EP1843383A3 - Motifs d'objets conducteurs sur un substrat et son procédé de production - Google Patents

Motifs d'objets conducteurs sur un substrat et son procédé de production Download PDF

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Publication number
EP1843383A3
EP1843383A3 EP07251477A EP07251477A EP1843383A3 EP 1843383 A3 EP1843383 A3 EP 1843383A3 EP 07251477 A EP07251477 A EP 07251477A EP 07251477 A EP07251477 A EP 07251477A EP 1843383 A3 EP1843383 A3 EP 1843383A3
Authority
EP
European Patent Office
Prior art keywords
substrate
base layer
patterns
producing
conductive objects
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP07251477A
Other languages
German (de)
English (en)
Other versions
EP1843383A2 (fr
Inventor
Gal Wollach
Yoash Carmi
Dany Eisenstadt
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hanita Coatings RCA Ltd
Original Assignee
Hanita Coatings RCA Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hanita Coatings RCA Ltd filed Critical Hanita Coatings RCA Ltd
Priority to EP09000091A priority Critical patent/EP2048707A1/fr
Publication of EP1843383A2 publication Critical patent/EP1843383A2/fr
Publication of EP1843383A3 publication Critical patent/EP1843383A3/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/022—Electroplating of selected surface areas using masking means
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
    • H01P11/001—Manufacturing waveguides or transmission lines of the waveguide type
    • H01P11/003—Manufacturing lines with conductors on a substrate, e.g. strip lines, slot lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/84—Heating arrangements specially adapted for transparent or reflecting areas, e.g. for demisting or de-icing windows, mirrors or vehicle windshields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0094—Shielding materials being light-transmitting, e.g. transparent, translucent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/017—Manufacturing methods or apparatus for heaters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0108—Transparent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49016—Antenna or wave energy "plumbing" making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49016—Antenna or wave energy "plumbing" making
    • Y10T29/49018—Antenna or wave energy "plumbing" making with other electrical component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Electric Cables (AREA)
EP07251477A 2006-04-04 2007-04-03 Motifs d'objets conducteurs sur un substrat et son procédé de production Withdrawn EP1843383A3 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP09000091A EP2048707A1 (fr) 2006-04-04 2007-04-03 Motifs d'objets conducteurs sur un substrat et son procédé de production

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US78872806P 2006-04-04 2006-04-04

Related Child Applications (1)

Application Number Title Priority Date Filing Date
EP09000091A Division EP2048707A1 (fr) 2006-04-04 2007-04-03 Motifs d'objets conducteurs sur un substrat et son procédé de production

Publications (2)

Publication Number Publication Date
EP1843383A2 EP1843383A2 (fr) 2007-10-10
EP1843383A3 true EP1843383A3 (fr) 2008-07-09

Family

ID=38462281

Family Applications (2)

Application Number Title Priority Date Filing Date
EP07251477A Withdrawn EP1843383A3 (fr) 2006-04-04 2007-04-03 Motifs d'objets conducteurs sur un substrat et son procédé de production
EP09000091A Withdrawn EP2048707A1 (fr) 2006-04-04 2007-04-03 Motifs d'objets conducteurs sur un substrat et son procédé de production

Family Applications After (1)

Application Number Title Priority Date Filing Date
EP09000091A Withdrawn EP2048707A1 (fr) 2006-04-04 2007-04-03 Motifs d'objets conducteurs sur un substrat et son procédé de production

Country Status (4)

Country Link
US (1) US7578048B2 (fr)
EP (2) EP1843383A3 (fr)
KR (1) KR20070099488A (fr)
IL (1) IL182371A0 (fr)

Families Citing this family (61)

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US20090165296A1 (en) * 2006-04-04 2009-07-02 Yoash Carmi Patterns of conductive objects on a substrate and method of producing thereof
IL182371A0 (en) * 2006-04-04 2007-07-24 Hanita Coatings R C A Ltd Patterns of conductive objects on a substrate and method of producing thereof
US7992293B2 (en) * 2006-04-04 2011-08-09 Hanita Coatings R.C.A. Ltd Method of manufacturing a patterned conductive layer
DE602007004001D1 (de) * 2006-06-09 2010-02-04 Arjobex America Laminierungsvorrichtung mit lückenhafter struktur zum tragen eines elektronischen elements, wie z. b. eines etiketts für einen rfid-tag
US7681301B2 (en) * 2007-03-07 2010-03-23 James Neil Rodgers RFID silicon antenna
US8514545B2 (en) * 2007-04-20 2013-08-20 Ink-Logix, Llc In-molded capacitive switch
US8198979B2 (en) * 2007-04-20 2012-06-12 Ink-Logix, Llc In-molded resistive and shielding elements
EP2144290A1 (fr) 2008-07-08 2010-01-13 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO Dispositif électronique et son procédé de fabrication
US8537016B2 (en) * 2008-10-27 2013-09-17 First Data Corporation Devices and methods for protecting a packaged radio frequency identification device from electronic reading
KR101008452B1 (ko) * 2008-11-11 2011-01-14 삼성전기주식회사 Ｒｆｉｄ 안테나를 구비한 인쇄회로기판과, ｒｆｉｄ 안테나와 ｒｆｉｄ 칩셋을 구비한 인쇄회로기판, 및 ｒｆｉｄ를 이용한 인쇄회로기판에 대한 제조공정 관리방법
JP2010199291A (ja) * 2009-02-25 2010-09-09 Sae Magnetics (Hk) Ltd コイルおよびコイル装置の製造方法
US8585911B2 (en) * 2009-03-18 2013-11-19 Kuo-Ching Chiang Thin film antenna and the method of forming the same
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KR101250644B1 (ko) * 2011-12-20 2013-04-03 오상진 내장형 안테나 모듈 제조방법 및 이로부터 제조되는 내장형 안테나 모듈
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US8933708B2 (en) 2012-04-11 2015-01-13 Ford Global Technologies, Llc Proximity switch assembly and activation method with exploration mode
US9831870B2 (en) 2012-04-11 2017-11-28 Ford Global Technologies, Llc Proximity switch assembly and method of tuning same
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US9219472B2 (en) 2012-04-11 2015-12-22 Ford Global Technologies, Llc Proximity switch assembly and activation method using rate monitoring
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US9184745B2 (en) 2012-04-11 2015-11-10 Ford Global Technologies, Llc Proximity switch assembly and method of sensing user input based on signal rate of change
US9944237B2 (en) 2012-04-11 2018-04-17 Ford Global Technologies, Llc Proximity switch assembly with signal drift rejection and method
US9287864B2 (en) 2012-04-11 2016-03-15 Ford Global Technologies, Llc Proximity switch assembly and calibration method therefor
US9559688B2 (en) 2012-04-11 2017-01-31 Ford Global Technologies, Llc Proximity switch assembly having pliable surface and depression
US9136840B2 (en) 2012-05-17 2015-09-15 Ford Global Technologies, Llc Proximity switch assembly having dynamic tuned threshold
US8981602B2 (en) 2012-05-29 2015-03-17 Ford Global Technologies, Llc Proximity switch assembly having non-switch contact and method
US9337832B2 (en) 2012-06-06 2016-05-10 Ford Global Technologies, Llc Proximity switch and method of adjusting sensitivity therefor
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CN104885576B (zh) * 2012-12-31 2017-12-05 阿莫绿色技术有限公司 柔性印刷电路基板及其制造方法
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US9654103B2 (en) 2015-03-18 2017-05-16 Ford Global Technologies, Llc Proximity switch assembly having haptic feedback and method
US9673341B2 (en) 2015-05-08 2017-06-06 Tetrasun, Inc. Photovoltaic devices with fine-line metallization and methods for manufacture
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US10161667B1 (en) * 2017-11-15 2018-12-25 Haier Us Appliance Solutions, Inc. Refrigerator appliance having a defrost chamber
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CN110016696B (zh) * 2019-03-25 2023-04-07 广东工业大学 一种基于光致导电电极板的微电铸装置及其微电铸方法
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IL182371A0 (en) 2007-07-24
KR20070099488A (ko) 2007-10-09
EP2048707A1 (fr) 2009-04-15
US20070226994A1 (en) 2007-10-04
US7578048B2 (en) 2009-08-25
EP1843383A2 (fr) 2007-10-10

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