EP1551730A1 - Support a surfaces adhesives - Google Patents

Support a surfaces adhesives

Info

Publication number
EP1551730A1
EP1551730A1 EP03751965A EP03751965A EP1551730A1 EP 1551730 A1 EP1551730 A1 EP 1551730A1 EP 03751965 A EP03751965 A EP 03751965A EP 03751965 A EP03751965 A EP 03751965A EP 1551730 A1 EP1551730 A1 EP 1551730A1
Authority
EP
European Patent Office
Prior art keywords
carrier
body portion
contact surface
dyne
rigid body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP03751965A
Other languages
German (de)
English (en)
Other versions
EP1551730A4 (fr
Inventor
Charles W. Extrand
Ralph Henderer
Frank Manganiello
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Entegris Inc
Original Assignee
Entegris Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/241,815 external-priority patent/US6926937B2/en
Priority claimed from US10/241,805 external-priority patent/US7108899B2/en
Application filed by Entegris Inc filed Critical Entegris Inc
Publication of EP1551730A1 publication Critical patent/EP1551730A1/fr
Publication of EP1551730A4 publication Critical patent/EP1551730A4/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B25/00—Layered products comprising a layer of natural or synthetic rubber
    • B32B25/04—Layered products comprising a layer of natural or synthetic rubber comprising rubber as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B25/08—Layered products comprising a layer of natural or synthetic rubber comprising rubber as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B25/00—Layered products comprising a layer of natural or synthetic rubber
    • B32B25/18—Layered products comprising a layer of natural or synthetic rubber comprising butyl or halobutyl rubber
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/302—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising aromatic vinyl (co)polymers, e.g. styrenic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/0008—Electrical discharge treatment, e.g. corona, plasma treatment; wave energy or particle radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
    • B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
    • B65D85/38—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for delicate optical, measuring, calculating or control apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0084—Containers and magazines for components, e.g. tube-like magazines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2274/00—Thermoplastic elastomer material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2310/00—Treatment by energy or chemical effects
    • B32B2310/14—Corona, ionisation, electrical discharge, plasma treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2323/00—Polyalkenes
    • B32B2323/04—Polyethylene
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2323/00—Polyalkenes
    • B32B2323/10—Polypropylene
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2325/00—Polymers of vinyl-aromatic compounds, e.g. polystyrene
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2367/00—Polyesters, e.g. PET, i.e. polyethylene terephthalate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2377/00—Polyamides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2439/00—Containers; Receptacles
    • B32B2439/02—Open containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/741—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support the auxiliary support including a cavity for storing a finished or partly finished device during manufacturing or mounting, e.g. for an IC package or for a chip

Definitions

  • This invention relates to carriers for handling small components, and more particularly it relates to carrier trays for handling small electronic components such as semiconductor chips and devices.
  • a film frame tray generally has a frame portion surrounding a thin film. On the top surface of the thin film, a layer of adhesive is disposed. A plurality of devices may then be arranged at any desired locations on the adhesive, and the adhesive serves to secure the devices in place.
  • An example of such a film frame carrier is disclosed in U.S. Patent No. 5,833,073, hereby fully incorporated herein by reference.
  • carrier tray designs have been developed wherein physical structures, in the form of pockets, are used to secure a plurality of devices on the surface of the tray.
  • An example of a pocketed matrix tray is disclosed in U.S. Patent No. 5,481,438.
  • Some of these matrix tray designs such as Japanese laid open patent application JP 05-335787, also include a multi-layer adhesive material in the bottom of the pockets for securing the devices in place.
  • a problem with previous carriers using typical adhesive materials is that such adhesives may attract contaminants in the form of particles that can damage the devices. These contaminants can be difficult to remove from the tray by washing without causing degradation of the adhesive.
  • the adhesive itself may contain solvents or other undesirable chemicals that can contaminate the devices or the process.
  • the adhesive itself may undergo changes in response to environmental conditions, becoming either too tacky so as to interfere with the operation of the robotic device handling process, or not tacky enough so as not to properly secure the devices in place.
  • Prior art carrier trays having pockets or other physical structures to retain the device may also present problems.
  • Devices such as bare or leadless chips are not easily captured in a physical structure due to the lack of projections on the device. Also, the devices may become dislodged from the physical restraints during handling, leading to device damage or improper positioning for handling by a robot.
  • the present invention is a carrier, having electrostatic discharge (ESD) safe properties, for handling and retaining a plurality of small components wherein the components are retained by adhesion between a surface of the components and a contact surface of the carrier.
  • the contact surface is formed from a relatively soft thermoplastic elastomer material having a moderate to high surface energy and a surface electrical resistivity of between about 1 x 10 4 ohms/square and 1 x 10 12 ohms/square.
  • the component is retained in place exclusively by adhesion with the thermoplastic contact surface and without other physical retaining structures or separate adhesives.
  • the contact layer of the carrier may be injection overmolded onto a rigid body portion, which is preferably formed from rigid thermoplastic material.
  • the contact surface and the rigid body portion may be held together with a polar bond formed during the injection molding process.
  • the relative amount of adhesion provided by the contact surface may be adjusted by intermixing or alloying the thermoplastic elastomer material with impact modifying polymers or blends of other thermoplastic elastomers.
  • the relative amount of adhesion and the electrical properties ofthe contact surface may be modified by intermixing or alloying the thermoplastic elastomer with inherently static dissipative or conductive polymers, inorganic filler material such as carbon fiber, carbon powder, metallic, or ceramics, or organic filler material.
  • small depressions or projections arranged randomly or in a regular matrixical pattern may be provided in the contact layer to alter the amount of surface area, and resultant amount of adhesion, available for contact with the components to be retained. It is a feature and advantage of the invention that components are retained on the carrier only by adhesion between a flat surface of the component with a thermoplastic elastomer contact surface ofthe carrier.
  • the carrier is more easily recyclable than known carriers.
  • a stack of carriers according to the invention may be repositioned with the components retained in place, without the need for any lateral contact or constraint on the components, and without any contact with the top sides ofthe components.
  • the relative amount of the component attractive force provided by the surface may be adjusted to suit an individual application by selection or modification ofthe materials used or by alteration of the surface geometry ofthe contact layer.
  • FIG. 1 is a perspective view of a prefened embodiment ofthe carrier ofthe present invention
  • FIG. 2 is a cross sectional view ofthe carrier of FIG. 1;
  • FIG 2A is an enlarged view of a portion of FIG. 2;
  • FIG. 2B is an enlarged view of a portion of FIG. 2, depicting an alternative embodiment
  • FIG. 3 is a table listing the various materials that may be used for the contact surface and body ofthe carrier;
  • FIG. 4 is a cross sectional view of multiple carriers in a stacked configuration;
  • FIG. 5 A is an enlarged view of a portion of FIG. 2 A;
  • FIG. 5B is an enlarged view of a portion of FIG. 2 A depicting mechanical bonding structures for. securing the component contact layer to the rigid body portion;
  • FIG. 5C is an enlarged view of a portion of FIG. 2A depicting a tie layer for securing the component contact layer to the rigid body portion;
  • FIG. 5D is an enlarged view of a portion of FIG. 2A depicting a multiplicity of depressions in the component contact layer for reducing the adhesiveness thereof;
  • FIG. 5B is an enlarged view of a portion of FIG. 2A depicting a multiplicity of projections on the component contact layer for reducing the adhesiveness thereof;
  • FIG. 6 is a cross sectional view of an alternative embodiment ofthe invention.
  • FIG. 7 is a persective view of an alternative embodiment of a carrier according to the invention.
  • FIG. 8 is a cross-sectional view ofthe carrier depicted in FIG. 7;
  • FIG. 9 is a cross sectional view of multiple carriers, as depicted in FIG. 7, in a stacked configuration;
  • FIG. 10 is a perspective, partially exploded view of a carrier according to FIG. 7 with a separate grid structure for defining individual component retaining regions; and FIG. 11 is a cross-sectional view ofthe carrier depicted in FIG. 10.
  • the term "about” means that dimensions, sizes, tolerances, formulations, parameters, shapes and other quantities and characteristics are not and need not be exact, but may be approximate and/or larger or smaller, as desired, reflecting tolerances, conversion factors, rounding off, measurement error and the like, and other factors known to those of skill in the art.
  • a dimension, size, formulation, parameter, shape or other quantity or characteristic is “about” or “approximate” whether or not expressly stated to be such.
  • Carriers are used in the micro-electronic industry for storing, transporting, fabricating, and generally holding small components such as, but not limited to, semiconductor chips, ferrite heads, magnetic resonant read heads, thin film heads, bare dies, bump dies, substrates, optical devices, laser diodes, preforms, and miscellaneous mechanical articles such as springs and lenses.
  • the present invention includes a carrier for handling semiconductor devices and other small components wherein the component has a surface area that can be placed into direct contact with a thermoplastic contact surface of the carrier having moderate to high surface energy.
  • the carrier is suitable for any type of component, including those having no projections or leads, such as bare or leadless chips, but may also be used with devices having leads such as Chip Scale Package (CSP) devices.
  • CSP Chip Scale Package
  • the devices are retained on the carrier without the use of a separate adhesive material, and without lateral or vertical physical restraints apart from the thermoplastic contact surface itself.
  • the contact surface generally includes a relatively soft thermoplastic material having a moderate to high surface energy.
  • the adhesion between a flat surface of the device and the contact surface retains the device during movement and normal handling of the tray while enabling the device to be easily lifted from the surface by a robotic handling apparatus.
  • the carrier may be made ESD safe through the use of materials having a surface electrical resistivity of between about 1 x 10 4 ohms/square and 1 x 10 12 ohms/square for either or both the contact surface and the body portion.
  • FIGS. 1 and 2 depict a preferred embodiment of a carrier according to the invention in the form of matrix tray 100.
  • Tray 100 has rigid body portion 110 in which is formed a plurality of individual component receiving pockets 102 arranged in a matrix and oriented in a plane defined by the "x" and "y" axes as shown.
  • Each pocket 102 has a depth dimension oriented in the "z" axis direction and contains at least one component contact surface 120 for engaging and retaining a single component.
  • Body portion 110 preferably has a peripheral border region 112 projecting laterally outward beyond the edge 122 of matrix portion 116.
  • a downwardly projecting skirt 114 may be provided on body portion 110.
  • the skirt 114 is positioned so as to engage the peripheral border region 112 of a tray located immediately below when multiple trays are stacked as shown in Figure 4.
  • other structures such as downwardly projecting legs or posts may be used to facilitate stacking of multiple trays.
  • the pockets 102 are shown as being formed integrally in rigid body portion 110, other configurations wherein component receiving pockets or other structures are formed are contemplated and are within the scope of the invention.
  • the pocket defining cross members 132 may be formed in a separate grid work piece and attached to the remainder of rigid body portion 110 using adhesives, fasteners or other means.
  • carrier 300 has a rigid body 302 oriented in a plane defined by the "x" and "y" axes as depicted.
  • Rigid body 302 is overlain by contact layer 120.
  • Rigid body 302 preferably has a peripheral border region 304 projecting laterally outward beyond the edge 306 of contact layer 120.
  • Body portion 302 may have a downwardly projecting skirt 308.
  • Skirt 308 is positioned so as to engage peripheral border region 304 of another carrier 300 located immediately below when multiple carriers 300 are stacked as depicted in Figure 9.
  • skirt 308 other structures such as legs or posts may be similarly used to facilitate stacking of multiple carriers 300.
  • Skirt 308 is of sufficient length so that any components 200 disposed on contact layer 120 do not contact any portion of the tray 300 stacked immediately above. Although not necessary for effective retention of components, a separate grid member 310 may be attached over contact layer 120 to define individual component retaining regions 312, as depicted in Figures 11 and 12.
  • contact surface 120 is formed from a polymeric elastomer material having a moderate to high surface energy, a relatively soft surface, and ESD safe properties.
  • thermoplastics offer the general advantages of easier recyclability, greater purity with a smaller process contamination causing sol-fraction, and lower cost, and are hence preferred.
  • the prefened materials for contact surface 120 are relatively soft thermoplastic elastomers, including, for example, elastomeric variants of urethane (UR), polybutylene terephthalate (PBT), polyolefms (PO), polyethylene terephthalate (PET), styrenic block co-polymers (e.g.
  • thermoplastic vulcanizate material such as polypropylene/crosslinked EDPM rubber, for example Santoprene® made by Advanced Elastomer Systems of Akron, Ohio, may be also used.
  • the surface energy of the material is preferably 20 dyne/centimeter to 100 dyne/centimeter, more preferably between about 30 dyne/centimeter to 45 dyne/centimeter, and most preferably about 40 dyne/centimeter.
  • the material preferably has a durometer hardness value of less than about Shore D75, and more than about Shore A15.
  • the contact surface be ESD safe, having a surface electrical resistivity value of between about 1 x 10 4 ohms/square and 1 x 10 12 ohms/square.
  • Inherently static dissipative polymers may be intermixed or alloyed with the contact surface material to achieve the desired surface electrical resistivity.
  • inherently conductive polymers such as doped polyaniline, polypynole, polythiophene, polyisothianaphthene, polyparaphenylene, polyparaphenylene vinylene, polyheptadiyne, or polyacetylene may be used as alloying polymers.
  • carbon fiber, carbon powder, metallic particulate, ceramic particulate, or other electrically conductive fillers may be added to the material.
  • Organic filler materials may also be used to alter the surface resistivity of the material, such as for example, quaternary ammonium salts, sulfonium salts, alkyl sulfonates, alkyl sulfates, alkyl phosphates, ethanol amides, ethanol amines, or fatty amines.
  • any other method or material may be used for the purpose which provides the requisite electrical properties along with the desired physical properties of surface energy, relative hardness and purity.
  • the amount of adhesion provided by contact surface 120 may be adjusted for particular applications wherein components with specific physical characteristics are to be retained. This adjustment may be accomplished by selecting or altering the material used for contact surface 120, or through alterations to the geometry and dimensions of the surface itself. Generally, for example, the materials having surface energies at the higher end of the ranges will be more strongly retentive of components than materials at the lower end of the ranges. Also, materials with hardness values at the softer end of the range will typically be more strongly retentive of components than will the harder materials. Any of the alloying or filler materials discussed above may also be intermixed or alloyed with the base material for the purpose of altering the surface energy or relative hardness of the base material.
  • the desired relative hardness properties may also be achieved using impact modifying polymers or blends of other thermoplastic elastomers as alloying agents.
  • surface layer 120 provide a degree of adhesion to a component per unit of component area at least greater than the conesponding gravitational force per unit area ofthe component, thus permitting retention of the component even when the tray is inverted. It is most prefened that the amount of adhesion be sufficient to retain the components under shock and vibration loads typically encountered during shipping and handling operations.
  • the amount of adhesion may also be reduced by selectively altering the geometry and resulting amount of available component contact area of contact surface 120. This may be accomplished by forming a multiplicity of regular depressions 180 or projections 182 in contact surface 120 as shown in greatly exaggerated fashion for clarity in Figure 5C or 5D, respectively.
  • the depressions 180 or projections 182 may be ananged randomly or in a regular matrix pattern on contact surface 120.
  • the depressions 180 or projections 182 may be from about 0.000040 inch to 0.10 inch in depth or height respectively, and spaced from about 0.000040 inch to about 0.30 inch apart, as may be needed to achieve the desired amount of adhesion.
  • the features may be formed on contact surface 120 by stamping with a mold machined with a negative impression of the desired features.
  • the mold may be machined using known machining techniques. Photolithography may be used to machine the mold to form regular features at the smaller ends ofthe ranges. As an alternative, a mold having a fine, random distribution of features may be made by sandblasting, glass beading, or shotpeening the mold surface.
  • FIG. 2 A One prefened embodiment of a matrix tray, suitable for bare or leadless devices 208, is shown in Figure 2 A.
  • the contact surface 120 is molded over the bottom 104 of each pocket 102 in a continuous layer.
  • a device 208 has a surface 209 in direct contact with contact surface 120.
  • Device 208 is retained in place by adhesion between surface 209 and contact surface 120 exclusively.
  • body portion 110 is not in direct contact with device 208 and does not constrain the device.
  • FIG. 2B has contact surface 120 formed as a part of a raised structure 106 within the pocket 102. As illustrated, this structure is particularly suitable for certain types of components 210 having projecting leads 212.
  • the invention may include any pocket configuration or structure wherein a thermoplastic elastomer contact surface having the requisite properties is presented that can be placed into contact with the surface of a device.
  • the tray may include a matrix of platform structures 158 raised above the surface of the body portion ofthe tray 110 in place of recessed pockets.
  • Contact surface 120 is provided at the top of each structure 158.
  • contact surface 120 be injection overmolded using standard injection molding techniques.
  • the materials for surface layer 120 and body portion 110 are selected so that a polar bond is formed during the injection molding process.
  • the two layers may also be mechanically fastened together, or may be secured by a combination of methods.
  • mechanical bonding structures 160 as shown best in Figure 5B, may be provided on body portion 110 to enhance bonding efficacy.
  • an intermediate or tie layer 170 may be used between the two materials to enhance bonding effectiveness as shown in Figure 5E.
  • thermoplastic polymers be used for body portion 110, as well as for contact portion 120, since thermoplastics tend to offer the general advantages of easier recyclability, greater purity with a smaller process contamination causing sol-fraction, and lower cost.
  • Body portion 110 may be made ESD safe using the same materials and techniques as discussed for contact portion 120. Suitable rigid thermosetting polymers may also be used for body portion 110, but are less prefened.
  • Body portion 110 provides rigidity and mechanical strength to the tray, and accordingly must be made from suitably rigid material and must have adequate thickness to withstand the mechanical loading anticipated during use and handling of the tray.
  • any suitable polymer material having the desired qualities of rigidity, mechanical strength, and chemical compatibility may be used, some suitable polar polymer materials for body portion 110 are listed in the first column of the table found in Figure 3.
  • the listed "Group A" thermoplastic materials may be molded with any of the contact portion materials listed in the second column of the table without need for surface treatment of the body material, although surface treatment may be used to enhance bonding efficacy.
  • the body materials listed in “Group B” are generally non-polar polymers, and require surface treatment in the form of corona, plasma, chemical, or flame treatment to achieve a proper polar bond with contact portion 120.
  • the materials in “Group B” may be bonded using a separate intermediate tie layer of mutually compatible material, such as Bynel® made by Du Pont Corporation or Tymor® made by Nichimen Corporation.
  • individual components may be placed with a significant portion of the surface of the component in contact with the contact surface 120.
  • the moderate to high surface energy and relative softness of contact surface 120 results in effective retention of the component on contact surface 120 by adhesion between the thermoplastic contact surface 120 and a surface of the device, but without the need for separate adhesives or other physical retaining structures.
  • the ESD safe static dissipative properties of the materials for the contact surface, rigid body portion or both, provide electrical protection for the devices stored therein.
  • the thermoplastic construction of the tray reduces the amount of process contamination contributed by the tray. Moreover, the thermoplastic components are more easily and completely recycled, for reduced environmental impact.
  • each device 208 is in direct contact with, and is retained by contact surface 120.
  • the devices 208 are disposed within pockets 102, and do not extend above the top surface 124 of cross members 132.
  • skirt 114 of each tray contacts and rests on peripheral border region 112 of the tray immediately below. Skirt 114 is of sufficient height so that bottom surface 126 of the tray is spaced apart from the top surfaces 124 of the tray immediately below.
  • Devices 208 are retained in place only by adhesion with contact surface 120.
  • the devices 208 are not laterally constrained within the pocket by body portion 110, and are not vertically constrained by contact with bottom surface 126 of the tray immediately above.
  • the stack of trays 101 may be repositioned and even inverted without causing the devices 208 to be dislodged, and without the need for device contact with other trays or with other portions ofthe same tray.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Thermal Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Packaging Frangible Articles (AREA)
  • Laminated Bodies (AREA)

Abstract

L'invention concerne un support conçu pour la manipulation et le maintien d'une pluralité de petits composants. Le support présente un composant élastomère à surface de contact formée à partir d'un matériau élastomère thermoplastique ayant une énergie superficielle comprise entre 20 dynes/cm et 100 dynes/cm, une dureté comprise entre environ A15 Shore et D75 Shore, et une résistivité électrique superficielle comprise entre environ 1 x 104 ohm/carré et 1 x 1012 ohm/carré.
EP03751965A 2002-09-11 2003-09-04 Support a surfaces adhesives Withdrawn EP1551730A4 (fr)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US241805 2002-09-11
US10/241,815 US6926937B2 (en) 2002-09-11 2002-09-11 Matrix tray with tacky surfaces
US10/241,805 US7108899B2 (en) 2002-09-11 2002-09-11 Chip tray with tacky surface
US241815 2002-09-11
PCT/US2003/027533 WO2004024594A1 (fr) 2002-09-11 2003-09-04 Support a surfaces adhesives

Publications (2)

Publication Number Publication Date
EP1551730A1 true EP1551730A1 (fr) 2005-07-13
EP1551730A4 EP1551730A4 (fr) 2007-10-24

Family

ID=31996730

Family Applications (1)

Application Number Title Priority Date Filing Date
EP03751965A Withdrawn EP1551730A4 (fr) 2002-09-11 2003-09-04 Support a surfaces adhesives

Country Status (6)

Country Link
EP (1) EP1551730A4 (fr)
JP (1) JP2006505457A (fr)
KR (1) KR20050042186A (fr)
AU (1) AU2003270072A1 (fr)
TW (1) TWI290121B (fr)
WO (1) WO2004024594A1 (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8081118B2 (en) * 2008-05-15 2011-12-20 The Boeing Company Phased array antenna radiator assembly and method of forming same
KR101043475B1 (ko) * 2009-06-02 2011-06-23 삼성전기주식회사 다층 세라믹 기판용 지그 및 이를 이용한 다층 세라믹 기판의 제조 방법
NL2005626C2 (nl) * 2010-11-04 2012-05-07 Fico Bv Drager voor gesepareerde elektronische componenten en werkwijze voor visuele inspectie van gesepareerde elektronische componenten.
KR20170100353A (ko) * 2016-02-25 2017-09-04 (주)코스탯아이앤씨 반도체 수납 트레이 및 반도체 수납 트레이용 커버
JP7002302B2 (ja) * 2016-12-13 2022-02-10 芝浦メカトロニクス株式会社 成膜装置
JP7377426B2 (ja) * 2019-01-29 2023-11-10 キョーラク株式会社 二重容器
JP6730493B1 (ja) * 2019-06-14 2020-07-29 アァルピィ東プラ株式会社 積層体及び搬送部材

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4395451A (en) * 1980-07-14 1983-07-26 Althouse Victor E Semiconductor wafer and die handling method and means
US4778326A (en) * 1983-05-24 1988-10-18 Vichem Corporation Method and means for handling semiconductor and similar electronic devices
US4875581A (en) * 1985-03-19 1989-10-24 Robert B. Ray Static dissipative elastomeric coating for electronic packaging components
US5769237A (en) * 1996-07-15 1998-06-23 Vichem Corporation Tape carrier for electronic and electrical parts
JP2002002871A (ja) * 2000-04-20 2002-01-09 Hitachi Ltd 半導体装置の製造方法およびそれに用いられるトレイ

Also Published As

Publication number Publication date
KR20050042186A (ko) 2005-05-04
JP2006505457A (ja) 2006-02-16
TWI290121B (en) 2007-11-21
EP1551730A4 (fr) 2007-10-24
TW200406349A (en) 2004-05-01
WO2004024594A1 (fr) 2004-03-25
AU2003270072A1 (en) 2004-04-30

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