EP2084204A1 - Composition de résine époxy thermodurcissable contenant un prépolymère de polyuréthanne bloqué et un prépolymère de polyuréthanne à terminaison époxy - Google Patents

Composition de résine époxy thermodurcissable contenant un prépolymère de polyuréthanne bloqué et un prépolymère de polyuréthanne à terminaison époxy

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Publication number
EP2084204A1
EP2084204A1 EP07821780A EP07821780A EP2084204A1 EP 2084204 A1 EP2084204 A1 EP 2084204A1 EP 07821780 A EP07821780 A EP 07821780A EP 07821780 A EP07821780 A EP 07821780A EP 2084204 A1 EP2084204 A1 EP 2084204A1
Authority
EP
European Patent Office
Prior art keywords
epoxy resin
resin composition
group
composition according
thermosetting epoxy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP07821780A
Other languages
German (de)
English (en)
Inventor
Andreas Kramer
Jürgen Finter
Urs Rheinegger
Jan Olaf Schulenburg
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sika Technology AG
Original Assignee
Sika Technology AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sika Technology AG filed Critical Sika Technology AG
Priority to EP07821780A priority Critical patent/EP2084204A1/fr
Publication of EP2084204A1 publication Critical patent/EP2084204A1/fr
Withdrawn legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/08—Processes
    • C08G18/10—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
    • C08L2666/20—Macromolecular compounds having nitrogen in the main chain according to C08L75/00 - C08L79/00; Derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
    • C08L75/04—Polyurethanes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer

Definitions

  • the invention relates to the field of impact modifiers and the field of thermosetting epoxy resin compositions.
  • Impact modifiers have long been used to improve the strength of adhesives in the event of sudden impact.
  • epoxy resin compositions generally have high mechanical strengths, but are very brittle, that is, in a sudden force, such as occurs in a collision of vehicles breaks the cured epoxy resin and leads to destruction of the composite.
  • Liquid rubbers have long been used for toughening.
  • liquid rubbers based on acrylonitrile / butadiene copolymers such as those available under the name Hycar®, are used.
  • EP-B-0 338 985 describes impact-resistant epoxy resin compositions which, in addition to liquid rubbers based on acrylonitrile / butadiene copolymers, additionally comprise liquid rubbers based on polyurethane prepolymers which are terminated with a phenol or a lactam.
  • WO-A-2005/007766 discloses epoxy resin compositions containing a reaction product of an isocyanate group-terminated prepolymer and a blocking agent selected from the group bisphenol, phenol, benzyl alcohol, aminophenol or benzylamine.
  • a blocking agent selected from the group bisphenol, phenol, benzyl alcohol, aminophenol or benzylamine.
  • such epoxy resin compositions have weaknesses in low temperature impact strength ( ⁇ 0 ° C).
  • WO-A-03/093387 discloses impact-resistant epoxy resin compositions containing adducts of dicarboxylic acids with glycidyl ethers or of Bis (aminophenyl) sulfone Isonneren or aromatic alcohols containing glycidyl ethers.
  • these compositions also have deficiencies in low temperature impact strength ( ⁇ 0 ° C).
  • WO-A-2004/055092 and WO-A-2005/007720 disclose epoxy resin compositions having improved impact resistance which contain a reaction product of an isocyanate group-terminated polyurethane prepolymer with a monohydroxy epoxide. While these epoxy resin compositions have improved low temperature impact strength over those containing phenol-terminated polyurethane urethanes, they are still not optimal.
  • the object of the present invention is therefore to provide heat-curing epoxy resin compositions which improved
  • a further aspect of the invention is the use of the composition as a one-component thermosetting adhesive. Further aspects are a method of bonding according to claim
  • the present invention relates, in a first aspect, to a thermosetting epoxy resin composition which comprises at least one epoxy resin A having on average more than one epoxide group per molecule, at least one curing agent B for epoxy resins which is activated by elevated temperature, at least one terminally blocked polyurethane prepolymer of the formula (I) and at least one epoxy group-terminated polyurethane prepolymer of the formula (II).
  • thermosetting composition contains at least one
  • Epoxy resin A with an average of more than one epoxide group per molecule is preferably present as a glycidyl ether group.
  • the epoxy resin A having an average of more than one epoxy group per molecule is preferably an epoxy liquid resin or a solid epoxy resin.
  • solid epoxy resin is well known to the person skilled in the art and is used in contrast to "liquid epoxy resins".
  • the glass transition temperature of solid resins is above room temperature, i. they can be ground at room temperature to give pourable powders.
  • Preferred solid epoxy resins have the formula (X)
  • substituents R 'and R "independently of one another are either H or CH 3.
  • substituents, radicals or groups interpreted as meaning that in the same molecule the identically named substituents, radicals or groups can occur simultaneously with different meaning.
  • the index s stands for a value of> 1.5, in particular from 2 to 12.
  • Such solid epoxy resins are commercially available, for example, from Dow or Huntsman or Hexion.
  • Preferred liquid epoxy resins have the formula (XI)
  • the substituents R '"and R""independently of one another are either H or CH 3.
  • the index r stands for a value from 0 to 1.
  • r stands for a value of less than 0.2 Diglycidyl ether of bisphenol
  • the epoxy resin A is an epoxy liquid resin of the formula (XI).
  • the thermosetting epoxy resin composition contains both at least one epoxy liquid resin of the formula (XI) and at least one solid epoxy resin of the formula (X).
  • the proportion of epoxy resin A is preferably 10 to 85% by weight, in particular 15 to 70% by weight, preferably 15 to 60% by weight, of the weight of the composition.
  • composition of the invention further contains at least one hardener B for epoxy resins, which is activated by elevated temperature. It is preferably a curing agent which is selected from the group consisting of dicyandiamide, guanamines, guanidines, aminoguanidines and derivatives thereof.
  • substituted ureas such as, for example, 3-chloro-4-methylphenylurea (chlorotoluron), or phenyldimethylureas, in particular p-chlorophenyl-N, N-dimethylurea (monuron), 3-phenyl -1, 1-dimethylurea (Fenuron) or 3,4-dichlorophenyl-N, N-dimethylurea (diuron).
  • substituted ureas such as, for example, 3-chloro-4-methylphenylurea (chlorotoluron)
  • phenyldimethylureas in particular p-chlorophenyl-N, N-dimethylurea (monuron), 3-phenyl -1, 1-dimethylurea (Fenuron) or 3,4-dichlorophenyl-N, N-dimethylurea (diuron).
  • compounds of the class of imidazoles and amine complexes can
  • Hardener B is preferably a hardener which is selected from the group consisting of dicyandiamide, guanamine, guanidines, aminoguanidines and derivatives thereof; substituted ureas, in particular 3-chloro-4-methylphenylurea (chlorotoluron), or phenyldimethylureas, in particular p-chlorophenyl-N, N-dimethylurea (monuron), 3-phenyl-1,1-dimethylurea (fenuron), 3 , 4-dichlorophenyl-N, N-dimethylurea (diuron), as well as imidazoles and amine complexes.
  • curing agent B is dicyandiamide.
  • the total amount of hardener B is 0.5-12% by weight, preferably 1-8% by weight, based on the weight of the total composition.
  • the inventive composition further contains at least one terminally blocked polyurethane prepolymer of the formula (I).
  • R 1 is a p-valent radical of an isocyanate-terminated linear or branched polyurethane prepolymer PU1 after removal of the terminal isocyanate groups, p for a value of 2 to
  • R 8 and R 2 independently represent a substituent selected from the group consisting of
  • R 5 , R 6 , R 7 and R 8 are each independently an alkyl or cycloalkyl or aralkyl or arylalkyl group or R 5 forms together with R 6 , or R 7 together with R 8 , a part an A to 7 membered ring which is at most substituted.
  • R 9 , R 9 and R 10 are each independently an alkyl or aralkyl or arylalkyl group or an alkyloxy or aryloxy or aralkyloxy group and R 11 is an alkyl group.
  • R 13 and R 14 are each independently an alkylene group having 2 to 5 C atoms, which optionally has double bonds or is substituted, or for a phenylene group or for a hydrogenated
  • Phenylene group and R 15 , R 16 and R 17 are each independently H or an alkyl group or an aryl group or an aralkyl group.
  • R 18 is an aralkyl group or a mono- or polynuclear substituted or unsubstituted aromatic group which optionally has aromatic hydroxyl groups.
  • phenols or bisphenols are to be considered after removal of a hydroxyl group.
  • Preferred examples of such phenols and bisphenols are, in particular, phenol, cresol, resorcinol, pyrocatechol, cardanol (3-pentadecenylphenol (from cashew nut shell oil)), nonylphenol, phenols reacted with styrene or dicyclopentadiene, bisphenol A, bisphenol -F and 2,2'-diallyl-bisphenol-A.
  • R 18 in particular, hydroxybenzyl alcohol and benzyl alcohol are considered after removal of a hydroxyl group. If R 5 , R 6 , R 7 , R 8 , R 9 , R 9 ' , R 10 , R 11 , R 15 , R 16 or R 17 for a
  • Alkyl group this is in particular a linear or branched C1-C20 alkyl group.
  • R 5 , R 6 , R 7 , R 8 , R 9 , R 9 ' , R 10 , R 15 , R 16 , R 17 or R 18 is an aralkyl group, this grouping is in particular a methylene-bonded aromatic group, in particular a benzyl group.
  • R 5, R 6, R 7, R 8, R 9, R 9 'or R 10 is an alkylaryl group, this is particularly a group bonded through phenylene Ci to C-20 alkyl group, such as tolyl or xylyl.
  • radicals R 2 are radicals which are selected from the group consisting of
  • the radical Y in this case represents a saturated or olefinically unsaturated hydrocarbon radical having 1 to 20 C atoms, in particular having 1 to 15 C atoms.
  • Y in particular AIIyI methyl, nonyl, dodecyl or an unsaturated C15-alkyl radical having 1 to 3 double bonds are preferred.
  • the preparation of the terminally blocked polyurethane prepolymer of the formula (I) is carried out from the isocyanate-terminated linear or branched polyurethane prepolymer PU1 with one or more isocyanate-reactive compounds R 2 H. If several such isocyanate-reactive compounds are used, the reaction can be sequential or with a Mixture of these compounds take place.
  • the reaction is carried out in such a way that the one or more isocyanate-reactive compounds R 2 H are used stoichiometrically or in stoichiometric excess in order to ensure that all NCO groups have reacted.
  • the terminally blocked polyurethane prepolymer of the formula (I) advantageously has an elastic character and is furthermore advantageously soluble or dispersible in epoxy liquid resins.
  • the amount of the terminally blocked polyurethane prepolymer of the formula (I) is advantageously between 1 and 45% by weight, in particular between 3 and 35% by weight, based on the total weight of the thermosetting epoxy resin composition.
  • composition according to the invention furthermore contains at least one epoxide group-terminated polyurethane prepolymer of the formula (II).
  • R is an n-valent radical of an isocyanate-terminated linear or branched polyurethane prepolymer PUT after removal of the terminal isocyanate groups and R 4 is independently a radical of a primary or secondary hydroxyl-containing aliphatic, cycloaliphatic, aromatic or araliphatic epoxide according to the Removing the hydroxide and epoxide groups, and m is 1, 2 or 3 and n is independently from 2 to 8.
  • the preparation of the epoxy-terminated polyurethane polymer of the formula (II) is carried out by reacting an isocyanate-terminated linear or branched polyurethane prepolymer PUT with one or more monohydroxyl-epoxy compound of the formula (V).
  • the reaction can be carried out sequentially or with a mixture of these compounds.
  • the monohydroxyl epoxy compound of the formula (V) has 1, 2 or 3 epoxide groups.
  • the hydroxyl group of this monohydroxyl epoxy compound (V) may be a primary or a secondary hydroxyl group.
  • Such monohydroxyl epoxy compounds can be produced, for example, by reacting polyols with epichlorohydrin. Depending on the reaction, the reaction also produces the corresponding monohydroxy-epoxy compounds in various concentrations in the reaction of polyfunctional alcohols with epichlorohydrin as by-products. These can be isolated by conventional separation operations.
  • hydroxyl-containing epoxides in particular glycidol, 3-glycidyloxybenzyl alcohol or hydroxymethylcyclohexene oxide.
  • distillation residues which are obtained in the production of high purity, distilled epoxy liquid resins. Such distillation residues have an up to three times higher concentration of hydroxyl-containing epoxides than commercially available undistilled epoxy liquid resins.
  • epoxides with a ß-hydroxy ether group prepared by the reaction of (poly) epoxides with a deficit of monovalent nucleophiles such as carboxylic acids, phenols, thiols or se ⁇ -amines can be used.
  • the radical R 4 is particularly preferably a trivalent radical of the formula
  • R is methyl or H.
  • the free primary or secondary OH functionality of the monohydroxyl epoxy compound of the formula (V) permits efficient reaction with terminal isocyanate groups of prepolymers without having to use disproportionate excesses of the epoxide component.
  • the epoxide group-terminated polyurethane prepolymer of the formula (II) advantageously has an elastic character and is furthermore advantageously soluble or dispersible in epoxy liquid resins.
  • the amount of the epoxy group-terminated polyurethane prepolymer of the formula (II) is advantageously between 1 and 45% by weight, in particular between 3 and 35% by weight, based on the total weight of the thermosetting epoxy resin composition.
  • the weight ratio of the terminally blocked polyurethane prepolymer of the formula (I) to the epoxide group-terminated is advantageous Polyurethane prepolymer of the formula (II) between 0.05 and 20, in particular between 0.25 and 4, preferably between 0.5 and 2, most preferably about 1.
  • the polyurethane prepolymer PU1, on which R 1 is based, can be prepared from at least one diisocyanate or triisocyanate and from a polymer Q PM with terminal amino, thiol or hydroxyl groups and / or from an optionally substituted polyphenol Q PP .
  • poly in “polyisocyanate”, “polyol”, “polyphenol” and “polymer kaptan” refers to molecules which formally contain two or more of the respective functional groups.
  • Suitable diisocyanates are aliphatic, cycloaliphatic, aromatic or araliphatic diisocyanates, in particular commercial products such as methylene diphenyl diisocyanate (MDI), hexamethylene diisocyanate (HDI), toluene diisocyanate (TDI), tolidine diisocyanate (TODI), isophorone diisocyanate (IPDI), trimethylhexamethylene diisocyanate (TMDI), 2,5- or 2,6-bis (isocyanatomethyl) bicyclo [2.2.1] heptane, 1,5-naphthalenediisocyanate (NDI), dicyclohexylmethyl diisocyanate (Hi 2 MDI), p-phenylene diisocyanate (PPDI), m-tetra- methylxylylene diisocyanate (TMXDI), etc.
  • MDI methylene diphenyl diisocyanate
  • HDI hex
  • Suitable triisocyanates are trimers or biurets of aliphatic, cycloaliphatic, aromatic or araliphatic diisocyanates, especially the isocyanurates and biurets of the diisocyanates described in the previous paragraph. Of course, suitable mixtures of di- or triisocyanates can be used.
  • polymers Q PM with terminal amino, thiol or hydroxyl groups are particularly suitable polymers Q PM having two or three terminal amino, thiol or hydroxyl groups.
  • the polymers Q PM advantageously have an equivalent weight of 300-6000, in particular of 600-4000, preferably of 700-2200 g / equivalent of NCO-reactive groups.
  • Suitable polymers Q PM are polyols, for example the following commercially available polyols or any mixtures thereof:
  • Polyoxyalkylenpolyole also called polyether polyols, which are the polymerization of ethylene oxide, 1, 2-propylene oxide, 1, 2- or 2,3-butylene oxide, tetrahydrofuran or mixtures thereof, optionally polymerized by means of a starter molecule having two or three active H atoms such as water or compounds with two or three OH groups.
  • a starter molecule having two or three active H atoms such as water or compounds with two or three OH groups.
  • Both polyoxyalkylene polyols having a low level of unsaturation (measured according to ASTM D-2849-69 and expressed in milliequivalents of unsaturation per gram of polyol (mEq / g)) prepared, for example, with the aid of so-called double metal cyanide complex catalysts (in short DMC) can be used.
  • Catalysts as well as polyoxyalkylene polyols having a higher degree of unsaturation, prepared for example with the aid of anionic catalysts such as NaOH, KOH or alkali metal alkoxides.
  • Particularly suitable are polyoxypropylene diols and triols having a degree of unsaturation lower than 0.02 meq / g and having a molecular weight in the range of 1000-30,000 daltons, polyoxybutylene diols and triols, polyoxypropylene diols and triols having a molecular weight of 400-8000 daltons, and so-called Ethylene oxide-endcapped polyoxypropylene diols or triols, the latter being special polyoxypropylene polyoxyethylene polyols obtained, for example, by reacting pure polyoxypropylene polyols. After completion of the polypropoxylation pylenpolyole be alkoxylated with ethylene oxide and thereby have primary hydroxyl groups.
  • Hydroxy-terminated polybutadiene polyols such as those prepared by polymerization of 1,3-butadiene and allyl alcohol or by oxidation of polybutadiene, and their hydrogenation products;
  • Styrene-acrylonitrile grafted polyether polyols such as those supplied by Elastogran under the name Lupranol®;
  • Polyhydroxy-terminated acrylonitrile / butadiene copolymers as can be prepared, for example, from carboxyl-terminated acrylonitrile / butadiene copolymers (commercially available under the name Hycar® CTBN from Nanoresins AG, Germany) and epoxides or aminoalcohols;
  • Polyester polyols prepared, for example, from di- to trihydric
  • Alcohols such as 1, 2-ethanediol, diethylene glycol, 1, 2-propanediol, dipropylene glycol, 1, 4-butanediol, 1, 5-pentanediol, 1, 6-hexanediol, neopentyl glycol, glycerol, 1, 1, 1-T ⁇ methylolpropan or mixtures of the aforementioned
  • Alcohols with organic dicarboxylic acids or their anhydrides or esters such as succinic acid, glutaric acid, adipic acid, suberic acid,
  • Sebacic acid dodecanedicarboxylic acid, maleic acid, fumaric acid, phthalic acid, isophthalic acid, terephthalic acid and hexahydrophthalic acid or
  • Polycarbonate polyols as obtainable by reacting, for example, the abovementioned alcohols used to form the polyester polyols with dialkyl carbonates, diaryl carbonates or phosgene.
  • the polymers Q PM di- or higher functional polyols having OH equivalent weights of 300 to 6'00O g / OH equivalent, in particular from 600 to 4000 g / OH equivalent, preferably 700 - 2200 g / OH equivalent.
  • the polyols selected from the group consisting of polyethylene glycols, polypropylene glycols, polyethylene glycol-polypropylene glycol block copolymers, polybutylene glycols, hydroxyl-terminated polybutadienes, hydroxyl-terminated butadiene / acrylonitrile Copolymers, hydroxyl-terminated synthetic rubbers, their hydrogenation products and mixtures of said polyols.
  • polymers Q PM it is also possible to use di- or higher-functional amino-terminated polyethylene ethers, polypropylene ethers, for example those marketed under the name Jeffamine® by Huntsman,
  • polymers are Q PM in particular
  • polymers Q PM can also be chain-extended, as can be carried out in a manner known to the person skilled in the art by the reaction of polyamines, polyols and polyisocyanates, in particular of diamines, diols and diisocyanates.
  • the radicals Y 1 and Y 2 represent a divalent organic radical and the indices u and v vary from 1 to typically 5, depending on the stoichiometric ratio.
  • the indices x and y vary from 1 to typically 5, depending on the stoichiometric ratio, and are in particular 1 or 2.
  • the species of the formula (VI) can also be reacted with the species of the formula (VII) to form a chain-extended polyurethane prepolymer PU1 having NCO groups.
  • diols and / or diamines and diisocyanates are preferred.
  • higher-functionality polyols such as trimethylolpropane or pentaerythritol
  • polyisocyanates such as isocyanurates of diisocyanates
  • the prepolymers PU1 in general and in the case of the chain-extended polyurethane prepolymers in particular, it must advantageously be ensured that the prepolymers do not have too high viscosities, in particular if higher functional compounds are used for the chain extension, since this can be converted into the polymers of the formula (I ) or make the application of the composition difficult.
  • polymers Q PM are preferred polyols with molecular weights between 600 and 6000 Dalton selected from the group consisting of polyethylene glycols, polypropylene glycols, polyethylene glycol polypropylene glycol kol block polymers, polybutylene glycols, hydroxyl-terminated polybutadienes, hydroxyl-terminated butadiene-acrylonitrile copolymers and mixtures thereof.
  • Polymers Q PM particularly preferred are ⁇ , ⁇ -Dihydroxypoly- glycols with C2-C6-alkylene groups or having mixed C 2 -C 6 alkylene groups which are terminated with amino, thiol or, preferably, hydroxyl groups.
  • polyphenol Q PP are particularly suitable bis-, tris- and tetraphenols. These are understood to mean not only pure phenols, but optionally also substituted phenols. The type of substitution can be very diverse. In particular, this is understood to mean a substitution directly on the aromatic nucleus to which the phenolic OH group is bonded. Phenols are furthermore not only understood as mononuclear aromatics, but also as polynuclear or condensed aromatics or heteroaromatics which have the phenolic OH group directly on the aromatic or heteroaromatic compounds. Due to the nature and position of such a substituent, among other things, the reaction necessary for the formation of the polyurethane prepolymer PU1 with isocyanates is influenced.
  • Preferred diphenols and dicresols prepared by reacting phenols or cresols with di-isopropylidenbenzene have a chemical structural formula as shown below for cresol, for example:
  • the polyurethane prepolymer PU1 is prepared from at least one diisocyanate or triisocyanate and from a polymer Q PM with terminal amino, thiol or hydroxyl groups.
  • the preparation of the polyurethane prepolymer PU1 is carried out in a manner known to the polyurethane expert, in particular by using the diisocyanate or triisocyanate in a stoichiometric excess with respect to the amino, thiol or hydroxyl groups of the polymer Q PM .
  • the polyurethane prepolymer PU1 is prepared from at least one diisocyanate or triisocyanate and from an optionally substituted polyphenol Q PP .
  • the preparation of the polyurethane prepolymer PU1 is carried out in a manner known to the polyurethane expert, in particular by using the diisocyanate or triisocyanate in a stoichiometric excess with respect to the phenolic groups of the polyphenol Q PP .
  • the polyurethane prepolymer PU1 is prepared from at least one diisocyanate or triisocyanate and from a polymer Q PM with terminal amino, thiol or hydroxyl groups and from an optionally substituted polyphenol Q PP .
  • the polyurethane prepolymer PU1 from at least one diisocyanate or triisocyanate and from a polymer Q PM with terminal amino, thiol or hydroxyl groups and / or from an optionally substituted polyphenol Q PP different possibilities are available.
  • a mixture of at least one polyphenol Q PP and at least one polymer Q PM is reacted with at least one diisocyanate or triisocyanate in an excess of isocyanate.
  • At least one polyphenol Q PP is reacted with at least one diisocyanate or triisocyanate in an isocyanate excess and then with at least one polymer Q PM in excess.
  • At least one polymer Q PM is reacted with at least one diisocyanate or triisocyanate in an isocyanate excess and subsequently with at least one polyphenol Q PP in a deficit.
  • the polyurethane prepolymer PU1 preferably has an elastic character and displays a glass transition temperature Tg of less than 0 0 C.
  • the polyurethane prepolymer PU1 ', on which R 3 is based, can be prepared in an analogous manner, as described above for the polyurethane prepolymer PU1, from at least one diisocyanate or triisocyanate and from a polymer Q PM with terminal amino, thiol or hydroxyl groups and / or one, optionally substituted, polyphenol Q PP produce.
  • the thermosetting epoxy resin composition may further contain a thixotropic agent C based on a urea derivative.
  • the urea derivative is a reaction product of an aromatic monomeric diisocyanate with an aliphatic amine compound. It is also quite possible to react several different monomeric diisocyanates with one or more aliphatic amine compounds or a monomeric diisocyanate with several aliphatic amine compounds.
  • the reaction product of 4,4'-diphenylmethylene diisocyanate (MDI) with butylamine has proved to be particularly advantageous.
  • the urea derivative is preferably present in a carrier material.
  • the carrier material may be a plasticizer, in particular a phthalate or an adipate, preferably a diisodecyl phthalate (DIDP) or dioctyl adipate (DOA).
  • the carrier may also be a non-diffusing carrier. This is preferred to ensure as little as possible migration after curing of unregulated components.
  • Preferred non-diffusing carriers are blocked polyurethane prepolymers. The preparation of such preferred urea derivatives and support materials are described in detail in the patent application EP 1 152 019 A1.
  • the support material is advantageously a blocked polyurethane polymer PU2, in particular obtained by reacting a trifunctional polyether polyol with IPDI and subsequent blocking of the terminal isocyanate groups with ⁇ -caprolactam.
  • % By weight, preferably 5 to 25% by weight, based on the weight of the total composition.
  • the ratio of the weight of the urea derivative to the weight of the carrier possibly present is preferably from 2:98 to 50:50, in particular from 5:95 to 25:75.
  • thermosetting epoxy resin composition preferably further contains a liquid rubber D, which is preferably a carboxyl- or epoxy-terminated polymer.
  • this liquid rubber D is a carboxyl- or epoxide-terminated acrylonitrile / butadiene copolymer or a derivative thereof.
  • Such liquid rubbers are commercially available, for example, under the name Hycar® CTBN and CTBNX and ETBN from Nanoresins AG, Germany.
  • Particularly suitable derivatives are elastomer-modified prepolymers having epoxide groups, such as those described under the product line Polydis®, preferably from the product line Polydis® 36 .., from the company Struktol® (Schill + Seilacher Group, Germany) or under the product line Albipox ( Nanoresins, Germany) are sold commercially.
  • this liquid rubber D is a polyacrylate liquid rubber which is completely miscible with liquid epoxy resins and only separates into microdroplets on curing of the epoxy resin matrix.
  • polyacrylate liquid rubbers are available, for example, under the designation 20208-XPA from Rohm and Haas.
  • liquid rubbers can also be used, in particular mixtures of carboxyl or epoxide terminated acrylonitrile / butadiene copolymers or derivatives thereof.
  • the liquid rubber D is advantageously used in an amount of 1 to 35% by weight, in particular 1 to 25% by weight, based on the weight of the composition.
  • the heat-curing epoxy resin composition preferably also contains a solid toughener E.
  • a "toughener” here and below is understood to mean an addition to an epoxy resin matrix which is already at low additions of 0.1-15% by weight, in particular 0.5-8% by weight This results in a significant increase in toughness and is thus able to absorb higher bending, tensile, impact or impact stress before the matrix breaks or breaks in.
  • the solid toughener E in a first embodiment is an organic ionic surfactant. exchanged layered mineral E1.
  • the ion-exchanged layered mineral E1 may be either a cation-exchanged layered mineral E1c or an anion-exchanged layered mineral Ela.
  • the cation-exchanged layered mineral E1c is obtained here from a layered mineral ET in which at least part of the cations have been replaced by organic cations.
  • a layered mineral ET in which at least part of the cations have been replaced by organic cations.
  • Examples of such cation-exchanged layered minerals E1c are in particular those mentioned in US 5,707,439 or in US 6,197,849.
  • the process for producing these cation-exchanged layer minerals E1c is described there.
  • Preferred as a layer mineral ET is a layered silicate.
  • the layer mineral ET is particularly preferably a phyllosilicate, as described in US Pat. No. 6,197,849, column 2, line 38 to column 3, line 5, in particular a bentonite.
  • Layer minerals ET such as kaolinite or a montmorillonite or a hectorite or an illite have proven to be particularly suitable. At least some of the cations of the layered mineral EV are replaced by organic cations. Examples of such cations are n-octyl ammonium, trimethyldodecyl ammonium, dimethyl dodecyl ammonium or bis (hydroxyethyl) octadecyl ammonium or similar derivatives of amines which can be obtained from natural fats and oils; or guanidinium cations or amidinium cations; or cations of the N-substituted derivatives of pyrrolidine, piperidine, piperazine, morpholine, thiomorpholine; or cations of 1,4-diazobicyclo [2.2.2] octane (DABCO) and 1-azobicyclo [2.2.2] octane; or cations of N-
  • Cyclic ammonium compounds are characterized by increased thermal stability compared to linear ammonium compounds, as the thermal Hoffmann degradation can not occur in them.
  • Preferred cation-exchanged layered minerals E1c are known to the person skilled in the art under the term Organoclay or Nanoclay and are commercially available, for example, under the group names Tixogel® or Nanofil® (Southern Chemistry), Cloisite® (Southern Clay Products) or Nanomer® (Nanocor Inc.).
  • the anion-exchanged layered mineral E1a is in this case obtained from a layered mineral E1 "in which at least some of the anions have been exchanged for organic anions
  • An example of such an anion-exchanged layered mineral E1a is a hydrotalcite E1", in which at least one part the carbonate anions of the intermediate layers have been replaced by organic anions.
  • Another example is functionalized alumoxanes such. As described in US Pat. No. 6,328,890. It is quite possible that the composition simultaneously contains a cation-exchanged layered mineral E1c and an anion-exchanged layered mineral E1a.
  • the solid toughener in a second embodiment, is a block copolymer E2.
  • the block copolymer E2 is obtained from an anionic or controlled free-radical polymerization of methacrylic acid ester with at least one further monomer having an olefinic double bond.
  • Preferred monomers having an olefinic double bond are those in which the double bond is conjugated directly with a heteroatom or with at least one further double bond.
  • monomers are suitable which are selected from the group comprising styrene, butadiene, acrylonitrile and vinyl acetate.
  • ASA acrylate-styrene-acrylic acid
  • block copolymers E2 are block copolymers of methyl methacrylate, styrene and butadiene. Such block copolymers are available, for example, as triblock copolymers under the group name SBM from Arkema.
  • the solid toughener E in a third embodiment is a core-shell polymer E3.
  • Core-shell polymers consist of an elastic core polymer and a rigid shell polymer.
  • Particularly suitable core-shell polymers consist of a core (core) of elastic acrylate or butadiene polymer which wraps around a rigid shell of a rigid thermoplastic polymer.
  • This core-shell structure is formed either spontaneously by demixing a block copolymer or is predetermined by the polymerization as latex or suspension polymerization with subsequent grafting.
  • Preferred core-shell polymers are so-called MBS polymers, which are commercially available under the trade names Clearstrength TM from Atofina, Paraloid TM from Rohm and Haas or F-351 TM from Zeon.
  • core-shell polymer particles which are already present as a dried polymer latex.
  • core-shell polymer particles which are already present as a dried polymer latex.
  • examples of these are GENIOPERL M23A from Wacker with polysiloxane core and acrylate shell, radiation-crosslinked rubber particles of the NEP series, manufactured by Eliokem or Nanoprene from Lanxess or Paraloid EXL from Rohm and Haas.
  • Further comparable examples of core-shell polymers are offered under the name Albidur TM by Nanoresins AG, Germany.
  • the solid toughener E in a fourth embodiment is a solid reaction product E4 of a carboxylated solid nitrile rubber with excess epoxy resin.
  • thermosetting epoxy resin composition may contain the solid core-shell polymer E3, in particular in an amount of 0.1-15% by weight, preferably 1-8% by weight, based on the weight of the composition.
  • the composition additionally contains at least one filler F.
  • filler F are preferably mica, talc, kaolin, wollastonite, feldspar, Syenith,
  • Chlorite Chlorite, bentonite, montmorillonite, calcium carbonate (precipitated or ground),
  • Filler F is meant to mean both the organic coated and the uncoated commercially available and known to those skilled forms.
  • the total content of the total filler F is 3 to 50% by weight, preferably 5 to 35% by weight, in particular 5 to 25% by weight, based on the weight of the total composition.
  • the composition contains a physical or chemical blowing agent, such as that available under the tradename Expancel TM from Akzo Nobel or Celogen TM from Chemtura.
  • the proportion of blowing agent is advantageously 0.1 to 3 wt .-%, based on the weight of the composition.
  • the composition additionally contains at least one epoxy group-carrying reactive diluent G.
  • reactive diluents G are in particular: glycidyl ethers of monofunctional saturated or unsaturated, branched or unbranched, cyclic or open-chain C 4 -C 30 alcohols, eg Butanol glycidyl ethers, hexanol glycidyl ethers, 2-ethyl hexanol glycidyl ethers, allyl glycidyl ethers, tetrahydrofurfuryl and furfuryl glycidyl ethers, trimethoxysilyl glycidyl ethers, etc.
  • glycidyl ethers of monofunctional saturated or unsaturated, branched or unbranched, cyclic or open-chain C 4 -C 30 alcohols eg Butanol glycidyl ethers, hexanol glycidyl ethers, 2-ethyl hexanol g
  • glycidyl ethers of difunctional saturated or unsaturated, branched or unbranched, cyclic or open-chain C 2 -C 30 -alcohols, for example ethylene glycol, butanediol, hexanediol -, Oktandiolgylcidyl- ether, Cyclohexandimethanoldigylcidylether, Neopentylglycoldiglycidyl- ether etc.
  • Glycidyl ethers of tri- or polyfunctional, saturated or unsaturated, branched or unbranched, cyclic or open-chain Akoholen such as epoxidized castor oil, epoxidized trimethylolpropane, epoxidized pentaerythrol or polyglycidyl ethers of aliphatic polyols such as sorbitol, glycerol, trimethylolpropane, etc.
  • - glycidyl ethers of phenolic and aniline compounds such as phenylglycidyl ether, cresylglycidyl ether, p-tert-butylphenylglycidyl ether, nonylphenol glycidyl ether, 3-n Pentadecenyl glycidyl ether (from cashew nut shell oil), N, N-diglycidylaniline, etc.
  • Epoxidized amines such as N, N-diglycidylcyclohexylamine etc.
  • Epoxidized monocarboxylic or dicarboxylic acids such as neodecanoic acid glycidyl ester, glycidyl methacrylate, glycidyl benzoate, diglycidyl phthalate, tetra- and hexahydrophthalate, diglycidyl esters of dimer fatty acids etc.
  • Epoxidized di- or trifunctional, low to high molecular weight polyether polyols such as polyethylene glycol diglycidyl ether, polypropylene glycol diglycidyl ether, etc. Particularly preferred are hexanediol diglycidyl ether, cresyl glycidyl ether, p-tert-butylphenyl glycidyl ether, polypropylene glycol diglycidyl ether and polyethylene glycol diglycidyl ether.
  • Reactive diluent G 0.5 - 20% by weight, preferably 1 - 8% by weight, based on the weight of the total composition.
  • composition may comprise other ingredients, especially catalysts, heat and / or light stabilizers, thixotropic agents, plasticizers, solvents, mineral or organic fillers, blowing agents, dyes and pigments.
  • thermosetting epoxy resin compositions are particularly suitable as one-component adhesives.
  • the invention relates to a use of the above-described thermosetting epoxy resin composition as a one-component thermosetting adhesive.
  • a one-component adhesive has a wide range of uses.
  • thermosetting one-component adhesives are feasible, which are characterized by a high impact strength, both at higher temperatures and especially at low temperatures, in particular between 0 0 C to -40 0 C.
  • Such adhesives are needed for bonding heat stable materials.
  • Heat-resistant materials are materials which at a curing temperature from 100 to 220 0 C, preferably 120-200 0 C are dimensionally stable at least during the curing time.
  • these are metals and plastics such as ABS, polyamide, polyphenylene ethers, composite materials such as SMC, unsaturated polyester GRP, epoxy or acrylate composites.
  • Preferred is the application in which at least one material is a metal.
  • Particularly preferred use is the bonding of the same or different metals, especially in the shell in the automotive industry.
  • the preferred metals are above all steel, in particular electrolytically galvanized, hot-dip galvanized, oiled steel, Bonazink coated steel, and subsequently phosphated steel, and aluminum in particular in the variants typically occurring in the car industry.
  • the composition has high mechanical values.
  • glass transition temperatures of over 85 ° C, in particular of 100 0 C or higher, can be achieved, which is particularly important for applications with high operating temperatures.
  • Another aspect of the invention thus relates to a method for bonding heat-stable materials, in which these materials are contacted with an above-described epoxy resin composition and comprises one or more steps of curing at a temperature of 100-220 0 C, preferably 120-200 0 C. includes.
  • Such an adhesive is in particular first contacted with the materials to be bonded at a temperature of between 10 ° C and 80 0 C, in particular between 10 ° C and 60 ° C, and later cured at a temperature of typically 100 - 220 0 C, preferably 120-200 ° C.
  • Such an article is preferably a vehicle or an attachment of a vehicle.
  • sealing compounds or coatings can be realized with a composition according to the invention in addition to heat-curing adhesives.
  • novel compositions are not only suitable for the automotive industry but also for other applications. Particularly noteworthy are related applications in transport engineering such as ships, trucks, buses or rail vehicles or in the construction of consumer goods such as washing machines.
  • the bonded by means of a novel composition materials are typically at temperatures between 120 0 C and -40 0 C, preferably between 100 ° C and -40 0 C, in particular between 80 ° C and -40 ° C for use.
  • compositions which typically have fracture energies measured according to ISO 11343, of more than 15.0 J at 23 ° C and more than 7.0 J at -30 0 C. It can be sometimes formulate compositions which have fracture energies of more than 18.0 J at 23 ° C and of more than 11.0 J at -30 0 C. Particularly advantageous compositions have even fracture energies of more than 18.0 J at 23 ° C and more than 12.0 J at -30 ° C.
  • thermosetting epoxy resin composition is the application as a thermosetting structural adhesive in vehicle construction.
  • Exemplary preparation of a monohydroxyl-containing epoxide MHE trimethylolpropane glycidyl ether was prepared according to the process in US Pat. No. 5,668,227, Example 1, from trimethylolpropane and epichlorohydrin using tetramethylammonium chloride and sodium hydroxide solution.
  • a yellowish product having an epoxide number of 7.5 eq / kg and a hydroxyl group content of 1.8 eq / kg is obtained. It can be concluded from the HPLC-MS spectrum that essentially a mixture of trimethylolpropane diglycidyl ether and trimethylolpropane triglycidyl ether is present. This product was used as MHE.
  • BlockPreo2 150 g polyTHF 2000 (OH number 57 mg / g KOH) and 150 Liquiflex H
  • Table 2 shows the reference compositions Ref. 1-Ref. 4 and the compositions 1, 2 and 3 according to the invention.
  • the reference examples contain in each case only the epoxide group-terminated polyurethane prepolymer, or only the terminally blocked polyurethane prepolymer, while in Examples 1, 2 and 3 a mixture thereof is used.
  • the amount of dicyandiamide was adjusted in each case to the epoxide group concentration.
  • test specimens were produced from the described compositions and with electrolytically galvanized DC04 steel (eloZn) with the dimensions 100 ⁇ 25 ⁇ 1.5 mm, the bond area being 25 ⁇ 10 mm and a layer thickness of 0.3 mm. Hardened for 30 min. At 175 ° C. The pulling speed was 10mm / min.
  • electrolytically galvanized DC04 steel eloZn
  • the tensile strength was determined according to DIN EN ISO 527.
  • test specimens were made of the described compositions and with electrolytically galvanized DC04 steel (eloZn) with the dimensions 90 ⁇ 20 ⁇
  • the impact velocity was 2 m / s.
  • the fracture energy (BE) in joules is the area under the measurement curve (from 25% to 90%, according to ISO 11343).
  • the glass transition temperature was determined by DSC. A device Mettler DSC822 6 was used for this purpose. 20-30 mg adhesive samples were each weighed into an aluminum crucible. After the sample in
  • DSC was cured for 30 min. At 175 ° C, the sample was cooled to -20 0 C and then with a heating rate of 20 ° C / min to Heated to 150 ° C. The glass transition temperature was determined from the measured DSC curve using the DSC software.
  • Examples 1, 2 and 3 have good mechanics but in particular higher fracture energies compared to the corresponding comparative examples.

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Polyurethanes Or Polyureas (AREA)
  • Epoxy Resins (AREA)

Abstract

L'invention concerne des compositions de résine époxy thermodurcissables contenant au moins une résine époxy (A) présentant en moyenne plus d'un groupe époxy par molécule, au moins un durcisseur de résines époxy (B) activé par augmentation de la température, au moins un prépolymère de polyuréthanne bloqué de façon terminale, représenté par la formule (I), et au moins un prépolymère de polyuréthanne à terminaison époxy, représenté par la formule (II). Ces compositions de résine époxy servent notamment d'adhésifs thermodurcissables à un constituant et se caractérisent par des indices mécaniques élevés, des températures de transition vitreuse élevées et des résiliences élevées.
EP07821780A 2006-10-24 2007-10-24 Composition de résine époxy thermodurcissable contenant un prépolymère de polyuréthanne bloqué et un prépolymère de polyuréthanne à terminaison époxy Withdrawn EP2084204A1 (fr)

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EP07821780A EP2084204A1 (fr) 2006-10-24 2007-10-24 Composition de résine époxy thermodurcissable contenant un prépolymère de polyuréthanne bloqué et un prépolymère de polyuréthanne à terminaison époxy

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EP20060122864 EP1916272A1 (fr) 2006-10-24 2006-10-24 Compositions d'epoxy contenant des prépolymères de polyuréthane blocqués et terminés par époxy.
PCT/EP2007/061417 WO2008049858A1 (fr) 2006-10-24 2007-10-24 Composition de résine époxy thermodurcissable contenant un prépolymère de polyuréthanne bloqué et un prépolymère de polyuréthanne à terminaison époxy
EP07821780A EP2084204A1 (fr) 2006-10-24 2007-10-24 Composition de résine époxy thermodurcissable contenant un prépolymère de polyuréthanne bloqué et un prépolymère de polyuréthanne à terminaison époxy

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EP2084204A1 true EP2084204A1 (fr) 2009-08-05

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EP07821780A Withdrawn EP2084204A1 (fr) 2006-10-24 2007-10-24 Composition de résine époxy thermodurcissable contenant un prépolymère de polyuréthanne bloqué et un prépolymère de polyuréthanne à terminaison époxy

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Families Citing this family (67)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1431325A1 (fr) * 2002-12-17 2004-06-23 Sika Technology AG Composition de résine époxy durcissable à la chaleur ayant une résistance au choc à basse température
EP1498441A1 (fr) * 2003-07-16 2005-01-19 Sika Technology AG Compositions réticulables à la chaleur comprenant un modificateur de résistance au choc à basse température
EP1741734A1 (fr) * 2005-07-05 2007-01-10 Sika Technology AG Composition réticulable à la chaleur et résistant au choc à basse température comprenant des résines époxydes solides
EP1876194A1 (fr) * 2006-06-30 2008-01-09 Sika Technology AG Composition thermodurcissable adaptée au collage de substrats revêtus
EP1916270A1 (fr) * 2006-10-24 2008-04-30 Sika Technology AG Compositions d'epoxy thermodurcissables contenant des prépolymères de polyuréthane blocqués
DE502008001517D1 (de) * 2008-01-30 2010-11-25 Sika Technology Ag Auswaschbeständige hitzehärtende Epoxidharzklebstoffe
EP2128182A1 (fr) 2008-05-28 2009-12-02 Sika Technology AG Composition en réside d'époxy durcissant à la chaleur et contenant un accélérateur doté d'atomes hétéroclites
EP2143745B1 (fr) * 2008-07-09 2010-04-21 Sika Technology AG Polymères avec fonctions hybride
DE502008000478D1 (de) 2008-07-17 2010-05-06 Sika Technology Ag Haftvermittlerverbindungen für beölten Stahl
EP2145924A1 (fr) 2008-07-18 2010-01-20 Sika Technology AG Produits de réaction à base de copolymères bloc amphiphiles et leur utilisation en tant que modificateur de la résistance à l'impact
ATE468344T1 (de) 2008-08-27 2010-06-15 Sika Technology Ag Silan-/harnstoff-verbindung als hitzeaktivierbarer härter für epoxidharzzusammensetzungen
EP2182025B1 (fr) 2008-10-31 2010-10-06 Sika Technology AG Composition de résine époxy durcissant à la chaleur appropriée comme adhésive de carrosserie
CN101875715B (zh) * 2009-04-30 2012-12-12 比亚迪股份有限公司 一种环氧改性的聚氨酯和紫外光固化涂料及其制备方法
WO2011056357A1 (fr) 2009-11-05 2011-05-12 Dow Global Technologies Llc Adhésifs de résine époxy structuraux contenant des durcisseurs élastomères coiffés avec des cétoximes
EP2436712A1 (fr) 2010-10-01 2012-04-04 Sika Technology AG Modificateurs de la résilience pour compositions de résine époxyde
US10023774B2 (en) * 2010-10-01 2018-07-17 Council Of Scientific & Industrial Research Adhesive composition and uses thereof
EP2468834A1 (fr) 2010-12-23 2012-06-27 Sika Technology AG Compositions de matériau d'étanchéité durcissant à la chaleur dotée d'une formation de peau rapide et d'une résistance à la traction élevée
EP2468785A1 (fr) 2010-12-23 2012-06-27 Sika Technology AG Compositions de matériau d'étanchéité durcissant à la chaleur dotées d'une formation de peau rapide et d'une bonne stabilité de stockage
EP2655516B1 (fr) 2010-12-26 2018-12-26 Dow Global Technologies LLC Colles d'assemblage à base de résine époxy, contenant des durcisseurs élastomères à chaînes allongées et coiffés par des composés de phénol, de polyphénol ou d'aminophénol
WO2013142751A2 (fr) 2012-03-23 2013-09-26 Dow Global Technologies Llc Adhésifs structuraux ignifuges à base de résine époxyde et procédé pour le collage d'éléments métalliques
CN104144959B (zh) 2012-03-23 2018-03-09 陶氏环球技术有限责任公司 应力耐久性提高的耐碰撞粘合剂
EP2730594A1 (fr) * 2012-11-12 2014-05-14 Sika Technology AG Caoutchoucs liquides réactifs en prépolymères isocyanate-terminés bloqués avec collecteur de glycol
JP2015537081A (ja) * 2012-11-12 2015-12-24 ジーカ テクノロジー アクチェンゲゼルシャフト エポキシ系接着剤用の新規衝撃改質剤
WO2014119533A1 (fr) * 2013-01-31 2014-08-07 ナガセケムテックス株式会社 Résine époxy, son procédé de production, composition de résine époxy, et article durci
EP2956680B1 (fr) 2013-02-15 2020-04-08 Sika Technology AG Procédé et dispositif de fabrication d'un élément structurel renforcé
US9255173B2 (en) 2013-03-15 2016-02-09 Lake Region Manufacturing, Inc. Oxirane (ethylene oxide) polyurethane coatings
US9714361B2 (en) 2013-03-15 2017-07-25 Lake Region Manfacturing, Inc. Oxirane (ethylene oxide) polyurethane coatings
EP3074474B1 (fr) 2013-11-27 2019-12-25 Dow Global Technologies LLC Composition de revêtement de polyuréthane durcissable et son procédé de préparation
EP3137538A1 (fr) 2014-05-01 2017-03-08 Dow Global Technologies LLC Procédé de fabrication et de séchage de préimprégnés
EP3152251B1 (fr) 2014-06-09 2018-05-02 Dow Global Technologies LLC Procédé de fabrication de pré-imprégné renforcé par des fibres, multicouche, durcissable
BR112017000219A2 (pt) 2014-07-08 2018-01-16 Dow Global Technologies Llc adesivo durável à falha de alta tg de cura retardada
CN106715505B (zh) * 2014-10-13 2020-03-27 陶氏环球技术有限责任公司 含有基于丙烯酸酯的增韧剂的环氧组合物
EP3009461A1 (fr) * 2014-10-13 2016-04-20 Sika Technology AG Pré-polymère de polyester en tant qu'améliorateur de la résilience dans des formules époxy
CN105017725A (zh) * 2015-07-06 2015-11-04 苏州久美玻璃钢股份有限公司 船舶用玻璃钢管道连接件法兰的成型方法
CN107922570B (zh) 2015-09-10 2021-11-30 陶氏环球技术有限责任公司 用于环氧树脂胶粘剂的封端型聚氨基甲酸酯增韧剂
KR102626998B1 (ko) 2015-09-10 2024-01-19 다우 글로벌 테크놀로지스 엘엘씨 높은 종횡비의 충전제를 갖는 높은 모듈러스의 강인화된 1성분 에폭시 구조용 접착제
EP3347398B1 (fr) 2015-09-10 2024-07-31 DDP Specialty Electronic Materials US, LLC Adhésifs époxy renforcés à un composant présentant une adhérence améliorée aux surfaces huileuses et une résistance élevée au lavage
DE102015012172A1 (de) * 2015-09-23 2017-03-23 Universität Kassel Thermisch aktivierbare, schnellhärtende Klebstoffbeschichtung
EP3170860B1 (fr) 2015-11-19 2020-07-29 3M Innovative Properties Company Adhésif structurel présentant une résistance améliorée à la corrosion
WO2017127253A1 (fr) 2016-01-19 2017-07-27 Dow Global Technologies Llc Adhésifs monocomposants à base de polyuréthane et/ou de polyurée modifiés par époxy présentant un allongement élevé et une excellente stabilité thermique, et procédés d'assemblage les utilisant
US10767040B2 (en) 2016-06-20 2020-09-08 Sika Technology Ag Thermosetting epoxy resin compositions useful as structural reinforcement or structural foam
BR112019008052B1 (pt) 2016-10-24 2023-10-31 Dow Global Technologies Llc Adesivo de epóxi termocurável de componente único e método para formar uma ligação adesiva entre dois substratos
EP3585854B1 (fr) 2017-02-26 2021-10-13 Dow Global Technologies, LLC Adhésifs époxy à un seul composant durcis contenant un mélange d'agents durcisseurs latents
CN107200996B (zh) * 2017-05-03 2019-10-22 湖南金戈新材料有限责任公司 一种改性环氧树脂材料及其制备方法
WO2018226288A1 (fr) 2017-06-07 2018-12-13 Dow Global Technologies Llc Composé de moulage ayant des filaments orientés de manière aléatoire et méthodes de fabrication et d'utilisation de celui-ci
EP3668936B1 (fr) 2017-08-15 2024-07-17 DDP Specialty Electronic Materials US, LLC Adhésifs époxy résistants durcissables à température ambiante à deux composants
WO2019055129A1 (fr) 2017-09-12 2019-03-21 Dow Global Technologies Llc Formulation pour adhésif
EP3681966A1 (fr) 2017-09-12 2020-07-22 DDP Specialty Electronic Materials US, Inc. Adhésifs époxy renforcés à un constituant
BR112020012572B1 (pt) 2017-12-19 2024-01-16 Sika Technology Ag Método de ligação adesiva de substratos estáveis ao calor
CN111491972B (zh) * 2017-12-19 2022-06-28 Sika技术股份公司 增韧剂用于增大单组分热固化环氧树脂组合物的最大线性膨胀的用途
JP7411577B2 (ja) 2018-05-29 2024-01-11 ディディピー スペシャルティ エレクトロニック マテリアルズ ユーエス，エルエルシー 一液型エポキシ接着剤混合物を使用する接合方法
EP3802678A1 (fr) 2018-06-05 2021-04-14 Dow Global Technologies, LLC Procédé de recyclage de composites époxy-fibres en polyoléfines
EP3611202A1 (fr) * 2018-08-13 2020-02-19 Sika Technology Ag Compositions de résine époxy thermodurcissables à un constituant
EP3844202B1 (fr) 2018-08-31 2024-06-19 Dow Global Technologies, LLC Formulation composite à base d'époxyde
WO2020121124A1 (fr) * 2018-12-13 2020-06-18 3M Innovative Properties Company Matériau polymère comprenant un matériau contenant de l'uretdione et un composant époxy, compositions à deux composants et procédés
KR102874303B1 (ko) 2019-02-15 2025-10-22 다우 글로벌 테크놀로지스 엘엘씨 에폭시 조성물
US20220204820A1 (en) 2019-05-21 2022-06-30 Ddp Specialty Electronic Materials Us, Llc Epoxy adhesive composition and method of use
CN113966356B (zh) * 2019-06-14 2023-10-13 Sika技术股份公司 增韧的双组分环氧组合物
CN114008162A (zh) 2019-06-18 2022-02-01 Ddp特种电子材料美国有限责任公司 具有改进的耐湿性的单组分增韧环氧胶粘剂
WO2021061263A1 (fr) * 2019-09-23 2021-04-01 Ppg Industries Ohio, Inc. Compositions durcissables
CN111574951B (zh) * 2020-06-11 2021-04-13 北京高盟新材料股份有限公司 一种自结皮改性聚氨酯热固化密封剂组合物及其制备方法
US20230365845A1 (en) 2020-10-26 2023-11-16 Ddp Specialty Electronic Materials Us, Llc One-component structural adhesive
US20240376353A1 (en) 2021-08-30 2024-11-14 Ddp Specialty Electronic Materials Us, Llc Two-component structural adhesive
US20260002060A1 (en) 2022-03-22 2026-01-01 Ddp Specialty Electronic Materials Us, Llc Two-component thermally-conductive structural adhesive
EP4506389A4 (fr) * 2022-04-08 2026-04-01 Adeka Corp Composition de résine durcissable
JP2025538336A (ja) * 2022-11-29 2025-11-28 シーカ テクノロジー アクチェンゲゼルシャフト 湿気及び熱硬化性シーリング組成物
CN119019972B (zh) * 2024-08-13 2025-07-01 青岛朗道轮履技术有限公司 粘结物及其制备方法和应用

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0684419B2 (ja) * 1986-02-21 1994-10-26 旭電化工業株式会社 硬化性樹脂組成物
US5278257A (en) * 1987-08-26 1994-01-11 Ciba-Geigy Corporation Phenol-terminated polyurethane or polyurea(urethane) with epoxy resin
EP0338985B1 (fr) 1988-04-18 1994-05-18 Ciba-Geigy Ag Résines époxy modifiées
JP2675822B2 (ja) * 1988-08-05 1997-11-12 横浜ゴム株式会社 一液系可撓性エポキシ樹脂組成物
JPH05163474A (ja) * 1991-12-16 1993-06-29 Yokohama Rubber Co Ltd:The 構造用接着剤に適したエポキシ樹脂組成物
TW289763B (fr) 1992-11-11 1996-11-01 Ciba Geigy Ag
US5530052A (en) 1995-04-03 1996-06-25 General Electric Company Layered minerals and compositions comprising the same
DE69907162T2 (de) 1998-02-20 2004-02-19 Vantico Ag Organophile phyllosilikate
US6322890B1 (en) 1998-03-30 2001-11-27 Wm. Marsh Rice University Supra-molecular alkylalumoxanes
AU7722300A (en) * 1999-09-27 2001-04-30 Georgia Tech Research Corporation Electrically conductive adhesive containing epoxide-modified polyurethane
EP1152019A1 (fr) 2000-05-02 2001-11-07 Sika AG, vorm. Kaspar Winkler & Co. Agents thixotropes
EP1359202A1 (fr) * 2002-05-03 2003-11-05 Sika Schweiz AG Composition de résine époxy réticulable par application de chaleur
EP1431325A1 (fr) 2002-12-17 2004-06-23 Sika Technology AG Composition de résine époxy durcissable à la chaleur ayant une résistance au choc à basse température
CA2529737C (fr) 2003-07-07 2013-05-07 Dow Global Technologies Inc. Composition de colle epoxyde et son procede d'application
EP1498441A1 (fr) * 2003-07-16 2005-01-19 Sika Technology AG Compositions réticulables à la chaleur comprenant un modificateur de résistance au choc à basse température
ATE352576T1 (de) * 2004-03-12 2007-02-15 Dow Global Technologies Inc Epoxidharz klebstoffzusammensetzung

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
None *
See also references of WO2008049858A1 *

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US20090288766A1 (en) 2009-11-26
JP5096475B2 (ja) 2012-12-12
WO2008049858A1 (fr) 2008-05-02
US8071217B2 (en) 2011-12-06
CN101528802A (zh) 2009-09-09
CN101528802B (zh) 2012-09-26
EP1916272A1 (fr) 2008-04-30
JP2010507707A (ja) 2010-03-11

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