EP2157199A1 - Kupferlegierungsmaterial und herstellungsverfahren dafür - Google Patents

Kupferlegierungsmaterial und herstellungsverfahren dafür Download PDF

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Publication number
EP2157199A1
EP2157199A1 EP08739314A EP08739314A EP2157199A1 EP 2157199 A1 EP2157199 A1 EP 2157199A1 EP 08739314 A EP08739314 A EP 08739314A EP 08739314 A EP08739314 A EP 08739314A EP 2157199 A1 EP2157199 A1 EP 2157199A1
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EP
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Prior art keywords
copper alloy
alloy material
cold working
heat treatment
present
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EP08739314A
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English (en)
French (fr)
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EP2157199A4 (de
Inventor
Hiroshi Kaneko
Kuniteru Mihara
Tatsuhiko Eguchi
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Furukawa Electric Co Ltd
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Furukawa Electric Co Ltd
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Publication of EP2157199A1 publication Critical patent/EP2157199A1/de
Publication of EP2157199A4 publication Critical patent/EP2157199A4/de
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    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon

Definitions

  • the present invention relates to a copper alloy material and to a method for production thereof.
  • a copper alloy material has been used for applications such as a lead frame, a connector, a terminal material, or the like of an electrical and electronic device, more specifically a connector or a terminal material to be mounted on a motor vehicle, a relay, a switch, a socket, or the like.
  • the copper alloy needs to have properties such as an electrical conductivity, an yield strength (an yield stress), a tensile strength, a bending workability and an yield stress relaxation characteristic.
  • the properties need to be improved further as the demand for a smaller size, a lighter weight, a higher function, a higher package density, or a higher environment temperature of the electrical and electronic device increases.
  • a work hardening process is a combination of a solid solution hardening of Sn and/or Zn with a cold working such as a rolling out, a wire drawing, or the like, thereby improving strengths of the alloys.
  • a cold working such as a rolling out, a wire drawing, or the like.
  • a precipitation hardening is provided as a method for improving strength, in which a fine second phase in a nanometer order is precipitated in a material.
  • the method it is possible to improve the strength and an electrical conductivity, thereby being available to various alloy systems.
  • a chemical compound of Ni and Si is precipitated in Cu, thereby improving the strength.
  • the Cu-Ni-Si based alloy does not have sufficient electrical conductivity, and it is necessary to improve the electrical conductivity.
  • a solution heat treatment is introduced for solution heating a solute atom as an intermediate process before a heat aging precipitation treatmentto obtain a fine precipitatedstate.
  • the processing is conducted at a temperature between 750°C and 1000°C depending on an alloy system, a solute concentration, or the like.
  • a wrinkle tends to become large on a surface of a bend section, so that an electric current may be converged, or a plated surface of a material may crack when the bend section is used as a contact. Therefore, there is required a technology to decrease the crystalline grain diameter under a high temperature in the solution heat treatment.
  • An invention has disclosed a method for production of a copper alloy with high strength, in which a chemical compound of Ni and Ti is dispersed (refer to Japanese Patent Publication No. 04-053945 ). Moreover, another invention has disclosed a method for production of a copper alloy, in which a chemical compound of Ti and Fe is dispersed (refer to Japanese Patent Publication No. 07-258806 ).
  • the present inventors have examined regarding a composition of a copper alloy material, an average crystalline grain diameter thereof, an electrical conductivity property, an yield strength, a stress relaxation characteristic and a bending workability. It is found that it becomes possible to improve the properties by controlling properly individual conditions, thereby achieving the present invention.
  • the present invention provides the following aspects.
  • FIG. 1 is a schematic explanatory drawing showing a method of testing a stress relaxation.
  • an element X represents a transition element that has a 3d electron in an outer shell, such as Ni, Fe, Co, Cr, or the like.
  • an element Y represents an element that has valence electrons as two pieces or four pieces, such as Ti, Si, Zr, Hf, or the like.
  • the elements X and the elements Y may be a chemical compound, such as NiSiTi, NiSiZr, CoSiTi, Co 2 Si, CuSiTi, CoHfSi, CuHfSi, Fe 5 Si 3 , Ti 5 Si 3 , Ni 3 Ti 2 Si, Co 3 Ti 2 Si, Cr 3 Ti 2 Si, Fe 2 Ti, Ni 3 Zr 2 Si, CoSiZr, Cr 2 Ti, CrMnTi, Ni 2 Si, Ni 3 Si, NigTi 2 Zr, or the like.
  • the chemical compounds or a chemical compound in which any of the constituent elements are substituted by another element are precipitated mostly with a fine size as not larger than 50 nm as a matrix in the copper.
  • the elements X and the elements Y have a function to improve the strength, the electrical conductivity and the yield stress relaxation characteristic.
  • each of the contents for the elements X is not larger than 0.1 mass%, or where each of the contents for the elements Y is not larger than 0.01 mass%, because the amount of precipitation hardening is not sufficient. Still further, it is not desirable either in a case where any one of the elements X is not less than 4 mass%, or where any one of the elements Y is not less than 3 mass%, because there is generated a crystallized precipitate as rougher and larger in a texture of the alloy material, that may worsen a plating ability thereon, may become a cause to generate a crack at the period of bending work, or the like.
  • a range for any one of the element X should be between 0.1 mass% and 4 mass%, and it is desirable to be between 0.3 mass% and 3.0 mass%, or it is further preferable to be between 0.3 mass% and 2.5 mass%.
  • a range for any one of the element Y to be contained should be between 0.01 mass% and 3 mass%, and it is desirable to be between 0.03 mass% and 2.0 mass%, or it is further preferable to be between 0.04 mass% and 1.5 mass%.
  • an element Z represents Sn, Mg, Zn, Ag, Mn, B and P.
  • the elements of the Sn, the Mg, the Zn, the Ag and the Mn have a function that improves the strength, the yield stress relaxation characteristic, or the like, due to a synergistic effect as to be formed a chemical compound with any of the elements X and/or any of the elements Y, or by being solution heated in a copper alone.
  • the B and the P it becomes able to obtain the function that improves the strength thereof and the yield stress relaxation characteristic thereof, by increasing a density of a fine precipitate that is comprised of any of the elements X and any of the elements Y, or any of the elements X, any of the elements Y and any of the elements Z.
  • any of the elements Z may become the constituent elements for a second phase that will be described below and that has an advantage in order to control a crystalline grain diameter thereof.
  • a range of the content of any one of the elements Z is normallybetween 0.01 mass% and 3 mass%, and it is desirable to be between 0.03 mass% and 2 mass%, or it is further preferable to be between 0.05 mass% and 1.0 mass%.
  • the copper alloy material according to the present invention has the electrical conductivity of not less than 50% IACS, the yield strength of not less than 600 MPa, and the stress relaxation rate of not higher than 20% as to be measured after the same is maintained for 1000 hours at a state under applying a stress of 80% of the yield strength thereof.
  • the electrical conductivity thereof is normally not more than 70% IACS.
  • any upper limit either is not set for the yield strength, however, the same is normally not more than 900 MPa.
  • the above mentioned stress relaxation rate thereof is normally as not lower than 8%, though there is not set any lower limit either.
  • the crystalline grain diameter thereof is able to control the crystalline grain diameter thereof by performing a solution heat treatment at a higher temperature. And then it is able to obtain the bending workability as to be more excellently in a case where an average of the crystalline grain diameter thereof is not larger than 10 ⁇ m. Still further, it becomes able to obtain further function and advantage that improve the strength thereof by designing the crystalline grains to be as smaller. That is to say, it becomes able to obtain the excellent bending workability and the excellent strength thereof by designing the preferable average crystalline grain diameter thereof as not larger than 6 ⁇ m, or by designing the same as not larger than 4 ⁇ m as further preferably. Still further, there is no lower limit in particular regarding the average crystalline grain diameter thereof, however, the same is not smaller than 3 ⁇ m in a normal case.
  • the present invention it is effective to diffuse a second phase that has the particle diameter between 50 nm and 1000 nm with a density thereof as not lower than 104 pieces per mm 2 regarding the control of the crystalline grain diameter thereof.
  • the second phase principally means a precipitate and a part of crystallized precipitates.
  • the particle diameter of the second phase is between 60 nm and 800 nm, or it is further preferable to be between 70 nm and 700 nm. Still further, it is desirable to design the distribution density thereof as not lower than 105 pieces per mm 2 .
  • the effect to suppress the growth of the grains becomes to be decreased in a case where the particle diameter of the above mentioned second phase is excessively smaller. On the contrary in a case where the same thereof is excessively larger, there may be given rise to such as a worsening in bending workability thereof, a decrease in density of the second phase thereof, or the like.
  • the second phase it becomes able to enhance the functions and the advantages that suppress the crystalline grain diameter thereof as not to be rougher and larger, because the second phase becomes able to exist stably without being solution heated in the copper even at a higher temperature thereof by being composed of the element that has a melting point not lower than 1400°C, such as Si, Co, Ni, Fe, Ti, Zr, Cr, or the like.
  • a chemical compound such as Ni-Co-Cr-Si, Co-Si, Ni-Co-Si, Cr-Ni-Si, Co-Cr-Si, Ni-Zr, Mn-Zr, Ni-Mn-Zr, Fe-Zr, Mn-Zr, Fe-Mn-Zr, Ni-Ti, Co-Ti, Ni-Co-Ti, Fe-Ni-Si, Fe-Si, Mn-Si, Ni-Mn-P, Fe-P, Ni-P, Fe-Ni-P, Mn-B, Fe-B, Mn-Fe-B, Ni-B, Cr-B, Ni-Cr-B, Ni-Co-B, Ni-Co-Hf-Si, Ni-Co-Al, Ni-Ca, Ni-Co-Mn-Sn, Co-Ni-P, Al-Hf, Al-Zr, Al-Cr
  • the second phase is more preferable for the second phase to be as a chemical compound that is comprised of three elements as ternary, such as Cr-Ni-Si, Co-Cr-Si, Fe-Ni-Si, or the like.
  • the following processes are performed in order onto a substance for a copper alloy material, that comprises the steps of: casting (1); treating with heat for homogenizing (2); hot working (3); facing (4); cold working (6); treating with heat to be solution heated (7); cold working (9); treating with heat for aging precipitation (10) ; cold working (11); and then annealing to be heat treated for refining (12).
  • the step of cold working (6) has a function thereby a precipitated state of the fine precipitate becomes to be higher in density thereof and finer by controlling thereof at the step of treating with heat to be solution heated (7). And then thereby it becomes able to improve the strength thereof, the electrical conductivity thereof, and the yield stress relaxation characteristic thereof. Moreover, it becomes able to improve the strength thereof due to the work hardening by making use of the step of cold working (9). Further, it is desirable for a sum of a processing rate as an R1 (%) at the step of cold working (9) and a processing rate as an R2 (%) at the step of cold working (11) to be between 5% and 65%.
  • the heat aging precipitation treatment (8) has a function that the precipitated state becomes further higher in density thereof and further finer in the heat aging precipitation treatment (8), because it gives a core for the precipitation, with increasing a dislocation density thereof at the process of cold working (7). And then thereby it becomes able to improve the strength thereof, the electrical conductivity thereof and the yield stress relaxation characteristic thereof.
  • a temperature of the heat aging precipitation treatment (8) should be within a temperature range between 400°C and 700°C, and it is desirable to be between 425°C and 675°C, or it is further preferable to be between 450°C and 650°C.
  • a precipitated amount is too lower in a case where the temperature thereof is excessively lower, or because a precipitate becomes rougher and larger in a case where the same is excessively higher. Therefore, it is able to obtain the most excellent properties thereof in a case between 400°C and 700°C with an amount of time for between five seconds and twenty hours.
  • a processing temperature for the heat aging precipitation treatment (10) to be as lower than the processing temperature for the of treating with heat for aging precipitation (8), because it is necessary to maintain the precipitate to be as higher in density thereof and finer that contributes to the precipitation hardening thereof.
  • the heat aging precipitation treatment (5) with a processing temperature between 400°C and 800°C for between five seconds and twenty hours after the process of facing (4), that is a method in order to control a dispersion state of the second phase which has a particle diameter between 50 nm and 1000 nm.
  • the second phase is precipitated, such as at the cooling process in the process of hot working (3), at the process of raising the temperature thereof in the solution heat treatment (7), that is designed in order to control the crystalline grain diameter thereof, and that contributes to control the crystalline grain diameter thereof as smaller.
  • the heat aging precipitation treatment (5) has a function thereby the density of the above mentioned second phase becomes further higher.
  • the advantage becomes to be decreased in a case where the temperature thereof is excessively lower, or in a case where the same is excessively higher, or in a case where an amount of time for the process is excessively shorter.
  • the advantage becomes to be decreased either in a case where the amount of time for the process is excessively longer, because the distribution density of the second phase becomes rougher and larger.
  • the temperature range of the heat aging precipitation treatment (5) it is desirable for the temperature range of the heat aging precipitation treatment (5) to be between 425°C and 675°C, or it is further preferable to be between 450°C and 650°C.
  • the copper alloy material and the method for production thereof according to the present invention that is superior in the electrical conductivity thereof, the strength thereof, the yield stress relaxation characteristic thereof and the bending workability thereof at the same time, and that is the most suitable for the application to an electrical and electronic device.
  • the stress relaxation characteristic thereof it is able to obtain the advantages at least under a state of not higher than 150°C for the copper alloy material according to the present invention, though the assessment is performed at the temperature of 150°C as pursuant to the standard specification.
  • the copper alloy material according to the present invention that is superior in the electrical conductivity thereof, the strength thereof, the yield stress relaxation characteristic thereof and the bending workability thereof, and that is suitable for the application to such as a connector for an electrical and electronic device, a material for a terminal, or the like, and more specifically to such as a connector or a material for a terminal to be made use for such as mounting on a motor vehicle, a relay, a switch, a socket, or the like.
  • FIG 1 is an explanatory drawing in order to show a method of testing the stress relaxation characteristic thereof, wherein FIG. 1(a) shows a state before the process of treating with heat, and FIG. 1(b) shows a state after the process of treating with heat.
  • a position of the test piece No. 1 at the time of adding the initial stress as the 80% of the yield strength thereof is defined to be as having a distance of ⁇ 0 from a reference level held on a testing stand No. 4 as shown in FIG. 1(a) .
  • a position of the test piece No. 2 is defined to be as having a distance of H t from the reference level, that is after maintaining the test piece No.
  • the No. 3 represents a test piece in the contrast in a case where there is not loaded any stress thereunto, and then a position thereof is defined to be as having a distance of H 1 from the reference level.
  • ⁇ 0 designates the distance from the reference level regarding the test piece at the period when the same is bended
  • H 1 designates the distance from the reference level regarding the test piece at the time when the same is not bended
  • H t designates the distance from the reference level regarding the test piece that is after being performed the process of treating with heat and being bended, and then that is after unloading.
  • Each test piece is cut out with a width of 10 mm and a length of 25 mm in a direction as parallel to the rolling direction thereof. And then there is performed a W-bending with an axis of bending each thereof in parallel to the rolling direction thereof or in a right angle. Moreover, there is performed thereafter an observation whether or not any cracking at each part of the bending work thereof by making use of an optical microscope and a scanning electron microscope (SEM). And then thereby there is adopted a ratio between a bend radius as an R and a board thickness as a t that are the limit values of which there is not occurred any cracking thereon. And hence there is performed a calculation of the ratio as R/t.
  • the samples are selected from the sample materials for the above mentioned measurements, that have individual board widths w of approximately ten millimeters, and then on which surfaces are rubbed slightly with making use of a metal polishing powder in order to remove an oxide film layer thereon. And then thereafter there is performed the above mentioned w-bending for each thereof to have individual angles at each inner side of the bending thereof as ninety degrees respectively, for the samples with the w-bending in parallel to the rolling direction (Good Way: GW hereinafter), and for the other samples with the w-bending in a right angle to the rolling direction (Bad Way: BW hereinafter). And hence there is performed the above mentioned measurements for the two types of the samples.
  • the copper alloy materials is produced through one of the Processes A to D described below and indicated with the capital letters.
  • Process A there is performed a process of cold working with a reduction in area between 50% and 98%, there is performed a solution heat treatment at a temperature between 800°C and 1000°C, there is performed another process of cold working with a reduction in area between 5% and 50%, there is performed a heat aging precipitation treatment at a temperature between 400°C and 650°C, there is performed a process of finishing cold working with a reduction in area between 5% and 50%, and then there is performed a process of annealing to be heat treated for refining at a temperature between 200°C and 450°C with an amount of time for between five seconds and ten hours.
  • Process B there is performed the process of cold working with the reduction in area between 50% and 98%, there is performed the solution heat treatment at the temperature between 800°C and 1000°C, there is performed a heat aging precipitation treatment at a temperature between 400°C and 650°C, there is performed the other process of cold working with the reduction in area between 5% and 50%, there is performed another heat aging precipitation treatment at the temperature between 400°C and 650°C, there is performed the process of finishing cold working with the reduction in area between 5% and 50%, and then there is performed a process of annealing to be heat treated for refining at a temperature between 200°C and 550°C with the amount of time for between five seconds and ten hours.
  • Process C there is performed the heat aging precipitation treatment at the temperature between 400°C and 650°C, there is performed the process of cold working with the reduction in area between 5% and 98%, there is performed the solution heat treatment at the temperature between 800°C and 1000°C, there is performed the other process of cold working with the reduction in area between 5% and 50%, there is performed the other heat aging precipitation treatment at the temperature between 400°C and 650°C, there is performed the process of finishing cold working with the reduction in area between 5% and 50%, and then there is performed the process of annealing to be heat treated for refining at the temperature between 200°C and 550°C with the amount of time for between five seconds and ten hours.
  • Process D there is performed the heat aging precipitation treatment at the temperature between 400°C and 650°C, there is performed the process of cold working with the reduction in area between 5% and 98%, there is performed the solution heat treatment at the temperature between 800°C and 1000°C, there is performed another heat aging precipitation treatment at a temperature between 400°C and 550°C, there is performed the process of cold working with the reduction in area between 5% and 50%, there is performed the other heat aging precipitation treatment at the temperature between 400°C and 650°C, there is performed the process of finishing cold working with the reduction in area between 5% and 50%, and then there is performed the process of annealing to be heat treated for refining at the temperature between 200°C and 550°C with the amount of time for between five seconds and ten hours.
  • each of the obtained copper alloy materials is treated as individual sample materials. Further, there are performed the examination on the characteristics of the yield strength (YS), the electrical conductivity (EC) and the stress relaxation rate (SR). Furthermore, there are shown the obtained results in Table 1-1 and Table 1-2.
  • the present invention samples 1-1 through 1-32 are superior in the yield strength thereof, the electrical conductivity thereof and the yield stress relaxation characteristic thereof.
  • the comparative sample 1-1 has the density of the precipitate as lower because of the amount of the element X as lower, and then thereby the same has the strength, the electrical conductivity and the yield stress relaxation characteristic as inferior.
  • the comparative sample 1-2 has the electrical conductivity as inferior, because there becomes to be increased the amount of the atoms thereof to be solution heated due to the amount of the element X as larger.
  • the comparative sample 1-3 has the density of the precipitate as lower because of the amount of the element Y as lower, and then thereby the same has the strength, the electrical conductivity and the yield stress relaxation characteristic as inferior. Furthermore, the comparative sample 1-4 has the electrical conductivity as inferior, because there becomes to be increased the amount of the atoms thereof to be solution heated due to the amount of the element Y as larger.
  • the present invention samples 2-1 through 2-32 are superior in the yield strength thereof, the electrical conductivity thereof and the yield stress relaxation characteristic thereof.
  • the comparative samples 2-1 to 2-3 individually have the electrical conductivities as too inferior, due to the individual amounts of the elements Z in each thereof as excessively larger.
  • the present invention samples 3-1 through 3-32 are superior in the yield strength thereof, the electrical conductivity thereof and the yield stress relaxation characteristic thereof.
  • the comparative samples 3-1 to 3-3 as shown in Table 3-2 that individually have the temperatures regarding the solution heat treatment as higher respectively, the sample materials individually have the crystalline grain diameters as larger than 10 ⁇ m respectively, and then that are inferior in the bending workability.
  • the present invention samples 4-1 through 4-32 are superior in the yield strength thereof, the electrical conductivity thereof, the yield stress relaxation characteristic thereof and the bending workability thereof.
  • the sample materials individually have the crystalline grain diameters as larger than 10 ⁇ m respectively, and then thereby that are inferior in the bending workability on the contrary.
  • the elements are mixed to obtain the content and the composition as shown in Table 5-1. Moreover, there is performed a dissolution thereafter for an alloy by making use of the high frequency melting furnace, in which a remaining portion is comprised of copper and an unavoidable impurity. And hence there is obtained an ingot by casting the same with the cooling rate between 0.1°C per second and 100°C per second. Further, there is performed the process of treating with heat for homogenizing the same at between 900°C and 1050°C for between a half hour and ten hours. And then thereafter there is performed the process of hot working for the same with the reduction in area of not less than 50% at the processing temperature of not lower than 650°C.
  • the process of cold working is performed with the reduction in area between 50% and 98%, there is performed the solution heat treatment at the temperature between 800°C and 1000°C, another process of cold working is performed with a reduction in area of R1% in the table, there is performed the heat aging precipitation treatment at the temperature between 400°C and 650°C, a process of finishing cold working is performed with a reduction in area of R2% in the table, and the process of annealing to be heat treated for refining is performed at the temperature between 200°C and 450°C with the amount of time for between five seconds and ten hours.
  • the copper alloy materials is produced, and then a part of each of the obtained copper alloy materials thereby is treated as individual sample materials. Furthermore, there are shown the obtained results in Table 5-2 and Table 5-3.
  • the present invention samples 5-1 through 5-3 are superior in the yield strength thereof, the electrical conductivity thereof, the yield stress relaxation characteristic thereof and the bending workability thereof.
  • the elements are mixed to obtain compositions as shown in Table 5-1 according to Example 5.
  • an alloy is melt in a high frequency melting furnace, so that a remaining portion is comprised of copper and an unavoidable impurity.
  • the alloy is cast to obtain an ingot with the cooling rate between 0.1°C and 100°C per second.
  • the process of cold working with the reduction in area between 50% and 98% there is performed the solution heat treatment at the temperature between 800°C and 1000°C, there is performed a heat aging precipitation treatment at the temperature of T8 [°C] as shown in Table 6-1 and Table 6-2 with an amount of time for four hours, there is performed another process of cold working with the reduction in area between 5% and 50%, there is performed another heat aging precipitation treatment at the temperature of T10 [°C] as shown in the tables with the amount of time for four hours, there is performed a process of finishing cold working with the reduction in area between 5% and 50%, and then there is performed the process of annealing to be heat treated for refining at the temperature between 200°C and 450°C with the amount of time for between five seconds and ten hours. Accordingly, the copper alloy materials are obtained, and then a part of each of the obtained copper alloy materials is treated as individual sample materials.
  • the present invention samples 6-1 and 6-2 are superior in the yield strength thereof, the electrical conductivity thereof, the yield stress relaxation characteristic thereof and the bending workability thereof.
  • the comparative samples 6-1 and the comparative samples 6-2 as shown in Table 6-2 that individually have the T10 as higher than the T8 as the temperature of the heat aging precipitation treatment respectively, because the function of the precipitation hardening thereby is not sufficient, and then because the strength thereof becomes lower.
  • the copper alloy materials are produced, and then a part of each of the obtained copper alloy materials is treated as individual sample materials.
  • the copper alloy material is applicable to a lead frame for an electrical and electronic device, a connector, a material for a terminal, or the like, and more specifically to such as a connector or a material for a terminal to be made use for such as mounting on a motor vehicle, a relay, a switch, a socket, or the like.
  • the present invention claims the priority based on Japanese Patent Application No. 2007-086026 , that is patent applied in Japan on the twenty-eighth day of March 2007, and on Japanese Patent Application No. 2008-085013 , that is patent applied in Japan on the twenty-seventh day of March 2008, and the entire contents of which are expressly incorporated herein by reference.

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EP08739314A 2007-03-28 2008-03-28 Kupferlegierungsmaterial und herstellungsverfahren dafür Withdrawn EP2157199A4 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007086026 2007-03-28
JP2008085013A JP2008266787A (ja) 2007-03-28 2008-03-27 銅合金材およびその製造方法
PCT/JP2008/056196 WO2008123455A1 (ja) 2007-03-28 2008-03-28 銅合金材およびその製造方法

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EP2157199A1 true EP2157199A1 (de) 2010-02-24
EP2157199A4 EP2157199A4 (de) 2012-06-27

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US (1) US20100170595A1 (de)
EP (1) EP2157199A4 (de)
JP (1) JP2008266787A (de)
CN (1) CN101680056B (de)
WO (1) WO2008123455A1 (de)

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EP2386665A4 (de) * 2008-12-12 2012-07-04 Jx Nippon Mining & Metals Corp Ni-Si-Co-KUPFERLEGIERUNG UND HERSTELLUNGSVERFAHREN DAFÜR
EP2692877A4 (de) * 2011-03-31 2014-10-22 Univ Tohoku Kupferlegierung und herstellungsverfahren für die kupferlegierung
RU2574934C1 (ru) * 2014-11-14 2016-02-10 Федеральное государственное автономное образовательное учреждение высшего профессионального образования "Белгородский государственный национальный исследовательский университет" (НИУ "БелГУ") Медный сплав

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EP2248921A4 (de) * 2008-01-31 2011-03-16 Furukawa Electric Co Ltd Kupferlegierungswerkstoff für elektrisches/elektronisches bauteil und verfahren zur herstellung des kupferlegierungswerkstoffs
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