EP1733599A2 - Systeme de diode electroluminescente et son procede de production - Google Patents

Systeme de diode electroluminescente et son procede de production

Info

Publication number
EP1733599A2
EP1733599A2 EP05752758A EP05752758A EP1733599A2 EP 1733599 A2 EP1733599 A2 EP 1733599A2 EP 05752758 A EP05752758 A EP 05752758A EP 05752758 A EP05752758 A EP 05752758A EP 1733599 A2 EP1733599 A2 EP 1733599A2
Authority
EP
European Patent Office
Prior art keywords
light
emitting diode
conductor track
heat sink
arrangement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP05752758A
Other languages
German (de)
English (en)
Inventor
Ulrich Keth
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Pmc Projekt Management Consult GmbH
Original Assignee
Pmc Projekt Management Consult GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pmc Projekt Management Consult GmbH filed Critical Pmc Projekt Management Consult GmbH
Publication of EP1733599A2 publication Critical patent/EP1733599A2/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/40—Cooling of lighting devices
    • F21S45/47—Passive cooling, e.g. using fins, thermal conductive elements or openings
    • F21S45/48—Passive cooling, e.g. using fins, thermal conductive elements or openings with means for conducting heat from the inside to the outside of the lighting devices, e.g. with fins on the outer surface of the lighting device
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8582—Means for heat extraction or cooling characterised by their shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S43/00—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights
    • F21S43/10—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source
    • F21S43/13—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source characterised by the type of light source
    • F21S43/14—Light emitting diodes [LED]
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0305—Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]

Definitions

  • the invention relates to a light-emitting diode arrangement with a conductor track carrier, which has an electrical conductor track arrangement, and at least one light-emitting diode, which is electrically connected to the conductor track arrangement.
  • the invention further relates to a method for producing a light-emitting diode arrangement in which a conductor track carrier is provided with a solder, the light-emitting diode is placed on the conductor track carrier and the light-emitting diode and the conductor track carrier are heated together.
  • Light-emitting diodes are increasingly being used where previously conventional light sources or incandescent lamps have been used.
  • the light intensity of light-emitting diodes has increased continuously in recent years, so that, for example, is going to equip brake lights or direction indicators with LEDs.
  • Light-emitting diodes have the advantage over incandescent lamps that they make better use of the electrical energy supplied. In addition, they generally have a lower weight and a longer service life.
  • a known technique for this is to provide the conductor track carrier with solder paste at certain sections of the conductor track arrangement, to put on the light-emitting diode and then to heat it together with the conductor track arrangement.
  • the connections of the light emitting diode can be soldered to the conductor track arrangement.
  • This method of manufacture allows a light-emitting diode arrangement to be produced inexpensively. However, it considerably limits the possibilities of dissipating the existing heat from the light-emitting diode.
  • the invention has for its object to extend the life of LEDs with higher power. This object is achieved in a light-emitting diode arrangement of the type mentioned in the introduction in that a heat sink is arranged on the side of the conductor track carrier opposite the light-emitting diode and the conductor track carrier has a through opening between the light-emitting diode and the heat sink.
  • the previously known procedure for mounting the light-emitting diodes is not disturbed, ie the light-emitting diode can still be placed on the surface of the conductor track carrier and connected to the conductor track arrangement by soldering.
  • a heat sink is now added.
  • the heat sink does not stand in the way of mounting the " light-emitting diode on the conductor track arrangement. Heat flow from the light-emitting diode to the heat sink is possible through the through opening provided in the conductor track carrier. A greater amount of heat can now be dissipated to the ambient air via the heat sink that the heat loss does not lead to a critical temperature increase.
  • the light-emitting diode and the heat sink are preferably connected to one another in a heat-conducting manner through the through opening of the conductor track carrier. This is particularly advantageous when the light emitting diode has a higher output, for example when the light emitting diode has a light output that corresponds to that of a 100 watt incandescent lamp. In this case, the heat-conducting connection of the light-emitting diode to the heat sink through the conductor track carrier ensures improved heat dissipation.
  • Aluminum sheet rolled on a copper foil Such a double metal, with otherwise the same dimensions, has a lower weight than a pure copper sheet, so that use in particular in mobile applications is facilitated. Aluminum is generally less expensive than copper, so that the LED arrangement can be manufactured inexpensively.
  • the conductor track arrangement is preferably covered by a cover which has openings on connection surfaces of the conductor track arrangement. Solder can be applied through the openings, which then melts when the light-emitting diode and conductor track carrier are heated together and establishes the soldered connection between the light-emitting diode and the conductor track arrangement.
  • the cover is also interrupted in the area of the passage opening, so that the solder can also be applied to the heat sink when the solder is applied to the conductor arrangement.
  • the conductor track carrier and the heat sink are preferably glued to one another. This further facilitates production.
  • the conductor track carrier and the heat sink can be connected to one another in an upstream production step.
  • an adhesive is simply applied to the conductor track carrier and / or the heat sink.
  • the connection is then made by placing the heat sink on the conductor track carrier.
  • This has the advantage that the soldered connection between the light emitting diode and the heat sink no longer has to transmit holding forces. Rather, these holding forces are applied by the adhesive connection between the conductor track carrier and the heat sink.
  • the solder joint between the The heat sink and the light-emitting diode can then be dimensioned exclusively for the heat transfer from the light-emitting diode to the ambient air.
  • the conductor track carrier is preferably designed to be flexible, and the area of the heat sink is limited to a predetermined area in the vicinity of the light-emitting diode.
  • the use of the heat sink therefore only insignificantly deteriorates the flexibility of the conductor track carrier.
  • heat sinks of adjacent light-emitting diodes there is preferably a distance between heat sinks of adjacent light-emitting diodes, the length of which corresponds at least to the length of one heat sink.
  • the length preferably corresponds approximately to the length of a heat sink.
  • the object is achieved in a method of the type mentioned at the outset by using a conductor track carrier which has a through-opening in the region of the light-emitting diode and mounts a heat sink in the region of the through-opening from the side opposite the light-emitting diode.
  • a conductor track carrier which has a through-opening in the region of the light-emitting diode and mounts a heat sink in the region of the through-opening from the side opposite the light-emitting diode.
  • the heat sink is attached to the conductor carrier from the opposite side, it does not interfere with this production method.
  • the through opening in the conductor track carrier ensures that the conductor track carrier does not hinder the dissipation of heat from the light-emitting diode, but that sufficient heat transfer from the light-emitting diode to the heat sink can take place.
  • the heat sink and the conductor track carrier are brought together, the heat sink is provided with solder through the through opening and the light-emitting diode is soldered to the heat sink by heating or a similar heat transfer is created.
  • the solder then creates an excellent thermally conductive connection between the light emitting diode and the heat sink.
  • the production of this heat-conducting connection is relatively simple, because the light-emitting diode arrangement consisting of light-emitting diode and conductor track carrier has to be heated to a soldering temperature anyway. With the correct dimensioning of its quantity, the solder can fill the through opening completely or at least almost completely, so that the optimal cross-sectional area is guaranteed for the heat transfer from the light-emitting diode to the heat sink. An additional step is therefore for the connection between the Light emitting diode and the heat sink are not required, so that the manufacturing process remains inexpensive.
  • solder is applied to the conductor carrier and to the heat sink in one operation.
  • a template is often used to apply the solder, for example when the solder is applied using a common solder paste template.
  • Fig. 2 is an enlarged sectional view of part of the light emitting diode arrangement.
  • the light-emitting diode arrangement 1 shows a light-emitting diode arrangement 1 with a conductor track carrier 2, on which a plurality of light-emitting diodes 3 are arranged.
  • the light-emitting diodes 3 have a so-called light stone 4, which functions as the actual light source, and a housing 5, which is generally formed from ceramic.
  • LEDs work with a relatively high degree of efficiency. With increasing power of the light emitting diode 3, however, its power loss also increases. This power loss is converted into heat and leads to an increase in the temperature of the light-emitting diode 3, which can lead to "thermal death". In order to be able to give off the heat to the surroundings, a heat sink 6 is therefore provided for each light-emitting diode 3.
  • the conductor track carrier 2 has several layers, namely a flexible film 7, for example made of polyimide, onto which conductor tracks 8, 9 made of copper are applied.
  • the conductor tracks 8, 9 form a conductor track arrangement.
  • This conductor track arrangement is covered by a cover film 10 or a lacquer.
  • the cover film 10 or the lacquer has openings 11, 12 through which connection surfaces 13, 14 of the conductor track arrangement 8, 9 are accessible.
  • the light-emitting diode 3 has contact areas 15, 16 which are connected to the connection areas 13, 14 of the conductor track arrangement 8, 9 via a solder 17, 18.
  • the application of the solder is explained below.
  • the heat sink 6 is connected to the conductor track carrier 2 via an adhesive layer 19.
  • the heat sink 6 is designed as a double metal, which is essentially formed from aluminum 20.
  • the aluminum 20 is provided on its surface facing the conductor track carrier 2 with a relatively thin copper layer 21.
  • This copper layer 21 can be formed, for example, by a thin copper foil that is rolled onto the aluminum 20.
  • Other compounds, for example vapor deposition or electrochemical deposition of copper on aluminum, are of course also possible.
  • the conductor track carrier 2 has a through opening 22 in the region of the light-emitting diode 3. This through opening 22 also passes through the adhesive layer 19, so that a contact region 23 of the copper layer 21 is exposed to the light emitting diode 3.
  • the light-emitting diode 3 has a metal surface 24 in the plane in which the contact surfaces 15, 16 also lie. The space which is delimited by the metal surface 24, the copper surface 21 and the through opening 22 is defined by a solder 25. filled. The solder 25 forms a thermally conductive connection from the light-emitting diode 3 to the heat sink 6.
  • a heat sink 6 is assigned to each light-emitting diode 3. Between each
  • the heat sink 6 is connected to the conductor track carrier 2.
  • the conductor track carrier 2 can already be provided with the adhesive layer 19, which is covered by a protective film (not shown). This protective film is removed before connecting the heat sink 6 to the conductor track carrier 2.
  • solder As soon as the conductor track carrier 2 is provided with the heat sink 6 or the heat sinks 6, it is coated with solder.
  • This coating takes place, for example, with the aid of a solder paste stencil, this method being designed such that solder only reaches the connection surfaces 13, 14 through the openings 11, 12 and the copper layer 21 of the heat sink 6 through the through opening 22. If necessary, a larger amount of solder is introduced into the area bounded by the through opening 22.
  • the solder can be formed, for example, by a solder paste that contains a sufficient amount of solder.
  • the LED 3 is then placed on the conductor carrier 2 provided with solder.
  • the light-emitting diode 3 is heated with the conductor track carrier 2 and the heat sinks 6 attached thereto, for example in a tunnel oven.
  • the arrangement of the light-emitting diode 3, conductor track carrier 2 and heat sink 6 is heated to a soldering temperature at which the solder becomes fluid. At this temperature, therefore, on the one hand, the solder 17, 18 connects the connection areas 13, 14 to the contact areas 15, 16 of the light-emitting diode 3 and, on the other hand, the solder 25 connects the metal area 24 to the contact area 23 of the copper layer 21 of the heat sink 6.
  • the heat sink 6 can be formed by a sheet which is commercially available under the name "Cupalblech" is valid. Such a sheet is widely used in lightning protection and in the high voltage range. It is therefore available on the market at reasonable prices. Since it consists largely of aluminum, its weight is less than the weight of a pure copper sheet of the same size. This reduction in weight has considerable advantages in particular when the light-emitting diode arrangement 1 is to be used in a mobile application, for example in a motor vehicle.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Led Device Packages (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

L'invention concerne un système de diodes électroluminescentes (1) comprenant un support de pistes conductives (2) qui présente un système de pistes conductives électriques (8, 9) et au moins une diode électroluminescente (3) électriquement reliée au système de pistes conductives (8, 9). L'invention vise à augmenter la durée de vie de diodes électroluminescentes de plus grande puissance. A cet effet, un corps de refroidissement (6) est placé sur la face opposée à la diode électroluminescente (3) du support de pistes conductives (2) et le support de pistes conductives (2) présente entre la diode électroluminescente (3) et le corps de refroidissement (6) un orifice traversant (22).
EP05752758A 2004-04-07 2005-03-24 Systeme de diode electroluminescente et son procede de production Withdrawn EP1733599A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102004016847A DE102004016847A1 (de) 2004-04-07 2004-04-07 Leuchtdiodenanordnung und Verfahren zum Herstellen einer Leuchtdiodenanordnung
PCT/EP2005/003131 WO2005099323A2 (fr) 2004-04-07 2005-03-24 Systeme de diodes electroluminescente et son procede de production

Publications (1)

Publication Number Publication Date
EP1733599A2 true EP1733599A2 (fr) 2006-12-20

Family

ID=34970784

Family Applications (1)

Application Number Title Priority Date Filing Date
EP05752758A Withdrawn EP1733599A2 (fr) 2004-04-07 2005-03-24 Systeme de diode electroluminescente et son procede de production

Country Status (4)

Country Link
EP (1) EP1733599A2 (fr)
BR (1) BRPI0504768A (fr)
DE (1) DE102004016847A1 (fr)
WO (1) WO2005099323A2 (fr)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100764380B1 (ko) 2005-12-16 2007-10-08 삼성전기주식회사 슬림형 백라이트유닛
EP1996860A2 (fr) 2006-01-31 2008-12-03 3M Innovative Properties Company Ensemble eclairage del avec construction de feuille conforme
US7806560B2 (en) 2007-01-31 2010-10-05 3M Innovative Properties Company LED illumination assembly with compliant foil construction
TWI324669B (en) * 2007-03-15 2010-05-11 Ind Tech Res Inst Light modules
DE102007023918A1 (de) 2007-05-23 2008-11-27 Siemens Ag Österreich Beleuchtungseinheit
KR100962706B1 (ko) 2009-11-27 2010-06-15 주식회사 테크엔 파워 ｌｅｄ를 갖는 대형 조명등의 제조 방법
DE102009054840A1 (de) * 2009-12-17 2011-06-22 Poly-Tech Service GmbH, 67681 Leuchtmittel mit einer Mehrzahl von Leuchtdioden
DE202014102862U1 (de) * 2014-06-24 2015-09-25 Zumtobel Lighting Gmbh Anordnung zur Lichtabgabe mit LED und Trägerelement

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000069000A1 (fr) * 1999-05-12 2000-11-16 Osram Opto Semiconductors Gmbh & Co. Ohg Ensemble diodes electroluminescentes

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JP2751576B2 (ja) 1990-06-14 1998-05-18 日立電線株式会社 発光ダイオード・マイクロチップの実装方法
JPH09329395A (ja) * 1996-06-06 1997-12-22 Furukawa Electric Co Ltd:The ヒートシンク
JP4056598B2 (ja) 1997-10-09 2008-03-05 シチズン電子株式会社 赤外線データ通信モジュール
JP2002162626A (ja) 2000-11-22 2002-06-07 Sony Corp 液晶表示用光源の放熱装置及びその製造方法
JP4737575B2 (ja) 2001-01-30 2011-08-03 ハリソン東芝ライティング株式会社 発光ダイオードアレイ及び光源装置
US20040012958A1 (en) 2001-04-23 2004-01-22 Takuma Hashimoto Light emitting device comprising led chip
KR100419611B1 (ko) 2001-05-24 2004-02-25 삼성전기주식회사 발광다이오드 및 이를 이용한 발광장치와 그 제조방법
JP4045781B2 (ja) 2001-08-28 2008-02-13 松下電工株式会社 発光装置
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DE20120770U1 (de) * 2001-12-21 2002-03-28 OSRAM Opto Semiconductors GmbH & Co. oHG, 93049 Regensburg Oberflächenmontierte LED-Mehrfachanordnung und Beleuchtungseinrichtung damit
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Publication number Priority date Publication date Assignee Title
WO2000069000A1 (fr) * 1999-05-12 2000-11-16 Osram Opto Semiconductors Gmbh & Co. Ohg Ensemble diodes electroluminescentes

Also Published As

Publication number Publication date
WO2005099323A2 (fr) 2005-10-20
DE102004016847A1 (de) 2005-12-22
WO2005099323A3 (fr) 2006-02-16
BRPI0504768A (pt) 2006-10-24

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