EP1504073A1 - Composition de resine epoxyde thermodurcissable - Google Patents

Composition de resine epoxyde thermodurcissable

Info

Publication number
EP1504073A1
EP1504073A1 EP03722492A EP03722492A EP1504073A1 EP 1504073 A1 EP1504073 A1 EP 1504073A1 EP 03722492 A EP03722492 A EP 03722492A EP 03722492 A EP03722492 A EP 03722492A EP 1504073 A1 EP1504073 A1 EP 1504073A1
Authority
EP
European Patent Office
Prior art keywords
weight
composition according
epoxy
diglycidyl ether
thixotropic agent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP03722492A
Other languages
German (de)
English (en)
Inventor
Andreas Kramer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sika Schweiz AG
Original Assignee
Sika Schweiz AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sika Schweiz AG filed Critical Sika Schweiz AG
Priority to EP03722492A priority Critical patent/EP1504073A1/fr
Publication of EP1504073A1 publication Critical patent/EP1504073A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/08—Processes
    • C08G18/10—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C09J175/12—Polyurethanes from compounds containing nitrogen and active hydrogen, the nitrogen atom not being part of an isocyanate group
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/24—Graft or block copolymers according to groups C08L51/00, C08L53/00 or C08L55/02; Derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
    • C08L75/04—Polyurethanes
    • C08L75/12—Polyurethanes from compounds containing nitrogen and active hydrogen, the nitrogen atom not being part of an isocyanate group

Definitions

  • the shell preferably consists of polymers based on methyl methacrylate, cyclohexyl methacrylate, butyl acrylate, styrene, methacrylonitrile.
  • a particularly preferred use is the bonding of the same or different metals, in particular in the body-in-white in the automotive industry.
  • the preferred metals are above all steel, in particular electrolytically galvanized, hot-dip galvanized, oiled steel and subsequently phosphated steel, and aluminum, in particular in the variants typically occurring in automobile construction.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polyurethanes Or Polyureas (AREA)

Abstract

L'invention concerne des compositions qui contiennent au moins une résine époxyde A ayant en moyenne plus d'un groupe époxyde par molécule, au moins un produit d'addition époxyde B ayant en moyenne plus d'un groupe époxyde par molécule, au moins un agent thixotrope C à base de dérivé d'urée dans une substance support non diffusante, ainsi qu'au moins un durcisseur D pour résines époxydes, activé par augmentation de la température. Selon certains modes de réalisation préférés, l'invention concerne aussi des compositions qui contiennent également au moins un polymère noyau-enveloppe E, une matière de charge F ou un diluant réactif G. L'invention concerne également l'utilisation de cette composition en tant qu'adhésif monocomposant, ainsi que des procédés pour la production de cette composition. L'invention concerne en outre l'utilisation de l'agent thixotrope C à base de dérivé d'urée dans une substance support non diffusante en tant qu'agent pour augmenter la résistance aux chocs.
EP03722492A 2002-05-03 2003-04-16 Composition de resine epoxyde thermodurcissable Withdrawn EP1504073A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP03722492A EP1504073A1 (fr) 2002-05-03 2003-04-16 Composition de resine epoxyde thermodurcissable

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
EP02009923A EP1359202A1 (fr) 2002-05-03 2002-05-03 Composition de résine époxy réticulable par application de chaleur
EP02009923 2002-05-03
EP03722492A EP1504073A1 (fr) 2002-05-03 2003-04-16 Composition de resine epoxyde thermodurcissable
PCT/EP2003/003962 WO2003093387A1 (fr) 2002-05-03 2003-04-16 Composition de resine epoxyde thermodurcissable

Publications (1)

Publication Number Publication Date
EP1504073A1 true EP1504073A1 (fr) 2005-02-09

Family

ID=28799689

Family Applications (2)

Application Number Title Priority Date Filing Date
EP02009923A Withdrawn EP1359202A1 (fr) 2002-05-03 2002-05-03 Composition de résine époxy réticulable par application de chaleur
EP03722492A Withdrawn EP1504073A1 (fr) 2002-05-03 2003-04-16 Composition de resine epoxyde thermodurcissable

Family Applications Before (1)

Application Number Title Priority Date Filing Date
EP02009923A Withdrawn EP1359202A1 (fr) 2002-05-03 2002-05-03 Composition de résine époxy réticulable par application de chaleur

Country Status (5)

Country Link
US (2) US20050159511A1 (fr)
EP (2) EP1359202A1 (fr)
JP (2) JP4515251B2 (fr)
AU (1) AU2003229684A1 (fr)
WO (1) WO2003093387A1 (fr)

Families Citing this family (76)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6787579B2 (en) * 2001-05-02 2004-09-07 L&L Products, Inc. Two-component (epoxy/amine) structural foam-in-place material
US20030050352A1 (en) * 2001-09-04 2003-03-13 Symyx Technologies, Inc. Foamed Polymer System employing blowing agent performance enhancer
US6793274B2 (en) 2001-11-14 2004-09-21 L&L Products, Inc. Automotive rail/frame energy management system
AU2002361136A1 (en) 2001-12-21 2003-07-09 Henkel Teroson Gmbh Expandable epoxy resin-based systems modified with thermoplastic polymers
US7318873B2 (en) 2002-03-29 2008-01-15 Zephyros, Inc. Structurally reinforced members
US7169344B2 (en) 2002-04-26 2007-01-30 L&L Products, Inc. Method of reinforcing at least a portion of a structure
US7077460B2 (en) 2002-04-30 2006-07-18 L&L Products, Inc. Reinforcement system utilizing a hollow carrier
EP1359202A1 (fr) 2002-05-03 2003-11-05 Sika Schweiz AG Composition de résine époxy réticulable par application de chaleur
US7004536B2 (en) 2002-07-29 2006-02-28 L&L Products, Inc. Attachment system and method of forming same
US7105112B2 (en) 2002-11-05 2006-09-12 L&L Products, Inc. Lightweight member for reinforcing, sealing or baffling
EP1431325A1 (fr) 2002-12-17 2004-06-23 Sika Technology AG Composition de résine époxy durcissable à la chaleur ayant une résistance au choc à basse température
US7313865B2 (en) 2003-01-28 2008-01-01 Zephyros, Inc. Process of forming a baffling, sealing or reinforcement member with thermoset carrier member
US20040204551A1 (en) * 2003-03-04 2004-10-14 L&L Products, Inc. Epoxy/elastomer adduct, method of forming same and materials and articles formed therewith
US7111899B2 (en) 2003-04-23 2006-09-26 L & L Products, Inc. Structural reinforcement member and method of use therefor
US7125461B2 (en) 2003-05-07 2006-10-24 L & L Products, Inc. Activatable material for sealing, baffling or reinforcing and method of forming same
GB2401349A (en) 2003-05-08 2004-11-10 L & L Products Reinforcement for a vehicle panel
US7199165B2 (en) * 2003-06-26 2007-04-03 L & L Products, Inc. Expandable material
US7249415B2 (en) 2003-06-26 2007-07-31 Zephyros, Inc. Method of forming members for sealing or baffling
EP1498441A1 (fr) 2003-07-16 2005-01-19 Sika Technology AG Compositions réticulables à la chaleur comprenant un modificateur de résistance au choc à basse température
US7469459B2 (en) 2003-09-18 2008-12-30 Zephyros, Inc. System and method employing a porous container for sealing, baffling or reinforcing
EP1568749A1 (fr) * 2004-02-25 2005-08-31 Sika Technology AG Adhesif a deux composants pour la production de materiaux semi-finis et de composites sandwich
US20050241756A1 (en) * 2004-04-28 2005-11-03 L&L Products, Inc. Adhesive material and structures formed therewith
US8070994B2 (en) 2004-06-18 2011-12-06 Zephyros, Inc. Panel structure
GB2415658A (en) 2004-06-21 2006-01-04 L & L Products Inc An overmoulding process
DE102004033728B4 (de) * 2004-07-13 2009-07-23 Plasmatreat Gmbh Verfahren zum Bearbeiten und Verkleben von Werkstücken aus einem Metall oder einer Metalllegierung mit einer hydratisierten Oxid- und/oder Hydroxidschicht
US7374219B2 (en) 2004-09-22 2008-05-20 Zephyros, Inc. Structural reinforcement member and method of use therefor
EP1695990A1 (fr) * 2005-02-28 2006-08-30 Dow Global Technologies Inc. Composition adhesive epoxy a deux composants
US7503620B2 (en) 2005-05-12 2009-03-17 Zephyros, Inc. Structural reinforcement member and method of use therefor
US7700670B2 (en) * 2005-05-13 2010-04-20 Beach Brian A Low-density molding compound
DE602005020260D1 (de) * 2005-06-02 2010-05-12 Dow Global Technologies Inc Schlagzähmodifizierter Strukturklebstoff auf Epoxid Basis
CN101233167B (zh) 2005-07-01 2012-07-18 Sika技术股份公司 固态可热膨胀材料
EP1741734A1 (fr) 2005-07-05 2007-01-10 Sika Technology AG Composition réticulable à la chaleur et résistant au choc à basse température comprenant des résines époxydes solides
US7926179B2 (en) 2005-08-04 2011-04-19 Zephyros, Inc. Reinforcements, baffles and seals with malleable carriers
KR101303246B1 (ko) * 2005-08-24 2013-09-06 헨켈 아일랜드 리미티드 개선된 내충격성을 갖는 에폭시 조성물
US8475694B2 (en) 2005-10-25 2013-07-02 Zephyros, Inc. Shaped expandable material
GB0600901D0 (en) 2006-01-17 2006-02-22 L & L Products Inc Improvements in or relating to reinforcement of hollow profiles
EP1829917A1 (fr) 2006-03-02 2007-09-05 Sika Technology AG Elastomeres de silicone moulables presentant une adhesivite selective sans primaire
DE102006012550A1 (de) * 2006-03-18 2007-09-20 Degussa Gmbh Verwendung einer substituierten Guanidin-Verbindung sowie deren Salze oder Hydrate als Härter für Epoxidharze
US7892396B2 (en) * 2006-06-07 2011-02-22 Zephyros, Inc. Toughened activatable material for sealing, baffling or reinforcing and method of forming same
RU2432367C2 (ru) * 2006-06-07 2011-10-27 Зефирос, Инк. Способ уплотнения, экранирования и упрочнения части самоходного транспортного средства
EP1876194A1 (fr) * 2006-06-30 2008-01-09 Sika Technology AG Composition thermodurcissable adaptée au collage de substrats revêtus
ES2691528T3 (es) 2006-07-31 2018-11-27 Henkel Ag & Co. Kgaa Composiciones adhesivas basadas en resina epoxi curable
WO2008045270A1 (fr) * 2006-10-06 2008-04-17 Henkel Ag & Co. Kgaa Adhésifs à base de pâte d'époxy pouvant être pompés et résistant au lavage
EP1916270A1 (fr) * 2006-10-24 2008-04-30 Sika Technology AG Compositions d'epoxy thermodurcissables contenant des prépolymères de polyuréthane blocqués
EP1916285A1 (fr) 2006-10-24 2008-04-30 Sika Technology AG Résine Epoxy solide dérivatisée et son utilisation
EP1916269A1 (fr) * 2006-10-24 2008-04-30 Sika Technology AG Prépolymères de polyuréthane blocqués et compositions de résines d'epoxy thermodurcissables
EP1916272A1 (fr) * 2006-10-24 2008-04-30 Sika Technology AG Compositions d'epoxy contenant des prépolymères de polyuréthane blocqués et terminés par époxy.
EP1935955A1 (fr) * 2006-12-21 2008-06-25 Sika Technology AG Méthode pour coller la feuillure de bord ouverte
EP1972646A1 (fr) 2007-03-20 2008-09-24 Sika Technology AG Polymères terminés par des groupes époxy, leur préparation et leur utilisation comme modificateurs résistants aux chocs
WO2008127925A2 (fr) * 2007-04-11 2008-10-23 Dow Global Technologies, Inc. Résines époxy structurelles contenant des caoutchoucs à noyau-enveloppe
KR20100059818A (ko) * 2007-07-26 2010-06-04 헨켈 코포레이션 경화성 에폭시 수지계 접착제 조성물
CN101932668B (zh) 2007-10-30 2015-03-25 汉高股份及两合公司 抗洗脱的环氧糊状粘合剂
EP2060592B1 (fr) * 2007-11-14 2010-01-27 Sika Technology AG Composition de résine époxy durcissant à la chaleur contenant des urées non aromatiques en tant qu'accélérateurs
EP2085426B1 (fr) * 2008-01-30 2010-10-13 Sika Technology AG Colles en résine époxy durcissant à la chaleur et résistantes au lavage
GB0806434D0 (en) 2008-04-09 2008-05-14 Zephyros Inc Improvements in or relating to structural adhesives
EP2110397A1 (fr) 2008-04-16 2009-10-21 Sika Technology AG Polymère de polyuréthane basé sur des blocs de copolymères amphiphiles et leur utilisation comme modificateur de résistance aux chocs
EP2145924A1 (fr) 2008-07-18 2010-01-20 Sika Technology AG Produits de réaction à base de copolymères bloc amphiphiles et leur utilisation en tant que modificateur de la résistance à l'impact
GB0916205D0 (en) 2009-09-15 2009-10-28 Zephyros Inc Improvements in or relating to cavity filling
WO2011056357A1 (fr) 2009-11-05 2011-05-12 Dow Global Technologies Llc Adhésifs de résine époxy structuraux contenant des durcisseurs élastomères coiffés avec des cétoximes
WO2011109699A1 (fr) 2010-03-04 2011-09-09 Zephyros, Inc. Stratifié structurel composite
GB201016530D0 (en) 2010-09-30 2010-11-17 Zephyros Inc Improvements in or relating to adhesives
CN102477276A (zh) * 2010-11-26 2012-05-30 上海恩意材料科技有限公司 一种具有高粘接强度的环氧胶黏剂
WO2012091842A2 (fr) 2010-12-26 2012-07-05 Dow Global Technologies Llc Colles d'assemblage à base de résine époxy, contenant des durcisseurs élastomères à chaînes allongées et coiffés par des composés de phénol, de polyphénol ou d'aminophénol
GB201102672D0 (en) * 2011-02-15 2011-03-30 Zephyros Inc Improved structural adhesives
CN102516894B (zh) * 2011-11-10 2015-07-29 郑州中原应用技术研究开发有限公司 一种汽车内后视镜镜座专用结构胶片及其制备方法
CN105722933A (zh) 2013-07-26 2016-06-29 泽费罗斯股份有限公司 热固性粘合膜的改进或涉及它的改进
CN105295325B (zh) 2014-06-27 2019-12-27 康廷南拓结构塑料有限公司 包括表面改性的微球体的低密度模塑料
GB201417985D0 (en) 2014-10-10 2014-11-26 Zephyros Inc Improvements in or relating to structural adhesives
US10738226B2 (en) * 2016-01-13 2020-08-11 Sika Technology Ag Single-component thermosetting epoxy resin with improved adhesion
EP3800212B1 (fr) 2016-12-12 2024-04-10 PPG Industries Ohio, Inc. Résine polyester acrylique et composition de revêtement aqueuse la contenant
EP3418312A1 (fr) * 2017-06-22 2018-12-26 Sika Technology Ag Procédé de liaison de corps moulés par injection d'une composition de résine époxyde thermodurcissable à un composant dans des espaces creux
WO2020095995A1 (fr) 2018-11-08 2020-05-14 株式会社Adeka Composition de résine durcissable
CN113966356B (zh) 2019-06-14 2023-10-13 Sika技术股份公司 增韧的双组分环氧组合物
CN112646524A (zh) * 2020-12-23 2021-04-13 重庆德天汽车新材料研究院有限公司 一种用于粘接自润滑钢板的单组分环氧胶黏剂及其制备方法
JP7822242B2 (ja) * 2022-04-27 2026-03-02 サンライズ株式会社 自動車用接着剤
CN115286896A (zh) * 2022-08-08 2022-11-04 深圳市飞荣达科技股份有限公司 高韧性环氧树脂及其制备方法

Family Cites Families (56)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3148167A (en) * 1958-11-14 1964-09-08 Gen Tire & Rubber Co Polyurethane composition containing an epoxy compound
US3533983A (en) * 1966-06-01 1970-10-13 Furane Plastics Thermosetting phenyl glycidyl ether derivatives of isocyanate-terminated organic compounds
US3505283A (en) * 1967-05-15 1970-04-07 Merck & Co Inc Isocyanates as thickening agents for epoxy resins
AU3296071A (en) 1970-09-03 1973-03-08 Kolbel H Self-curing epoxy resins
CA1006284A (en) * 1972-12-11 1977-03-01 August Merckens Nachf. Kommanditgesellschaft Thixotropic coating agent, process for the preparation and use
US4486556A (en) * 1982-09-30 1984-12-04 Ford Motor Company Thermosetting coating composition-III
ES2020299B3 (es) * 1986-12-19 1991-08-01 Ciba-Geigy Ag Resinas epoxidicas con contenido de poliester sobre base de polialquilenglicol.
US5278257A (en) * 1987-08-26 1994-01-11 Ciba-Geigy Corporation Phenol-terminated polyurethane or polyurea(urethane) with epoxy resin
EP0307666A1 (fr) 1987-08-26 1989-03-22 Ciba-Geigy Ag Polyuréthanes ou polyurées terminés par des phénols et résines d'époxyde contenant ces composés
IT213534Z2 (it) 1988-02-02 1990-01-22 Rinaldi Superforni Forno elettrico per la cottura in continuo di pizze disposte in teglia.
DE58907670D1 (de) 1988-04-18 1994-06-23 Ciba Geigy Modifizierte Epoxidharze.
US4962138A (en) 1988-05-27 1990-10-09 W. R. Grace & Co.-Conn. Reactive hot melt structural adhesive
US4918878A (en) 1988-05-27 1990-04-24 Electric Avenue, Inc. Pay telephone enclosure
US5079094A (en) * 1988-05-27 1992-01-07 W. R. Grace & Co.-Conn. Article comprising metal substrates bonded with reactive hot melt structural adhesive and process thereof
US5189081A (en) * 1988-07-04 1993-02-23 Somar Corporation Penetrable, epoxy resin composition comprising glycidyl ether of bisphenol modified with glycol or urethane, and inorganic filler
ES2068911T3 (es) * 1988-07-28 1995-05-01 Ciba Geigy Ag Combinaciones de flexibilizadores para resinas epoxi.
US5151327A (en) * 1990-03-15 1992-09-29 Nitto Denko Corporation Adhesive sheet for reinforcing thin rigid plates
JPH0772233B2 (ja) * 1991-02-19 1995-08-02 日本ゼオン株式会社 エポキシ樹脂系発泡性組成物
WO1993000381A1 (fr) * 1991-06-26 1993-01-07 Teroson Gmbh Colle a fusion reactive
US5290857A (en) * 1991-09-04 1994-03-01 Nippon Zeon Co., Ltd. Epoxy resin adhesive composition
TW289763B (fr) * 1992-11-11 1996-11-01 Ciba Geigy Ag
DE4240480A1 (de) 1992-12-02 1994-08-25 Bayer Ag Organische Polyisocyanate mit zumindest teilweise blockierten Isocyanatgruppen
JP2850698B2 (ja) * 1993-03-30 1999-01-27 日本ゼオン株式会社 エポキシ樹脂系構造用接着性組成物
JP3655646B2 (ja) * 1993-05-24 2005-06-02 日産自動車株式会社 エポキシ樹脂用接着補強剤及び該補強剤を含有する自動車用エポキシ樹脂系構造接着性組成物
US5484853A (en) * 1993-07-28 1996-01-16 China Technical Consultants, Inc. Cryogenic adhesives made from epoxy terminated urethanes
US5530052A (en) * 1995-04-03 1996-06-25 General Electric Company Layered minerals and compositions comprising the same
JPH08325349A (ja) * 1995-06-01 1996-12-10 Nitto Denko Corp エポキシ樹脂組成物およびそれを用いた補強接着シート
DE69616187T2 (de) * 1995-07-19 2002-07-11 Raytheon Co., Lexington Bei Raumtemperatur stabiler flexibler Einkomponenten-Epoxidklebstoff
DE19549028A1 (de) 1995-12-28 1997-07-03 Huels Chemische Werke Ag Feuchtigkeitsvernetzende Schmelzklebstoffe, welche kein oder nur geringe Mengen an Kohlendioxid emittieren
JP3619975B2 (ja) * 1996-02-07 2005-02-16 東都化成株式会社 重合脂肪酸変性エポキシ樹脂、その製造方法及び該樹脂を含有した硬化性樹脂組成物
JP3245354B2 (ja) * 1996-06-12 2002-01-15 神東塗料株式会社 カチオン性電着塗料用樹脂組成物
US6077884A (en) * 1996-11-20 2000-06-20 Sika Chemie Gmbh Aqueous dispersion of epoxy resin and blend of epoxy resin-polyoxyalkylene amines
US6153709A (en) * 1998-01-26 2000-11-28 Essex Specialty Products, Inc. Chip resistant, vibration damping coatings for vehicles
ES2195547T3 (es) * 1998-02-20 2003-12-01 Vantico Ag Filosilicatos organofilicos.
US6322890B1 (en) * 1998-03-30 2001-11-27 Wm. Marsh Rice University Supra-molecular alkylalumoxanes
AT407748B (de) * 1998-05-12 2001-05-25 Solutia Austria Gmbh Verkappte amine als härter für wasserverdünnbare einkomponenten (1k)-epoxidharzsysteme
DE19858921A1 (de) 1998-12-19 2000-06-21 Henkel Teroson Gmbh Schlagfeste Epoxidharz-Zusammensetzungen
JP2002533487A (ja) * 1998-12-22 2002-10-08 アクゾ ノーベル ナムローゼ フェンノートシャップ チキソトロピー性アミノホルムアルデヒド樹脂
JP2000212504A (ja) * 1999-01-26 2000-08-02 Somar Corp コイル被覆用塗膜
US6248204B1 (en) * 1999-05-14 2001-06-19 Loctite Corporation Two part, reinforced, room temperature curable thermosetting epoxy resin compositions with improved adhesive strength and fracture toughness
DE19924170A1 (de) * 1999-05-25 2000-11-30 Basf Coatings Ag Thixotropierungsmittel
US6740192B1 (en) * 1999-09-27 2004-05-25 Georgia Tech Research Corp. Joining electroconductive materials with electroconductive adhesive containing epoxide-modified polyurethane
WO2001023466A1 (fr) 1999-09-27 2001-04-05 Georgia Tech Research Corp. Adhesif electroconducteur contenant du polyurethanne modifie en epoxy
JP2001234038A (ja) * 2000-02-23 2001-08-28 Sekisui Chem Co Ltd 硬化性エポキシ樹脂組成物
JP4108282B2 (ja) * 2000-04-12 2008-06-25 清水建設株式会社 ポリウレタン系一液型湿気硬化性組成物
EP1152019A1 (fr) * 2000-05-02 2001-11-07 Sika AG, vorm. Kaspar Winkler & Co. Agents thixotropes
US6903180B2 (en) * 2000-12-11 2005-06-07 Nippon Steel Chemical Co., Ltd. Epoxy resins, process for preparation thereof, epoxy resin compositions and cured articles
JP2002179753A (ja) * 2000-12-13 2002-06-26 Nippon Shiika Kk 高耐候性ポリウレタン系一液型湿気硬化性組成物
JP2003096266A (ja) * 2001-09-20 2003-04-03 Mitsui Kinzoku Toryo Kagaku Kk 舗装用バインダー組成物及びそれを用いた舗装材
DE10250399A1 (de) * 2001-10-30 2003-05-28 Yokohama Rubber Co Ltd Härtbare Harzzusammensetzung
JP3866114B2 (ja) * 2002-02-05 2007-01-10 オート化学工業株式会社 揺変性室温硬化性組成物及びその製造方法
EP1359202A1 (fr) 2002-05-03 2003-11-05 Sika Schweiz AG Composition de résine époxy réticulable par application de chaleur
EP1431325A1 (fr) 2002-12-17 2004-06-23 Sika Technology AG Composition de résine époxy durcissable à la chaleur ayant une résistance au choc à basse température
CA2529737C (fr) 2003-07-07 2013-05-07 Dow Global Technologies Inc. Composition de colle epoxyde et son procede d'application
EP1498441A1 (fr) 2003-07-16 2005-01-19 Sika Technology AG Compositions réticulables à la chaleur comprenant un modificateur de résistance au choc à basse température
CA2983081C (fr) 2015-06-10 2024-01-02 Inventio Ag Systeme d'ascenseur avec generation d'appel predictive

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO03093387A1 *

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JP2010043288A (ja) 2010-02-25
JP4515251B2 (ja) 2010-07-28
US20080073029A1 (en) 2008-03-27
EP1359202A1 (fr) 2003-11-05
AU2003229684A1 (en) 2003-11-17
WO2003093387A1 (fr) 2003-11-13
US7786214B2 (en) 2010-08-31
US20050159511A1 (en) 2005-07-21
JP2005524736A (ja) 2005-08-18

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