EP2089911A1 - Système de dissipateur de chaleur pour un système d'interconnexion de réseau photovoltaïque - Google Patents

Système de dissipateur de chaleur pour un système d'interconnexion de réseau photovoltaïque

Info

Publication number
EP2089911A1
EP2089911A1 EP07840086A EP07840086A EP2089911A1 EP 2089911 A1 EP2089911 A1 EP 2089911A1 EP 07840086 A EP07840086 A EP 07840086A EP 07840086 A EP07840086 A EP 07840086A EP 2089911 A1 EP2089911 A1 EP 2089911A1
Authority
EP
European Patent Office
Prior art keywords
heat
enclosure
heat pipe
heat sink
diode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP07840086A
Other languages
German (de)
English (en)
Inventor
Scott Stephen Duesterhoeft
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TE Connectivity Corp
Original Assignee
Tyco Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tyco Electronics Corp filed Critical Tyco Electronics Corp
Publication of EP2089911A1 publication Critical patent/EP2089911A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02S—GENERATION OF ELECTRIC POWER BY CONVERSION OF INFRARED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES
    • H02S40/00—Components or accessories in combination with PV modules, not provided for in groups H02S10/00 - H02S30/00
    • H02S40/30—Electrical components
    • H02S40/34—Electrical components comprising specially adapted electrical connection means to be structurally associated with the PV module, e.g. junction boxes
    • H02S40/345—Electrical components comprising specially adapted electrical connection means to be structurally associated with the PV module, e.g. junction boxes with cooling means associated with the electrical connection means, e.g. cooling means associated with or applied to the junction box
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02S—GENERATION OF ELECTRIC POWER BY CONVERSION OF INFRARED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES
    • H02S40/00—Components or accessories in combination with PV modules, not provided for in groups H02S10/00 - H02S30/00
    • H02S40/30—Electrical components
    • H02S40/34—Electrical components comprising specially adapted electrical connection means to be structurally associated with the PV module, e.g. junction boxes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

Definitions

  • the present invention is directed to a heat dissipation system for a photovoltaic array interconnection system, and more particularly to a connection box having a heat pipe for dissipating heat generated by internal components of the photovoltaic interconnection system.
  • PV interconnection systems lack efficient means for expelling heat generated from internal system electronic components, e.g., diode assemblies, to the exterior of the interconnection enclosure. This inability to expel the heat more rapidly causes a risk of heat rise sufficient to damage the enclosure and/or the internal components of the interconnection system.
  • Heat pipes are devices that are well known, for example, for use in space technology, dehumidification and air conditioning applications, and laptop CPU cooling systems.
  • "Heat pipe” is a term that refers to a closed pipe containing a working fluid such as water which is present in two phases, liquid and gas.
  • a heat pipe consists of a sealed aluminum or copper container whose inner surfaces have a capillary wicking material.
  • the heat pipe has the ability to transport heat against gravity by an evaporation-condensation cycle with the help of porous capillaries that form the wick.
  • the wick provides the capillary action that returns the condensate to the evaporator.
  • a portion of the heat pipe is placed over the hot spot and thereby serves as an evaporator, while a portion remote from the evaporator serves as a condenser, which returns liquid to the evaporator.
  • the evaporation and condensing cool the component efficiently until the heat load becomes so great that the working fluid evaporates faster than the condensing fluid can return to the evaporator, at which point the evaporator "dries out". Once the evaporator dries out, the increase in temperature with increased power is orders of magnitude greater than before the dry out point was reached.
  • the process of moving heat is essentially reduced to conduction by the thin walled tube.
  • the basic components of a heat pipe are the container, the working fluid, and the wick (or capillary) structure.
  • the container isolates the working fluid from the outside environment, is leak-proof, maintains the pressure differential across its walls, and enable transfer of heat to take place from and into the working fluid.
  • the container material is non-porous to prevent the diffusion of vapor, and has high thermal conductivity to minimize the temperature drop between the heat source and the wick.
  • the wick generates capillary pressure to transport the working fluid from the condenser to the evaporator, and distributes the liquid around the evaporator section to any area where heat is absorbed by the heat pipe. Internally, a liquid that enters the pores of the capillary material under its own pressure, thereby saturating all internal surfaces.
  • Heat pipes are used in air-conditioners, refrigerators, heat exchangers, transistors, capacitors, etc. Heat pipes are also used in laptop computers to reduce the working temperature for better efficiency. They are essentially maintenance free. Heat pipes have proven to be an accepted method of providing thermal control in notebook computers and portable personal computers (PCs) to transfer and dissipate CPU-generated heat selectively throughout the system without adversely impacting temperature-sensitive components.
  • the present invention is directed to a heat dissipation system for a photovoltaic array interconnection system.
  • the heat dissipation system includes an enclosure, one or more diode elements, a heat pipe system, and one or more heat sinks attached either end of the heat pipe system.
  • the enclosure includes apertures for inserting power cables.
  • the heat pipe system is in thermal communication with the diode elements, and the heat pipe system penetrates the walls of the enclosure between the diode and the heat sink.
  • the heat sink is disposed on an exterior of the enclosure. Cooling fins are arranged on the heat sink such that heat from the heat pipe is conducted into the fins, and heat from the fins is dissipated to the ambient atmosphere on the exterior of the enclosure.
  • connection box for a photovoltaic array interconnection system.
  • the connection box includes an enclosure, one or more diode elements, a heat pipe system, and one or more heat sinks attached either end of the heat pipe system.
  • the enclosure includes apertures for inserting power cables.
  • the heat pipe system is in thermal communication with the diode elements, and the heat pipe system penetrates the walls of the enclosure between the diode and the heat sink.
  • the heat sink is disposed on an exterior of the enclosure. Cooling fins are arranged on the heat sink such that heat from the heat pipe is conducted into the fins, and heat from the fins is dissipated to the ambient atmosphere on the exterior of the enclosure.
  • An advantage of the present invention is increased heat dissipation characteristics for connection boxes in a photovoltaic array interconnection system.
  • Another advantage is the use of heat pipe technology for eliminating heat generated by interconnection components in a connection box.
  • FIG. 1 is a perspective view of the PV interconnection system of the present invention.
  • Figure 2 is a sectional plan view of the PV interconnection system.
  • Figure 3 is a cross-sectional view of the PV interconnection system taken along the lines 3-3 in Figure 2.
  • the heat dissipation system of the present invention is applied to an interconnection system for photovoltaic (PV) arrays, and preferably to a roof mounted PV array, although the PV arrays may be independently mounted on frames, building facades or other configurations.
  • PV photovoltaic
  • connection box 12 houses the components of the interconnection system 10, including a series of electrical connectors 14 for connecting conductors of the PV array (not shown).
  • Connectors 16 are mounted to rail assemblies 14. Up to six rail assemblies 14 per connection box 12 is the preferred arrangement, although more than six rail assemblies 14 may be enclosed within a connection box suitable for larger configurations.
  • the rail assemblies 14 provide mechanical support for the connectors 14.
  • Connectors 16 are electrically isolated from the diode assemblies 15.
  • connection box 12 has cable couplers 18, and an aperture or apertures 34 disposed on the underside of the box 12 in the area opposite of the cable couplers 18.
  • the cable couplers 18 are sealed penetrations for the external connection cables 36 that interconnect to other interconnection systems [not shown] in order to form parallel or series wiring configurations for the power system.
  • the cable couplers 18 seal the interior of the connection box 12 from water or other liquids, as well as dirt and dust, while allowing the cables 36 to enter the connection box 12.
  • the cable couplers 18 are designed for high voltage and . high current carrying capacity, and preferably conform to the established International Protection (IP) standard IP-67, for sealing requirements in the photovoltaic industry.
  • IP International Protection
  • connection box 12 provides disconnect means for isolating the connection box 12 from the other connection boxes in the power system. Proper mating of the cable couplers 18 is ensured by polarity keyed housing, fully shrouded contacts, and squeeze to release connection system. It should be understood that the connection box 12 also may include additional interconnection system components, for example, diode assemblies, jumpers, printed circuit boards, etc., which are omitted from the figures for simplicity.
  • the heat pipe 26 extends through the connection box 12 in thermal contact with all of the diodes 15.
  • the diodes 15 are suspended between the rail assemblies 14.
  • the diodes 15 may have a semicircular recess (not shown) conforming to the outer diameter of the heat pipe 26.
  • the recesses are configured to receive the heat pipe 26 transversely in the connection box 12, so as to maintain thermal conductivity between the heat pipe 26 and the diodes 15.
  • the heat pipe 26 is preferably bonded to the diodes 15 with thermally conductive epoxy or adhesive 38.
  • the heat pipe may be embedded in an overmolded cover which mates with the diode 15 when attached to the box portion 12.
  • the heat pipe 26 penetrates the connection box 12 on opposite sides.
  • the heat sinks 28 are also preferably bonded to the heat pipe 26 with a thermally conductive adhesive material. Alternate means for bonding the heat pipe 26 with the heat sink 28 may be employed, for example, embedding the pipe in the heat sink 28, threaded connections, soldering or brazing.
  • the heat sinks 28 may be any type of conventional heat sink.
  • the heat sinks 28 include a plurality of cooling fins 32 that provide expanded fin surface area and airflow paths for optimum heat transfer.
  • the cooling fins 32 are connected by a common base portion 32.
  • the heat sinks 28 expel the heat to the ambient environment outside of the connection box 12, for example, the outdoor air surrounding an array of PV roof tiles.
  • heat pipe 26 condenses and is returned by capillary action to the inside of the connection box, and the cycle is continuously repeated, thereby efficiently removing greater heat than can be passively radiated through the surfaces of the connection box 12.
  • more than one heat pipe 26 with heat sinks 28 may be installed, for example, where the diode assemblies 15 may be arranged in tandem or in multiple rows, where a single heat pipe 28 cannot contact all of the diode assemblies.
  • the heat pipe 26 may be configured in a variety of non-linear shapes, for example, U-shape, W-shape or S-shape, where the heat pipe 26 is configured for a similarly configured diode arrangement.

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

L'invention concerne un système de dissipateur de chaleur pour un système d'interconnexion de réseau photovoltaïque (PV) qui comprend une enceinte contenant un ou plusieurs éléments de diode. Un système de tuyau de chaleur comporte des puits de chaleur attachés à une extrémité ou aux deux. Le tuyau de chaleur traverse l'enceinte en contact thermique avec les ensembles de diode. Des ailettes de refroidissement sont disposées sur le puits de chaleur de telle sorte que la chaleur provenant du tuyau de chaleur est conduite à l'intérieur de l'ailette et l'ailette dissipe la chaleur vers l'atmosphère ambiante à l'extérieur de l'enceinte afin de refroidir les composants à l'intérieur de l'enceinte.
EP07840086A 2006-11-22 2007-11-21 Système de dissipateur de chaleur pour un système d'interconnexion de réseau photovoltaïque Withdrawn EP2089911A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/562,683 US20080115911A1 (en) 2006-11-22 2006-11-22 Heat dissipation system for solarlok photovoltaic interconnection system
PCT/US2007/024336 WO2008066764A1 (fr) 2006-11-22 2007-11-21 Système de dissipateur de chaleur pour un système d'interconnexion de réseau photovoltaïque

Publications (1)

Publication Number Publication Date
EP2089911A1 true EP2089911A1 (fr) 2009-08-19

Family

ID=39284749

Family Applications (1)

Application Number Title Priority Date Filing Date
EP07840086A Withdrawn EP2089911A1 (fr) 2006-11-22 2007-11-21 Système de dissipateur de chaleur pour un système d'interconnexion de réseau photovoltaïque

Country Status (4)

Country Link
US (1) US20080115911A1 (fr)
EP (1) EP2089911A1 (fr)
CN (1) CN101542747B (fr)
WO (1) WO2008066764A1 (fr)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080283118A1 (en) * 2007-05-17 2008-11-20 Larankelo, Inc. Photovoltaic ac inverter mount and interconnect
JP2009099971A (ja) * 2007-09-28 2009-05-07 Enphase Energy Inc 光電池モジュール用の汎用インターフェース
GB0808930D0 (en) * 2008-05-16 2008-06-25 Sunamp Ltd Energy Storage system
US8435056B2 (en) * 2009-04-16 2013-05-07 Enphase Energy, Inc. Apparatus for coupling power generated by a photovoltaic module to an output
WO2010123325A2 (fr) * 2009-04-24 2010-10-28 커넥스일렉트로닉스(주) Boîte de jonction intelligente pour un module de cellules solaires
JP2011018463A (ja) * 2009-07-07 2011-01-27 Kitani Denki Kk 太陽光発電システムにおけるケーブルの締付け接続固定構造
GB0919934D0 (en) 2009-11-16 2009-12-30 Sunamp Ltd Energy storage systems
GB201016047D0 (en) * 2010-09-24 2010-11-10 Pace Plc Means for heating dissipation for electrical and/or electronic apparatus
US9083121B2 (en) 2010-12-17 2015-07-14 Sunpower Corporation Diode-included connector, photovoltaic laminate and photovoltaic assembly using same
US8519278B2 (en) 2011-02-16 2013-08-27 Amphenol Corporation Photovoltaic junction box
EP2735021A4 (fr) 2011-07-18 2015-03-11 Enphase Energy Inc Ensemble de montage élastique pour modules photovoltaïques
JP5729648B2 (ja) * 2011-10-13 2015-06-03 ホシデン株式会社 太陽電池モジュール用端子ボックス
USD734653S1 (en) 2012-11-09 2015-07-21 Enphase Energy, Inc. AC module mounting bracket
CN104242815A (zh) * 2014-09-29 2014-12-24 谢英健 一种光伏太阳能接线盒
US10756669B2 (en) 2014-12-04 2020-08-25 Solarmass Energy Group Ltd. Solar roof tile
TWM499043U (zh) * 2015-01-28 2015-04-11 訊凱國際股份有限公司 具熱交換機制的散熱器結構
CN104821785B (zh) * 2015-03-26 2017-02-01 常熟市福莱德连接器科技有限公司 一种光伏接线盒
US9970714B2 (en) 2016-05-11 2018-05-15 Toyota Motor Engineering & Manufacturing North America, Inc. Heat pipe heat flux rectifier
US10530292B1 (en) 2019-04-02 2020-01-07 Solarmass Energy Group Ltd. Solar roof tile with integrated cable management system
FR3098080B1 (fr) * 2019-06-28 2021-06-04 Valeo Systemes De Controle Moteur Système électronique et convertisseur de tension comprenant un tel système électronique
EP4000990A1 (fr) 2020-11-19 2022-05-25 ABB Schweiz AG Connecteur de charge de véhicule électrique à refroidissement actif
DE102021125242A1 (de) * 2021-09-29 2023-03-30 Weidmüller Interface GmbH & Co. KG Photovoltaikmodul und Anschlussanordnung für ein Photovoltaikmodul

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3851296A (en) * 1972-09-01 1974-11-26 Raychem Corp Cable coupling
US3829740A (en) * 1973-07-09 1974-08-13 Buehler Corp Cooling arrangement for a direct current power supply
US5339214A (en) * 1993-02-12 1994-08-16 Intel Corporation Multiple-fan microprocessor cooling through a finned heat pipe
US5338369A (en) * 1993-02-16 1994-08-16 Rawlings Lyle K Roof-integratable photovolatic modules
JP3255524B2 (ja) * 1993-12-28 2002-02-12 三菱電機株式会社 冗長回路を有する半導体装置およびその製造方法
US6104611A (en) * 1995-10-05 2000-08-15 Nortel Networks Corporation Packaging system for thermally controlling the temperature of electronic equipment
US6056044A (en) * 1996-01-29 2000-05-02 Sandia Corporation Heat pipe with improved wick structures
US5746839A (en) * 1996-04-08 1998-05-05 Powerlight Corporation Lightweight, self-ballasting photovoltaic roofing assembly
CA2199239A1 (fr) 1997-03-05 1998-09-05 Trevor Zapach Appareil electronique
TW331586B (en) * 1997-08-22 1998-05-11 Biing-Jiun Hwang Network-type heat pipe device
EP0946085A1 (fr) * 1998-03-24 1999-09-29 Lucent Technologies Inc. Appareil électronique dont l'enceinte extérieure est protégée de l'environnement
US6111189A (en) * 1998-07-28 2000-08-29 Bp Solarex Photovoltaic module framing system with integral electrical raceways
US6582249B1 (en) * 1999-11-17 2003-06-24 Tyco Electronics Amp Gmbh Apparatus for contacting foil conductors, in particular of a solar module
US6553729B1 (en) * 2000-06-09 2003-04-29 United Solar Systems Corporation Self-adhesive photovoltaic module
US6501013B1 (en) * 2001-07-10 2002-12-31 Powerlight Corporation Photovoltaic assembly array with covered bases
US6912816B2 (en) * 2001-10-01 2005-07-05 Futura Solar, Llc Structurally integrated solar collector
US6750391B2 (en) * 2001-10-25 2004-06-15 Sandia Corporation Aternating current photovoltaic building block
US6875914B2 (en) * 2002-01-14 2005-04-05 United Solar Systems Corporation Photovoltaic roofing structure
EP2298229A1 (fr) * 2002-07-25 2011-03-23 Jonathan S. Dahm Procédé et appareil permettant d'utiliser des diodes électroluminescentes à des fins de cuisson
US6928775B2 (en) * 2002-08-16 2005-08-16 Mark P. Banister Multi-use electric tile modules
US7031158B2 (en) * 2002-10-30 2006-04-18 Charles Industries, Ltd. Heat pipe cooled electronics enclosure
JP4311538B2 (ja) * 2003-06-27 2009-08-12 株式会社日立製作所 ディスク記憶装置の冷却構造
DE20311183U1 (de) * 2003-07-21 2004-07-08 Tyco Electronics Amp Gmbh Anschlussdose für ein Solarpaneel und Solarpaneel
DE20311184U1 (de) * 2003-07-21 2004-02-19 Tyco Electronics Amp Gmbh Anschlussdose zum Anschließen an ein Solarpaneel
JP4408224B2 (ja) * 2004-01-29 2010-02-03 富士通株式会社 放熱機能を有する筐体
US7345877B2 (en) * 2005-01-06 2008-03-18 The Boeing Company Cooling apparatus, system, and associated method
JP4418397B2 (ja) * 2005-04-27 2010-02-17 行田電線株式会社 太陽電池モジュール用端子ボックス

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO2008066764A1 *

Also Published As

Publication number Publication date
CN101542747A (zh) 2009-09-23
WO2008066764A1 (fr) 2008-06-05
CN101542747B (zh) 2012-07-18
US20080115911A1 (en) 2008-05-22

Similar Documents

Publication Publication Date Title
CN101542747B (zh) 用于光电阵列互连系统的散热系统
US6490160B2 (en) Vapor chamber with integrated pin array
EP2170030B1 (fr) Appareil électronique
JP4929400B2 (ja) 自由空間光学素子を有する電子システム
JP4309215B2 (ja) 回路装置冷却装置
US7345877B2 (en) Cooling apparatus, system, and associated method
US20180153058A1 (en) Cooling system and method of cooling electronic device
CN102686878B (zh) 包括热交换器组件的风力涡轮机机舱
US7675163B2 (en) Carbon nanotubes for active direct and indirect cooling of electronics device
JPH04233259A (ja) 熱除去装置
US20070215198A1 (en) Solar cell system with thermal management
US20110044043A1 (en) Led lamp
JPH11351769A (ja) ヒートシンク
CN107017214A (zh) 被冷却的电力电子组件
KR20020042421A (ko) 히트 파이프 및 열전 냉각기를 이용한 조밀한 칩 패키징용장치
CN101377392A (zh) 热交换器
WO2010026114A2 (fr) Nacelle d'éolienne comportant un échangeur de chaleur
WO2014140098A1 (fr) Dissipateur thermique à élément refroidissant en tuyau plat
JP2010079403A (ja) 電子装置用冷却システム
US7584622B2 (en) Localized refrigerator apparatus for a thermal management device
CN206136562U (zh) 一种内置大功率发热元件的热管散热式高ip防护等级箱柜
JP4360624B2 (ja) 半導体素子冷却用ヒートシンク
JP2006041355A (ja) 冷却装置
JP2018174184A (ja) 冷却装置及び冷却装置を備えた照明装置
CN106304810B (zh) 一种内置大功率发热元件的热管散热式高ip防护等级箱柜

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20090608

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC MT NL PL PT RO SE SI SK TR

17Q First examination report despatched

Effective date: 20090908

DAX Request for extension of the european patent (deleted)
RIC1 Information provided on ipc code assigned before grant

Ipc: H01L 23/36 20060101ALI20111118BHEP

Ipc: H01L 31/048 20060101ALI20111118BHEP

Ipc: H01L 31/024 20060101AFI20111118BHEP

GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

GRAC Information related to communication of intention to grant a patent modified

Free format text: ORIGINAL CODE: EPIDOSCIGR1

GRAJ Information related to disapproval of communication of intention to grant by the applicant or resumption of examination proceedings by the epo deleted

Free format text: ORIGINAL CODE: EPIDOSDIGR1

GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20120601