EP1493847A3 - Plattierungswerkzeug, Plattierungsverfahren, Elektroplattierungsvorrichtung, plattiertes Produkt und Verfahren zu dessen Herstellung - Google Patents

Plattierungswerkzeug, Plattierungsverfahren, Elektroplattierungsvorrichtung, plattiertes Produkt und Verfahren zu dessen Herstellung Download PDF

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Publication number
EP1493847A3
EP1493847A3 EP04015654A EP04015654A EP1493847A3 EP 1493847 A3 EP1493847 A3 EP 1493847A3 EP 04015654 A EP04015654 A EP 04015654A EP 04015654 A EP04015654 A EP 04015654A EP 1493847 A3 EP1493847 A3 EP 1493847A3
Authority
EP
European Patent Office
Prior art keywords
plating
plated product
electroplating apparatus
tool
producing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP04015654A
Other languages
English (en)
French (fr)
Other versions
EP1493847A2 (de
Inventor
Yoji Mitsui
Tadashi Godo
Itaru Okonogi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2003191570A external-priority patent/JP2005023389A/ja
Priority claimed from JP2003431754A external-priority patent/JP2005187891A/ja
Priority claimed from JP2004165416A external-priority patent/JP4273333B2/ja
Priority claimed from JP2004165418A external-priority patent/JP4273334B2/ja
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Publication of EP1493847A2 publication Critical patent/EP1493847A2/de
Publication of EP1493847A3 publication Critical patent/EP1493847A3/de
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/001—Magnets
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C25D17/08—Supporting racks, i.e. not for suspending
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/04—Tubes; Rings; Hollow bodies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/0253—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing permanent magnets
    • H01F41/026—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing permanent magnets protecting methods against environmental influences, e.g. oxygen, by surface treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/14—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates
    • H01F41/24—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates from liquids
    • H01F41/26—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates from liquids using electric currents, e.g. electroplating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Power Engineering (AREA)
  • Environmental & Geological Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroplating Methods And Accessories (AREA)
EP04015654A 2003-07-04 2004-07-02 Plattierungswerkzeug, Plattierungsverfahren, Elektroplattierungsvorrichtung, plattiertes Produkt und Verfahren zu dessen Herstellung Withdrawn EP1493847A3 (de)

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
JP2003191570 2003-07-04
JP2003191570A JP2005023389A (ja) 2003-07-04 2003-07-04 電気めっき方法、および電気めっき装置
JP2003431754 2003-12-26
JP2003431754A JP2005187891A (ja) 2003-12-26 2003-12-26 めっき方法、めっき製品の製造方法、およびめっき製品
JP2004165418 2004-06-03
JP2004165416A JP4273333B2 (ja) 2003-07-14 2004-06-03 めっき治具、めっき方法、および電気めっき装置
JP2004165416 2004-06-03
JP2004165418A JP4273334B2 (ja) 2003-12-05 2004-06-03 めっき治具、めっき方法、およびリング状のめっき物

Publications (2)

Publication Number Publication Date
EP1493847A2 EP1493847A2 (de) 2005-01-05
EP1493847A3 true EP1493847A3 (de) 2008-10-01

Family

ID=33437165

Family Applications (1)

Application Number Title Priority Date Filing Date
EP04015654A Withdrawn EP1493847A3 (de) 2003-07-04 2004-07-02 Plattierungswerkzeug, Plattierungsverfahren, Elektroplattierungsvorrichtung, plattiertes Produkt und Verfahren zu dessen Herstellung

Country Status (3)

Country Link
US (1) US20050056542A1 (de)
EP (1) EP1493847A3 (de)
CN (1) CN1330795C (de)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7498062B2 (en) * 2004-05-26 2009-03-03 Wd Media, Inc. Method and apparatus for applying a voltage to a substrate during plating
CN101440467B (zh) * 2008-12-12 2010-06-02 南车四方车辆有限公司 一种金属部件螺纹孔在热浸锌防腐处理中的保护方法
CN101570876B (zh) * 2009-06-08 2011-11-30 深圳市常兴金刚石磨具有限公司 用于钻头电镀的电镀设备、电镀方法
TWI397615B (zh) * 2010-04-01 2013-06-01 Zhen Ding Technology Co Ltd 電鍍裝置
CN101942650B (zh) * 2010-09-26 2012-05-23 广东工业大学 一种旋涡迫流化学复合镀装置及使用该装置的工艺方法
FR3037600B1 (fr) * 2015-06-17 2017-06-23 Maxence Renaud Procede de traitement de surfaces de pieces de geometrie complexe, dispositif porte-pieces et dispositif de traitement
CN104894629B (zh) * 2015-06-26 2017-03-29 张家口时代橡胶制品股份有限公司 磷化生产线工件挂具
HUE039958T2 (hu) * 2015-12-08 2019-02-28 Schaeffler Technologies Ag Állvány gyûrû alakú alkatrészek felvételére, valamint eljárás
DE102016209595B3 (de) * 2016-06-01 2017-07-13 Schaeffler Technologies AG & Co. KG Vorrichtung zur Beschichtung von Kugeln
CN106591932B (zh) * 2016-12-30 2023-09-29 宁波工程学院 用于深孔电镀的电镀制具及电镀方法
CN108251872B (zh) * 2017-12-20 2019-12-06 宁波韵升股份有限公司 一种烧结钕铁硼磁体复合电镀方法
EP3540098A3 (de) * 2018-03-16 2019-11-06 Airbus Defence and Space GmbH Vorrichtung und verfahren zur kontinuierlichen metallisierung eines objekts
IT201800010055A1 (it) * 2018-11-06 2020-05-06 Stefano Zini Attrezzatura per trattamenti di rivestimento elettrolitico.
CN110453270A (zh) * 2019-09-16 2019-11-15 东莞东浩源电镀有限公司 一种手机零件用新型电镀治具及其使用方法
IT201900023484A1 (it) * 2019-12-10 2021-06-10 Danieli Off Mecc Apparato di stabilizzazione
CN114645309B (zh) * 2022-03-23 2023-09-19 南通雨奇金属制品有限公司 一种运动自行车用铝合金把立表面着色镀覆处理装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58193396A (ja) * 1982-04-30 1983-11-11 Nippon Paint Co Ltd 電着塗料浴の処理方法
EP0502475A2 (de) * 1991-03-04 1992-09-09 Kanegafuchi Kagaku Kogyo Kabushiki Kaisha Verfahren zur Plattierung eines Verbundmagneten sowie Verbundmagnet mit einem Metallüberzug
US5360527A (en) * 1993-04-30 1994-11-01 Hitachi Magnetics Corp. Rackless rack for electroplating
JP2001181893A (ja) * 1999-10-13 2001-07-03 Sumitomo Special Metals Co Ltd 表面処理装置
DE10309401A1 (de) * 2003-03-04 2004-09-16 Vacuumschmelze Gmbh & Co. Kg Vorrichtung und Verfahren zu Beschichtung von Gegenständen

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE794695A (fr) * 1972-01-29 1973-05-16 W Kampschulte & Cie K G Dr Bain galvanique de nickel pour la separation de revetements de nickel satines mats
JP2520450B2 (ja) * 1988-06-02 1996-07-31 信越化学工業株式会社 耐食性希土類磁石の製造方法
JPH0510471U (ja) * 1991-07-26 1993-02-09 辰澤興業有限公司 メツキ電解槽における回転バレル
US5229687A (en) * 1991-10-09 1993-07-20 Gte Products Corporation Mercury vapor discharge lamp containing means for reducing mercury leaching
US5229686A (en) * 1991-10-09 1993-07-20 Gte Products Corporation Mercury vapor discharge lamp containing means for reducing mercury leaching
GB9326082D0 (en) * 1993-12-21 1994-02-23 Baj Coatings Ltd Rotor blades
WO1997035331A1 (fr) * 1996-03-18 1997-09-25 Seiko Epson Corporation Procede de formation d'aimant a liaison de terres rares, composition dudit aimant et son procede de fabrication
US5736813A (en) * 1996-11-29 1998-04-07 General Electric Company PH control of leachable mercury in fluorescent lamps
CN2302267Y (zh) * 1997-05-14 1998-12-30 鸿利机械工业股份有限公司 防腐蚀电镀桶机构
US5951763A (en) * 1998-02-09 1999-09-14 Knox; David J. Immersible rotatable carousel apparatus for wetting articles of manufacture
JP3709292B2 (ja) * 1998-10-16 2005-10-26 ミネベア株式会社 樹脂結合型希土類磁石
US6515421B2 (en) * 1999-09-02 2003-02-04 General Electric Company Control of leachable mercury in fluorescent lamps
US6853118B2 (en) * 2001-05-03 2005-02-08 General Electric Company Control of leachable mercury in mercury vapor discharge lamps
US6743340B2 (en) * 2002-02-05 2004-06-01 Applied Materials, Inc. Sputtering of aligned magnetic materials and magnetic dipole ring used therefor

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58193396A (ja) * 1982-04-30 1983-11-11 Nippon Paint Co Ltd 電着塗料浴の処理方法
EP0502475A2 (de) * 1991-03-04 1992-09-09 Kanegafuchi Kagaku Kogyo Kabushiki Kaisha Verfahren zur Plattierung eines Verbundmagneten sowie Verbundmagnet mit einem Metallüberzug
US5360527A (en) * 1993-04-30 1994-11-01 Hitachi Magnetics Corp. Rackless rack for electroplating
JP2001181893A (ja) * 1999-10-13 2001-07-03 Sumitomo Special Metals Co Ltd 表面処理装置
DE10309401A1 (de) * 2003-03-04 2004-09-16 Vacuumschmelze Gmbh & Co. Kg Vorrichtung und Verfahren zu Beschichtung von Gegenständen

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
DATABASE WPI Week 198351, Derwent World Patents Index; AN 1983-847343, XP002492508 *

Also Published As

Publication number Publication date
CN1576399A (zh) 2005-02-09
CN1330795C (zh) 2007-08-08
EP1493847A2 (de) 2005-01-05
US20050056542A1 (en) 2005-03-17

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