EP2092092A1 - Procédés de façonnage de la topographie de surface d'un métal ou d'un alliage nanocristallin ou amorphe et articles formés par de tels procédés - Google Patents
Procédés de façonnage de la topographie de surface d'un métal ou d'un alliage nanocristallin ou amorphe et articles formés par de tels procédésInfo
- Publication number
- EP2092092A1 EP2092092A1 EP07875205A EP07875205A EP2092092A1 EP 2092092 A1 EP2092092 A1 EP 2092092A1 EP 07875205 A EP07875205 A EP 07875205A EP 07875205 A EP07875205 A EP 07875205A EP 2092092 A1 EP2092092 A1 EP 2092092A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- etching
- electrochemically
- workpiece
- achieve
- topography
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000012876 topography Methods 0.000 title claims abstract description 137
- 238000000034 method Methods 0.000 title claims abstract description 103
- 229910045601 alloy Inorganic materials 0.000 title abstract description 75
- 239000000956 alloy Substances 0.000 title abstract description 75
- 239000005300 metallic glass Substances 0.000 title abstract description 42
- 238000005530 etching Methods 0.000 claims abstract description 273
- 238000000151 deposition Methods 0.000 claims abstract description 155
- 230000008021 deposition Effects 0.000 claims abstract description 92
- 229910052751 metal Inorganic materials 0.000 claims abstract description 51
- 239000002184 metal Substances 0.000 claims abstract description 51
- 238000004070 electrodeposition Methods 0.000 claims abstract description 45
- 238000009826 distribution Methods 0.000 claims abstract description 44
- 229910052709 silver Inorganic materials 0.000 claims abstract description 13
- 239000004332 silver Substances 0.000 claims abstract description 13
- 230000001747 exhibiting effect Effects 0.000 claims description 50
- 238000004519 manufacturing process Methods 0.000 claims description 37
- 239000002707 nanocrystalline material Substances 0.000 claims description 36
- 230000002441 reversible effect Effects 0.000 claims description 22
- 238000000576 coating method Methods 0.000 claims description 20
- 239000000463 material Substances 0.000 claims description 19
- 239000007787 solid Substances 0.000 claims description 16
- 210000003041 ligament Anatomy 0.000 claims description 13
- 238000005204 segregation Methods 0.000 claims description 13
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 12
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 12
- 230000000694 effects Effects 0.000 claims description 12
- 239000011248 coating agent Substances 0.000 claims description 10
- 229910052721 tungsten Inorganic materials 0.000 claims description 10
- 230000001050 lubricating effect Effects 0.000 claims description 9
- 239000007788 liquid Substances 0.000 claims description 8
- 239000012530 fluid Substances 0.000 claims description 7
- 229910052759 nickel Inorganic materials 0.000 claims description 5
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 5
- 239000010937 tungsten Substances 0.000 claims description 5
- 230000001788 irregular Effects 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 4
- 238000012545 processing Methods 0.000 abstract description 17
- 238000002310 reflectometry Methods 0.000 abstract description 6
- 230000002596 correlated effect Effects 0.000 abstract description 4
- 238000007747 plating Methods 0.000 abstract description 4
- 238000001228 spectrum Methods 0.000 abstract 1
- 230000008569 process Effects 0.000 description 25
- 239000012071 phase Substances 0.000 description 23
- 150000002739 metals Chemical class 0.000 description 14
- 238000001878 scanning electron micrograph Methods 0.000 description 12
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 11
- 229910052804 chromium Inorganic materials 0.000 description 11
- 239000011651 chromium Substances 0.000 description 11
- 239000000543 intermediate Substances 0.000 description 10
- 239000000203 mixture Substances 0.000 description 9
- 239000000126 substance Substances 0.000 description 8
- 229910001080 W alloy Inorganic materials 0.000 description 7
- 230000001276 controlling effect Effects 0.000 description 7
- 230000000875 corresponding effect Effects 0.000 description 7
- MOWMLACGTDMJRV-UHFFFAOYSA-N nickel tungsten Chemical compound [Ni].[W] MOWMLACGTDMJRV-UHFFFAOYSA-N 0.000 description 6
- 229910000808 amorphous metal alloy Inorganic materials 0.000 description 5
- 239000003086 colorant Substances 0.000 description 5
- 238000005260 corrosion Methods 0.000 description 5
- 230000007797 corrosion Effects 0.000 description 5
- 238000004458 analytical method Methods 0.000 description 4
- 239000007943 implant Substances 0.000 description 4
- 239000000314 lubricant Substances 0.000 description 4
- 238000003672 processing method Methods 0.000 description 4
- 239000000047 product Substances 0.000 description 4
- 238000004833 X-ray photoelectron spectroscopy Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000001312 dry etching Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 230000037361 pathway Effects 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 239000000523 sample Substances 0.000 description 3
- 238000001039 wet etching Methods 0.000 description 3
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910003296 Ni-Mo Inorganic materials 0.000 description 2
- 238000000429 assembly Methods 0.000 description 2
- 230000000712 assembly Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 229910002056 binary alloy Inorganic materials 0.000 description 2
- 238000005219 brazing Methods 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 230000003197 catalytic effect Effects 0.000 description 2
- 239000007795 chemical reaction product Substances 0.000 description 2
- 230000005757 colony formation Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000002425 crystallisation Methods 0.000 description 2
- 230000008025 crystallization Effects 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 238000004049 embossing Methods 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- 239000002932 luster Substances 0.000 description 2
- 230000013011 mating Effects 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000003701 mechanical milling Methods 0.000 description 2
- DDTIGTPWGISMKL-UHFFFAOYSA-N molybdenum nickel Chemical group [Ni].[Mo] DDTIGTPWGISMKL-UHFFFAOYSA-N 0.000 description 2
- 230000000737 periodic effect Effects 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 239000002243 precursor Substances 0.000 description 2
- 238000001953 recrystallisation Methods 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- 238000001947 vapour-phase growth Methods 0.000 description 2
- 229910000967 As alloy Inorganic materials 0.000 description 1
- 229910020515 Co—W Inorganic materials 0.000 description 1
- 229910004803 Na2 WO4.2H2 O Inorganic materials 0.000 description 1
- 229910018104 Ni-P Inorganic materials 0.000 description 1
- 229910018536 Ni—P Inorganic materials 0.000 description 1
- -1 Sodium tungstate hexahydrate Chemical class 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000012072 active phase Substances 0.000 description 1
- 235000019270 ammonium chloride Nutrition 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000004071 biological effect Effects 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000002848 electrochemical method Methods 0.000 description 1
- 230000005518 electrochemistry Effects 0.000 description 1
- 239000002659 electrodeposit Substances 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 239000008151 electrolyte solution Substances 0.000 description 1
- 238000000866 electrolytic etching Methods 0.000 description 1
- 238000002149 energy-dispersive X-ray emission spectroscopy Methods 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- XLYOFNOQVPJJNP-ZSJDYOACSA-N heavy water Substances [2H]O[2H] XLYOFNOQVPJJNP-ZSJDYOACSA-N 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- CWQXQMHSOZUFJS-UHFFFAOYSA-N molybdenum disulfide Chemical compound S=[Mo]=S CWQXQMHSOZUFJS-UHFFFAOYSA-N 0.000 description 1
- 239000002086 nanomaterial Substances 0.000 description 1
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 1
- RRIWRJBSCGCBID-UHFFFAOYSA-L nickel sulfate hexahydrate Chemical compound O.O.O.O.O.O.[Ni+2].[O-]S([O-])(=O)=O RRIWRJBSCGCBID-UHFFFAOYSA-L 0.000 description 1
- 229940116202 nickel sulfate hexahydrate Drugs 0.000 description 1
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 238000004439 roughness measurement Methods 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 238000005480 shot peening Methods 0.000 description 1
- NLJMYIDDQXHKNR-UHFFFAOYSA-K sodium citrate Chemical compound O.O.[Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O NLJMYIDDQXHKNR-UHFFFAOYSA-K 0.000 description 1
- 239000001509 sodium citrate Substances 0.000 description 1
- 229960000999 sodium citrate dihydrate Drugs 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000007669 thermal treatment Methods 0.000 description 1
- 238000003325 tomography Methods 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
- 235000019263 trisodium citrate Nutrition 0.000 description 1
- 210000003462 vein Anatomy 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
- B23H9/00—Machining specially adapted for treating particular metal objects or for obtaining special effects or results on metal objects
- B23H9/008—Surface roughening or texturing
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/18—Electroplating using modulated, pulsed or reversing current
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
- C25D5/611—Smooth layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/615—Microstructure of the layers, e.g. mixed structure
- C25D5/617—Crystalline layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/615—Microstructure of the layers, e.g. mixed structure
- C25D5/619—Amorphous layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F3/00—Electrolytic etching or polishing
- C25F3/02—Etching
- C25F3/08—Etching of refractory metals
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F3/00—Electrolytic etching or polishing
- C25F3/02—Etching
- C25F3/14—Etching locally
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Crystallography & Structural Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
La présente invention concerne la gravure électrochimique qui permet de façonner la topographie d'un métal ou d'un alliage nanocristallin ou amorphe, laquelle peut être produite par tout procédé incluant un dépôt électrochimique. Des procédés de gravure courants peuvent être utilisés. La topographie peut être régulée par des paramètres variables qui produisent l'élément et/ou les paramètres de gravure. L'article nanocristallin présente une surface comprenant au moins deux éléments, au moins l'un d'eux étant un métal, et l'un d'eux étant plus actif sur le plan électrochimique que les autres. L'élément actif a une distribution spatiale définie dans la pièce à travailler, qui est en rapport spatial prédécesseur avec la topographie spécifiée. La gravure élimine préférentiellement une partie de l'élément actif, de façon à obtenir la topographie spécifiée. Une régulation est possible en ce qui concerne : la rugosité, la couleur, en particulier dans un spectre allant de l'argent au noir en passant par le gris, la réflectivité et la présence, la distribution et la densité du nombre de creux et de canaux, ainsi que leur profondeur, largeur, dimension. Des paramètres de traitement qui ont été corrélés dans le système Ni-W aux caractéristiques topographiques incluent, tant pour la phase de dépôt que pour la phase de gravure d'une surface nanocristalline : le cycle de service, la densité du courant, la durée de dépôt, la chimie du dépôt, le rapport de polarité. L'influence relative des paramètres de traitement peut être notée et corrélée pour établir un rapport entre les valeurs des paramètres de traitement et le degré des caractéristiques topographiques. Une régulation peut être établie en ce qui concerne les caractéristiques topographiques. Une corrélation peut être réalisée pour tout système qui présente une distribution spatiale définie d'un élément actif qui est en rapport spatial prédécesseur avec une caractéristique topographique souhaitée.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US85906706P | 2006-11-15 | 2006-11-15 | |
| PCT/US2007/023939 WO2009035444A1 (fr) | 2006-11-15 | 2007-11-14 | Procédés de façonnage de la topographie de surface d'un métal ou d'un alliage nanocristallin ou amorphe et articles formés par de tels procédés |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| EP2092092A1 true EP2092092A1 (fr) | 2009-08-26 |
Family
ID=39941858
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP07875205A Withdrawn EP2092092A1 (fr) | 2006-11-15 | 2007-11-14 | Procédés de façonnage de la topographie de surface d'un métal ou d'un alliage nanocristallin ou amorphe et articles formés par de tels procédés |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20100282613A1 (fr) |
| EP (1) | EP2092092A1 (fr) |
| WO (1) | WO2009035444A1 (fr) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2006420A1 (fr) * | 2007-06-22 | 2008-12-24 | Danmarks Tekniske Universitet - DTU | Couche microporeuse pour diminuer la friction dans un procédé de formage de métaux |
| US9011706B2 (en) * | 2008-12-16 | 2015-04-21 | City University Of Hong Kong | Method of making foraminous microstructures |
| US9522387B2 (en) * | 2012-06-15 | 2016-12-20 | Lawrence Livermore National Security, Llc | Highly active thermally stable nanoporous gold catalyst |
| US9004240B2 (en) | 2013-02-27 | 2015-04-14 | Integran Technologies Inc. | Friction liner |
| US9518335B2 (en) * | 2014-01-02 | 2016-12-13 | City University Of Hong Kong | Method of fabricating improved porous metallic material and resulting structure thereof |
| US9840789B2 (en) | 2014-01-20 | 2017-12-12 | City University Of Hong Kong | Etching in the presence of alternating voltage profile and resulting porous structure |
| DE102014005941A1 (de) * | 2014-04-24 | 2015-11-12 | Te Connectivity Germany Gmbh | Verfahren zum Herstellen eines elektrischen Kontaktelements zur Vermeidung von Zinnwhiskerbildung, und Kontaktelement |
| US10199630B2 (en) * | 2015-08-21 | 2019-02-05 | TOP Battery Co., Ltd | Electrode terminal, electro-chemical device and electro-chemical device comprising same |
| EP3438330B9 (fr) | 2017-08-03 | 2024-08-14 | Groz-Beckert KG | Partie d'outil de machine textile et procédé de fabrication d'un outil textile |
| CN107815720B (zh) * | 2017-09-15 | 2020-04-17 | 广东工业大学 | 一种自支撑还原氧化石墨烯涂层及其制备方法和应用 |
| DK3460102T3 (da) * | 2017-09-21 | 2020-07-13 | Hymeth Aps | Fremgangsmåde til fremstilling af en elektrokatalysator |
| US11492723B2 (en) * | 2019-11-05 | 2022-11-08 | Cilag Gmbh International | Electrolyte solutions for electropolishing of nitinol needles |
| CN114921823B (zh) * | 2021-02-01 | 2024-07-19 | 芜湖美的厨卫电器制造有限公司 | 一种镀层的制备方法、应用该制备方法的电极、家电设备 |
| AU2023206867A1 (en) * | 2022-01-14 | 2024-06-27 | EvolOH, Inc. | Scalable electrode flow fields for water electrolyzers and method of high-speed manufacturing the same |
| CN115094460B (zh) * | 2022-07-19 | 2023-08-29 | 同济大学 | 一种碱性电解槽用镍基复合电极及其制备方法 |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2260296A (en) * | 1939-09-29 | 1941-10-28 | Bell Telephone Labor Inc | Electrical filter |
| JPS5242134B2 (fr) * | 1972-12-30 | 1977-10-22 | ||
| GB1487485A (en) * | 1974-02-05 | 1977-09-28 | Siemens Ag | Method of forming a catalytic layer |
| US4437956A (en) * | 1982-05-19 | 1984-03-20 | The United States Of America As Represented By The United States Department Of Energy | Method for preparing surfaces of metal composites having a brittle phase for plating |
| US4461680A (en) * | 1983-12-30 | 1984-07-24 | The United States Of America As Represented By The Secretary Of Commerce | Process and bath for electroplating nickel-chromium alloys |
| US4977038A (en) * | 1989-04-14 | 1990-12-11 | Karl Sieradzki | Micro- and nano-porous metallic structures |
| US5433797A (en) * | 1992-11-30 | 1995-07-18 | Queen's University | Nanocrystalline metals |
| US5389226A (en) * | 1992-12-17 | 1995-02-14 | Amorphous Technologies International, Inc. | Electrodeposition of nickel-tungsten amorphous and microcrystalline coatings |
| US5616432A (en) * | 1994-06-14 | 1997-04-01 | Ovonic Battery Company, Inc. | Electrochemical hydrogen storage alloys and batteries fabricated from Mg containing base alloys |
| US6080504A (en) * | 1998-11-02 | 2000-06-27 | Faraday Technology, Inc. | Electrodeposition of catalytic metals using pulsed electric fields |
| US20060118425A1 (en) * | 2000-04-19 | 2006-06-08 | Basol Bulent M | Process to minimize and/or eliminate conductive material coating over the top surface of a patterned substrate |
| DE10039596C2 (de) * | 2000-08-12 | 2003-03-27 | Omg Ag & Co Kg | Geträgerte Metallmembran, Verfahren zu ihrer Herstellung und Verwendung |
| US6558231B1 (en) * | 2000-10-17 | 2003-05-06 | Faraday Technology Marketing Goup, Llc | Sequential electromachining and electropolishing of metals and the like using modulated electric fields |
| WO2004005193A2 (fr) * | 2002-07-03 | 2004-01-15 | Xintek, Inc. | Procedes de fabrication et d'activation de cathodes a emission de champ composites a nanostructure |
| DE10326788B4 (de) * | 2003-06-13 | 2005-05-25 | Robert Bosch Gmbh | Kontaktoberflächen für elektrische Kontakte und Verfahren zur Herstellung |
| KR20050074283A (ko) * | 2004-12-27 | 2005-07-18 | 진텍, 인크. | 나노구조 복합체 전계 방출 음극에 대한 제조 및 활성화방법 |
| US7758708B2 (en) * | 2006-07-31 | 2010-07-20 | The Governors Of The University Of Alberta | Nanocomposite films |
-
2007
- 2007-11-14 EP EP07875205A patent/EP2092092A1/fr not_active Withdrawn
- 2007-11-14 WO PCT/US2007/023939 patent/WO2009035444A1/fr not_active Ceased
- 2007-11-15 US US11/985,569 patent/US20100282613A1/en not_active Abandoned
Non-Patent Citations (1)
| Title |
|---|
| See references of WO2009035444A1 * |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2009035444A1 (fr) | 2009-03-19 |
| US20100282613A1 (en) | 2010-11-11 |
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