EP1859459A1 - Filtre de traversee et element electrique multicouche - Google Patents

Filtre de traversee et element electrique multicouche

Info

Publication number
EP1859459A1
EP1859459A1 EP06722608A EP06722608A EP1859459A1 EP 1859459 A1 EP1859459 A1 EP 1859459A1 EP 06722608 A EP06722608 A EP 06722608A EP 06722608 A EP06722608 A EP 06722608A EP 1859459 A1 EP1859459 A1 EP 1859459A1
Authority
EP
European Patent Office
Prior art keywords
base plate
base
feedthrough filter
multilayer
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP06722608A
Other languages
German (de)
English (en)
Inventor
Markus Albrecher
Günter Engel
Markus Ortner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Electronics AG
Original Assignee
Epcos AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Epcos AG filed Critical Epcos AG
Publication of EP1859459A1 publication Critical patent/EP1859459A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/18—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material comprising a plurality of layers stacked between terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors
    • H01C1/148—Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors the terminals embracing or surrounding the resistive element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/248—Terminals the terminals embracing or surrounding the capacitive element, e.g. caps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/35—Feed-through capacitors or anti-noise capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/40—Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations

Definitions

  • a feedthrough filter and a multilayer electrical device are provided.
  • An object to be solved is to provide an electrical feedthrough filter that can withstand high mechanical loads. Another object to be achieved is to provide a multilayer electrical device having stable electrical properties.
  • the invention relates to an electrical multilayer component comprising a main body with two-dimensional external contacts on its first base surface and an active component region arranged in the main body interior, which does not overlap with the external contacts in a projection plane onto which the active component region and the external contacts are projected vertically.
  • the projection plane is preferably parallel to the base of the device.
  • the specified multilayer component is preferably used in a feedthrough filter.
  • a z. B. in an implementation filter arrangement to be used which comprises a base plate with a pad and an electrical component with a base body.
  • the body is an active component ment area.
  • an outer electrode is arranged, which extends on a side surface of the base body and a base surface (underside) of the base body.
  • the region of the outer electrode arranged on the base surface of the main body forms a contact surface.
  • the outer electrode and the contact surface of the device is soldered to the pad of the base plate, that is electrically and mechanically fixed by means of a solder mass connected to the pad of the base plate.
  • the region of the body which is susceptible to cracking is thus arranged between surfaces which connect the first edge of the base body, the edge of the contact surface facing away from the side surface and the upper edge of the solder mass.
  • the arranged on the side surface outer electrode and arranged on the base contact surface are wetted by a solder mass.
  • the corner region of the main body which is essentially bounded by surfaces that can be wetted transversely to one another and the edges of these surfaces facing away from one another, is firmly connected to the base plate in the described arrangement and substantially not seen from the base plate capable of vibrating.
  • the rest of the base body which is not directly fastened to the base plate, on the other hand, is swingable to a greater extent, viewed from the base plate.
  • the boundary between the two mentioned areas is susceptible to cracking. Since it can happen that the outer electrode and / or the contact surface through the
  • Lot mass are not fully wetted, is in principle the entire ⁇ ck Scheme the body cracking.
  • the main body preferably has dielectric layers of ceramic, between which internal electrodes are arranged, which comprise mutually oppositely oppositely-polarized first and second internal electrodes, which are electrically connected to different external contacts.
  • mutually opposed first and second internal electrodes may in a variant oppose each other in a transverse direction, i. H. overlap.
  • Mutually opposed first and second internal electrodes may alternatively face each other in a longitudinal direction, wherein each of a first and a second internal electrode lie in a plane and are arranged side by side.
  • outer electrodes which are electrically connected to outer contacts are arranged, to which the inner electrodes are connected.
  • the main body has two base surfaces - top and bottom - which are each substantially parallel to a lateral plane, wherein at least one base surface should be turned when mounting the device on a circuit board to this circuit board.
  • the Basic body is referred to as lateral surface.
  • the lateral surface of the basic body comprises two opposing first side surfaces and two opposing two side surfaces. te side surfaces.
  • a first side surface is arranged transversely to the second side surfaces, and vice versa.
  • the first base area is equated below with the bottom of the body below. However, this should not be a restriction, because the bottom and top of the body are z. B. interchangeable by turning the device.
  • Also on a second base surface of the main body can be arranged with the external electrodes electrically connected external contacts, which do not overlap in the projection plane with the overlapping surface of the first and the second internal electrodes. This is particularly advantageous if the component is provided for fastening (soldering) on two facing printed circuit boards between these printed circuit boards.
  • An active device region is understood as meaning a volume in which the electric field strength is more than 5% of the maximum field strength between opposing, oppositely poled internal electrodes. In the case of a multilayer capacitor, this is a component region which is defined in the lateral plane by overlapping regions of the counterpoled internal electrodes. A crack in the active area has an effect on the electrical properties of the feedthrough filter and can in extreme cases to a
  • an electrical multi-layer component is specified with a base body, which has the first and second inner layers arranged alternately one above another. having electrodes, wherein the first inner electrodes are connected to a first outer electrode and the second inner electrodes to a second outer electrode.
  • the outer electrodes are arranged on a lateral surface of the base body and are electrically connected to an outer contact arranged on a first base surface of the base body.
  • a lateral plane - projection plane - an arbitrarily selected first and a subsequent second inner electrode have an overlapping surface which does not interact with the outer contacts overlaps.
  • the distance between the first outer electrode and the edge facing this arbitrarily selected second inner electrode is greater than the measured in the same direction cross-sectional length of the external contact connected to the first outer electrode.
  • the multilayer component is designed as a capacitor with at least one capacitor element.
  • the multilayer component can in addition to capacitive elements and other elements, eg. B. varistors include.
  • the dielectric layers are formed from a varistor ceramic.
  • the first internal electrodes form a first stack and the second internal electrodes form a second stack, wherein the two stacks are arranged next to one another, and wherein the active component region is arranged between the stacks.
  • the main body has dielectric layers - preferably
  • the ceramic may in one variant be a capacitor ceramic COG, X7R, Z5U, Y5V, HQM.
  • the ceramic may be a ZnO-containing varistor ceramic.
  • the main body can layers of various ceramics, eg. B. at least one layer of capacitor ceramic and at least one further layer of varistor ceramic, have.
  • filters with an integrated varistor can be designed as ESD protection.
  • the first outer electrodes connected to the first inner electrodes and the second outer electrodes connected to the second inner electrodes are arranged in a variant on different, opposite side surfaces of the main body.
  • the component may have a plurality of juxtaposed stacks, which are preferably galvanically separated from one another and each realize an independent component unit, for example a capacitor element.
  • different component units can be contacted independently of one another via a separate pair of external electrodes.
  • the outer electrodes are each electrically connected to a separate external contact arranged on the underside of the main body, wherein for all stacks and all external contacts, the first and the second internal electrodes of the stack have an overlapping surface in a projection plane which has no overlap with external contacts.
  • the first internal electrodes may be connected to two first external electrodes which are mounted on a first external electrode. are arranged opposite first side surfaces of the base body.
  • the second internal electrodes are connected to two second external electrodes, which are arranged on an opposite second lateral surface of the main body.
  • Metal layers with internal electrodes structured therein may contain any metals, metal alloys or their combination.
  • the external contact of the component is connected in a variant by means of solder with a contact surface of a printed circuit board. Due to different expansion coefficients of the base body material (ceramic) and solder, a crack can occur when the temperature changes in the base body, which attaches to the inwardly facing edge of the outer contact and obliquely continues upward to the outer electrode. The fact that the active volume of the component is withdrawn from the edge regions of the component, it is not affected by the resulting crack.
  • the specified component is thus characterized by a high reliability of its electrical properties, if a crack occurs in the base body on the inwardly facing edge of the external contact. With the measures described in particular a short circuit between the differently polarized internal electrodes can be avoided in a cracking.
  • the described multilayer component can be used in particular in a feedthrough filter explained below.
  • a feedthrough filter which has a base plate.
  • the base plate has one on its
  • Top disposed first and arranged on its underside second contact surface, which are galvanically connected together.
  • an electrical feedthrough (lead) is passed through, which is soldered to the second, but not to the first contact surface.
  • At least one electrical component, whose first external contact is soldered to the first contact surface, is arranged on the base plate.
  • a plurality of electrical components are arranged on the base plate.
  • the top and bottom of the base plate can be reversed by turning the base plate together.
  • a suitable for receiving the e- lektrischen implementation opening is preferably formed, which has a metallized inner surface.
  • the inner diameter of the opening is preferably adapted to the outer diameter of the bushing.
  • the first and second contact surfaces are preferably electrically connected to one another through this opening.
  • solder joint between the base plate and the electrical component is relieved in terms of transferable through the implementation mechanical loads - usually tensile forces - that the solder joint between the bushing and the base plate is arranged on the other side of the base plate.
  • the base plate may, for example, a known per se, preferably laminated to form contact surfaces with copper circuit board (PCB, Printed Circuit Board) z. B. made of FR4 or suitable for high frequency applications organic material.
  • PCB copper circuit board
  • Printed Circuit Board Printed Circuit Board
  • the implementation is preferably isolated from the housing.
  • the feedthrough serves to make contact with the electrical component, which is generally packaged and / or encapsulated by a potting compound.
  • the passage is preferably embedded in the potting compound, which has the advantage that the implementation is thereby better fixed in the component.
  • the housing comprises a cover, which seals tightly with the base plate.
  • the housing is preferably electrically conductive and may be a metal housing.
  • the housing is preferably galvanically connected to at least one conductor track of the base plate. This track can in
  • Cavity, d. H. be arranged on top of the base plate, or alternatively on the underside of the base plate.
  • fastening tabs are provided with holes for attachment of the feedthrough filter on a support.
  • the housing is for the operation of the feedthrough filter advantageous, but not essential, for example, when the feedthrough filter is to be integrated in a preferably be provided with a cover electrical module. Therefore, the housing of the feedthrough filter can be dispensed with.
  • the base plate may be a part of the housing. Between the housing and the base plate, a cavity is formed, in which the electrical component is arranged. The cavity may be filled with a potting compound, on the one hand encapsulated the electrical component and on the other hand fixed the electrical feedthrough in the housing.
  • the cavity is filled with air, wherein the electrical component is not shed.
  • the integrated in the feedthrough filter electrical component is preferably an SMD component, d. H. a surface mountable component.
  • the bushing is electrically connected to the electrical component.
  • the implementation can be flexible. In one variant, for example, it can be present as a composite of several strands.
  • the bushing may alternatively be a preferably bare wire.
  • the wire can be flexible or rigid depending on the design.
  • the opening provided for the implementation in the base plate essentially in the middle.
  • the implementation is thus preferably arranged in the middle of the base plate.
  • the feedthrough filter is designed in a variant as a feedthrough capacitor with at least one, preferably at least two, housed multilayer capacitors.
  • the multilayer capacitors are preferably parallel to one another. interconnected. Multilayer capacitors have the
  • the feedthrough filter may generally be a filter.
  • Feedthrough filter in addition to multilayer capacitors and other components, eg. B. at least one inductive component or a varistor, in particular a multi-layer varistor included.
  • the other components are preferably also arranged on the base plate.
  • a symmetrical structure of the feedthrough filter, for example, with two identical multilayer capacitors has advantages.
  • the feed-through filter is particularly suitable for suppressing interference from a power supply or signal line of a downstream device.
  • the feedthrough filter with ceramic multilayer capacitors is characterized, for example, in comparison with an feedthrough filter with tube capacitors by a smaller footprint at a given capacity.
  • a second external contact of the electrical component is preferably soldered to a third contact surface arranged on the upper side of the base plate.
  • the third contact surface is galvanically connected by means of a through-connection with a fourth contact surface arranged on the underside of the base plate.
  • FIG. 1A shows a perspective view of a multilayer component according to a first embodiment
  • FIGS. 1B and 1C each show a cross section of the multilayer component according to FIG. 1A transverse to internal electrodes;
  • FIG. 1D shows a view of overlapping internal electrodes and external contacts of the component according to FIGS. 1A to 1C in a lateral projection plane;
  • FIG. 2A shows a perspective view of a multilayer component according to a second embodiment
  • FIGS. 2B and 2C each show a cross-section of the multilayer component according to FIG. 2A transversely to internal electrodes;
  • FIG. 2D shows a view of overlapping internal electrodes and external contacts of the component according to FIGS. 2A to 2C in a lateral projection plane
  • FIGS. 3A and 3B each show a cross-section of the multilayer component according to FIG. 2A, which is fastened on a printed circuit board and in which cracks have formed;
  • FIG. 4A shows a perspective view of a multilayer component according to a third embodiment
  • FIGS. 4B and 4C show, in cross section, the multilayer component according to FIG. 4A transversely to internal electrodes;
  • FIG. 5 in cross-section an feedthrough filter with arranged on a base plate multilayer capacitors
  • FIG. 6 shows a feedthrough filter in cross section with multilayer capacitors arranged between two base plates
  • FIG. 7A is a bottom view of the base plate according to FIG. 5;
  • FIG. 7B shows a view of the base plate according to FIG. 5 from above.
  • FIG. 1A a first multilayer component with a main body 10 and external electrodes 11, 12 is shown.
  • the outer electrodes 11, 12 are arranged on opposite side surfaces of the base body 10 and extend beyond the edges 111 of the respective side surface.
  • a part of the outer electrode 11, 12 arranged on the lower side of the main body 10 forms an outer contact 21 or 22.
  • a part of the outer electrode 11, 12 which is arranged on the upper side of the main body 10 forms an outer contact 21 "or 22 'which, for example, has an outer contact for connection to an upper one shown in FIG.
  • the outer contact 21 has an edge 112 facing away from the side surface, to which a crack can attach when the component is connected to a base plate 40.
  • the superimposed parts of the internal electrodes 1, 2 form together with interposed dielectric
  • Layers a stack 100, which substantially coincides with an active device region 114.
  • the distance d measured between the second outer electrode 12 and the edges of the first inner electrodes 1 facing this outer electrode is greater than the length of the outer contact 22 assigned to the outer electrode 12 measured in this direction. This also applies to the first outer electrode 11, the external contact 21 and the second internal electrodes 2. Therefore, in a projection plane shown in FIG. ID, the surfaces of the external contacts 21, 22 are spaced from the overlapping surface 3 of the first and second internal electrodes 1, 2.
  • FIGS. 2A to 2D show a second multilayer component with two first outer electrodes IIa, IIb and two second outer electrodes 12a, 12b.
  • the first internal electrodes 1 are connected to the two first external electrodes IIa, IIb arranged on opposite first side surfaces of the main body 10.
  • the second internal electrodes 2 are connected to the two second external electrodes 12a, 12b arranged on opposite second side surfaces of the main body 10.
  • the second internal electrodes 2 are dimensioned in the longitudinal direction x such that they are spaced from the first external electrodes IIa, IIb by a larger amount d than the cross-sectional length L of the external contacts 21a or 21b.
  • the first internal electrodes 1 are dimensioned such that they are spaced from the second external electrodes 12a, 12b by a larger amount d "than the cross-sectional length L 'of the external contacts 22a, 22b.
  • FIG. 2D shows the projection of the underside of the component as well as of the first and the second internal electrodes 1, 2 onto a lateral projection plane.
  • the overlapping surface 3 of the first and the second inner electrode 1, 2 is spaced from all external contacts 21a, 21b, 22a, 22b.
  • FIGS. 3A, 3B show the component according to the second embodiment, which is fastened by means of solder 81 to contact surfaces 41 of a base plate 40 (eg printed circuit board).
  • a crack 82 has formed which connects the boundaries of the solder joint in the longitudinal direction and in the vertical direction.
  • the crack 82 is applied to the inwardly facing edge of the outer contact 21, 22, since this edge defines the boundary between fixed parts and a vibratory part of the base body 10.
  • a corner region of the main body 10 which is prone to cracking is arranged.
  • the active device region 114 is spaced from this corner region.
  • FIGS. 4A to 4C show an embodiment of the multilayer component with a plurality of independent functional units.
  • the functional units are each formed by a stack 100, 101, 102, 103 of dielectric layers and overlapping first and second internal electrodes 1, 2.
  • Each stack 100, 101, 102, 103 is connected to a pair of outer electrodes 11, 12; 11-1, 12-1; 11-2, 12-2; 11-3, 12-3 connected.
  • These external electrodes have external contacts 21, 22; 21-1, 22-1; 21-2, 22-2; 21-3, 22-3 up.
  • the stacks are galley vanish separated from each other.
  • Each stack is essentially the same as the stack 100 already set apart in FIGS. 1A to 1D.
  • multilayer components shown in FIGS. 1A to 4C are surface-mountable multilayer capacitors.
  • multilayer components may, however, be multilayer varistors.
  • FIG. 5 shows a schematic detail of the basic structure of an feedthrough filter with two electrical components 61, 62, which are designed as multilayer capacitors.
  • the multilayer capacitors may have different capacitance values in one variant.
  • the multilayer capacitors can have the same capacitance values in a further variant.
  • the components 61, 62 are arranged on the upper side of a base plate 40 and fixedly connected to contact surfaces 41, 43 of this base plate by means of solder 81.
  • the components 61, 62 are in this case multilayer components according to the second preferred embodiment (FIGS. 2A to 2D).
  • the components 61, 62 may also have a different construction, for example according to the first or the third embodiment.
  • first 41 and third 43 contact surfaces are arranged on the upper side of the base plate 40 .
  • a second contact surface 42 is arranged on the underside of the base plate 40.
  • an opening 49 is provided in the base plate 40, the inner surface is metallized.
  • the opening 49 is arranged centrally in the base plate 40. Through the opening 49, an electrical feedthrough 50 - in this variant, a bare wire - passed.
  • the cross section of the passage 50 is preferably adapted to the cross section of the opening 49 in a form-fitting manner.
  • the passage 50 is soldered to the second contact surface 42 located on the underside of the base plate.
  • solder joints 81 "between the base plate 40 and the components 61, 62 are substantially mechanically decoupled from the solder joint 81 between the base plate 40 and the leadthrough 50.
  • the feedthrough filter can contain more than just two components.
  • four multilayer capacitors with different capacitance values are mounted on the base plate 40. All components are preferably arranged only on one side of the base plate. In one variant, both sides of the base plate are equipped with such components.
  • the area of the base plate is preferably less than 100 mm 2 and is typically 80 mm 2 .
  • the base plate may comprise in a variant of a thin, flexible film which is provided with a solderable conductive layer, for. B. metal layer is coated.
  • FIGS. 7A, 7B An exemplary base plate 40 is shown in FIGS. 7A, 7B.
  • the base plate 40 is disposed in a housing 70, preferably made of metal.
  • housing walls fastening elements 71 are provided for attachment of the device to an external support, which are formed in this variant as a highlight.
  • the facing the underside of the base plate 40 part of the housing may, for. B. be connected by means of a solder mass not shown here fixed to the fourth contact surface 44 of the base plate 40.
  • FIG. 6 shows a feed-through filter with multilayer capacitors 61, 62 arranged between two base plates 40, 40 '.
  • the outer electrodes of the multilayer capacitors 61, 62 are firmly connected to the two base plates 40, 40' by means of a solder mass 81.
  • the feedthrough 50 as in FIG. 5, is firmly connected to the lower base plate 40 by means of the solder mass 81 "and to the upper base plate 40" by means of the solder mass 81 "".
  • Feedthrough 50 and the multilayer capacitors 61, 62 are mounted on different sides of the base plate 40 ".
  • FIG. 7A shows the underside view and FIG. 7B shows the top view of the base plate 40 according to FIG. 5, which is designed for a component 61, 62 whose external contacts 21a, 21b, 22a, 22b are arranged according to the variant shown in FIG. 2A are.
  • the position of the component 61, 62 on the base plate 40 is indicated by a dashed line.
  • a fourth contact surface 44 is provided, which by means of plated-through holes 45 with two arranged on top of the base plate tracks 405 is electrically connected.
  • the conductor track 405 is preferably passivated except for their third contact surfaces 43 provided areas, ie coated with an insulating layer, not shown here, preferably from a halogen-free material.
  • the third contact surfaces 43 are soldered to external contacts 21a, 21b of the component shown in FIGS. 2A to 2D.
  • the contact surfaces 41 are soldered to external contacts 22a, 22b of said device.
  • Two contact surfaces 41 provided for a component 61 or 62 are electrically connected to one another by means of a preferably passivated electrical connection 401.
  • an insulating region 48 is arranged.
  • the base plate 40 shown in Fig. IA 1 7B is constructed symmetrically with respect to a through the center of the base plate continuous transverse or longitudinal axis.
  • the center of the opening 50 provided for the passage 50 agrees here with the center of the base plate.
  • capacitor ceramics COG, X7R, Z5U, Y5V, HQM.
  • feedthrough filters and multilayer components described here are not based on the embodiments shown in the figures. limited or the number of components shown.
  • the contact surfaces 43 has 41, 43 arranged on top of the base plate contact surface 42, 44 disposed on the underside of the base plate contact surface 45 vias

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Filters And Equalizers (AREA)

Abstract

L'invention concerne un filtre de traversée comportant une plaque de base (40) dotée d'une première piste conductrice sur sa face supérieure et d'une deuxième piste conductrice (41, 42) sur sa face inférieure. Les pistes conductrices (41,42) sont reliées par galvanisation au moyen d'une enveloppe interne métallisée passant à travers une ouverture (49) formée dans la plaque de base (40). Cette ouverture (49) est traversée par une traversée électrique (50) qui est brasée à la deuxième piste conductrice (42) mais pas à la première piste conductrice (41). Sur la plaque de base (40) est disposé au moins un élément électrique (61, 62) dont le premier contact externe (22a) est brasé à la première piste conductrice (41).
EP06722608A 2005-03-17 2006-03-14 Filtre de traversee et element electrique multicouche Withdrawn EP1859459A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102005012395A DE102005012395A1 (de) 2005-03-17 2005-03-17 Durchführungsfilter und elektrisches Mehrschicht-Bauelement
PCT/DE2006/000451 WO2006097080A1 (fr) 2005-03-17 2006-03-14 Filtre de traversee et element electrique multicouche

Publications (1)

Publication Number Publication Date
EP1859459A1 true EP1859459A1 (fr) 2007-11-28

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
EP06722608A Withdrawn EP1859459A1 (fr) 2005-03-17 2006-03-14 Filtre de traversee et element electrique multicouche

Country Status (5)

Country Link
US (1) US20090212883A1 (fr)
EP (1) EP1859459A1 (fr)
JP (1) JP2008537857A (fr)
DE (1) DE102005012395A1 (fr)
WO (1) WO2006097080A1 (fr)

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DE102005012395A1 (de) 2006-09-21
US20090212883A1 (en) 2009-08-27
WO2006097080A1 (fr) 2006-09-21
JP2008537857A (ja) 2008-09-25

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