EP1846529A2 - Adhesifs de contact fusibles reticulables par irradiation - Google Patents

Adhesifs de contact fusibles reticulables par irradiation

Info

Publication number
EP1846529A2
EP1846529A2 EP06701180A EP06701180A EP1846529A2 EP 1846529 A2 EP1846529 A2 EP 1846529A2 EP 06701180 A EP06701180 A EP 06701180A EP 06701180 A EP06701180 A EP 06701180A EP 1846529 A2 EP1846529 A2 EP 1846529A2
Authority
EP
European Patent Office
Prior art keywords
radiation
component
crosslinkable
groups
hotmelt psa
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP06701180A
Other languages
German (de)
English (en)
Inventor
Thomas Möller
Holger TÖNNIESSEN
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Henkel AG and Co KGaA
Original Assignee
Henkel AG and Co KGaA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Henkel AG and Co KGaA filed Critical Henkel AG and Co KGaA
Publication of EP1846529A2 publication Critical patent/EP1846529A2/fr
Withdrawn legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J115/00—Adhesives based on rubber derivatives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J119/00—Adhesives based on rubbers, not provided for in groups C09J107/00 - C09J117/00
    • C09J119/006—Rubber characterised by functional groups, e.g. telechelic diene polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
    • C09J123/04—Homopolymers or copolymers of ethene
    • C09J123/08—Copolymers of ethene
    • C09J123/0846—Copolymers of ethene with unsaturated hydrocarbons containing other atoms than carbon or hydrogen atoms
    • C09J123/0869—Acids or derivatives thereof
    • C09J123/0884—Epoxide containing esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0016—Plasticisers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C08L101/02—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/04—Homopolymers or copolymers of ethene
    • C08L23/08—Copolymers of ethene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/04—Macromolecular compounds according to groups C08L7/00 - C08L49/00, or C08L55/00 - C08L57/00; Derivatives thereof
    • C08L2666/06—Homopolymers or copolymers of unsaturated hydrocarbons; Derivatives thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y10T428/287—Adhesive compositions including epoxy group or epoxy polymer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether

Definitions

  • the invention relates to radiation-crosslinkable hot melt pressure sensitive adhesives and their preparation and use.
  • hot melt adhesives are generally understood at room temperature solid to waxy and water and solvent-free adhesives, which are applied to the parts to be bonded from the melt and physically bond after assembly on cooling to solidify.
  • the hotmelt pressure-sensitive adhesives (HMPSA), which belong to the group of hot-melt adhesives, remain permanently tacky and tacky on cooling and immediately adhere to almost all substrates under light contact pressure.
  • Hot-melt pressure-sensitive adhesives have a wide industrial use and are used, for example, in the beverage industry for labeling, in the packaging industry, in the graphic industry, for example bookbinding, or for the production of disposable articles, for example hygiene articles, such as baby diapers.
  • hot melt adhesives allow a solvent-free application. Costly drying intermediate stages are thereby eliminated. Since solvent-based adhesive systems have to fulfill increasingly stringent environmental regulations, hot-melt pressure-sensitive adhesives also offer environmental benefits.
  • Hot melt adhesives based on polyacrylates are known.
  • WO 02/10307 PSAs for the production of adhesive tapes which consist of block copolymers, for. B. from copolymers of acrylates, isoprene and styrene.
  • a component is included, which in one embodiment has an unsaturated group which is capable of radiation-chemical crosslinking.
  • These pressure-sensitive adhesives crosslink by a radical polymerization of olefinic double bonds.
  • WO 00/22062 describes radiation-crosslinkable adhesives which contain block copolymers having at least one butadiene block having a 1, 2-vinyl content of at least 25%. These adhesives can also be crosslinked by photoinitiators radiation curing due to a content of olefinic double bonds.
  • WO 01/55276 radiation-curable adhesives are described which can be applied at low temperature. These contain block copolymers, one block being composed of polyvinyl / aromatic building blocks and a second block being a polydiene block with vinyl functionality.
  • EP 1130070 describes adhesives for coating thermally shrinkable films or labels which can crosslink by radiation.
  • These adhesives may consist of epoxidized block copolymers and / or cycloaliphatic epoxides with olefinic double bonds, a photoinitiator, a tackifying resin and other additives.
  • polymers may be contained which contain either olefinic double bonds or non-reactive copolymers based on isoprene or isobutylene.
  • crosslinking groups either epoxy groups are possible or it is a crosslinking described via double bonds.
  • a more precise limitation of the epoxidized block copolymers is not specified.
  • hot melt adhesives are still missing for special applications which have the lowest possible viscosity under processing conditions. This property is significantly influenced by the choice of polymers for the hot melt adhesive. Furthermore, a disadvantage of hot melt adhesives according to the prior art is insufficient initial adhesion combined with high heat resistance of the bond, which is required for certain applications.
  • the object of the present invention is to provide a hot-melt pressure-sensitive adhesive having a low viscosity at the application temperature, which results in a high initial adhesion and a rapid crosslinking, and thus produces increased adhesion and cohesion to the substrates.
  • the application temperature should be so low that the substrates are not damaged.
  • these hotmelt adhesives should be suitable for bonding shrinkable materials such as labels, which are then fed immediately after a shrinkage process.
  • the object is achieved by a radiation-crosslinkable hot-melt pressure-sensitive adhesive containing 15 to 89.99% by weight of at least one radiation-crosslinkable polymer as component (A) based on epoxidized polyolefins, where the epoxy groups are not combined in blocks, 10 to 85% by weight. 0 to 20% by weight of at least one low molecular weight OH gomer as component (C), the oligomer having reactive groups which react with the epoxy groups of component (A) and 0.01 to 30 wt .-% additives as component (D), wherein the sum should be 100%.
  • various polymers can be used. These should have a molecular weight of greater than 1000.
  • the polymers contain several epoxy groups.
  • epoxy groups can be used in the preparation polymerized in directly in the polymers, but they can also be subsequently reacted in starting polymers or produced in the polymers. This can be done by suitable starting polymers having olefinic double bonds, these double bonds being able to be converted into epoxy groups by known processes.
  • Suitable starting polymers are, for example, those with rubber-elastic behavior, which can be stretched and immediately assume their initial dimension again after the strain has been removed.
  • starting polymers for the preparation of component (A) can be selected from the group of elastomeric acrylate, polyester urethane, ethylene acrylate, butyl rubber; Natural rubber; Styrene copolymers, alone or in admixture, wherein the copolymers are random, alternating, graft or block copolymers.
  • elastomer alloys in particular EPDM / PP, NR / PP and NBR / PP, and also polyurethanes, polyether esters and polyetheramides.
  • thermoplastic elastomers TPE
  • thermoplastic rubbers which ideally have a combination of the use properties of elastomers and the processing properties of thermoplastics. This can be achieved if in the respective polymers simultaneously soft and elastic segments with high ductility and low glass transition temperature as well as hard crystallizable segments with low ductility, high glass transition temperature and tendency to associate formation exist.
  • thermoplastic elastomers are in particular selected from the group of styrene block polymers, for example styrene-diene copolymers (SBS, SIS) styrene-ethylene / butylene copolymers (SEBS) or styrene-ethylene / propylene-styrene copolymers (SEPS , SEP SEEPS).
  • SBS styrene-diene copolymers
  • SEBS styrene-ethylene / butylene copolymers
  • SEPS styrene-ethylene / propylene-styrene copolymers
  • polymers which are suitable as starting polymers for component (A) are, for example, homo- or copolymers of 1,3-butadiene, 2-methyl-1,3-butadiene (isoprene), 1,3-pentadiene, 2-ethyl- 1, 3-butadiene, 2-propyl-1,3-butadiene, 2-isopropyl-1,3-butadiene, 2-hexyl-1,3-butadiene, 2,3-dimethyl-1,3-butadiene, 2, 3-diethyl-1,3-butadiene, 2-methyl-1,3-pentadiene, 2-methyl-1,3-hexadiene, 2-methyl-1,3-octadiene, 2-methyl-1,3-decadiene, 2,3-dimethyl-1,3-pentadiene, 2,3-dimethyl-1,3-hexadiene, 2,3-dimethyl-1,3-octadiene and 2,3-dimethyl-1,3-de
  • the above-mentioned starting polymers may contain a plurality of unsaturated double bonds. These may be contained in the polymer main chain and / or they may be contained in side chains. In particular, no long-chain branched or star-shaped polymers should be present, but the double bonds may be present in short side chains, in particular as a vinylic functional group. These double bonds are reacted, at least in part, by known methods, so that the starting polymers are provided with epoxy groups.
  • the epoxy group-containing polymers thus obtained are suitable as component (A) in the context of the invention.
  • Other suitable starting polymers may contain functional groups, e.g. OH groups. These can then be reacted with glycidyl-containing low molecular weight compounds, whereby suitable polymers are obtained as component (A).
  • component (A) it is essential for component (A) that the suitable polymers do not have the epoxy groups as one or more, eg two, blocks.
  • the epoxy groups should be distributed statistically over the entire length of the molecular chains.
  • the polymers are linear.
  • Particularly suitable as component (A) are epoxidized homopolymers or copolymers of 1,3-butadiene, of 1,3-pentadiene, of cyclopentadiene, in particular also of isoprene. These can in one embodiment with other monomers, such as. As styrene copolymerized. It is possible that at the end of the polymer chain or in side chains further functional groups such as OH groups are present.
  • component (A) contains only epoxy groups and, if appropriate, further functional groups which are not reactive with the epoxy group, for example double bonds.
  • the OH number of such polymers is, for example, below 50 mg KOH / g, in particular below 20, preferably below 10 mg KOH / g.
  • only terminal OH groups are present on the molecular chain, a further particularly preferred embodiment is free of OH groups.
  • the molecular mass of the binder of component (A) is between 1000 to 100,000 g / mol, preferably 1000 to 50,000, in particular 5000 to 30,000 g / mol or 1300 to 3000 g / mol.
  • M n the number average (M n ) understood. This can be determined by known methods, for example by gel permeation chromatography.
  • Component (A) may be solid at room temperature, but preferably viscous polymers are also possible.
  • the viscosity should be between 2000 mPas to 5000000 mPas at 20 0 C, preferably 3000 to 1,000,000 mPas at 30 0 C, more preferably 10000 to 50,000 mPas at 38 0 C.
  • the number of epoxy groups in the case of the epoxy groups introduced by oxidation of double bonds can be from 1 to 100% of the original double bonds, in particular from 10 to 80%.
  • the polymers should contain on average at least two epoxy groups per molecule, preferably it should be at least three.
  • the content of epoxy groups is from 0.1 to 20 meq / g (milliequivalents / g), preferably from 0.2 to 15 meq / g, in particular 0.3 to 12 meq / g. Examples of such polymers are described in EP-A 1217011 or in EP-A 0946600.
  • the amount of component (A) should be 15-90% by weight, in particular 20-60% by weight.
  • component (A) it is also possible for a plurality of polymers to be present in a mixture, but preferably at least 75% of isoprene or butadiene homopolymers or copolymers should be present.
  • the hot-melt pressure-sensitive adhesive comprises at least one tackifying resin.
  • the resin causes additional tackiness and improves the compatibility of the hot melt pressure sensitive adhesive components.
  • These are, in particular, resins which have a softening point of 70 to 140 ° C.
  • resins which can be used in the context of the invention are: a) hydroabietyl alcohol and its esters, in particular its esters with aromatic carboxylic acids such as terephthalic acid and phthalic acid, b) preferably modified natural resins such as resin acids from balsam resin, TaII resin or root resin, for example fully saponified gum rosin or alkyl esters of optionally partially hydrogenated rosin with low softening points such as methyl, diethylene glycol, glycerol and pentaerythritol esters, c) terpene resins, in particular copolymers of terpene, for example: styrene-terpenes , Alpha-methyl-styrene-terpenes Phenol-mod
  • the component (B) has a lower molecular weight of below 1500 g / mol, in particular below 1000. It may be chemically inert or it may optionally contain functional groups. Examples of such functional groups may be double bonds. However, there are no epoxy groups. In one embodiment, these double bonds do not react with the component (A). In a further embodiment, however, it is possible that any reactive double bonds of component (B) present may react with existing double bonds of component (A).
  • the amount of component (B) is 10 to 85% by weight, preferably 25 to 65% by weight.
  • the component (B) is selected so as to be compatible with the component (A) and together with the optional component (C).
  • compatibility is meant that after mixing and homogenizing the ingredients over a longer period, for example 8 hours at application temperature, no phase separation is observed.
  • additional low molecular weight oligomeric substances may be present as component (C) which can crosslink with component (A).
  • These low molecular weight oligomeric substances are those compounds which have reactive groups which can react with in the epoxide crosslinking reaction. These lead to an influence of the network in the crosslinking reaction, for example to a chain extension in difunctional compounds, to a branching in trifunctional compounds or to a chain termination in monofunctional compounds.
  • These are oligomeric compounds having a molecular weight below about 1000 g / mol. These preferably carry at least two reactive groups per molecule.
  • these may be low molecular weight, epoxidized butadiene oligomers or cycloaliphatic polyepoxides.
  • epoxidized natural oils and fats such as epoxidized soybean oil, linseed oil, sunflower oil, etc. can be used.
  • epoxidized reaction products of saturated oils and fats such as, for example, epoxidized C 4 -C 22 fatty acid 2-ethylhexyl esters.
  • resoles, novolaks, epoxy resins, glycidyl esters of carboxylic acids or glycidyl ethers can be used.
  • such oligomers may also contain oxethane groups.
  • low molecular weight oligomeric compounds are also suitable as component (C2) which have two or more epoxy group-reactive functional groups, in particular polyols.
  • polyols are, for example, polyalkylene glycols such as polyethylene glycol or polypropylene glycol or also glycerol derivatives.
  • Other polyol compounds may be low molecular weight polyester polyols prepared from aliphatic and / or aromatic di- or polycarboxylic acids with low molecular weight polyols.
  • oligomeric vinyl ethers having a molecular weight below 1000 g / mol may also be present as component (C3). These vinyl ethers react with the epoxy crosslinking reaction.
  • the reactivity can be controlled during crosslinking. Furthermore, it is possible to extend the crosslinking chains by adding difunctional compounds or to obtain a denser crosslinking by using polyfunctional groups.
  • compounds which carry at least two epoxy groups are used as low molecular weight oligomers (C1). These are preferably viscous.
  • a further embodiment contains as low molecular weight oligomeric compound (C2) at least one polyol having at least two OH groups.
  • the molecular weight of these compounds should be between 200 and 1000 g / mol. However, mixtures of C1, C2 and C3 can also be used.
  • Component (C) may be present in amounts of 0-20% by weight, in particular 5-15% by weight. Component (C) should be able to react with component (A). This leaves later unwanted high levels of migratory low molecular weight components in the crosslinked hot melt pressure sensitive adhesive.
  • radiation-crosslinkable is understood to mean the initiation of a polymerization reaction of the epoxy groups under the influence of radiation. Particularly suitable are UV, electron beams (ESH), short-wave visible light, but also IR radiation. In the case of ESH or UV irradiation, desired product properties can be set via the radiation dose, with IR radiation via the product temperature and the residence time. In the context of this invention, the radiation crosslinking by UV or electron beams is preferred.
  • the irradiation of the hot-melt pressure-sensitive adhesive according to the invention with UV light preferably takes place at a wavelength in the range from 100 nm to 380 nm.
  • the generation of UV rays generally takes place in gas discharge lamps, of which in particular mercury vapor lamps can be used.
  • As a UV radiation dose 50 - 2000 J / cm 2 are suitable.
  • a radiation dose of 10 to 100 kilogray (kGy) is preferred.
  • the crosslinking can be controlled by the use of photoinitiators, photosensitizers or regulator molecules, in addition to the radiation dose.
  • additives as component (D) include additives as component (D), which may influence certain properties of the adhesive.
  • additives include, for example, initiators, plasticizers, stabilizers, waxes, adhesion promoters or similar additives.
  • the amount should be at least 0.01% by weight. It is also possible to use several additives as a mixture.
  • At least one photoinitiator and / or photosensitizer are contained in the radiation-crosslinkable hotmelt PSA.
  • all commercial photoinitiators for the cationic suitable nische polymerization which are compatible with the hotmelt PSA of the invention, ie at least largely homogeneous mixtures and under storage conditions do not react with the functional groups.
  • the photopolymerization carried out according to the invention is a cationic photopolymerization.
  • the photoinitiators are under the influence of the radiation of a molecular cleavage with simultaneous formation of free Lewis upon. Bronsted acids.
  • Preferred cationic photoinitiators are, for example, the aryldiazonium salts known to the person skilled in the art, for example diaryliodonium or triarylsulfonium salts or iodonium salts.
  • the selection according to the reactivity and the radiation source is known to the person skilled in the art and possibly also requires an adaptation in the amount to be used.
  • Suitable photoinitiators are commercially available under the names Omnirad BL 440, Omnirad 55, Omnipol TX, Sarcat CD 1010, Sarcat CD 1011, Cyracure UVI-6976, Cyracure UVI-6992 or UVI-6974, Rhodorsil 2074, Deuteron 1240.
  • photosensitizers can additionally be used. Through the use of photosensitizers, it is possible to extend the absorption of photopolymerization initiators to shorter and / or longer wavelengths and thus to accelerate crosslinking. The absorbed radiation of certain wavelength is transferred as energy to the photopolymerization initiator.
  • Photosensitizers useful in the invention are e.g. Acetophenone, thioxanthan, benzophenone and fluorescein and their derivatives.
  • free-radical photoinitiators are additionally present, which allow a reaction of olefinic double bonds of the various components.
  • Such initiators are familiar to the person skilled in the art.
  • Cohesive strength, viscosity, softening point or setting speed. chen may be necessary in the adhesive formulation other additives and additives. These include plasticizers to increase flexibility, stabilizers and antioxidants. Furthermore, fillers can be used to increase the strength.
  • the plasticizer is preferably used for adjusting the viscosity and is contained in the hot-melt pressure-sensitive adhesive according to the invention generally in a concentration of 0 to 25 wt .-%, preferably in a concentration of 5 to 20 wt .-%.
  • Suitable plasticizers are medicinal white oils, naphthenic mineral oils, phthalates, adipates, polypropylene, polybutene, polyisoprene oligomers, hydrogenated polyisoprene and / or polybutadiene oligomers, benzoate esters, vegetable or animal oils and derivatives thereof.
  • Hydrogenated plasticizers are selected from the group of paraffinic hydrocarbon oils - for example, commercially available under the trade name Primol® from Exxon.
  • polystyrene resins are available under the name "Parapol” from Exxon Chemicals or under the name “Oppanol” from BASF.
  • Preferred paraffin oils used have a viscosity of 100 to 600 mPas at 25 ° C. They are available as “Kaydol” from Witco or Primol 352 from Esso. It is also possible to use monohydric or polyhydric alcohols having a molar mass of from 1000 to 6000 g / mol.
  • esters are suitable as plasticizers, for.
  • liquid polyesters and glycerol esters such as glycerol diacetate and glycerol triacetate, and Neopentylglykoldiben- zoat, Glyceryltribenzoat, pentaerythritol tetrabenzoate and 1, 4-Cyclohexan- dimethanoldibenzoat.
  • plasticizers based on aromatic dicarboxylic acid esters, ie the corresponding ester of phthalic acid, isophthalic acid or terephthalic acid.
  • the alcohol residue in these plasticizer-used esters usually has 1 to 8 carbon atoms.
  • fatty acids preferred are fatty acids having 8 to 36 carbon atoms.
  • waxes in amounts of 0 to 25 wt .-% can be added to the hotmelt PSA. The amount is so dimensioned that on the one hand, the viscosity is lowered to the desired range, on the other hand, the adhesion is not adversely affected.
  • the wax can be of natural or synthetic origin. Vegetable waxes, animal waxes, mineral waxes or petrochemical waxes can be used as natural waxes. Hard waxes such as montan ester waxes, sarsol waxes, etc. can be used as the chemically modified waxes.
  • polyethylene glycol waxes and polyethylene glycol waxes are used.
  • customary auxiliaries and additives can be added to the hot-melt pressure-sensitive adhesive according to the invention.
  • the stabilizers first. Their function is to prevent the reactive components from premature reaction and to protect the polymers from decomposition during processing.
  • the antioxidants to call are usually added in amounts of up to 3 wt .-%, preferably in amounts of about 0.1 to 1, 0 wt .-% of the hot melt pressure sensitive adhesive.
  • Stabilizers which can be used in the context of the invention include phosphites, phenols, sterically hindered phenols of high molecular weight, polyfunctional phenols, sulfur and phosphorus-containing phenols.
  • Compounds which can be used in the context of the invention are, for example, hydroquinone, hydroquinone methyl ether or phenothiazine. The choice and the properties are known to the person skilled in the art.
  • additives may be included in the hot melt pressure sensitive adhesive to vary certain properties. These may include, for example, dyes such as titanium dioxide, fillers such as talc, clay and the like. It must, however Ensure that the filler does not prevent penetration of the radiation into the adhesive and initiation of the reaction.
  • the radiation-crosslinkable hot-melt pressure-sensitive adhesive according to the invention may contain polymers which contain no reactive groups. These may be those polymers having a molecular weight greater than 1000 g / mol, which are described as starting polymers of component (A).
  • polymers from the group ethylene-n-butyl acrylate copolymers, ethylene (meth) acrylic acid copolymers, ethylene-vinyl acetate copolymers, amorphous polyolefins, for example polypropylene homopolymers, propylene-butene copolymers, propylene-hexene copolymers and in particular amorphous poly-alpha-olefin copolymers (APAOs) prepared by metallocene catalysis. It is also possible to use polyamides which additionally impart additional flexibility, toughness and strength to the hot-melt pressure-sensitive adhesive.
  • APAOs poly-alpha-olefin copolymers
  • hydrophilic polymers for example polyvinyl methyl ether, polyvinylpyrrolidone, polyethyloxazolines, starch or cellulose esters which, for example, increase the wettability of the adhesives.
  • portions of non-reactive polymers are added based on selected ⁇ -olefin copolymers. These copolymers are described in the literature. They are particularly useful when prepared via metallocene catalysis. The copolymers produced in this way are distinguished by a narrow molecular weight distribution. They support the hot melt adhesive properties of the hotmelt PSA of the invention.
  • These polymeric constituents may contain from 0 to 30% by weight, in particular 2 to 20% by weight, in the hot-melt pressure-sensitive adhesive according to the invention.
  • the polymers are free of epoxide groups.
  • the molecular weight is over 1000, preferably over 10000 g / mol.
  • the radiation-crosslinkable hotmelt PSA according to the invention may contain adhesion promoters.
  • Adhesion promoters are substances that have the adhesive strength of Improve adhesive on the substrate. Typical adhesion promoters are, for example, ethylene / acrylamide comonomers, polymeric isocyanates, reactive organosilicon compounds or phosphorus derivatives. Such adhesion promoters are known to the person skilled in the art. They should contain in an amount of 0 to 10 wt .-%, preferably 1 to 5 wt .-% in the adhesive.
  • the hot-melt pressure-sensitive adhesive according to the invention contains:
  • component (A) 20 to 60% by weight of at least one radiation-crosslinkable copolymer based on epoxidized polyolefins as component (A), the epoxy groups being distributed statistically over the molecular chain,
  • a further preferred embodiment of a hot-melt pressure-sensitive adhesive according to the invention comprises in component (A) and component (B) olefinic double bonds and additionally a free-radical polymerization initiator.
  • the hot-melt pressure-sensitive adhesive according to the invention is generally prepared by mixing.
  • unreactive components such as plasticizers, waxes and resins, for example at 80 0 C to 200 0 C, in particular at ca.130 0 C
  • the thermally sensitive components such as component (A), optionally component (C), photoinitiators, photosensitizers added with stirring and stirred until homogeneous.
  • component (A) optionally component (C)
  • photoinitiators photoinitiators
  • photosensitizers added with stirring and stirred until homogeneous.
  • the hot-melt pressure-sensitive adhesives according to the invention are used for bonding substrates such as glass, lacquered or unpainted paper and, in particular, plastics, such as e.g. PET, PEN, PP, PVC, PS and PE.
  • plastics such as e.g. PET, PEN, PP, PVC, PS and PE.
  • the hot-melt pressure-sensitive adhesives according to the invention are distinguished, in particular, by a very good adhesion to the abovementioned plastics.
  • a preferred embodiment of the Schmeizhaftklebstoffs invention is the bonding of hollow bodies with labels, especially of thermally shrinkable ble labels.
  • Hollow bodies are e.g. Bottles, cans, barrels, pods or cartridges. It may be rotationally symmetrical objects, but also angular hollow bodies are possible. They consist for example of metal, glass or thermoplastics. Preference is given to polar plastics, in particular polyesters. Such hollow bodies are for example for mineral water and soft drinks in use.
  • the labels generally consist of thermoplastics such as polyethylene, polypropylene, polystyrene, polyvinyl chloride or cellophane. It is preferred to use labels made of a film based on non-polar plastics, in particular oriented polypropylene (OPP). There are no special requirements for the shape of the labels. These are preferably wrap-around labels.
  • the hot melt pressure sensitive adhesives according to the invention is in the labeling of aerosol cans or contour bottles with subsequent shrinkage of the labels.
  • the shrinkable labels are shrunk at temperatures of at least 120 0 C, usually above 150 0 C within a few seconds to the contour of an aerosol can, for example.
  • the melting point according to the invention has Pressure-sensitive adhesive after irradiation with UV or electron beams a very low, creep with good adhesive strength of the overlap bonding on.
  • the heat resistance of the hot melt pressure-sensitive adhesive according to the invention is improved. This results in no shifts of overlapping glued labels in case of changes in shape by shrinking the labels. Problems, such as the contamination of the exposed by the sliding process adhesive layer are thus prevented.
  • the hotmelt PSAs according to the invention neither the entrainment nor the overlap bonding dissolves, nor does a shift in the overlap bonding take place.
  • the hot melt pressure sensitive adhesives according to the invention should have a correspondingly low viscosity before irradiation; at 130 ° C., they are usually 100 mPas to 4500 mPas.
  • a viscosity of up to 2500 mPas is particularly suitable, in particular the range is 200 mPas to 1000 mPas, measured with a Brookfield DV 2+ viscometer, spindle 27.
  • a low viscosity is required for use in high-speed labeling lines.
  • the hot melt pressure sensitive adhesives of the present invention have the requisite low viscosity at low processing temperatures such as those used on temperature sensitive labels, e.g. B. plastic labels from OPP is desired.
  • the processing temperatures are in the range of 50 0 C to 150 0 C, preferably in the range of 90 0 C to 130 0 C.
  • the low viscosity simultaneously ensures a clean machine operation on the commercial machines. In particular, on machines with high speeds (over 30,000 hollow body / h) soiling, such as threading and spraying, avoided.
  • the high pressure-sensitive tackiness ensures safe transport and safe removal of labels on high-speed machines.
  • the processing is carried out on labeling machines, which apply with segments, rollers or nozzles the hotmelt adhesive on the label or on the hollow body.
  • the adhesive is applied in such a way that a driving range (Label on hollow body) and an overlap area (end of label on-start) exists.
  • the hot-melt pressure-sensitive adhesive according to the invention can be used both as entrainment adhesive and as overlap adhesive. This simplifies the labeling process.
  • the hotmelt PSA of the invention is irradiated with a sufficient UV or electron beam dose, so that the hotmelt PSA has sufficient adhesion and connects the substrates.
  • the duration of the irradiation should be below 5 sec.
  • transparent labels are preferably used or those which are at least UV-transparent at the adhesive zone.
  • the applied and bonded labels are briefly placed in an oven together with the article to shrink the label to the required temperature.
  • the hot melt pressure sensitive adhesive exhibits excellent strength properties, so that separation or displacement does not occur at the overlapping point of the label.
  • the crosslinking caused by the irradiation results in a high final adhesion and heat resistance which, for example, opens up the following application areas in the field of labeling:
  • the hot-melt pressure-sensitive adhesives used according to the invention are characterized in particular by high cohesion and adhesion in addition to the high heat resistance.
  • Labeling with properties of a tamper-evident closure can be opened due to the high adhesion usually only with material tear.
  • shrinkable films can be bonded, which wrap a packaging object, and then subjected to a shrinking process, for example, the shrinking of trays.
  • the invention finds general application in disposable article (sanitary article) manufacture or in packaging, particularly in shrink-wrap labeling.
  • hot-melt PSAs Another use of the hot-melt PSAs according to the invention is the coating of self-adhesive films and tapes with an adhesive layer.
  • tapes or films for example based on polyolefins, are coated with the adhesive according to the invention and this is crosslinked by radiation. Thereafter, these items can be made up. In this way, permanently tacky films and tapes can be produced.
  • Another field of application of the present invention is a use for the production of self-adhesive labels. These labels are coated with an adhesive according to the invention and crosslinked by radiation. The self-adhesive surfaces thus obtained can be covered by anti-adhesively coated carrier films. Self-adhesive labels are obtained.
  • the adhesive surfaces of patches or other self-adhesive substrates can be coated with an adhesive according to the invention.
  • the hot melt adhesives according to the invention have an improved bond strength after crosslinking.
  • the resulting network has a uniform structure and improved adhesion and cohesion over a wide temperature range.
  • Kuraray KL 610 epoxidized polyisoprene homopolymer Kuraray
  • Kuraray KL 630 epoxidized polyisoprene homopolymer Kuraray
  • Escorez 5400/5380 1 1 tackifier resin
  • Resin based on polycyclopentadiene Exxon
  • Irganox HP2225 FF commercial stabilizer (Ciba)
  • an inventive adhesive at about 120 is at one end - 130 0 C applied in strip form. This end is glued onto a cleaned aluminum can. Subsequently, will Apply the adhesive stripwise on the other side of the foil and glue the overlap (about 1 cm). Subsequently, the labeled can is irradiated on the bond line with a type Fusion F-600 UV system with an H radiator (240 watts / cm) at a belt speed of 25 m / min. The distance to the substrate is 10 cm. It is then marked the overlap of the seam and then shrunk in a convection oven at 120 0 C. After constant time intervals (5 min.) It is judged whether the adhesive can withstand the forces of the shrinking process. This can be determined by slippage of the overlap mark.
  • Viscosities are measured with a Brookfield DV2 + at the indicated

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Epoxy Resins (AREA)

Abstract

L'invention concerne un adhésif de contact fusible réticulable par irradiation, qui contient des polyoléfines époxydées réticulables par irradiation en tant que constituant (A), les groupes époxydes étant pratiquement répartis sur la chaîne polymère, une résine donnant du collant et exempte de groupes époxydes en tant que constituant (B), éventuellement un composé oligomère (C) qui contient des groupes réactifs pouvant réagir avec les groupes époxydes du constituant (A), ainsi qu'au moins un photoamorceur et d'autres additifs.
EP06701180A 2005-02-10 2006-01-11 Adhesifs de contact fusibles reticulables par irradiation Withdrawn EP1846529A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE200510006282 DE102005006282A1 (de) 2005-02-10 2005-02-10 Strahlungsvernetzbare Schmelzhaftklebstoffe
PCT/EP2006/000172 WO2006084537A2 (fr) 2005-02-10 2006-01-11 Adhesifs de contact fusibles reticulables par irradiation

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EP1846529A2 true EP1846529A2 (fr) 2007-10-24

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EP06701180A Withdrawn EP1846529A2 (fr) 2005-02-10 2006-01-11 Adhesifs de contact fusibles reticulables par irradiation

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US (1) US7682477B2 (fr)
EP (1) EP1846529A2 (fr)
AU (1) AU2006212536B2 (fr)
BR (1) BRPI0606944A2 (fr)
DE (1) DE102005006282A1 (fr)
WO (1) WO2006084537A2 (fr)

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JP6582363B2 (ja) * 2013-12-03 2019-10-02 オート化学工業株式会社 接着剤組成物及びその製造方法
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Also Published As

Publication number Publication date
BRPI0606944A2 (pt) 2009-07-28
AU2006212536A1 (en) 2006-08-17
DE102005006282A1 (de) 2006-08-24
US7682477B2 (en) 2010-03-23
WO2006084537A2 (fr) 2006-08-17
AU2006212536B2 (en) 2012-04-19
WO2006084537A3 (fr) 2007-04-26
US20080039594A1 (en) 2008-02-14

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