EP2089464A1 - Colle thermofusible pour chauffage par micro-ondes - Google Patents

Colle thermofusible pour chauffage par micro-ondes

Info

Publication number
EP2089464A1
EP2089464A1 EP07820583A EP07820583A EP2089464A1 EP 2089464 A1 EP2089464 A1 EP 2089464A1 EP 07820583 A EP07820583 A EP 07820583A EP 07820583 A EP07820583 A EP 07820583A EP 2089464 A1 EP2089464 A1 EP 2089464A1
Authority
EP
European Patent Office
Prior art keywords
hot melt
melt adhesive
adhesive
heating
microwave radiation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP07820583A
Other languages
German (de)
English (en)
Inventor
Marcel Roth
Petra Padurschel
Erik Niehaus
Gunter Hoffmann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Henkel AG and Co KGaA
Original Assignee
Henkel AG and Co KGaA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Henkel AG and Co KGaA filed Critical Henkel AG and Co KGaA
Publication of EP2089464A1 publication Critical patent/EP2089464A1/fr
Withdrawn legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/05—Alcohols; Metal alcoholates
    • C08K5/053—Polyhydroxylic alcohols
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
    • C09J123/04—Homopolymers or copolymers of ethene
    • C09J123/08—Copolymers of ethene
    • C09J123/0846—Copolymers of ethene with unsaturated hydrocarbons containing other atoms than carbon or hydrogen atoms
    • C09J123/0853—Vinylacetate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/04—Homopolymers or copolymers of ethene
    • C08L23/08—Copolymers of ethene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/04—Macromolecular compounds according to groups C08L7/00 - C08L49/00, or C08L55/00 - C08L57/00; Derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L29/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal or ketal radical; Compositions of hydrolysed polymers of esters of unsaturated alcohols with saturated carboxylic acids; Compositions of derivatives of such polymers
    • C08L29/02—Homopolymers or copolymers of unsaturated alcohols
    • C08L29/04—Polyvinyl alcohol; Partially hydrolysed homopolymers or copolymers of esters of unsaturated alcohols with saturated carboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/50—Additional features of adhesives in the form of films or foils characterized by process specific features
    • C09J2301/502—Additional features of adhesives in the form of films or foils characterized by process specific features process for debonding adherents
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
    • Y10T428/31645—Next to addition polymer from unsaturated monomers
    • Y10T428/31649—Ester, halide or nitrile of addition polymer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31855—Of addition polymer from unsaturated monomers
    • Y10T428/3188—Next to cellulosic
    • Y10T428/31895—Paper or wood
    • Y10T428/31906—Ester, halide or nitrile of addition polymer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31855—Of addition polymer from unsaturated monomers
    • Y10T428/31935—Ester, halide or nitrile of addition polymer

Definitions

  • the invention relates to a non-crosslinking hot melt adhesive which heats when irradiated with microwaves and loses its adhesive properties. Furthermore, the invention relates to a method for bonding packaging with non-reactive hot melt adhesives, wherein the bond can be solved by heating with microwaves again.
  • Non-reactive hot melt adhesives are known.
  • EP 1124911 describes hot melt adhesives which are produced on the basis of poly- ⁇ -olefins. These are described in particular for the application of the hot melt adhesive by spraying.
  • EP 388712 describes hot melt adhesives based on ethylene-acrylic acid-acrylic ester copolymers. These copolymers are used for bonding solid substrates.
  • EP 890584 describes hot melt adhesives based on polyolefins prepared by a metallocene-catalyzed synthesis. Such hot melt adhesives are characterized by a particularly narrow molecular weight distribution and by a narrow melting range.
  • EP 498998 describes a process for heating polymer material, the polymer material containing dispersed ferromagnetic particles. These mixtures can be heated by microwave irradiation so that the melting temperature of the polymer material is exceeded.
  • fusible or crosslinkable polymers are described which contain finely divided powder of substances which form dipoles and are sensitive to microwave radiation. The compositions are not specified further.
  • DE 19924138 is known in which hot melt adhesive compositions are described which contain nanoscale ferromagnetic particles. It is described that such adhesive bonds can be heated by the action of electromagnetic radiation, wherein the adhesive bond is then easily solvable.
  • WO 92/09503 is known.
  • packaging units which are permeable to microwave radiation and contain a hot melt adhesive, which is heated by microwaves and then goes into the liquid state.
  • the methods described therein for obtaining microwave radiation activatable hot melt adhesives include additives which retain water in the polymer or hygroscopic water retaining substances. A disadvantage is found that such additives adversely affect the properties of the hot melt adhesive.
  • solid additives are described there, such as, for example, carbon black which, when mixed, make the hot melt adhesive heatable by microwave radiation.
  • various particulate substances are listed, which can be heated as such by microwave radiation and the hot melt adhesive are mixed.
  • the object of the present invention is therefore to provide a hot-melt adhesive which is suitable for bonding packaging in the food sector, which can be heated by the application of microwave radiation and the adhesive bond produced therewith is detachable.
  • the invention is achieved by a non-reactive thermoplastic hot melt adhesive, which is heatable by microwave radiation, characterized in that at least 50 wt.% Based on the amount of the base polymers of a thermoplastic polymer of ethylene-vinyl acetate are contained, optionally additionally containing thermoplastic, polar groups Polymers, and 0.5 to 15 wt.% Of polyols having a boiling point above 120 0 C.
  • thermoplastic polymers having polar groups e.g., polyethylene vinyl acetate copolymers, optionally additionally containing thermoplastic polymers having polar groups, and 0.5 to 15% by weight of Polyols having a boiling point above 120 0 C, wherein the bond is releasable by irradiation of the bonded substrates with microwave radiation.
  • Non-crosslinking hotmelt adhesives usually contain from 15 to 80% by weight of thermoplastic base polymers which impart the basic properties to the adhesive, such as melt viscosity and melting behavior, adhesion and stability. It is essential to the invention that at least 50% by weight of the base polymers consist of ethylene-vinyl acetate copolymers.
  • hot melt adhesives are suitable which contain at least 70% by weight of thermoplastic EVA polymers, based on the amount of the base polymers.
  • Ethylene vinyl acetate (EVA) polymers are widely used. These are copolymers based on vinyl acetate and ethylene, which may optionally contain further monomers einpolymerisierbare. These should generally be crystalline or partially crystalline and have a softening point above 50 ° C.
  • the vinyl acetate content should be between 10 and 50% by weight, preferably between 15 and 40% by weight.
  • C3 to C10 unsaturated carboxylic acids such as acrylic acid, methacrylic acid, crotonic acid, isocrotonic acid
  • ⁇ , ⁇ -unsaturated C 4 to C 10 alkylene dicarboxylic acids such as maleic acid, fumaric acid or itaconic acid.
  • Ci to C15 alkyl vinyl esters Ci to C15 alkyl (meth) acrylate
  • Ci to C15 alkyl esters of dicarboxylic acids for example Alkylfumerat, methyl (meth) acrylate, butyl (meth) acrlyate , 2-ethylhexyl (meth) acrylate
  • Ci to C ⁇ hydroxyalkyl (meth) acrylate such as hydroxyethyl or hydroxypropyl (meth) acrylate
  • Acrylonitrile acrylamide, methacrylamide, N-methylol-acrylamide.
  • Such monomers may be contained in amounts of from 0.2 to 10% by weight, especially up to 5% by weight in the EVA copolymer.
  • the molecular weight (M N ) of such EVA polymers is usually between 3,000 and 200,000 g / mol, in particular up to 100,000 g / mol (number average molecular weight (M N ), as obtainable by gel permeation chromatography).
  • EVA polymers processes for their preparation and suitable comonomers are known to those skilled in the art. He can do it according to application properties, e.g. the melting temperature, melt viscosity, adhesion properties or compatibility with other ingredients.
  • hot melt adhesive base polymers polymers which are different from EVA polymers
  • hot melt base polymers are understood to mean thermoplastic synthetic polymers which essentially determine properties important for hot melt adhesives, such as adhesion, strength and temperature behavior.
  • polymers examples include polyamide resins, copolyamides, polyetheramides, polyesteramides, polyesters, polyethers, polycarbonates; thermoplastic elastomers; reactive and non-reactive linear or branched thermoplastic polyurethanes; Polymers such as ethylene / acrylate, propylene / hexene, SIS, SBS, SEBS copolymers; Polyolefins, such as amorphous ⁇ -olefin copolymers (APAO), semi-crystalline polyolefins, especially propylene (PP) or ethylene (PE) copolymers.
  • APAO amorphous ⁇ -olefin copolymers
  • PP propylene
  • PE ethylene
  • non-reactive polar hot melt adhesive base polymers are suitable for hot melt adhesives suitable according to the invention, for example polar modified polyethylene or polypropylene, polyamides, polyesters, polyesteramides, polyolefin copolymers prepared by metallocene catalysis, polyurethanes.
  • Particularly suitable are polymers which have a high number of polar groups in the structure. Examples of such structures are urethane or urea groups, carboxyl, ester or amide groups, OH or NH groups.
  • Such polymers are known to the person skilled in the art.
  • the hot-melt adhesive may additionally contain in the compositions according to the invention at least one thermoplastic base polymer selected from the classes indicated above having a molecular weight of from 2000 to 200 000 g / mol. It should be noted, however, that the various polymers give a substantially homogeneous mix during processing and bonding, i. during melting or storage no phase separation should occur, so that a homogeneous bond is ensured.
  • the amount of the additional thermoplastic base polymers should be 0 to 50% by weight, preferably 0 to 30% by weight, based on the base polymer fraction.
  • those polymers are selected which contain no substances of health concern, including low molecular weight migration-capable substances. These should preferably be approved for use in the food industry.
  • the hot melt adhesive contains between 0.5 to 15% of at least one polyol which has a boiling point above 120 0 C.
  • Suitable polyols are the customary known two, three or more polyfunctional alcohols. They can be solid at room temperature or they are liquid.
  • alcohols examples include diols or triols, such as glycol, diethylene glycol, ethylene glycol, glycerol, ethoxylated Glycehndehvate, neopentyl glycol, trimethylolpropane, trimethylolethane, pentaerythritol, hexanthol or sugar alcohols based on hexoses or pentoses, such as glucose, mannitol, sorbitol, xylose, arabinose. It is also possible to use mixtures of different alcohols. It is also possible to use low molecular weight polyvinyl alcohols.
  • the boiling point of the polyols used should in particular be chosen so that it is above the melting temperature of the hot melt adhesive. In particular, it should be above 150 0 C, in particular above 200 ° C.
  • the upper limit can be up to 350 0 C or the alcohol decomposes at high temperature. It is useful if the selected polyols are authorized in the use of packaging and adhesives for packaging for the food industry.
  • the polyols should have a molecular weight of less than 1000, preferably less than 700, in particular less than 400. They may in particular be solid at 20.degree. C., but they may also be liquid substances.
  • the dipole moment of the polyols should be high, for example above 1.85 Debye, in particular above 2.3 Debye.
  • a particular embodiment employs trihydric to hexahydric alcohols.
  • the hot melt adhesives may contain other ingredients.
  • the hot melt adhesive according to the invention contains at least one tackifying resin.
  • the resin causes additional tackiness and improves the compatibility of the hot melt adhesive components.
  • These are in particular resins that have a softening point of 70 to 140 ° C (ring-ball method, DIN 52011).
  • These are, for example, aromatic, aliphatic or cycloaliphatic hydrocarbon resins, as well as modified or hydrogenated versions thereof. Examples include aliphatic or alicyclic petroleum hydrocarbon resins and hydrogenated derivatives.
  • suitable resins for the purposes of the invention are hydroabietyl alcohol and its esters, in particular its esters with aromatic carboxylic acids such as terephthalic acid and phthalic acid; preferably modified natural resins, such as resin acids from balsam resin, tall resin or root resin, for example fully saponified balsam resin or alkyl ester of optionally partially hydrogenated rosin with low softening points such as methyl, diethylene glycol, glycerol and pentaerythritol esters; Terpene resins, in particular copolymers of terpene, such as styrene-terpenes, ⁇ -methyl-styrene-terpenes, phenol-modified terpene resins and hydrogenated derivatives thereof; Acrylic acid copolymers, preferably styrene-acrylic acid copolymers and reaction products based on functional hydrocarbon resins. It is preferable to use partially polymerized tall resin, hydrogenated hydrocarbon resins or Kolophoniumg
  • the resin has a low molecular weight of below 2000 g / mol, in particular below 1500 g / mol. It may be chemically inert or it may optionally also contain functional groups, such as OH groups, carboxyl groups or double bonds.
  • the amount of the resin should be between 0 and 40% by weight, based on the hot-melt adhesive, in particular 5 to 30% by weight. Compatibility of the polyol components with the base polymers can also be improved with the resins.
  • additives are contained in the hot-melt pressure-sensitive adhesive according to the invention, which can influence certain properties of the adhesive, such.
  • cohesive strength viscosity, softening point or Processing viscosity.
  • additives include, for example, plasticizers, stabilizers, waxes, adhesion promoters, antioxidants or similar additives.
  • the amount should be up to 30% by weight. It is also possible to use several additives as a mixture. Furthermore, fillers can be used to increase the strength.
  • Plasticizers are preferably used to adjust viscosity or flexibility and are generally contained in a concentration of 0-20% by weight, preferably 2-15% by weight.
  • Suitable plasticizers are, for example, medicinal white oils, naphthenic mineral oils, polypropylene, polybutene, polyisoprene oligomers, hydrogenated polyisoprene and / or polybutadiene oligomers, benzoate esters, phthalates, adipates, vegetable or animal oils and derivatives thereof.
  • Hydrogenated plasticizers are selected, for example, from the group of paraffinic hydrocarbon oils.
  • polypropylene glycol and polybutylene glycol, and polymethylene glycol are suitable. Possibly. esters are also used as plasticizers, for.
  • alkyl monoamines and fatty acids having preferably 8 to 36 carbon atoms may be suitable.
  • waxes in amounts of 0 to 20 wt .-% may be added to the hot melt adhesive.
  • the amount is dimensioned so that on the one hand, the viscosity is lowered to the desired range, on the other hand, the adhesion is not adversely affected.
  • the wax can be of natural or synthetic origin. Vegetable waxes, animal waxes, mineral waxes or petrochemical waxes can be used as natural waxes. Hard waxes such as montan ester waxes, sarsol waxes, etc. can be used as the chemically modified waxes. As synthetic waxes find polyalkylene waxes and polyethylene glycol waxes use.
  • petrochemical waxes such as petrolatum, microwaxes and synthetic waxes, in particular polyethylene waxes, polypropylene waxes, if necessary, PE or PP copolymers, Fischer-Tropsch resins, paraffin waxes or microcrystalline waxes used.
  • antioxidants Another group of additives are stabilizers. Their task is to protect the polymers from degradation during processing. Here are in particular the antioxidants to call. They are usually added in amounts of up to 3 wt .-%, preferably in amounts of about 0.1 to 1, 0 wt .-% of the hot melt pressure sensitive adhesive. Such additives are known to those skilled in principle. He can make a selection of the desired properties of the hot melt adhesive.
  • a particular embodiment of the invention employs, in a hot melt adhesive according to the invention, in addition to the polyol or the polyol mixture, pigments that are sensitive to microwave radiation.
  • pigments are carbon black, iron oxide pigments, finely divided iron pigments. It may be usual finely divided pigments with a particle size between 0.2 to 5 microns, or it is nanoscale pigments. These can be used in an amount of 0.5 to 10 wt .-%, in particular 1 to 5 wt .-% based on the total hot melt adhesive.
  • hot melt adhesives are done by known methods. For example, the polymers may be charged and melted, then the resins and / or polyols are added. Subsequently, the additives can be added. Mixing can be done with known mixing equipment, e.g. heated stirrups or dissolvers take place, it is also possible that in melt kneaders or in extruders, the components of the hot melt adhesive are melted and mixed. Such methods are known in the art and require no further explanation. After mixing, the hot melt adhesive can be cooled, portioned and packaged.
  • the hot melt adhesive according to the invention should be essentially free of water or low-boiling alcohols. Such substances should be present only to the extent that they are contained as impurities in the starting raw materials. A further reduction of these impurities can also be achieved by the manufacturing process, wherein the mixtures are heated to temperatures above 100 0 C and / or degassed in a vacuum.
  • the application method depends on the type of substrate to be bonded and the suitable machines for it. It may be a punctiform order, a sheet-like application or a strip-shaped application.
  • the application can be done by known apparatuses, for example by application via spray nozzles or applicator nozzles, by slot dies, doctor blade or by roll application systems.
  • the hot melt adhesives according to the invention have a viscosity that is matched to the application method.
  • the hotmelt adhesives have a viscosity of 100 to 30,000 mPas, preferably 300 to 20,000 mPas, in particular 500 to 10,000 mPas at a temperature of 160 ° C (viscosity measured with Brookfield Thermosel, spindle 27, at specified temperature).
  • Particularly suitable are hot melt adhesives which have a viscosity between 500 and 10,000 mPas at application temperature, for example at 100 to 150 ° C., in particular up to 5000 mPas.
  • a hot melt adhesive with the lowest possible viscosity at application temperature. This ensures better applicability and easier conveyance of the hotmelt adhesive. Likewise, the wetting of the substrate is promoted thereby.
  • the air-facing side of the hot-melt adhesive must remain sticky and adhesive for as long as possible.
  • the hot-melt adhesives according to the invention exhibit a rapid heating rate under microwave irradiation.
  • the heating rate can also be achieved in thin layers.
  • the heating rate should be measured in a layer of 1 mm thickness in a commercial microwave oven with a power of 700 watts at least 20 0 C per minute, in particular at least 30 0 C per minute. In this case, temperatures above 80 ° C, especially above 100 0 C, especially be achieved over 150 ° C.
  • the hot-melt adhesives according to the invention are used for bonding substrates such as unpainted or coated paper or corresponding boards, films, plastics or glass, as well as for other substrates. In particular containers, such as folding boxes, outer cartons, trays, foil-shaped packaging can be produced therefrom.
  • the hot-melt adhesives according to the invention are distinguished in particular by a very good adhesion to the abovementioned substrates. A particular suitability is to be noted for such bonds, which are exposed to low temperatures during storage. The glued surfaces remain flexible even at low temperatures.
  • the bonds made with an adhesive according to the invention show a good bond strength without losing flexibility, creeping or having a noticeable loss of cohesion.
  • Another object of the invention is to provide a method for re-opening glued packages by microwave radiation.
  • two substrate surfaces through glued a hot melt adhesive according to the invention It is possible to fix the bonded surfaces by a pointwise bonding, it is also possible to produce a closed film between the two to be bonded substrate surfaces, it can also be an opening in a substrate surface are sealed with a drop of adhesive.
  • the adhesive layer acts to seal against diffusion of liquid or gases between the interior of the package and the outside. Contamination between inside and outside should be prevented.
  • the adhesive layer shows a good adhesion to both substrates, so that they stick together under usual manufacturing and storage temperatures between -30 and +50 0 C.
  • the adhesive layer is applied in a thickness of 1 to 500 microns.
  • the applied layer of the hotmelt adhesive is irradiated after storage with electromagnetic radiation in the microwave range, the thin adhesive layer heats up. This weakens cohesion or adhesion of the adhesive to the substrate, and it is possible to open the adhesive bond.
  • the hot melt adhesive In contrast to the known hot melt adhesives, it is surprising that even a thin layer of the hot melt adhesive can be heated in a short time by microwave radiation so far that the cohesive / adhesive force is significantly reduced.
  • the heating should be done to a temperature between 80 to 250 0 C, in particular to a temperature between 100 and 180 0 C.
  • the heating can be done depending on the design of the radiation source in a time between 30 seconds to 20 minutes.
  • the hot-melt adhesive of the invention and the method are suitable for closing two substrate parts of a package containing food or similar articles. It is then possible to heat such packages as a whole with microwave radiation, wherein the adhesive bonded to the adhesive according to the invention substrate parts are heated and open again. If necessary, it is also possible, only the glued To heat surface with microwave radiation and only there to soften the thin adhesive layer.
  • the hotmelt adhesive for the process according to the invention should not contain substances which evaporate rapidly under these conditions. This can ensure that no blistering and splashing occur during heating and that the contents of the packaging are not contaminated by the melt adhesive seam.
  • the method according to the invention is particularly suitable for bonding packagings which are to be opened again.
  • the hotmelt adhesives according to the invention can simply be heated again above their softening point by heating in microwave radiation, even in the presence of the contents. In this case, the cohesion of the adhesive layer between the two substrate parts is reduced. Thereafter, it is possible to mechanically separate the two bonded substrate parts from each other. It is also possible in another preferred embodiment that occurs by heating the package between the two bonded substrate parts, a mechanical stress. In this case, it is possible that due to the resulting stresses, the bonded site rises again without additional mechanical action.
  • the stress can be caused by the heating of the packaging by the substrate material, it is also possible that a structural tension is permanently present, which is fixed in the bonded state by the splice.
  • the substrates to be bonded it is also possible to produce packages that are closed under normal storage conditions, but at one point have a closed with an adhesive according to the invention opening. If a package which is at least partially bonded to a hotmelt adhesive according to the invention or has a corresponding opening is heated with the contents, an overpressure may build up inside the package contents. By the diminished Cohesion / adhesion of the bond, it is possible that the internal pressure at predetermined fractures, the bonded substrate parts separated from each other and so the excess pressure is released into the environment.
  • the hot-melt adhesive After removal of the packaging from the area of the microwave radiation, the hot-melt adhesive can cool again and it loses its stickiness. Thus, a drop, smearing, sticking to other surfaces can be avoided.
  • adhesives according to the invention can be used in the packaging for corresponding products.
  • the hot-melt adhesive of the invention is characterized by a good processability and adhesion of the bonds, and the cold flexibility is high.
  • a bonding method according to the invention a good sealing of the splices is ensured, these bonds can be dissolved in the heat by brief energy input by microwave radiation again.
  • the substrate surfaces are easily detachable, alternatively, the bonded areas separate by provided voltages between the substrate parts.
  • the ingredients become one by heating and homogenizing
  • Viscosity 160 0 C, mPas
  • a cardboard is coated with a hot melt adhesive according to Examples 1 to 6 and bonded to a same substrate in a width of 1 cm.
  • Bonding is fixed after cooling, the substrates are by tearing with the
  • the appropriate composite is placed in a microwave for a period of 5 min. placed.
  • the microwave source has a power of 700 watts. After removal of the bond from the microwave radiation, the bonded substrates are separated by pulling by hand.
  • a sample of Examples 1 to 6 (50 g) is heated in a microwave source and the temperature is measured. It is observed an improved heating rate.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

L'invention concerne un procédé de collage détachable de substrats. L'adhésif est à base de polymères non réactifs contenant au moins 50 % en poids d'un copolymère d'éthylène et d'acétate de vinyle ainsi que 0,5 à 15 % en poids de polyols ayant un point d'ébullition supérieur à 120°C. La colle correspondante peut être chauffée au moyen d'un rayonnement à micro-ondes. La plage de température de ramollissement de l'adhésif thermofusible est dépassée et les deux surfaces du substrat peuvent être encollées séparément l'une de l'autre.
EP07820583A 2006-12-14 2007-09-26 Colle thermofusible pour chauffage par micro-ondes Withdrawn EP2089464A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102006059462A DE102006059462A1 (de) 2006-12-14 2006-12-14 Hot melt für Mikrowellen-Erwärmung
PCT/EP2007/060188 WO2008071469A1 (fr) 2006-12-14 2007-09-26 Colle thermofusible pour chauffage par micro-ondes

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EP2089464A1 true EP2089464A1 (fr) 2009-08-19

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US (1) US20090305060A1 (fr)
EP (1) EP2089464A1 (fr)
DE (1) DE102006059462A1 (fr)
WO (1) WO2008071469A1 (fr)

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DE102006059462A1 (de) 2008-06-19
WO2008071469A1 (fr) 2008-06-19
US20090305060A1 (en) 2009-12-10

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