Classifications

• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/0213—Electrical arrangements not otherwise provided for
  • H05K1/0237—High frequency adaptations
  • H05K1/0243—Printed circuits associated with mounted high frequency components
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W42/00—Arrangements for protection of devices
  • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W42/00—Arrangements for protection of devices
  • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
  • H10W42/261—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons characterised by their shapes or dispositions
  • H10W42/276—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons characterised by their shapes or dispositions the arrangements being on an external surface of the package, e.g. on the outer surface of an encapsulation
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W44/00—Electrical arrangements for controlling or matching impedance
  • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/0213—Electrical arrangements not otherwise provided for
  • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
  • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
  • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
  • H05K2201/10227—Other objects, e.g. metallic pieces
  • H05K2201/10371—Shields or metal cases
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
  • H05K2201/10431—Details of mounted components
  • H05K2201/10439—Position of a single component
  • H05K2201/10477—Inverted
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
  • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
  • H05K2201/10621—Components characterised by their electrical contacts
  • H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
  • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
  • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
  • H05K3/341—Surface mounted components
  • H05K3/3431—Leadless components
  • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W44/00—Electrical arrangements for controlling or matching impedance
  • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
  • H10W44/203—Electrical connections
  • H10W44/209—Vertical interconnections, e.g. vias
  • H10W44/212—Coaxial feed-throughs in substrates
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W72/00—Interconnections or connectors in packages
  • H10W72/071—Connecting or disconnecting
  • H10W72/075—Connecting or disconnecting of bond wires
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W72/00—Interconnections or connectors in packages
  • H10W72/50—Bond wires
  • H10W72/541—Dispositions of bond wires
  • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W72/00—Interconnections or connectors in packages
  • H10W72/50—Bond wires
  • H10W72/551—Materials of bond wires
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W72/00—Interconnections or connectors in packages
  • H10W72/90—Bond pads, in general
  • H10W72/951—Materials of bond pads
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
  • H10W76/60—Seals
  • H10W76/63—Seals characterised by their shape or disposition, e.g. between cap and walls of a container
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W90/00—Package configurations
  • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
  • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
  • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Definitions

• the present invention relates to a surface mount microwave package and such a package mounted on a multilayer circuit. It applies in particular to microwave boxes used in the fields of avionics, telecommunications, space. Microwave components are generally placed in boxes, called microwave boxes, one function of which is to protect the components from the external electromagnetic environment and to avoid the propagation of parasitic modes inside. To this end, the internal volume of the microwave boxes is surrounded by a conductive surface forming a mass, the dimensions of a box being less than half a wavelength (of the order of 70 mm for a frequency of 20 GHz). Another function of microwave boxes is to protect components from the external physical environment, in particular from humidity. For this purpose, the boxes are closed hermetically, a neutral gas being trapped in the box.
• a Planar Pack in Anglo-Saxon literature.
• a Planar Pack “case includes a ceramic element and an engraved metal sheet, called” Lead Frame “in Anglo-Saxon literature.
• the ceramic element generally has a base in the form of U, and is closed by a lid brazed on this base to ensure airtightness.
• a microwave component (bare chip for example) can be placed in the ceramic element.
• a surface of the ceramic element is gilded to form a
• the U-shaped base is carried by the etched metal sheet.
• This metal sheet includes microstrip lines to route the microwave signals to the microwave component, and lines to route the low frequency signals (power supply, control).
• the microwave lines radiate in the half-space delimited by the metallic sheet ("Lead Frame") on the side of the ceramic element. This results in parasitic electromagnetic couplings between the microwave input and output of the same box on the one hand, and between neighboring boxes on the other hand.
• An object of the invention is to provide input-outputs (microwave and low frequencies) in microwave packages, avoiding any parasitic electromagnetic coupling, and this in a simple manner.
• the subject of the invention is in particular a surface mount microwave box, delimiting an interior volume, comprising at least:
• connection point placed outside the Faraday cage, the connection point being intended to be electrically connected to an external circuit
• connection point being placed on the mounting surface, so that the connection point is placed between the Faraday cage and the external circuit when the box is mounted on the external circuit.
• the invention also relates to an assembly comprising such a housing and a multilayer circuit, the housing being mounted on the multilayer circuit, the multilayer circuit comprising at least one conductive ground plane, a metallized hole is produced in the multilayer circuit opposite from the connection point of the box, so as to route the signal through the ground plane to a track of the circuit.
• the tracks of the multilayer circuit are placed between two ground planes. In this way, the implantation of the card being provided so that the signal remains in stripline mode (via a metallized hole), the quality of its shielding is maintained.
• connection point is connected to the input-output by a straight link, the link being perpendicular to the external circuit when the housing is mounted on it.
• connection point is formed by a conductive signal ball
• the housing further comprises a coaxial structure shielding the connection point, the coaxial structure being formed by ground balls, conductive, electrically connected to Faraday's cage, placed around the signal ball.
• a component is placed in the interior volume of the housing, the component being carried by a radiator forming a housing face, the radiator being opposite the face carrying the mounting surface.
• the main advantages of the invention are that it makes it easy, compared with direct wiring to a circuit, to dismantle the box (since it is surface mounted) to carry out tests for example.
• the transitions being vertical (perpendicular to the plane of the circuit), the box according to the invention can be used in wideband applications.
• the contact points are formed by conductive balls. This allows soldering to be carried out simply and reliably, the distance between the circuit and the housing being linked to the diameter of the balls.
• disassembly of the housing can be done by sending a jet of hot air under the case, which would not be possible if the case was glued for example.
• FIGS. 1 to 3 an example of implementation of the invention with a housing in a "face up" configuration
• FIGS. 1 to 3 in which an example of implementation of the invention is shown, with a case of the "face up” type, that is to say the microwave component or components of which are placed on the wall. of the box which is intended to be mounted on the external circuit.
• the housing 1 makes it possible to delimit an interior volume 1a.
• a base 3 forms a wall of the housing.
• the base is intended to be mounted on the external circuit 6.
• the base 3 can be a printed circuit comprising two conductive layers.
• the printed circuit forming the base may include a different number of conductive layers.
• the circuit forming the base 3 can be made using an insulating material, preferably organic. This insulating material can be metallized with copper for example to form the two conductive layers.
• the circuit comprises a thickness of 3d insulating material, on which are deposited conductive layers on either side of the insulating thickness.
• the first conductive layer forms an inner face of the housing 1.
• This layer comprises conductive surfaces 3a, 3b, 3c etched by methods known to those skilled in the art.
• the second conductive layer can form an outer face of the housing (in this example). It essentially comprises a single conductive surface 3e. This conductive surface 3e covers almost entirely the entire surface of the base 3, forming a mass. This mass is intended to be electrically connected to the external circuit 6.
• the housing further comprises a conductive structure 4, 5 which forms with the surface 3e, a Faraday cage surrounding the interior volume 1a of the housing.
• the internal volume 1a is thus protected against external electromagnetic disturbances.
• the conductive structure can be formed by a metallized cover.
• the conductive structure can (as shown in FIG. 1) be formed by metal walls 4 covered by a metal plate 5.
• the metal plate 5, the walls 4, and the base 3 can be brazed.
• a microwave component 2 is mounted in the housing 1.
• the mass of the component is in contact with a conductive surface 3b of the inner layer of the base 3.
• the microwave component can be a bare chip for example. This chip can be soldered or glued with a conductive adhesive, preferably soldered, on the conductive surface 3b.
• the conductive surface 3b is electrically connected to the outer layer 3e (see FIG. 3) by one or more, preferably several, metallized holes 7b. This produces a microwave mass.
• the metallized holes 7b are plugged to seal the housing 1.
• the microwave and low frequency inputs-outputs of the chip 2 are connected to tracks 3a of the inner layer of the base 3, for example with conductive wires 9.
• Each track 3a is electrically connected to a disk 30 (see FIG. 3) of the outer layer of the base 3.
• This electrical connection is produced by metallized signal holes 7a and 7c, passing through the base 3, respectively carrying the microwave signals and the low frequency signals.
• the metallized holes 7a and 7c are plugged to seal the housing 1.
• the discs 30 are electrically isolated from the outer conductive layer 3e. To this end, recesses 31 are made in the conductive layer 3e.
• the discs 30 form connection points of the housing 1. These connection points are intended to be electrically connected directly to the external circuit 6.
• the connections (not shown) between the external circuit 6 and the connection points connections can be made by soldering or gluing.
• conductive balls ⁇ a are placed in contact with the discs 30.
• These conductive balls 8a are an integral part of the housing. They then form the connection points of the housing in place of the disks 30.
• the conductive balls 8a can be tin-lead beads for example. They have the advantage of not being deformed during assembly of the housing on the external circuit 6, which makes it possible to control the distance between the housing 1 and the circuit 6.
• the balls 8a can be brazed or glued, preferably brazed, on circuit 6.
• the inner conductive layer may include a conductive surface 3c.
• the conductive surface 3c is electrically connected with the external conductive layer 3e by metallized holes, preferably plugged.
• these metallized holes are distributed in a regular mesh.
• the conductive tracks 3a intended for transmitting microwave signals are placed in recesses 20 of the conductive surface 3c, so as to shield these tracks in the plane of these tracks (inner layer).
• metallized holes of mass 21 electrically connect the interior conductive surface 3c with the exterior conductive layer 3e.
• these holes are plugged to seal the housing 1. They are distributed around the periphery of the metallized holes of microwave signals 7a. In this way, microwave shielding is carried out in the thickness of the base 3, that is to say in the insulating thickness 3d.
• these metallized holes are at least three in number per metallized hole of microwave signal 7a. They are preferably distributed over 360 ° so as to form a complete shielding.
• mass conductive balls (not shown) are placed at the outlet of the mass metallized holes 21. These conductive balls form an integral part of the housing 1. In this way, a coaxial structure is formed which shields the connections between the microwave input-output and the circuit 6. In other words, a shielding is made at the level of the connection itself, that is to say in the space between the box and the circuit 6.
• conductive balls 8b forming an integral part of the housing 1, can be placed to electrically connect the conductive surface 3e with the mass of the circuit 6. These conductive balls 8b are not necessarily in the extension of the metallized holes 32 formed in the base 3.
• the diameter of the balls (of masses and microwave signal), the diameter of the metallized holes, the distance between a signal ball and the mass balls surrounding it, and the number of mass balls are determined to obtain a controlled impedance, for example 50 Ohm.
• the circuit 6 on which the housing is intended to be mounted can be a multilayer circuit.
• the circuit 6 comprises at least one conductive ground plane 6a.
• a metallized hole 10a is made in the multilayer circuit opposite connection point 8a of the housing 1, so as to route the signal through the conductive ground plane 6a.
• the signal arrives via the metallized hole 10a at a track 11 for example, the track and the ground plane forming a structure making it possible to propagate a microwave signal.
• the circuit comprises a second conductive ground plane 6b placed under the track 11.
• the circuit 6 comprises two layers of microwave mass 6a, 6b between which propagates a microwave signal. An armored structure is thus formed.
• part of the signal being routed between the ground planes 61 and 6b at least one connection is made with another layer of the circuit 6 placed under the ground plane 6b. It is thus possible to propagate microwave signals in different layers 11, 12 of circuit 6.
• a third ground plane 6c is placed under the layer 12.
• the multilayer circuit 6 can have a different configuration. It can include more ground planes and more layers propagating microwave or low frequency signals.
• the ground balls of the housing are preferably connected to the ground plane 6a. They can also be connected to other ground planes by metallized holes. According to an advantageous embodiment, the conductive ground planes of the circuit are interconnected by metallized holes 10b. This forms a microwave shield in the thickness of the circuit.
• FIGS. 4 to 7, on which an example of implementation of the invention is shown, with a "face down" type housing, that is to say one or more microwave components or components are placed on a wall. of the box opposite that intended to be mounted on the external circuit.
• This configuration is used for microwave components that need to dissipate heat (amplifiers for example).
• the housing 40 makes it possible to delimit an interior volume 1a relative to the exterior 1b. It essentially comprises a cover 41, 42 placed on a base 45, 47.
• the cover essentially comprises a radiator 41 formed by a rectangular plate, under which is placed an upper frame 42.
• the base essentially comprises a lower frame 45 under which is placed a rectangular plate 47. When the cover is on the base, the upper frame and the lower frame are superimposed.
• the exterior surface of the base forms a mounting surface, intended to be mounted on the exterior circuit (not shown).
• the radiator 41 is a part capable of dissipating heat, preferably made of non-organic electrically conductive material, such as metal, for example copper.
• a microwave component 2 such as a bare chip, is connected by its mass to the radiator. This connection between the microwave component and the radiator can be achieved by soldering.
• the upper frame 42 (see FIGS. 4 and 5) is placed under the inner face of the radiator 41.
• the outer periphery 42b of this frame made conductive for example by a metallic deposit, is flush with that of the radiator 41.
• the frame 42 comprises a electrically insulating thickness 42a, for example of organic material.
• An electrically conductive layer 43 is deposited under the insulating thickness 42a. Consequently, the conductive layer 43 covers the surface of the frame opposite the radiator 41.
• the lower frame 45 (see Figures 4 and 6) is placed under the upper frame 42.
• the outer periphery 45d of this frame made conductive for example by a metallized deposit, is flush with that of the radiator 41 and of the upper frame 42.
• These external peripheries form the lateral external surfaces of the housing 40.
• the frame 45 comprises an insulating thickness 45a, for example of organic material, on which are deposited on either side two conductive layers 44, 46, a first conductive layer 44 being in contact with the conductive layer 43 of the upper frame 42, the second conductive layer facing the external circuit 6 when the housing 40 is mounted on it.
• the second conductive layer 46 comprises a surface 46b, forming a mass, almost entirely covering the surface of the frame to which it is applied (see FIG. 6).
• the conductive layer 46 is part of the mounting surface.
• the plate 47 has substantially the same surface as the radiator 42.
• the plate 47 is placed in the lower part of the lower frame (see FIG. 4).
• the outer surface of the plate 47 is part of the mounting surface.
• At least one surface of the base 47 is conductive, the base being metallic or metallized. This surface forms a mass intended to be electrically connected with the external circuit (not shown).
• this surface is the mounting surface.
• a conductive surface forming an integral part of the housing, surrounds the interior volume 1 a, thus forming a Faraday cage.
• the conductive surface is formed by the radiator 41, the base 47 (metallized or metallic), the outer periphery 42b, 45b of the superimposed frames, and the surface 46b of the layer 46 facing the circuit.
• the microwave and low frequency inputs-outputs of the chip 2 are connected to tracks 43a formed in the conductive layer 43.
• the connection can be made with conductive wires 9.
• the thickness of the frame 41 is provided so that these wire connections are as short as possible, which is the case when the active surface of the chip is in the plane of the conductive layer 43.
• the conductive layer 43 may comprise a surface 43b covering almost entirely the insulating thickness 42a. Recesses are made inside the surface 43b to electrically isolate it from the tracks 43a.
• Metallized holes 48 are made inside the insulating thickness 45a.
• the metallized holes 48 preferably plugged to ensure sealing, electrically connect the tracks 43a of the layer 43 with discs 46a of the layer 46.
• a metallized hole 48 connects a conductive disc 44a at the top of the lower frame with a conductive disc 46a at the bottom of the lower frame.
• the conductive disc 44a from the top is in contact with a track 43a.
• Recesses made in the conductive surface 46b make it possible to electrically isolate it from the discs 46a.
• the disks 46a form connection points for the housing 40, in the same way as the disks 30 form the connection points for the housing 1.
• conductive balls 8a are placed in contact with the discs 46a, these balls being an integral part of the housing. They then form the connection points of the housing 40, in the same way as for the housing 1.
• the metallized holes are shielded in the thickness of the insulating layer 45a.
• other metallized holes 49 can be produced inside the insulating layer 45a, in the same way as the metallized holes 48.
• the metallized holes 49 make it possible to electrically connect the surfaces 43b and 46b forming masses.
• the inner periphery 45c of the lower frame can be made conductive, except at the places where it comes into contact with the tracks 43a.
• conductive balls 8b forming an integral part of the housing 40, can be placed to electrically connect the conductive surface 46b as well as the plate 47 with the mass of the external circuit (not shown).
• the external circuit can be a multilayer circuit of the type described in relation to FIG. 1.
• the housing 40 is mounted on the external circuit in the same way as the housing 1. In the absence of conductive balls, the external surface of the base 46, 47 forms the mounting surface of the housing. In the presence of conductive balls 8a, 8b, these form the mounting surface 50 of the housing.
• Epoxy resin substrates are not suitable for microwave applications.
• the insulating parts of the housing are made with a microwave substrate, ie a substrate having a controlled dielectric constant and a low loss tangent (microwave power losses through the substrate).
• the microwave substrate may for example be a hydrocarbon loaded with glass fibers and silica powder, or based on charged teflon.
• the housing according to the invention is not necessarily formed with walls. We could replace the walls and the cover with a single piece forming a glued metal cover.
• the housing according to the invention is not necessarily a parallelepiped box. Its function is to create an interconnection, to protect a component against mechanical and chemical attack and to avoid any electromagnetic coupling.
• the housing can for example be formed by a resin surrounding the component.

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• Engineering & Computer Science (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Applications Claiming Priority (3)

Publications (1)

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• 2002
  • 2002-12-20 FR FR0216363A patent/FR2849346B1/fr not_active Expired - Fee Related
• 2003
  • 2003-12-08 AU AU2003299214A patent/AU2003299214A1/en not_active Abandoned
  • 2003-12-08 US US10/539,735 patent/US7482678B2/en not_active Expired - Lifetime
  • 2003-12-08 EP EP03799547A patent/EP1573809A1/de not_active Ceased
  • 2003-12-08 JP JP2004561488A patent/JP2006511071A/ja not_active Ceased
  • 2003-12-08 WO PCT/EP2003/050964 patent/WO2004057670A1/fr not_active Ceased

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