EP1500316A1 - Procede pour creer une structure a tranchees dans un substrat polymere - Google Patents

Procede pour creer une structure a tranchees dans un substrat polymere

Info

Publication number
EP1500316A1
EP1500316A1 EP03722247A EP03722247A EP1500316A1 EP 1500316 A1 EP1500316 A1 EP 1500316A1 EP 03722247 A EP03722247 A EP 03722247A EP 03722247 A EP03722247 A EP 03722247A EP 1500316 A1 EP1500316 A1 EP 1500316A1
Authority
EP
European Patent Office
Prior art keywords
laser
substrate
laser beam
mask
recesses
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP03722247A
Other languages
German (de)
English (en)
Inventor
Stefan Lesjak
Hubert De Steur
Wei Pan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Via Mechanics Ltd
Original Assignee
Siemens AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG, Siemens Corp filed Critical Siemens AG
Publication of EP1500316A1 publication Critical patent/EP1500316A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • B23K26/0661—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks disposed on the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/18—Working by laser beam, e.g. welding, cutting or boring using absorbing layers on the workpiece, e.g. for marking or protecting purposes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic materials
    • B23K2103/42—Plastics other than composite materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09981—Metallised walls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/0554—Metal used as mask for etching vias, e.g. by laser ablation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H05K2203/108—Using a plurality of lasers or laser light with a plurality of wavelengths
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H05K3/0035—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material of blind holes, i.e. having a metal layer at the bottom

Definitions

  • the invention relates to a method for producing a Gra ⁇ b en Design in the surface of a polymer substrate by irradiation with a laser of a predetermined wavelength.
  • WO 00/16443 discloses the production of hole and trench structures in printed circuit boards, such trench structures being used, for example, to form shielded conductor structures in the printed circuit boards.
  • the use of a laser is generally mentioned as a means of producing such trenches in a circuit board.
  • Object of the present invention is therefore to provide a method with which grave structures with clean pages ⁇ walls and an acceptable slope in polymer substrates, particularly those with glass fiber reinforcement, can be obtained.
  • a conformal mask made of a material reflecting the laser radiation is arranged on the surface of the substrate and has cutouts corresponding to the trench structure to be produced, and then the laser beam is guided over the cutouts of the mask, at least once in such a manner overlapping over the Boundary edge of the respective recess is guided such that the energy density of the portion of the laser beam striking the polymer surface lies at every point above a threshold at which the substrate material is completely removed.
  • a conforming mask is used in each case in the edge region of the one to be generated
  • the invention can be used particularly advantageously in the production of trench structures in a substrate reinforced with glass fibers, the mask then shielding that edge region of the laser beam which is below the energy threshold necessary for the evaporation of the glass fiber material, which for example has a peak power density of about 1-10 MW / cm 2 , preferably 6-7 MW / cm 2 , depending on the material.
  • a laser is preferably used for producing the trench structure, the wavelength of which is strongly reflected on the mask layer, preferably consisting of copper or a copper alloy. In this case, the laser beam can be focused directly on the surface of the substrate.
  • Lasers with a wavelength of 9 .mu.m to 11 .mu.m are preferably used, in particular a Q-switched CO 2 laser with a pulse frequency of 10 to 200 kHz, preferably of approximately 100 kHz, and a pulse duration of 50 to 500 ns, preferably approximately 150 ns.
  • a high-frequency (RF excited) pulsed C0 2 laser with a pulse frequency between 1 and 15 kHz, preferably between 3 and 5 kHz, and a pulse duration between 1 and 20 ⁇ s, preferably between 3 and 5 ⁇ s ,
  • a TEA-CO 2 laser transversely excited atmospheric laser with a pulse frequency between 1 and 15 kHz and a pulse duration between 50 and 100 ns, preferably about 70 ns, can also be used.
  • UV laser instead of the C0 2 laser, other lasers can also be used. It would even be possible to use a UV laser if it is available with sufficient power and an acceptable working speed. Since, for example, such a UV laser is only slightly reflected by a mask layer made of copper, it must not be focused directly on the level of the mask or the substrate surface.
  • the mask used in the invention is preferably a metal layer applied to the surface of the substrate, which, as mentioned, preferably consists of copper or a copper alloy.
  • This metal layer can be formed by chemical or galvanic deposition on the surface of the substrate, the cutouts then being made by partial Removal of this metal layer can be generated by chemical etching processes or mechanical separation processes.
  • the mask is also formed by structuring the metal layer by means of a laser, a different laser being used for this than the generation of the trench structure in the substrate.
  • a laser is therefore preferably used here, the wavelength of which is well absorbed by the material of the mask;
  • This can be a solid-state laser pumped with diodes or with a flash lamp and subsequent frequency multiplication, which is operated with a pulse frequency above 1 kHz up to 200 kHz and with a pulse duration between one ns and 200 ns, preferably between 10 and 60 ns.
  • either a single pass with the laser via the mask cutout can be sufficient to produce the trench structure, or the laser beam is guided in several adjacent tracks through the cutouts of the mask.
  • These laser processing traces can run in the longitudinal direction of the trenches or can be guided in a channel shape transversely to the longitudinal extension of the trenches.
  • FIG. 1 shows schematically the energy distribution of a laser beam and its effect on a trench to be produced in a substrate
  • FIG. 2 shows the energy distribution of a laser beam and whose IMPACT a grave structure in a substrate according to the inventive method
  • Figure 3, 4 and 5 the generation of a mask according to the invention and a grave structure in successive phases of the process
  • FIG. 6 shows the energy distribution of a laser beam guided next to one another in several passes in order to produce a trench which is wider in comparison to FIG. 2
  • FIG. 7 shows the schematic representation of the guidance of a laser beam in several longitudinal tracks
  • Figure 8 is a schematic representation of the guidance of a laser beam in a meandering track.
  • Figure 1 generally shows the Gaussian distribution of the energy density F L of a laser beam. It can be seen that the energy density is only sufficient above a threshold F G to vaporize glass fibers, for example.
  • a threshold F G to vaporize glass fibers
  • complete evaporation of the glass fiber-reinforced substrate material to form a trench 3 therefore only takes place within a central region 4 with a width D, where the energy density lies above a threshold value F G.
  • the energy density is not sufficient to completely vaporize the glass fiber material.
  • FIGS. 3 to 5 show the process sequence for the creation of a mask and the subsequent creation of a trench structure with two different lasers.
  • the glass fiber-reinforced substrate 1 is provided on its underside with the metal layer 2 and on its top with a metal layer 12, the mask 10 being to be formed from the latter.
  • cutouts 14 corresponding to a desired trench structure in the substrate 1 are generated with a laser radiation 13, which is well absorbed by the metal layer 12 due to its wavelength.
  • the laser radiation is preferably UV laser radiation with a wavelength of, for example, 355 nm.
  • the desired trench structure is then generated with laser radiation 15, preferably a CO 2 laser radiation of 9250 nm, in that the laser beam 15 is directed through the cutouts 14 onto the substrate 1 until the trenches 16 are produced (see FIG. 5).
  • laser radiation 15 preferably a CO 2 laser radiation of 9250 nm
  • the laser beam must be moved through the recesses one or more times, as previously described. It is essential that the laser beam 15 is guided at least once so close to the edges of the recesses 14 that those edge regions of the laser beam whose effective energy density is not sufficient to completely remove the glass fiber-reinforced substrate material are reflected by the mask 10. Only then is ensures that the trenches 16 each receive clean walls free of glass beads with an acceptable inclination.
  • FIG. 6 shows the superimposition of the energy distribution of, for example, three laser beam tracks lying next to one another over a substrate 1 with a mask 20 which has a relatively wide recess 21, so that a correspondingly wide trench 22 is produced.
  • the adjacent laser beam tracks each with the same energy distribution F1 L , F2 L and F3 L, have the effect that an energy density acts on each point of the trench to be produced which lies above the threshold F G.
  • the various laser beam traces for example 23, 24 and 25, can run in the longitudinal direction of the mask recess 21 according to FIG. However, it is also possible that a meandering track 26 according to FIG. 8 is guided back and forth between the edges of the recess 21.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laser Beam Processing (AREA)
  • Lasers (AREA)

Abstract

L'invention concerne un procédé pour créer une structure à tranchées dotée de parois latérales à forte pente, sans résidu dans un substrat (1) renforcé, en particulier, à la fibre de verre. Le procédé consiste à appliquer sur le substrat un masque (10) conforme qui présente des évidements correspondant à la structure à tranchées (3) à créer. A cet effet, un faisceau laser (15) est guidé au-dessus des évidement du masque, de manière à ce que les zones périphériques (5) pauvres en énergie du faisceau laser (FL) ne viennent pas en contact avec le substrat et que la partie (4) du faisceau laser touchant la surface polymère présente à chaque point une densité d'énergie dépassant un seuil (FG), à partir duquel la matière de substrat, y compris les fibres de verre de renforcement éventuellement présente, est totalement enlevée.
EP03722247A 2002-04-30 2003-04-01 Procede pour creer une structure a tranchees dans un substrat polymere Withdrawn EP1500316A1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10219388A DE10219388A1 (de) 2002-04-30 2002-04-30 Verfahren zur Erzeugung einer Grabenstruktur in einem Polymer-Substrat
DE10219388 2002-04-30
PCT/DE2003/001065 WO2003094584A1 (fr) 2002-04-30 2003-04-01 Procede pour creer une structure a tranchees dans un substrat polymere

Publications (1)

Publication Number Publication Date
EP1500316A1 true EP1500316A1 (fr) 2005-01-26

Family

ID=29224939

Family Applications (1)

Application Number Title Priority Date Filing Date
EP03722247A Withdrawn EP1500316A1 (fr) 2002-04-30 2003-04-01 Procede pour creer une structure a tranchees dans un substrat polymere

Country Status (7)

Country Link
US (1) US6822191B2 (fr)
EP (1) EP1500316A1 (fr)
JP (1) JP2005532677A (fr)
KR (1) KR20040104667A (fr)
CN (1) CN1650678A (fr)
DE (1) DE10219388A1 (fr)
WO (1) WO2003094584A1 (fr)

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KR20040104667A (ko) 2004-12-10
JP2005532677A (ja) 2005-10-27
WO2003094584A1 (fr) 2003-11-13
CN1650678A (zh) 2005-08-03
DE10219388A1 (de) 2003-11-20
US6822191B2 (en) 2004-11-23
US20030201258A1 (en) 2003-10-30

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