This means that precise micromachined workpieces can be produced.
  • means for rotating the direction of polarization of the laser beam and the workpiece relative to one another during the machining process are preferred
  • the plane of polarization of the laser beam has a substantially vertical axis. This measure also increases the precision in micromachining.
  • the method according to the invention makes it possible to produce injection nozzles for fuel injection, cooling bores in turbine blades, control throttles for hydraulic applications and spinnerets.
  • Fig. 3 shows a nozzle tip of an injection nozzle with spray holes.
  • a laser system 1 according to the invention has an ultrashort pulsed laser which generates laser pulses in the femtosecond range.
  • the laser is, for example, a Ti: sapphire system that emits pulses with a wavelength of 775 nm.
  • a half-wave plate 2 is arranged in the propagation path of the linearly polarized laser radiation generated by the laser system 1 and is arranged coplanar to the polarization plane of the laser radiation.
  • the plane of polarization of the laser radiation is perpendicular to the plane of the drawing and extends into it, which is indicated by a line P.
  • the half-wave plate 2 serves to rotate the direction of polarization of the laser radiation.
  • the half-wave plate 2 is equipped with a rotary drive device, not shown here, which rotates it about an axis of rotation essentially perpendicular to the plane of polarization.
  • a diffractive optic is arranged in the path of the laser radiation, which forms a device for generating a specific intensity distribution on a workpiece 3 to be machined and is formed by a hologram 4 in the exemplary embodiment shown.
  • the workpiece 3 is designed as a flat plate.
  • the hologram 4 is arranged on a positioning table, which is symbolized in FIG. 1 by an arrow 5 and is used for the exact setting of the distance between the hologram 4 and the workpiece 3 to be processed.
  • the hologram 4 is introduced into a transparent material made of plastic, a polymer, glass, quartz or a salt.
  • a lens system can also be used to diffract the beam of the laser pulses.
  • the workpiece 3 is also arranged on a positioning table, which is indicated in FIG. 1 by an arrow 6 and is used for precise adjustment of the area of the workpiece 3 that is to be machined.
  • a sacrificial layer 7 is placed in front of the workpiece 3 as a plate without gap formation.
  • Fastening means (not shown), in the simplest case an adhesive tape or a screw clamp, are used to produce a detachable connection between the workpiece 3 and the sacrificial layer.
  • the hologram 4 is, for example, a donut hologram, so that when the laser system 1 is operating, an intensity distribution in the form of a circle is established on the sacrificial layer 7 and after removal of the corresponding area on the sacrificial layer 7 on the workpiece 3 itself.
  • the laser radiation from the laser system 1 is directed via the half-wave plate 2 and the hologram 4 onto the sacrificial layer 7 and thus also onto the workpiece 3, so that the intensity distribution is circular.
  • the half-wave plate 2 is through the rotary drive device is continuously driven in rotation, so that the direction of polarization of the laser radiation is continuously rotated in the direction of rotation P in the polarization plane P during the machining process.
  • the laser radiation removes material from the sacrificial layer 7 and then from the workpiece 3 itself. In this case, either a blind hole is produced or a through hole is formed so that the laser radiation emerges again on the exit side 9 of the workpiece 3 facing away from an entry region 8 (FIG. 2c).
  • circularly polarized laser radiation can also be used.
  • a stationary ⁇ / 4 plate is used which circularly polarizes the laser radiation.
  • the workpiece 3 consists, for example, of a case-hardened steel, a nitriding steel or a stainless steel.
  • a nozzle tip 18 of an injection nozzle for a diesel engine has spray holes 19 and 20 which are generated by the laser system 1 when its laser pulses are directed onto the nozzle tip 18 from the outside.
  • a sacrificial layer 21 made of copper is placed on it, which is unwound from a roll, for example. After the respective spray hole 19 or 20 has been formed, the roll is further wound so that new material from the strip of sacrificial material rests on the nozzle tip 18, which then serves as the sacrificial layer 21.
  • the spray holes 19, 20 have a diameter of 100 to 200 microns and a depth in the millimeter range. With the laser system 1, however, bores with a diameter of only 50 ⁇ m can also be achieved.

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

L'invention concerne un procédé de micro-usinage d'une pièce à usiner (3), en particulier pour produire un orifice dans cette pièce à usiner (3), au moyen d'un rayonnement laser à impulsions ultracourtes. Selon ce procédé, une couche sacrificielle (7) est appliquée de manière solide sur une surface de la pièce à usiner (3). Intervient ensuite la production d'impulsions laser ultracourtes lesquelles pénètrent dans la couche sacrificielle (7) et enlèvent de la matière de la pièce à usiner (3). Cette couche sacrificielle (7) est retirée dès qu'une quantité suffisante de matière à été enlevée de ladite pièce à usiner (3).
EP02769865A 2001-08-17 2002-08-12 Procede et dispositif de micro-usinage d'une piece a usiner au moyen d'un rayonnement laser Ceased EP1420917A1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10140533 2001-08-17
DE10140533A DE10140533B4 (de) 2001-08-17 2001-08-17 Verfahren zur Mikrobearbeitung eines Werkstücks mit Laserstrahlung
PCT/DE2002/002958 WO2003018248A1 (fr) 2001-08-17 2002-08-12 Procede et dispositif de micro-usinage d'une piece a usiner au moyen d'un rayonnement laser

Publications (1)

Publication Number Publication Date
EP1420917A1 true EP1420917A1 (fr) 2004-05-26

Family

ID=7695855

Family Applications (1)

Application Number Title Priority Date Filing Date
EP02769865A Ceased EP1420917A1 (fr) 2001-08-17 2002-08-12 Procede et dispositif de micro-usinage d'une piece a usiner au moyen d'un rayonnement laser

Country Status (3)

Country Link
EP (1) EP1420917A1 (fr)
DE (1) DE10140533B4 (fr)
WO (1) WO2003018248A1 (fr)

Families Citing this family (8)

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Publication number Priority date Publication date Assignee Title
WO2004108344A2 (fr) * 2003-06-06 2004-12-16 Siemens Aktiengesellschaft Procede de fabrication de perçages traversants dans des materiaux metalliques
DE10340931A1 (de) * 2003-09-05 2005-03-31 Herbert Walter Verfahren und Vorrichtung zum Bohren feinster Löcher
JP2006150433A (ja) * 2004-12-01 2006-06-15 Fanuc Ltd レーザ加工装置
DE102007024701A1 (de) 2007-05-25 2008-11-27 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur Materialabtragung sowie Vorrichtung zur Durchführung des Verfahrens
DE102007024700A1 (de) * 2007-05-25 2008-12-04 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur Materialbearbeitung mit Laserstrahlung sowie Vorrichtung zur Durchführung des Verfahrens
DE102007051408A1 (de) 2007-10-25 2009-05-28 Prelatec Gmbh Verfahren zum Bohren von Löchern definierter Geometrien mittels Laserstrahlung
NL2009642C2 (nl) * 2012-10-16 2014-04-22 Climate Invest B V Werkwijze voor het bewerken van een oppervlak en bewerkt oppervlak.
EP3296054B1 (fr) 2016-09-19 2020-12-16 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Procédé de fabrication d'une pièce micro-usinée par érosion au laser

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JPS5933091A (ja) * 1982-08-18 1984-02-22 Hitachi Ltd レ−ザ加工方法
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DE19744368A1 (de) * 1997-10-08 1999-05-20 Lzh Laserzentrum Hannover Ev Verfahren und Vorrichtung zur Mikrobearbeitung von Werkstücken mittels Laserstrahlung, insbesondere zum Bilden von im wesentlichen rotationssymmetrischen Ausnehmungen in Werkstücken
AUPP681198A0 (en) * 1998-10-30 1998-11-19 Breville Pty Ltd Sandwich toaster
JP2000202667A (ja) * 1999-01-19 2000-07-25 Toyota Motor Corp インジェクタノズルの微細孔加工方法
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AT408589B (de) * 1999-07-07 2002-01-25 Femtolasers Produktions Gmbh Laservorrichtung
WO2001015819A1 (fr) * 1999-08-30 2001-03-08 Board Of Regents University Of Nebraska-Lincoln Interconnexions electriques en trois dimensions
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Also Published As

Publication number Publication date
DE10140533B4 (de) 2005-04-28
WO2003018248A1 (fr) 2003-03-06
DE10140533A1 (de) 2003-03-06

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