EP1481408A2 - Condensateur dote d'une couche d'adherence au niveau de son contact de cathode - Google Patents

Condensateur dote d'une couche d'adherence au niveau de son contact de cathode

Info

Publication number
EP1481408A2
EP1481408A2 EP02791642A EP02791642A EP1481408A2 EP 1481408 A2 EP1481408 A2 EP 1481408A2 EP 02791642 A EP02791642 A EP 02791642A EP 02791642 A EP02791642 A EP 02791642A EP 1481408 A2 EP1481408 A2 EP 1481408A2
Authority
EP
European Patent Office
Prior art keywords
housing
cathode contact
adhesive layer
anode body
capacitor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP02791642A
Other languages
German (de)
English (en)
Inventor
Peter Berendt
Thomas Hipp
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kemet Electronics Corp
Original Assignee
Epcos AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Epcos AG filed Critical Epcos AG
Publication of EP1481408A2 publication Critical patent/EP1481408A2/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/008—Terminals
    • H01G9/012—Terminals specially adapted for solid capacitors

Definitions

  • the invention relates to an electrolytic capacitor with an anode body which is surrounded by a housing.
  • a cathode contact runs on the top of the anode body.
  • the anode body is a porous sintered body made of tantalum powder.
  • An anode contact protrudes from the inside of the anode body.
  • a cathode contact runs on the top of the anode body and is connected in an electrically conductive manner to the outside of the anode body.
  • the anode body is encapsulated in a plastic housing.
  • the known tantalum electrolytic capacitors have the disadvantage that bubbles often form between the housing and the cathode contact during the manufacture of the housing.
  • the formation of these bubbles is explained by a sudden change in the coefficient of thermal expansion of the epoxy thermosets usually used for extrusion coating in the area of the glass transition temperature of these thermosets. This glass temperature is reached when the anode body is overmolded with the plastic or even exceeded during this process. Due to the sudden, strong thermal expansion of the plastic mass, bubbles easily form on the upper side of the component, where the thickness of the housing is relatively small, which means that the housing layer located above the cathode contact detaches from it.
  • the plastics used for the encapsulation of the anode body usually contain an adhesion reducing agent in the form of waxes or in the form of phenols, which ensure that the plastic can easily be detached from the injection molding tool used for the encapsulation in the form of an injection mold after the encapsulation of the anode body.
  • Iron materials are usually used for injection molds. Accordingly, the adhesive reducers used in the plastic mass are suitable for reducing the adhesion of the plastic to iron surfaces.
  • the cathode contacts usually also contain iron, the adhesion of the housing to the surface of the cathode contact is also reduced.
  • Advantageous embodiments of the capacitor are the subject of the dependent subclaims.
  • a capacitor which has an anode body.
  • the anode body is surrounded by a housing. Furthermore, an anode contact is led out of the interior of the anode body, which protrudes from the inside of the anode body. Furthermore, the capacitor has a cathode contact running along the top of the anode body, which is coated with an adhesive layer.
  • the adhesion of the housing to the cathode contact can be improved and the risk of the formation of a bubble can thus be reduced.
  • the housing can contain an injection-moldable plastic, which offers the advantage that the housing can be easily and inexpensively manufactured in large quantities by injection molding.
  • the injection-moldable plastic can contain an agent that reduces the adhesion of the plastic to iron-containing surfaces.
  • an agent can be, for example, a wax or one or more phenols.
  • anode body By overmolding the anode body with an injection-moldable plastic, an anode body is obtained which is overmolded by the housing.
  • the cathode contact can advantageously be formed from the iron-containing material of a system carrier.
  • System carriers are advantageously used to make a large number of capacitors simple and inexpensive in large quantities manufacture.
  • the starting point is a ribbon-shaped system carrier, to which a large number of anode bodies are attached. After separation, the anode bodies are extrusion-coated with the injection-moldable plastic.
  • System carrier materials that consist of iron or at least contain iron are usually used. For example, it is possible to use a system carrier material that consists of iron / nickel steel.
  • the cathode contact can advantageously have the form of a sheet metal strip, as can be obtained from a system carrier in conventional processes.
  • a sheet metal strip also has the advantage that a relatively large contact area is available for contacting the cathode contact with the anode body of the capacitor.
  • the material for the adhesive layer can be, for example, silver, copper, tin or lead. In general, all materials are suitable that improve the adhesion of the cathode contact to the housing. When using a plastic which contains an agent which reduces the adhesion of the plastic to iron-containing surfaces, particular care must be taken to ensure that the adhesive layer covering the cathode contact contains little or no iron.
  • silver in particular is particularly well suited as a material for the adhesive layer.
  • Silver has the advantage that, on the one hand, it does not easily melt or volatilize the relatively high temperatures that occur during the operation of the capacitor and thus cannot escape from the capacitor. Furthermore, it has been shown that silver has sufficient bendability, which is necessary in order to bring the capacitor formed from the system carrier into its final shape by bending the cathode contact.
  • the adhesive layer can advantageously be applied galvanically to the cathode contact. Such a galvanic process has the advantage that a large number of cathode contacts or system carriers can be coated simultaneously in a single electroplating bath.
  • the adhesive layer advantageously has a thickness of 0.1 to 0.5 ⁇ m.
  • a thinner adhesive layer runs the risk of deteriorating the adhesion to the housing.
  • thicker adhesive layers have the disadvantage that high costs arise for their production.
  • the thickness of the housing over the cathode contact can be reduced, which makes it advantageous to design the capacitor such that the thickness of the housing over the cathode contact is 2 to 5 mm.
  • the figure shows an example of a capacitor in a schematic cross section.
  • the capacitor has an anode body 1 which is porous and which is produced by pressing a tantalum powder.
  • an anode contact 3 is in the form of a wire or in the form of a
  • This anode contact 3 protrudes from the inside of the anode body 1. Outwardly, the anode contact 3 is contacted with an anode terminal 6. This contact can be made, for example, by welding or soldering.
  • the anode connection 6 forms a soldering surface 8 by bending on the outside of the housing 2 on the underside of the housing 2.
  • the anode body 1 is from the housing 2 molded.
  • the housing 2 contains an injection-molded plastic, for example an epoxy thermoset, which in turn also contains adhesion-reducing agents in the form of waxes or phenols.
  • a cathode contact 4 is arranged on the top of the anode body 1 and is in electrical contact with the anode body 1.
  • the cathode contact 4 is attached to the top of the anode body 1 by gluing using silver conductive adhesive.
  • an adhesive layer 5 is arranged, which has a thickness d between 0.1 and 0.5 ⁇ m.
  • the thickness D of the housing 2 over the cathode contact 4 is 1 to 10 mm.
  • the cathode contact 4 is formed from a part of a lead frame and has the shape of a sheet which is bent around the housing 2 on the outside of the housing 2 and forms a soldering surface 8 on the underside of the housing 2.
  • the invention is not limited to tantalum electrolytic capacitors, but can be used with any type of valve metal-containing capacitors.

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

La présente invention concerne un condensateur comprenant un corps d'anode (1) qui est entouré par un boîtier (2), un contact d'anode (3) qui dépasse de l'intérieur du corps d'anode (1), et un contact de cathode (4) qui s'étend le long du côté supérieur du corps d'anode (1) et est recouvert d'une couche d'adhérence (5) côté boîtier. La couche d'adhérence permet de réduire le risque de formation de bulles et ainsi le risque de déchirure du boîtier (2).
EP02791642A 2002-03-01 2002-12-17 Condensateur dote d'une couche d'adherence au niveau de son contact de cathode Withdrawn EP1481408A2 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE20203300U 2002-03-01
DE20203300U DE20203300U1 (de) 2002-03-01 2002-03-01 Kondensator mit Haftschicht am Kathodenkontakt
PCT/DE2002/004623 WO2003075296A2 (fr) 2002-03-01 2002-12-17 Condensateur dote d'une couche d'adherence au niveau de son contact de cathode

Publications (1)

Publication Number Publication Date
EP1481408A2 true EP1481408A2 (fr) 2004-12-01

Family

ID=7968484

Family Applications (1)

Application Number Title Priority Date Filing Date
EP02791642A Withdrawn EP1481408A2 (fr) 2002-03-01 2002-12-17 Condensateur dote d'une couche d'adherence au niveau de son contact de cathode

Country Status (5)

Country Link
US (1) US6744620B2 (fr)
EP (1) EP1481408A2 (fr)
CN (1) CN1623214A (fr)
DE (1) DE20203300U1 (fr)
WO (1) WO2003075296A2 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5067307A (en) * 1989-12-29 1991-11-26 Cavanna S.P.A. Method and apparatus for controlling the advance of a wrapping film

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10131236B4 (de) * 2001-06-28 2006-03-30 Epcos Ag Kondensator
DE102005007583A1 (de) * 2005-02-18 2006-08-24 Epcos Ag Verfahren zur Herstellung eines Anodenkörpers und Anodenkörper
CN101840783B (zh) * 2010-04-16 2012-05-02 株洲宏达电子有限公司 一种全钽外壳钽电解电容器引出线的引出方式及电容器
US11342129B2 (en) * 2018-06-21 2022-05-24 KYOCERA AVX Components Corporation Solid electrolytic capacitor with stable electrical properties at high temperatures

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4039904A (en) * 1976-01-02 1977-08-02 P. R. Mallory & Co., Inc. Intermediate precoat layer of resin material for stabilizing encapsulated electric devices
US4107762A (en) * 1977-05-16 1978-08-15 Sprague Electric Company Solid electrolyte capacitor package with an exothermically-alloyable fuse
US4417298A (en) * 1980-05-16 1983-11-22 Koreaki Nakata Chip type tantalum capacitor
US4558399A (en) * 1981-10-19 1985-12-10 Nippon Chemi-Con Corporation Electrolytic capacitor and a process for producing the same
US5053927A (en) * 1991-03-29 1991-10-01 Sprague Electric Company Molded fuzed solid electrolyte capacitor
JP2513411B2 (ja) 1993-06-22 1996-07-03 日本電気株式会社 固体電解コンデンサおよびその製造方法
DE19846936C1 (de) * 1998-10-12 2000-03-30 Siemens Matsushita Components Tantal-Elektrolytkondensator
JP2000223359A (ja) 1999-01-29 2000-08-11 Murata Mfg Co Ltd セラミック電子部品

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO03075296A2 *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5067307A (en) * 1989-12-29 1991-11-26 Cavanna S.P.A. Method and apparatus for controlling the advance of a wrapping film

Also Published As

Publication number Publication date
CN1623214A (zh) 2005-06-01
WO2003075296A3 (fr) 2003-12-24
US6744620B2 (en) 2004-06-01
WO2003075296A2 (fr) 2003-09-12
US20030165045A1 (en) 2003-09-04
DE20203300U1 (de) 2002-07-18

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