EP1439931A1 - Dispositif et procede de brasage par faisceau laser, notamment brasage fort par faisceau laser - Google Patents

Dispositif et procede de brasage par faisceau laser, notamment brasage fort par faisceau laser

Info

Publication number
EP1439931A1
EP1439931A1 EP02782724A EP02782724A EP1439931A1 EP 1439931 A1 EP1439931 A1 EP 1439931A1 EP 02782724 A EP02782724 A EP 02782724A EP 02782724 A EP02782724 A EP 02782724A EP 1439931 A1 EP1439931 A1 EP 1439931A1
Authority
EP
European Patent Office
Prior art keywords
laser beam
focusing device
focusing
soldering
laser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP02782724A
Other languages
German (de)
English (en)
Inventor
Matthias Negendanck
JüRGEN SCHWAB
Peter Kugler
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Erlas Erlanger Lasertechnik GmbH
Original Assignee
Erlas Erlanger Lasertechnik GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Erlas Erlanger Lasertechnik GmbH filed Critical Erlas Erlanger Lasertechnik GmbH
Publication of EP1439931A1 publication Critical patent/EP1439931A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/005—Soldering by means of radiant energy
    • B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, electron beams [EB]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/042—Automatically aligning the laser beam

Definitions

  • the invention relates to a device for laser beam soldering, in particular for laser brazing, according to the preamble of claim 1, and a method for laser beam soldering, in particular for laser beam brazing, according to claim 16.
  • the laser beam is e.g. in the published patent application DE 197 50 586 A1.
  • Laser beam brazing is a joining process that is used as a connection technique, for example in body construction, to connect two metal sheets in order to produce seams that can be painted over in the visible area.
  • the laser beam serves as a heat source and at the same time heats the two binding partners and the supplied solder material. By melting the filler material and flowing the melt into the joint, a material connection is achieved.
  • Processing heads for laser beam soldering have the tasks of shaping the laser beam in such a way that a suitable intensity profile of the laser beam is generated at the processing location, and bringing the solder material to this processing location with the aid of a feed device.
  • the beam shaping takes place, for example, at a.
  • Processing head for fiber-coupled Nd YAG lasers by collimation by means of a lens 6 of the beam after the fiber 7 and focusing by means of a lens 5 of the laser beam.
  • the laser beam is shaped in such a way that the laser focus 12 at the machining location, which is formed by the surface of the workpiece 8 and the point at which the laser beam strikes, has a diameter of less than 5 mm.
  • the Processing can also take place in the diverging or converging part of the beam caustic.
  • the solder material in the form of wire 1 is directed to the processing location via a tube 3 with a nozzle 2.
  • the wire is adjusted relative to the laser beam before the soldering process.
  • the adjustment is carried out in the commercially available machining heads by a mechanical adjustment device 4 of the feed tube for the solder wire, which are usually provided with translational and rotary adjustment options with clamping devices.
  • An elongated hole device is usually used for the translational adjustment.
  • the operator sets the position of the tube and thus the relative position of the wire to the laser beam by loosening one or more screws, readjusting the tube and tightening the screws.
  • the wire is usually positioned in the center of the laser beam before soldering. It is a rigid attitude.
  • the tracking of the position of the laser beam relative to the joint during soldering can be achieved in the known prior art by adaptive processing heads, the mode of operation of which is outlined in FIG. 2.
  • the tube 3 is mechanically coupled to a deflecting mirror 10 and to the focusing lens 5. Due to the rigid mechanical coupling of the components, the relative position of the laser focus and wire cannot be changed.
  • the functioning of the tracking is based on the wire 1 being guided through the joint. If the position of the wire 1 deviates from the position of the joint, transverse forces arise which are about the mechanical coupling is transmitted to an axis of rotation 9 which is parallel to the direction of feed.
  • the wire 1 is through the joint. tracked and the coupled movement of the deflecting mirror 10 and the focusing lens 5 around the. Rotation axis 9 rotated and thus the laser focus 12 carried.
  • a general disadvantage of this device is that the mechanism described is very sensitive and is irreparably damaged in the event of a collision with the component.
  • the invention is based on the object of proposing a mechanically robust device and a method for laser beam soldering, in particular laser beam brazing, which allow changes in the laser acoustics after the focusing device, preferably a very precise change in position of the laser focus relative to the solder wire and / or to the course of the joint.
  • the object of the invention is achieved with the device according to claim 1 and with the method according to claim 16.
  • the subclaims include expedient refinements and developments.
  • a device with a processing head with a laser beam feed device and focusing device and with a solder material feed is proposed, in which the relative movement in a plane perpendicular to the beam propagation direction from the focusing device to the beam feeding device changes the beam caustics after the focusing device with respect to the processing head, preferably with the Result of a very precise shift of the laser focus.
  • the processing head has a laser beam feed device, which has the task of guiding the laser beam to the focusing device and of an introduction device for the laser beam and, if necessary, additionally of a collimation device, for example when using a fiber-coupled Nd: YAG laser from a fastening device for the optical fiber and one Collimating device, and a focusing device, which is formed for example from focusing lenses, a system of lenses or focusing mirrors.
  • the solder material feed device is attached to the machining head or integrated in the machining head.
  • a device according to claim 1 is used, for example, in the method according to the invention for laser beam soldering, in particular laser beam brazing, it being provided that a laser beam is focused with a focusing device to form a laser focus and a solder material is fed in the area of the laser focus and that during laser beam soldering and / or adjusting the laser beam to the solder material, the focusing device is moved relative to the laser beam in a plane perpendicular to the beam propagation direction. The relative movement relates to the laser beam incident on the focusing device.
  • There are different seam shapes such. B. the seam at the flare or the fillet at the lap joint can be realized.
  • An advantageous embodiment of the method is that the relative movement of the laser beam and focusing device for adjustment takes place before machining and thus preferably enables a highly precise adjustment of the laser focus to the solder material.
  • seam shapes such as the fillet weld at the lap joint, in which two sheets are clamped together with an offset, whereby the throat that is created between the side surface of the upper binding partner and the surface of the lower binding partner is filled with solder
  • the relative position of the laser focus and the solder material must be can be set to within 0.1 mm.
  • a movement of the focusing leads in a plane perpendicular to the beam propagation direction is the same as the direction of the Poynting vector of the • laser beam while the laser beam remains stationary for a very long same or similar movement of the laser focus.
  • the desired relative position between laser focus and solder material can be set.
  • the required accuracy is achieved very well, since the movement of the components can be carried out protected from external influences within the machining head and highly precise displacement devices can be used at this position.
  • These adjustment settings can be made very precisely in one or more directions.
  • a further proposed embodiment of the method consists in that the relative movement of the laser beam and focusing device during the laser beam soldering takes place in one or more directions for tracking the area of the laser focus on the workpiece.
  • the change in the relative position of the laser beam and the focusing device is also used according to the invention to move the laser focus during processing.
  • This movement is preferably carried out to track the laser focus along the joining line.
  • In series production there are manufacturing-related tolerances of the components and thus tolerances in the course of the joining line.
  • Such deviations are compensated for by a correction movement in the form of a tracking of the laser focus.
  • a tracking movement could only be carried out by the adaptive processing head presented in the prior art or by a correction movement of the guiding machine, for example a 6-axis industrial robot, which moves the processing head over the workpiece along the processing path.
  • the device according to the invention characterized in that it has a modular structure, • which means that the presented device is independent of the transfer machine can be used. If you have a robot perform the tracking movement, for example, you are set to this robot type with the respective operating system. A transfer of the process to other guidance machines can only be realized through a large additional development effort. Furthermore, the method according to the invention enables partial sections with and without tracking to be soldered within the soldering process, ie the tracking can be switched on and off. This is advantageous if it turns out that passages of the seam course that are technologically demanding to be soldered are better processed without tracking, for example the beginning or the end of the seam, for which the machining process does not proceed in a steady and quasi-steady state.
  • a further advantageous embodiment is provided by a method in which the relative movement of the laser beam to the focusing device takes place during the laser beam soldering to compensate for different seam shapes.
  • Seam shapes can differ in terms of their geometric shape, material, but also due to different heat dissipation. Differences in the seam shapes require an adapted machining strategy, which can be implemented as follows.
  • the further development of the method enables the lateral position of the laser focus to be changed in a controlled manner in the case of different seam shapes on a component, for example in order to specifically direct the laser focus towards one of the two binding partners or to change the overlap area between the wire and the laser beam in a controlled manner during the soldering process to influence the process.
  • the relative movement is carried out with a movable laser beam feed device and a stationary focusing device
  • components of the laser beam feed device are changed in position, while the focusing device itself remains stationary.
  • the relative movement is carried out with a movable laser beam feed device and a movable focusing device
  • the interaction of the individual movements of the components leads to the desired change in the beam caustic after the focusing device, preferably to shift the laser focus.
  • Versions in which the type of movement of the focusing device is translational offer the possibility of moving the focusing device horizontally in a plane that is perpendicular to the direction of beam propagation.
  • the type of movement of the laser beam feed device is translational
  • the fastening device for the optical fiber and / or the collimating device are changed horizontally in a plane that is perpendicular to the beam propagation direction.
  • the type of movement of the focusing device and / or the beam feed device can also be rotary respectively.
  • the respective components are rotated through an angle around an axis which is either inside or outside the respective component.
  • the described possibilities of movement in the various embodiments enable the position of the individual components to be set very precisely in order to achieve the respectively required change in the beam caustic after the focusing device, preferably the relative position between the laser focus, the component and the wire.
  • the laser beam feed device and / or the focusing device can be moved in two or more directions in one plane perpendicular to the beam propagation direction.
  • This enables the device to change the beam caustic with two or more degrees of freedom, preferably to move the laser focus in two or more directions.
  • the device according to the invention thus offers very high flexibility.
  • the movement which leads to a relative change in position from laser focus to solder wire or from laser focus to the seam, has the advantage that the beam to the wire can be adjusted with high precision or that the laser focus can track the seam course of the component to be machined during machining. These movements usually take place perpendicular to the wire direction or perpendicular to the feed direction.
  • the simplest version is a device in which the drive for the movement of the focusing device and / or the beam feed device is manual. This device is advantageously used before the material processing to set the parameter "overlap". Furthermore, an adjustment of the relative position of the laser focus to the wire is made possible. If the seam geometry to be joined is uniformly asymmetrical, an offset of the laser focus relative to the wire can be achieved with the device ,
  • the drive for the movement of the focusing device and / or the beam feeder device is motorized with external energy allow, in addition to the advantages of the manual drive, further possible uses.
  • the superordinate guiding machines are e.g. 6-axis articulated arm or Cartesian robot for use. Its job is to move the machining head along the joining line over the component.
  • the change in the position of the laser focus relative to the wire or to the component can be carried out dynamically during processing. This means that either the process parameters can be changed or the laser focus can be adjusted during processing.
  • control device of the focusing device and / or beam feed device operated with external energy is a control, in particular a higher-level control of the guiding machine or regulation
  • machining strategies are introduced via the above-mentioned controls or regulations.
  • Figure 1 is a schematic side view of a device for
  • Figure 2 is a schematic side view of a modified device, also according to the known prior art
  • Figure 3 a to a schematic side view of a figure 3 c according to the invention: embodiment in different positions for adjustment
  • FIG. 4 a to enlarged enlargements from FIG. 3;
  • Figure 4 c
  • FIG. 5 a to a schematic side view of a figure 5 c according to the invention: embodiment in the tracking;
  • FIG. 7 a and a schematic side view of a FIG. 7 b according to the invention exemplary embodiment in the compensation of different ones
  • Figure 8 b
  • Figure 9 c the laser focus relative to the wire in the form of a schematic
  • Figure 10 shows another embodiment in perspective view.
  • FIG. 3 shows schematic side views of an exemplary embodiment in various settings for adjustment.
  • the illustrated adjustment process is part of the laser beam soldering process and takes place before the material is processed.
  • a fiber 7, a laser beam 11, a collimating lens 6, a focusing lens 5, a laser focus 12 and the wire 1 are shown.
  • the laser beam 11 is supplied via the fiber 7 and enters the arrangement diverging therefrom. It is aligned in parallel by the collimating lens 6 and focused in the direction of the wire 1 by the focusing lens 5.
  • the processing head in this proposed device consists of the laser beam feed unit with the fiber 7 and the collimating lens 6 and the focusing lens 5.
  • the distance d between the focusing lens 5 and the position of the wire 1 is the machining distance.
  • the wire is inserted before the laser focus 12 or after the laser focus 12. The machining distance is then the respective distance d between the focusing lens 5 and the position of the wire 1.
  • the center line M is formed as an axis of symmetry by the beam feed device, consisting of the fiber 7 and the collimating lens 6.
  • the line MF is the center line of the focusing lens 5.
  • the designation A in each case denotes the enlargements of the detail which are shown in FIG. 4.
  • FIG. 3 the principle of operation of the device according to the invention in the adjustment method according to the invention is shown in an exemplary embodiment.
  • the wire 1 is centered on the center line and the focusing lens 5 is also arranged centered on the center line M.
  • 4 a shows the corresponding enlarged section A with the laser focus 12, the wire 1 and the center line M.
  • the laser focus 12 hits the wire 1 at this Center setting.
  • This adjustment setting of the relative position between laser focus 12 and wire 1 leads to high-quality soldered seams in many soldering applications.
  • the wire 1 is no longer on the center line, for example due to mechanical damage to the solder wire feeder or an inaccurate assembly of the arrangement, but the focusing lens 5 is arranged symmetrically to the center line M.
  • the wire 1 in this arrangement is therefore no longer in the center of the laser focus 12.
  • This relative position is not suitable for most soldering applications and the relative position between the wire 1 and the laser focus 12 must be adjusted ,
  • the adjustment is carried out according to the invention by moving the focusing lens 5 to the right in the illustration in the figure, while the beam feed device consisting of the collimating lens 6 and the fiber 7 remains stationary.
  • the result of the adjustment is shown in Fig. 3 c. Due to the shift, the center line M and the center line MF of the focusing lens 5 have a distance x.
  • the result of the adjustment and the effect on the course of the laser beam 11 after the focusing lens 5 are shown schematically in FIG. 4 c.
  • the ML line is the center line to the laser focus.
  • the displacement x of the focusing lens 5 results in a displacement of the laser focus 12 in the same direction by the same or a similar amount a, so that the laser focus 12 again hits the wire 1 in the center.
  • the exemplary embodiment shows how the laser focus 12 is adjusted relative to the wire 1. If the setting is to be changed in order to achieve a central or asymmetrical positioning of laser focus 12 with respect to wire 1, this is done according to the invention by a translatory movement of the focusing lens 5.
  • FIG. 5 shows schematic side views of the same exemplary embodiment in different working settings for tracking during soldering.
  • the designation A in each case denotes the enlarged sections shown in FIG. 6.
  • 6 ac are the laser focus 12, the wire 1, a flare, which is formed from the left binding partner 51 and the right binding partner 52, is shown with a joint 53 and the center line ML of the laser focus 12.
  • the wire 1 is positively guided in the seam geometry of the flare joint; This means that the wire 1 is guided in the joint 53 in a positive manner during the soldering process through the lateral boundary consisting of the left binding partner 51 and the right binding partner 52.
  • the focusing lens 5, the wire 1 and the joint 53 are arranged symmetrically to the center line M.
  • the laser focus 12 is also symmetrical to the center line M and the wire 1 is struck by the laser focus 12 in the center. This working position leads to high quality solder seams in many soldering applications.
  • Fig. 5 b the flare, consisting of the two binding partners 51 and 52, thus the joint 53 and thus the position of the wire 1 to the center line M is shifted to the right.
  • This offset can be compensated for by tracking the focusing lens 5.
  • the focusing lens 5 is shifted to the right such that the center line MF hits the joint 53 and thus the wire 1 in the center.
  • This tracking movement of the focusing lens 5 can be triggered by a control or regulation.
  • 6 b shows the effect of the described tracking movement on the position of the laser focus 12.
  • the center line ML of the laser focus 12 is now aligned with the joint 53 and consequently with the wire 1.
  • the laser focus 12 hits the wire 1 in the middle.
  • the distance x between the center line M and the center line MF in FIG. 5 b is the same or almost the same as the distance a between the center line M and the laser focus center line ML in FIG. 6 b.
  • the described working position leads to high quality solder seams in many soldering applications.
  • 5 c shows the result of the tracking movement with the device according to the invention by the method according to the invention in the event that during the processing the flare is deviated to the left and the laser focus 12 is tracked.
  • 7 shows schematic side views of the same exemplary embodiment in different working settings for the compensation of different postforms.
  • the designation A in each case denotes the enlarged sections shown in FIG. 8.
  • Fig. 7 a the processing of a flare is shown.
  • the focusing lens is arranged symmetrically to the center line M.
  • 8a shows the components of the flare joint, the left binding partner 51 and the right binding partner 52 with the joint 53, as well as the laser beam 11, the laser focus 12, the wire 1 and the center line M.
  • the laser focus 12 hits the wire 1 and the flare joint in the center, so that good soldering results can be expected in many soldering applications.
  • FIG. 7 b shows the processing of an asymmetrical, flange-like joint geometry.
  • the left binding partner 54, the right binding partner 55, which together form the asymmetrical, flange-like joint geometry, and the joint 53 are shown.
  • the described shape requires an adapted machining strategy in the form of compensation by shifting the focusing lens 5 by the amount x, so that the laser focus 12 is shifted relative to the wire by the same or similar amount a.
  • the offset dimension a to be set is between 0 mm and the diameter of the laser focus 12 and / or the diameter of the laser beam at the machining distance and is preferably a few 0.1 mm in size.
  • Different seam shapes can also occur during the machining of a single component, so that the different seam shapes must be compensated for during machining.
  • the asymmetry of the joint can be formed, for example, by the geometric shape, but also by different materials of the two binding partners or by different heat dissipation in the two binding partners.
  • 7a / b shows an exemplary embodiment of the device according to the invention in the method according to the invention of compensating for different seam shapes.
  • FIG. 9 shows a further exemplary embodiment for different positions of the laser focus 12 relative to the wire 1 in the form of a schematic plan view of the processing zone.
  • the wire 1 and the laser focus 12 are shown.
  • the tip of the wire 1 is symmetrical to the laser focus 12
  • in the middle the overlap of wire 1 and laser focus 12 is minimal
  • in the right illustration the overlap of wire 1 and laser focus 12 is maximum.
  • the laser focus is preferably shifted by moving the focusing device with the structure and function explained above.
  • the size of the overlap is an important parameter in process control.
  • FIG. 10 shows an exemplary embodiment of the invention in a perspective view.
  • the image shows a device according to the invention for laser beam soldering as a processing head, a collimator 16 with a collimating lens (not shown), an optical waveguide plug 17, an adapter plate 15 for fastening the entire device to a guiding machine which guides the entire device along a programmed processing path, a focusing lens 5, two displacement devices 13 and 14 and an intermediate plate 19.
  • a solder wire 1, a wire nozzle 2, and a tube 3 for feeding the filler material to the processing point are attached to this processing head.
  • the solder wire 1 is guided with the tube 3 and brought through the nozzle 2 to the processing point.
  • the laser beam is brought into the device via an optical fiber cable (not shown) which is fastened in the optical fiber connector 17.
  • the laser beam passes through the collimator 16 and through the collimating lens (not shown) arranged in the collimator 16 and through the focusing lens 5 to the processing point.
  • the intermediate plate 19 serves as a suspension for the assembly, which consists of the linear displacement devices 13 and 14 and the focusing lens 5.
  • the focusing lens 5 is moved in the plane perpendicular to the beam propagation direction.
  • the laser focus on the workpiece level also shifts into the same Direction by the same or a similar amount of length.
  • the two linear units 13 and 14 are set.
  • the two linear units are moved by external motor power during processing.
  • the linear units are set manually before soldering or moved with external motor power during processing.

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Laser Beam Processing (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

L'invention concerne un dispositif et un procédé de brasage par faisceau laser, notamment de brasage fort par faisceau laser. Dans le brasage par faisceau laser, la position relative mutuelle du foyer laser, du fil et du joint de brasage est déterminante pour obtenir des résultats de haute qualité. Dans les têtes de façonnage connues, la position relative est obtenue à l'aide d'un mécanisme au niveau du guide-fil et/ou par ajustement adaptatif du faisceau. Le dispositif proposé est un dispositif mobile qui permet de positionner le foyer laser indépendamment de la tête de façonnage et par conséquent également indépendamment de la position du fil (1) et de la trajectoire de façonnage. A cet effet, il est prévu d'utiliser des dispositifs à déplacement linéaire (13) et (14) qui déplacent la lentille de focalisation (5) et par conséquent simultanément le foyer laser par rapport à la tête de façonnage. Ledit dispositif permet d'effectuer un ajustement très précis de la position relative entre le fil (1) et le foyer laser ou peut être utilisé avec des mécanismes de commande par moteur sur des dispositifs à déplacement linéaire (13) et (14), dans un circuit de réglage et de régulation.
EP02782724A 2001-10-20 2002-10-15 Dispositif et procede de brasage par faisceau laser, notamment brasage fort par faisceau laser Withdrawn EP1439931A1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10151828A DE10151828B4 (de) 2001-10-20 2001-10-20 Vorrichtung und Verfahren zum Laserstrahllöten, insbesondere Laserstrahlhartlöten
DE10151828 2001-10-20
PCT/DE2002/003891 WO2003035318A1 (fr) 2001-10-20 2002-10-15 Dispositif et procede de brasage par faisceau laser, notamment brasage fort par faisceau laser

Publications (1)

Publication Number Publication Date
EP1439931A1 true EP1439931A1 (fr) 2004-07-28

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
EP02782724A Withdrawn EP1439931A1 (fr) 2001-10-20 2002-10-15 Dispositif et procede de brasage par faisceau laser, notamment brasage fort par faisceau laser

Country Status (3)

Country Link
EP (1) EP1439931A1 (fr)
DE (1) DE10151828B4 (fr)
WO (1) WO2003035318A1 (fr)

Families Citing this family (5)

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Publication number Priority date Publication date Assignee Title
FR2847187B1 (fr) * 2002-11-18 2005-09-23 Le Controle Ind Systeme et procede pour deplacer un point de focalisation d'un rayonnement laser de puissance
FR2979271B1 (fr) * 2011-08-29 2013-08-16 Peugeot Citroen Automobiles Sa Controle et reglage de systeme de tete de brasage laser
DE202011052291U1 (de) 2011-12-14 2012-01-30 Scansonic Mi Gmbh Vorrichtung zur Materialbearbeitung mittels eines Laserstrahles
US10967452B2 (en) 2014-10-20 2021-04-06 Precitec Gmbh & Co.Kg Device for measuring the depth of a weld seam in real time
DE102021101658B4 (de) 2021-01-26 2022-10-06 Precitec Gmbh & Co. Kg Laserbearbeitungskopf mit chromatischer Kompensationsvorrichtung

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Publication number Priority date Publication date Assignee Title
JPH01228688A (ja) * 1988-03-09 1989-09-12 Mitsubishi Electric Corp レーザ加工機の加工ヘッド
US4896944A (en) * 1988-07-25 1990-01-30 Irwin Timothy L Method and apparatus for trepanning workpieces
EP0838297A1 (fr) * 1996-08-20 1998-04-29 MTA Automation AG Tête de brasage d'un appareil à braser automatique
DE19750586B4 (de) * 1997-11-17 2007-05-16 Volkswagen Ag Laser-Lötverfahren
JP3395142B2 (ja) * 1998-08-31 2003-04-07 住友重機械工業株式会社 光学系駆動装置

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Also Published As

Publication number Publication date
WO2003035318A1 (fr) 2003-05-01
DE10151828A1 (de) 2003-05-08
DE10151828B4 (de) 2007-06-06

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